Texas Instruments DAC82002EVM User manual

User’s Guide
DAC82002EVM User's Guide
ABSTRACT
This user’s guide describes the characteristics, operation, and use of the DAC82002 evaluation module (EVM).
This EVM is designed to evaluate the performance of the DAC82002 commercial, unbuffered voltage output
DAC in a variety of configurations. Throughout this document, the terms evaluation board, evaluation module,
and EVM are synonymous with the DAC82002EVM. This document includes a schematic, printed-circuit board
(PCB) layouts, and a complete bill of materials.
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Table of Contents
1 Overview..................................................................................................................................................................................3
1.1 Kit Contents........................................................................................................................................................................3
1.2 Related Documentation from Texas Instruments............................................................................................................... 3
2 System Setup.......................................................................................................................................................................... 4
2.1 Software Setup...................................................................................................................................................................4
2.2 Hardware Setup................................................................................................................................................................. 6
3 Detailed Description............................................................................................................................................................... 7
3.1 Hardware Description.........................................................................................................................................................7
3.2 Software Description.......................................................................................................................................................... 9
4 Schematic, PCB Layout, and Bill of Materials....................................................................................................................11
4.1 Schematic.........................................................................................................................................................................11
4.2 PCB Layout...................................................................................................................................................................... 14
4.3 Bill of Materials.................................................................................................................................................................16
List of Figures
Figure 2-1. Software Installation Path..........................................................................................................................................4
Figure 2-2. FTDI USB Drivers......................................................................................................................................................5
Figure 2-3. Hardware Setup........................................................................................................................................................ 6
Figure 3-1. DAC82002EVM Hardware Simplified Schematic...................................................................................................... 7
Figure 3-2. Default Buffer Configuration...................................................................................................................................... 8
Figure 3-3. Buffer DIP Adapter Connections............................................................................................................................... 8
Figure 3-4. DAC82002EVM GUI Location................................................................................................................................... 9
Figure 3-5. DAC82002EVM GUI Connection Detection.............................................................................................................. 9
Figure 3-6. Low Level Configuration Page................................................................................................................................ 10
Figure 3-7. Low Level Configuration Page Options................................................................................................................... 10
Figure 4-1. DAC82002EVM Schematic Page 1......................................................................................................................... 11
Figure 4-2. DAC82002EVM Schematic Page 2.........................................................................................................................12
Figure 4-3. DAC82002EVM Schematic Page 3.........................................................................................................................13
Figure 4-4. DAC82002EVM PCB Components Layout............................................................................................................. 14
Figure 4-5. DAC82002EVM PCB Layers...................................................................................................................................15
List of Tables
Table 1-1. Contents of DAC82002EVM Kit..................................................................................................................................3
Table 2-1. DAC82002EVM Power Supply Inputs.........................................................................................................................6
Table 2-2. DAC82002EVM Jumper Settings................................................................................................................................6
Table 3-1. DAC82002EVM J6 Pin Definitions..............................................................................................................................7
Table 4-1. DAC82002EVM Bill of Materials............................................................................................................................... 16
Trademarks
Windows™ is a trademark of Microsoft Corporation.
LabVIEW™ is a trademark of National Instruments.
All trademarks are the property of their respective owners.
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1 Overview
The DAC82002EVM is an easy-to-use platform to evaluate the functionality and performance of the DAC82002
commercial device.
The 16-bit DAC82002 is a high-accuracy, low-power, dual-channel digital-to-analog converter (DAC). The
DAC82002 uses a power-on-reset circuit to power up at either zero scale (0x0000) or midscale (0x8000),
depending on the RSTSEL pin. The DAC82002 uses a 3-wire serial peripheral interface (SPI) for digital
communication that operates at clock rates of up to 50 MHz.
1.1 Kit Contents
Table 1-1 details the contents of the EVM kit. Contact the nearest TI Product Information Center if any
component is missing. Download the latest versions of the related software in the DAC82002EVM tool folder.
