Texas Instruments TI CC3000 User manual

TI CC3000 BoosterPack Evaluation Board
User's Guide
Literature Number: SWRU331
November 2012

Contents
Preface ....................................................................................................................................... 4
1 Introduction ........................................................................................................................ 5
2 CC3000 BoosterPack Evaluation Board ................................................................................. 6
2.1 BoosterPack Board Top View ............................................................................................. 6
2.2 CC3000 BoosterPack Board Bottom View .............................................................................. 7
2.3 Antenna ...................................................................................................................... 9
2.4 Hardware Setup ........................................................................................................... 13
2.5 CC3000 BoosterPack Schematic ........................................................................................ 15
2.6 Bill of Materials (BOM) .................................................................................................... 16
2.6.1 PCB Design Guidelines .......................................................................................... 16
2.6.2 RF Trace ........................................................................................................... 16
2.6.3 Antenna ............................................................................................................ 17
2.6.4 Power Trace ....................................................................................................... 17
2.6.5 Ground ............................................................................................................. 18
3 Application Development ................................................................................................... 19
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List of Figures
2-1. BoosterPack Board Top View............................................................................................. 6
2-2. CC3000 BoosterPack Board Bottom View .............................................................................. 8
2-3. Antenna Location and RF Trace Routing................................................................................ 9
2-4. Matching Circuit Between the Antenna and the CC3000 BoosterPack ............................................ 10
2-5. Return Loss From the ACX Antenna and Matching Circuit.......................................................... 11
2-6. Antenna Radiation Pattern ............................................................................................... 12
2-7. Host PCB Mating Connector Arrangement ............................................................................ 13
2-8. CC3000 BoosterPack Schematics ...................................................................................... 15
2-9. Trace Design for PCB Layout............................................................................................ 16
2-10. Antenna Layout Guidelines .............................................................................................. 17
2-11. Power Trace................................................................................................................ 18
2-12. Ground Routing for the CC3000 BoosterPack Board................................................................. 18
3-1. MSP-EXP430G2 Test Platform and CC3000 BoosterPack Board.................................................. 19
List of Tables
2-1. Key Parts of CC3000 BoosterPack Board Top View................................................................... 6
2-2. J2 Configuration of the CC3000 Evaluation Module Board ........................................................... 7
2-3. Header J11 of the CC3000 BoosterPack Board Top View............................................................ 7
2-4. Header J12 of the CC3000 BoosterPack Board Top View............................................................ 7
2-5. Header J9 of the CC3000 BoosterPack Board Bottom View.......................................................... 8
2-6. Header J10 of the CC3000 BoosterPack Board Bottom View........................................................ 8
2-7. Launchpad to BoosterPack Pin Comparison .......................................................................... 13
2-8. PCB Stack-Up Data....................................................................................................... 16
2-9. Trace Design Measurement Values .................................................................................... 16
3
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Preface
SWRU331–November 2012
Read This First
About This Manual
This user guide describes how to use the TI CC3000 BoosterPack evaluation board to evaluate the
performance of the TI CC3000 module.
Related Documentation From Texas Instruments
•TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor Data Sheet (SWRS126)
• CC3000 Wiki for MCU: http://processors.wiki.ti.com/index.php/CC3000_Wi-Fi_for_MCU
If You Need Assistance
The primary sources of CC3000 information are the device-specific data sheets and user’s guides. For the
most up-to-date version of the user’s guide and data sheets, go to http://www.ti.com/product/cc3000.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable
protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense will be required
to take whatever measures may be required to correct this interference.
SimpleLink is a trademark of Texas Instruments.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
4Read This First SWRU331–November 2012
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Chapter 1
SWRU331–November 2012
Introduction
This user guide describes how to use the TI CC3000 BoosterPack evaluation board to evaluate the
performance and functionality of the TI CC3000 module. The TI CC3000 module is a self-contained Wi-Fi®
solution that enables internet connectivity for a wide variety of embedded applications. This document
details the key parts and features of the CC3000 BoosterPack evaluation board along with the different
options available for the user and includes layout guidelines to assist in PCB development.
5
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SWRU331-001
Chapter 2
SWRU331–November 2012
CC3000 BoosterPack Evaluation Board
2.1 BoosterPack Board Top View
Figure 2-1 Table 2-1 describe the key parts and jumpers mounted on top of the CC3000 BoosterPack
board. Table 2-2 describes the J2 configuration of the CC3000 evaluation module (EM) board. Table 2-3
and Table 2-4 describe the signals on J11 and J12.
Figure 2-1. BoosterPack Board Top View
Table 2-1. Key Parts of CC3000 BoosterPack Board Top View
Part Name Description
CC3000MOD Core module for performance evaluation (for more information, see the CC3000 module
datasheet)
Antenna Can be used for radiated testing by reworking the capacitor to correct pads
J1 U.FL RF connector used for conductive power tests
J2 Used to swap between test mode and operation mode. When pins 2 and 3 are shorted, J2 runs in
operation mode. When pins 1 and 2 are shorted, J2 runs in test mode.