Table 1-1. Contents of DAC82002EVM Kit
Item Quantity
DAC82002EVM evaluation board PCB 1
USB micro-B plug to USB-A plug cable 1
1.2 Related Documentation from Texas Instruments
The following document provides information regarding Texas Instruments integrated circuits used in the
assembly of the DAC82002EVM. This user's guide is available from the TI web site under literature number
SBAU401. Any letter appended to the literature number corresponds to the document revision that is current at
the time of the writing of this document. Newer revisions may be available from the TI web site at www.ti.com,
or call the Texas Instruments Literature Response Center at [phone] or the Product Information Center at
[phone]. When ordering, identify the document by both title and literature number.
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2 System Setup
2.1 Software Setup
This section provides the procedure for EVM software installation.
2.1.1 Operating Systems
The EVM software is compatible with the Windows™ 7 and 10 operating systems.
2.1.2 Software Installation
Before installing the software, make sure that the DAC82002EVM is not connected to the local machine.
Download the software from DAC82002EVM tool folder. After the software is downloaded, navigate to the
download folder, and run the DAC82002EVM software installer executable file.
When the DAC82002EVM software is launched, an installation dialog window opens and prompts the user
to select an installation directory. If left unchanged, Figure 2-1 shows that the software location defaults to
C:\Program Files (x86)\Texas Instruments\DAC82002EVM.
Figure 2-1. Software Installation Path
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The EVM software also installs the FTDI USB drivers using a separate executable file, and automatically copies
the required LabVIEW™ software files and drivers to the local machine. Figure 2-2 shows the FTDI USB drivers
installation window that is automatically launched after the DAC82002EVM software installation is complete.
Figure 2-2. FTDI USB Drivers
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2.2 Hardware Setup
This section describes the overall system setup for the EVM. A local machine runs the software that provides an
interface to the DAC82002EVM through the onboard controller.
The USB connection generates 5 V of power for use as the DAC supply voltage (VDD). The onboard controller
generates 3.3 V of power for the input/output (I/O) signals generated by the controller. These I/O signals are
level-translated to the VDD voltage of the DAC. Figure 2-3 displays the system hardware setup.
USB Port
EVM
Jumpers
Figure 2-3. Hardware Setup
2.2.1 Electrostatic Discharge Caution
CAUTION
Many of the components on the DAC82002EVM are susceptible to damage by electrostatic
discharge (ESD). Observe proper ESD handling precautions when unpacking and handling the
EVM, including the use of a grounded wrist strap at an approved ESD workstation.
2.2.2 Power Configurations and Jumper Settings
The DAC82002EVM provides electrical connections to the device supply pins. Table 2-1 shows the connections.
Table 2-1. DAC82002EVM Power Supply Inputs
DAC82002EVM
Connector Supply Name Voltage Range
J1 VDD 1.8 V to 5.5 V; remove J3 if applying an external VDD to the DAC
J4 AGND 0 V
J7 VREFIN 2 V to VDD; ignore if J8 is shorted and onboard 2.5-V VREF is used
The jumper settings on the DAC82002EVM are crucial to the proper operation of the EVM. Table 2-2 provides
the details of the configurable jumper settings on the EVM. Figure 4-1 defines the DAC82002EVM pin numbers.
Table 2-2. DAC82002EVM Jumper Settings
Jumper Default Position Available Option Description
J3 Short: 3.3 V from USB used as VDD Open: External VDD used External or onboard 3.3-V VDD selection
J5 Short: Reset DAC Value is 0 Open: Reset DAC value is midscale Reset DAC value selection
J8 Short: Onboard 2.5-V VREF used Open: External VREFIN used External or onboard 2.5-V VREF selection
J9 VOUTA: Unbuffered VOUTA output LN-A: Low-noise VOUTA output
HS-A: High-speed VOUTA output VOUTA Output Selection
J11 VOUTB: Unbuffered VOUTB output HS-B: High-speed VOUTB output
LN-B: Low-noise VOUTB output VOUTB Output Selection
J13 Short: FTDI disabled Open: FTDI enabled FTDI disable
If an external supply is applied to the DAC VDD input, remove jumper J3 to disconnect the 5-V USB supply from
the DAC VDD pin. For SPI communication to operate, J13 must be open.
For J9 and J11, use only one short at a time for each. Short the J10 and J12 SMA connectors to output VOUTA
and VOUTB, respectively.
2.2.3 Connecting the Hardware
After the power and jumper configurations are set up per Section 2.2.2, connect the USB cable from the
DAC82002EVM USB port to the local machine.
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3 Detailed Description
3.1 Hardware Description
The following sections provide detailed information on the EVM hardware and jumper configuration settings.
3.1.1 Theory of Operation
Figure 3-1 shows a simplified schematic of the DAC82002EVM board. By default, the DAC82002EVM features
two OPA388 single-channel, low-noise operational amplifiers, and one OPA2328 dual-channel high-speed
operational amplifier. Use jumpers J9 and J11 to select between unbuffered, low-noise, or high-speed output
configurations for VOUTA and VOUTB. Adapters for 8-pin DIP packages are available that allow for the
replacement of the default operational amplifiers with other options.
DAC82002
OPA
388
OPA
2328
OPA
2328
OPA
388
MUX VOUTA
MUX
USB
FT4222
SPI
External VDD
VOUTB
REF5025
2.5 V
External VREF
3.3 V
Figure 3-1. DAC82002EVM Hardware Simplified Schematic
3.1.1.1 Signal Definitions
The DAC82002EVM provides access to DAC pins through connection J6. Table 3-1 lists the J6 pin definitions.
Table 3-1. DAC82002EVM J6 Pin Definitions
Pin# Signal Description
1 SDIN FTDI serial data signal for DAC
2 GND Ground
3 SCLK FTDI serial CLK signal for DAC
4 GND Ground
5 SYNC
Serial data enable of SPI. Active
low. This input is the frame-
synchronization signal for the serial
data.
6 GND Ground
7 RESET Active-low RESET for DAC
8 GND Ground
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3.1.1.2 Buffer Customization
The DAC82002EVM has three operational amplifier circuits that can be configured using 0-Ω resistors. All three
circuits act as unity gain buffers with the default resistor placement. The following figure shows the 0-Ω resistors
are the only resistors that are populated on the DAC82002EVM by default.
3
2
6
7
4
V+
V-
OPA388IDR
U5A
3
2
6
7
4
V+
V-
OPA388IDR
U7A
V+
1nF
C11
1nF
C16
AGND
1nF
C17
AGND
V-
AGND
1nF
C21
1nF
C23
AGND
1nF
C24
AGND
VOUTA
VREF
V-
V+
1nF
C26
1nF
C28
AGND
1nF
C29
AGND
V+
1nF
C31
1nF
C33
AGND
1nF
C34
AGND
V-
AGND
AGND
AGND
AGND
AGND
AGND
LN-A
LN-B
HS-B
HS-A
TP3
LN-A
TP9
HS-A
TP21
HS-B
TP23
LN-B
A1
A2
A3
A7
A6
A5C6
C2
C3
B2
B3
B6
100nF
C13
100nF
C20
100nF
C27
100nF
C30
100nF
C32
100nF
C35
0
R13
0
R15
0
R17
0
R18
0
R19
0
R20
0
R21
0
R24
0
R27
0
R30
0
R32
0
R16
VOUTA
VREF
0
R28
AGND
VOUTA
VREF
0
R12
0
R23
0
R29
0
R14
VOUTA
VREF
0
R25
AGND
VOUTB
VREF
0
R31
0
R39
0
R43
0
R37
VOUTB
VREF
0
R41
AGND
VOUTB
VREF
0
R33
0
R40
0
R44
0
R38
VOUTB
VREF
0
R42
3
2
1
8
4
V+
V-
OPA2328DGKR
U6A
5
6
7
OPA2328DGKR
U6B
Figure 3-2. Default Buffer Configuration
The three operational amplifiers can be replaced by the desired DIP-8 package. The inserted packages must
follow the same pin mapping as the default operational amplifiers. Figure 3-3 shows the buffer DIP adapter
connections.