J11 Through-hole test points (for more information, see Table 2-3)
J12 Through-hole test points (for more information, see Table 2-4)
J13 Used to switch between external power and power from the motherboard. Can be used for power
measurements. Connect pins 1 and 2 for power from the LaunchPad flash programmer and
debugging tool. Connect pins 2 and 3 for external power.
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www.ti.com CC3000 BoosterPack Board Bottom View
Table 2-1. Key Parts of CC3000 BoosterPack Board Top View (continued)
Part Name Description
J14 DC jack for external power supply. If power is not supplied from the motherboard, ensure that
external power is applied.
Table 2-2. J2 Configuration of the CC3000 Evaluation Module Board
Mode Description
Test mode: CC3000 radio Connect pins 1 and 2. Test mode is used with the CC3000 radio tool to operate, test, and
tool(1) calibrate the CC3000 chip-set designs during development. This tool uses the RS232/UART pins
to run radio frequency (RF) RX and TX tests on the CC3000 module. For more information, see
the CC3000 wiki.
Functional mode: Normal mode Connect Pins 2 and 3. Normal mode is for regular functionality between the host platform and the
CC3000 module.
(1) For more information about test software for the PC, go to the CC3000 wiki at
http://processors.wiki.ti.com/index.php/CC3000_Wi-Fi_for_MCU.
Table 2-3. Header J11 of the CC3000 BoosterPack Board Top View
Pin Pin Name Pin Type Descriptions
1 Reserved – Reserved
2 Reserved – Reserved
3 WL_RS232_TX Output RS232 transmit output; Used for radio tool serial
interface in test mode. Leave floating in functional mode.
4 WL_RS232_RX Input RS232 receive output; Used for radio tool serial interface
in test mode. Leave floating in functional mode.
Table 2-4. Header J12 of the CC3000 BoosterPack Board Top View
Pin Pin Name Pin Type Descriptions
1 GND – Ground
2 SCL_CC3000 Output I2C clock signal output from the CC3000 device. This pin
is connected to SCL_EEPROM through a 0-Ωresistor
and is not used by end users.
3 SCL__EEPROM Input I2C clock signal input from EEPROM inside
CC3000MOD. This pin is connected to SCL_CC3000
using a 0-Ωresistor and is not used by end users.
4 SDA_CC3000 Input and Output I2C data signal from the CC3000 device. This pin is
connected to SDA_EEPROM using a 0-Ωresistor and is
not used by end users.
5 SDA_EEPROM Input and Output I2C data signal from EEPROM inside CC3000MOD. This
pin is connected to the SDA_CC3000 device using a 0-Ω
resistor and is not used by end users.
2.2 CC3000 BoosterPack Board Bottom View
The two BoosterPack mating connectors (J9 and J10) connect to the host platform and mount to the
bottom of the BoosterPack board, as shown in Figure 2-2.Table 2-5 and Table 2-6 describe the signals
on J9 and J10.
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CC3000 BoosterPack Board Bottom View www.ti.com
Figure 2-2. CC3000 BoosterPack Board Bottom View
Table 2-5. Header J9 of the CC3000 BoosterPack Board Bottom View
Pin Pin Name Pin Type Descriptions
1 VBAT_IN Power In Battery voltage input to module. For the MSP430 host
platform, VIO_HOST = VBAT_IN. For other platforms
that have different voltage levels from the battery
voltages, R14 can be removed.
2 VBAT_SW_EN Input Active-high enables signal from the host device
3 Reserved – Reserved
4 Reserved – Reserved
5 Reserved – Reserved
6 Reserved – Reserved
7 WL_SPI_CLK Input Host interface SPI clock input
8 Reserved – Reserved
9 Reserved – Reserved
10 Reserved – Reserved
Table 2-6. Header J10 of the CC3000 BoosterPack Board Bottom View
Pin Pin Name Pin Type Descriptions
1 GND – Ground
2 WL_SPI_IRQ Output Host interface SPI interrupt request
3 WL_SPI_CS Input Host interface SPI chip select
4 Reserved – Reserved
5 Reserved – Reserved
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SWRU331-003
AT8010-E2R9HAA
Z
XY
www.ti.com Antenna
Table 2-6. Header J10 of the CC3000 BoosterPack Board Bottom View (continued)
Pin Pin Name Pin Type Descriptions
6 WL_SPI_DIN Input Host interface SPI data input
7 WL_SPI_CLK Input Host interface SPI clock input
8 Reserved – Reserved
9 Reserved – Reserved
10 Reserved – Reserved
2.3 Antenna
The ACX ceramic mounts on the BoosterPack board with a specific layout and matching circuit for the
radiation tests conducted in FCC, CE, and IC certifications. Figure 2-3 shows the location of the ACX
ceramic antenna on the BoosterPack board and the RF trace routing from the CC3000 device to the
antenna. Figure 2-3 shows the matching circuit between the antenna and the BoosterPack board.
Figure 2-3. Antenna Location and RF Trace Routing
9
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AT8010-E2R9HAA
1.8 nH
1.5 pF
Antenna www.ti.com
Figure 2-4. Matching Circuit Between the Antenna and the CC3000 BoosterPack
The return loss is based on the matching circuit and RF trace routing, as shown in Figure 2-5.
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