Figure 3-3. Buffer DIP Adapter Connections
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3.2 Software Description
This section describes the features of the DAC82002EVM software, and discusses how to use these features.
The software provides basic control of all the DAC82002 registers and functions.
3.2.1 Starting the Software
To launch the software, locate the Texas Instruments folder in the All Programs menu, and select the
DAC82002EVM icon.
Figure 3-4. DAC82002EVM GUI Location
Figure 3-5 shows that if the onboard controller is connected correctly, the status bar at the bottom of the
screen displays CONNECTED. If the controller is not properly connected or not connected at all, the status
displays DEMO. If the graphical user interface (GUI) is not displaying the CONNECTED status while the EVM is
connected, unplug and reconnect the EVM, and then relaunch the GUI software.
Figure 3-5. DAC82002EVM GUI Connection Detection
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3.2.2 Software Features
The DAC82002EVM GUI allows for easy access to the registers that help configure an individual DAC82002
device using SPI communication.
Before using the GUI, see the DAC82002 device data sheet for detailed programming instructions.
3.2.2.1 Low Level Configuration Page
The Low Level Configuration page (Figure 3-6) allows access to low-level communication directly with the
DAC82002 device registers. Select a register on the Register Map list to show a description of the values in that
register, as well as information on the register address, default value, size, and current value. Data are written to
the registers by entering a value in the value column of the GUI.
Figure 3-6. Low Level Configuration Page
To store the values of the register map locally, select Save Configuration under the File menu option. The stored
configuration files can be recalled and loaded by selecting Open Configuration.
Figure 3-7 shows the four configuration buttons provided on the Low Level Configuration page that allow the
user to interact with the device registers:
•Write Selected
•Write Modified
•Read Selected
•Read All
The DAC82002EVM only supports writing to the device registers, so Read Selected and Read All have no
effect.
Figure 3-7. Low Level Configuration Page Options
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4 Schematic, PCB Layout, and Bill of Materials
This section contains the schematics, printed circuit board (PCB) layout diagrams, and a complete bill of materials for the DAC82002EVM.
4.1 Schematic
AGND
3.3V_PS
SCK_ISO
MOSI_ISO
VBUS 1
D- 2
D+ 3
ID 4
GND 5
6
7
8
11 10
9
J2
L1
4.7µF
C7
D1
USB_VBUS
D2 D3
10.0
R8
10.0
R9
AGND
FTDI_XSCI FTDI_XSCO
AGND AGND
100pF
C5
470nF
25V
C6
AGND
AGND
SS_ISO
AGND AGND AGND AGND AGND
AGND AGND
USB_VBUS
TP4
TP5
TP6
USB_VBUS 3.3V_PS
10uF
C18
AGND
4.7µF
C4
4.7µF
C36
3.3V_PS
3.3V_PS
TP14 TP15 TP16 TP17 TP18 TP19
AGND
TP20
TP7
USB_DM_N
USB_DP_P
1
2 3
U8A
4
5 6
U8B
10
89
U8C
VCC
14 GND 7
U8E
SCK_ISO FTDI_SCLK
FTDI_SDIN
FTDI_SYNC
VDD
AGND
MOSI_ISO
SS_ISO
TP26
TP27
TP24
TP25
10k
R34
1
2
J13
FTDI_EN
FTDI_EN
FTDI_EN
FTDI_EN
1112
13
U8D
AGND
100nF
C37
AGND
VDD
AGND
1 2
Y1
0
R11
100V
20pF
C14
100V
20pF
C15
IN
1OUT 5
2
EN
3NC 4
GND
U3
100nF
C2
100nF
C3
100nF
C8
10kR5
100nF
C12
12.0k
R1
47.0k
R4
1.00M
R10
VCCIN
26
VCCIO
7
VOUT3V3
25
DCNF0
4
DCNF1
5
IO2 11
IO3 12
SS 32
SS0O 17
RESET
3
BCD_DET
31
DEBUGGER
1
DM
22 DP
23
EP 33
INTR/WAKEUP/GPIO3 16
MISO 9
MOSI 10
RREF
21
SCK 8
SCL/SS1O/GPIO0 13
SDA/SS2O/GPIO1 14
STEST_RST
2
SUSP_OUT/SS3O/GPIO2 15
VBUS_DET
30
VPP
29
XSCI
18
XSCO
19
AGND 27
DGND 6
DGND 28
UGND 20
UGND 24
U2
FT4222HQ-D-R
AGND
USB_DP_P
USB_DM_N
FTDI_XSCI
FTDI_XSCO
3.3V_PS
USB_VBUS
3.3V_PS
AGND
Figure 4-1. DAC82002EVM Schematic Page 1
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Figure 4-2. DAC82002EVM Schematic Page 2
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3
2
6
7
4
V+
V-
OPA388IDR
U5A
3
2
6
7
4
V+
V-
OPA388IDR
U7A
V+
1nF
C11
1nF
C16
AGND
1nF
C17
AGND
V-
AGND
1nF
C21
1nF
C23
AGND
1nF
C24
AGND
VOUTA
VREF
V-
V+
1nF
C26
1nF
C28
AGND
1nF
C29
AGND
V+
1nF
C31
1nF
C33
AGND
1nF
C34
AGND
V-
AGND
AGND
AGND
AGND
AGND
AGND
LN-A
LN-B
HS-B
HS-A
TP3
LN-A
TP9
HS-A
TP21
HS-B
TP23
LN-B
A1
A2
A3
A7
A6
A5C6
C2
C3
B2
B3
B6
100nF
C13
100nF
C20
100nF
C27
100nF
C30
100nF
C32
100nF
C35
0
R13
0
R15
0
R17
0
R18
0
R19
0
R20
0
R21
0
R24
0
R27
0
R30
0
R32
0
R16
VOUTA
VREF
0
R28
AGND
VOUTA
VREF
0
R12
0
R23
0
R29
0
R14
VOUTA
VREF
0
R25
AGND
VOUTB
VREF
0
R31
0
R39
0
R43
0
R37
VOUTB
VREF
0
R41
AGND
VOUTB
VREF
0
R33
0
R40
0
R44
0
R38
VOUTB
VREF
0
R42
3
2
1
8
4
V+
V-
OPA2328DGKR
U6A
5
6
7
OPA2328DGKR
U6B
Figure 4-3. DAC82002EVM Schematic Page 3
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4.2 PCB Layout
Figure 4-4. DAC82002EVM PCB Components Layout
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Figure 4-5. DAC82002EVM PCB Layers
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4.3 Bill of Materials
Table 4-1. DAC82002EVM Bill of Materials
Designator Quantity Value Description Package Reference Part Number Manufacturer
!PCB 1 Printed circuit board DC188 Any
C1, C2, C3, C8, C9, C12, C13,
C20, C22, C27, C30, C32, C35,
C37
14 0.1 µF CAP, CERM, 0.1 µF, 50 V,±10%, X7R, AEC-
Q200 grade 0, 0603 603 06035C104K4Z4A AVX
C4, C7, C36 3 4.7 µF CAP, CERM, 4.7 µF, 16 V,±10%, X7R, 0603 603 GRM188Z71C475KE21D MuRata
C5 1 100 pF CAP, CERM, 100 pF, 25 V, ±10%, X7R,
0603 603 06033C101KAT2A AVX
C6 1 0.47 µF CAP, CERM, 0.47 µF, 25 V, ±10%, X7R,
0603 603 GRM188R71E474KA12D MuRata
C10 1 1 µF CAP, CERM, 1 µF, 25 V,±10%, X7R, AEC-
Q200 grade 1, 0603 603 CGA3E1X7R1E105K080AC TDK
C11, C16, C17, C21, C23, C24,
C26, C28, C29, C31, C33, C34 12 1000 pF CAP, CERM, 1000 pF, 50 V, ±5%, X7R, AEC-Q200 grade 1, 0603 603 C0603C102J5RACAUTO Kemet
C14, C15 2 20 pF CAP, CERM, 20 pF, 100 V, ±5%, C0G/NP0,
0805 805 08051A200JAT2A AVX
C18 1 10 µF CAP, CERM, 10 µF, 10 V, ±20%, X5R, 0603 603 C1608X5R1A106M080AC TDK
C19 1 27 pF CAP, CERM, 27 pF, 25 V,±5%, C0G/NP0,
0402 402 C0402C270J3GAC7867 Kemet
C25 1 1000 pF CAP, CERM, 1000 pF, 25 V, ±5%, X7R,
0402 402 C0402C102J3RACTU Kemet
C38, C39 2 8 pF CAP, CERM, 8 pF, 50 V,±6.25%, C0G/NP0,
0402 402 CC0402DRNPO9BN8R0 Yageo
D1, D2, D3 3 24 V PulseGuard ESD suppressor, 24 VDC, SMT 0603 TVS diode PGB1010603MR Littelfuse
FID1, FID2, FID3 3 Fiducial mark. There is nothing to buy or
mount. N/A N/A N/A
H1, H2, H3, H4 4 Machine screw, round, #4-40 × 1/4, Nylon,
Philips panhead Screw NY PMS 440 0025 PH B&F Fastener Supply
H5, H6, H7, H8 4 Standoff, hex, 0.5"L #4-40 nylon Standoff 1902C Keystone
J1 1 Standard banana jack, insulated, 10 A, red 571-0500 571-0500 DEM Manufacturing
J2 1 Receptacle, USB 2.0, micro-USB Type B,
R/A, SMT
USB-micro B USB 2.0,
0.65 mm, 5 pos, R/A, SMT 10118194-0001LF FCI
J3, J5, J8, J13 1 Header, 2.54 mm, 2×1, gold, TH Header, 2.54 mm, 2×1, TH 61300211121 Wurth Elektronik
J4 1 Standard banana jack, insulated, 10 A,
black 571-0100 571-0100 DEM Manufacturing
J6 1 Header, 100 mil, 4×2, gold, TH 4×2 header TSW-104-07-G-D Samtec
J7, J10, J12 1 Connector, end launch SMA, 50 Ω, SMT End launch SMA 142-0701-801 Cinch Connectivity
J9, J11 1 Header, 100 mil, 3×2, gold, TH 3×2 header TSW-103-07-G-D Samtec
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Table 4-1. DAC82002EVM Bill of Materials (continued)
Designator Quantity Value Description Package Reference Part Number Manufacturer
L1 1 600 Ω Ferrite bead, 600 Ω at 100 MHz, 1 A, 0603 603 782633601 Wurth Elektronik
LBL1 1 Thermal transfer printable labels, 0.650" W
x 0.200" H - 10,000 per roll
PCB label 0.650 × 0.200
inch THT-14-423-10 Brady
R1 1 12.0 kΩ RES, 12.0 kΩ, 0.1%, 0.1 W, 0603 603 RG1608P-123-B-T5 Susumu Co Ltd
R2, R3, R5, R34 4 10 kΩ RES, 10 kΩ, 5%, 0.1 W, 0603 603 RC0603JR-0710KL Yageo
R4 1 47.0 kΩ RES, 47.0 kΩ, 1%, 0.1 W, 0603 603 RC0603FR-0747KL Yageo
R8, R9 2 10 Ω RES, 10.0 Ω, 1%, 0.1 W, 0603 603 RC0603FR-0710RL Yageo
R10 1 1.00 MΩ RES, 1.00 MΩ, 1%, 0.1 W, AEC-Q200
grade 0, 0603 603 RMCF0603FG1M00 Stackpole Electronics Inc
R11, R12, R13, R14, R15, R16,
R17, R18, R19, R20, R21, R22,
R23, R24, R25, R26, R27, R28,
R29, R30, R31, R32, R33, R37,
R38, R39, R40, R41, R42, R43,
R44
31 0 Ω RES, 0 Ω, 5%, 0.1 W, 0603 603 RC0603JR-070RL Yageo
R35, R36 2 0 Ω 0-Ω jumper 0.1 W, 1/10 W chip resistor 0402
(1005 metric), thick film 402 CR0402-10W-000T Venkel
SH1, SH2, SH3, SH4, SH5 5 Shunt, 100 mil, gold-plated, black Shunt, 2 pos, 100 mil 881545-2 TE Connectivity
TP1, TP2, TP3, TP4, TP5, TP6,
TP8, TP9, TP10, TP11, TP12,
TP21, TP23, TP24, TP25, TP26,
TP27
1 Test point, miniature, white, TH White miniature test point 5002 Keystone
TP7, TP20 1 Test point, miniature, red, TH Red miniature test point 5000 Keystone
TP14, TP15, TP16, TP17, TP18,
TP19 6 Test point, multipurpose, black, TH Black multipurpose test point 5011 Keystone
U1 1 16-bit, low-glitch-energy, dual-channel
voltage-output DAC, WSON-10 WSON10 DAC82002DRXR Texas Instruments
U2 1 USB bridge, USB to I²C or SPI USB 2.0 I²C,
SPI 32-VQFN (5×5) VQFN32 FT4222HQ-D-R FTDI
U3 1 Micropower, 150-mA low-dropout CMOS
voltage regulator, 5-pin SOT-23, Pb-free DBV0005A LP5951MFX-3.3/NOPB Texas Instruments
U4 1
Low-noise, very low drift, precision voltage
reference, –40°C to +125°C, 8-pin SOIC
(D), green (RoHS and no Sb/Br)
D0008A REF5025AID Texas Instruments
U5, U7 2
Precision, zero-drift, zero-crossover, true
rail-to-rail input/output, operational amplifier,
D0008A (SOIC-8)
D0008A OPA388IDR Texas Instruments
U6 1
Precision, 40-MHz, 1.0-pA, low-noise,
RRIO, CMOS operational amplifier,
VSSOP-8
VSSOP8 OPA2328DGKR Texas Instruments
www.ti.com Schematic, PCB Layout, and Bill of Materials
SBAU401 – AUGUST 2022
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DAC82002EVM User's Guide 17
Copyright © 2022 Texas Instruments Incorporated

Table 4-1. DAC82002EVM Bill of Materials (continued)
Designator Quantity Value Description Package Reference Part Number Manufacturer
U8 1
Single power supply, quadruple buffer gate
with 3-state output CMOS logic level shifter,
PW0014A, large T and R
PW0014A SN74LV4T125PWR Texas Instruments
XU5, XU6, XU7 3 Socket, DIP-8, 2.54 mm pitch Socket, DIP-8, 2.54-mm
pitch 4808-3004-CP 3M
Y1 1 Crystal, 12 MHz, 30 ppm, 18 pF, SMD 11.4 mm × 4.7 mm ABLS2-12.000MHZ-D4Y-T Abracon Corporation
Schematic, PCB Layout, and Bill of Materials www.ti.com
18 DAC82002EVM User's Guide SBAU401 – AUGUST 2022
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Copyright © 2022 Texas Instruments Incorporated

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

www.ti.com
2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.