Texas Instruments DS280MB810EVM User manual

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DS280MB810EVM User’s Guide
User's Guide
SNLU213A–October 2016–Revised September 2019
DS280MB810EVM User’s Guide
The DS280MB810 is an 8 Channel Linear Repeater with the ability to extend the reach and robustness of
high speed serial links for up to 28 Gbps interfaces. Simplified equalization control, low power
consumption, and ultra-low additive jitter make the DS280MB810 ideal for front-port interfaces such as
100G-SR4/LR4/CR4 and backplane applications. The small 8 mm x 13 mm package easily fits behind
numerous standard front-port connectors, including SFP28, QSFP28, CFP2/CFP4, and CDFP, without the
need for a heat sink. The optimized package dimensions, high-speed signal escape, and the pin-
compatible retimer portfolio make the DS280MB810 well-suited for high-density backplane and front port
applications. The DS280MB810 can be configured via the default SMBus slave mode or with an external
EEPROM. With this kit, users can quickly evaluate the linear equalizer’s performance.
Figure 1. DS280MB810EVM.

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DS280MB810EVM User’s Guide
Contents
1 Features....................................................................................................................... 3
2 Applications................................................................................................................... 3
3 Ordering Information ........................................................................................................ 3
4 Setup .......................................................................................................................... 4
5 Example Hardware Test Setup........................................................................................... 14
6 Common Problems and Possible Solutions ............................................................................ 17
7 Bill of Materials ............................................................................................................. 18
8 EVM Cable Assemblies ................................................................................................... 21
List of Figures
1 DS280MB810EVM........................................................................................................... 1
2 DS280MB810EVM Block Diagram. ....................................................................................... 4
3 Repeater Profile Updater Installers........................................................................................ 6
4 DS280MB810EVM Default Configuration................................................................................. 7
5 SigCon Architect Configuration Page. .................................................................................... 8
6 SigCon Architect Low Level Page. ........................................................................................ 8
7 SigCon Architect High Level Page: Device Status. ..................................................................... 9
8 SigCon Architect High Level Page: Block Diagram.................................................................... 10
9 SigCon Architect High Level Page: Crossspoint Switch. ............................................................. 11
10 SigCon Architect High Level Page: Crosspoint Switch................................................................ 11
11 SigCon Architect EEPROM Page. ....................................................................................... 13
12 Example Test Set Up...................................................................................................... 14
13 25.78125 Gbps CAUI-4 Eye Mask with 5in input channel and minimal output channel ......................... 15
14 10.3125 Gbps nPPI Eye Mask with 5in Input Channel and Minimal Output Channel ............................ 15
15 25.78125 Gbps CAUI-4 Eye Mask with 10in Input Channel and Minimal Output Channel ...................... 16
16 10.3125 Gbps nPPI Eye Mask with 10in Input Channel and Minimal Output Channel .......................... 16
List of Tables
1 DS280MB810 Ordering Information....................................................................................... 3
2 Description of SMBus and EEPROM Connections...................................................................... 5
3 Test Point Connections (Output Voltage)................................................................................. 5
4 Settings and Measurements for CAUI-4 and nPPI with 5in Input Channel and Minimal Output Channel ..... 15
5 Settings and Measurements for CAUI-4 and nPPI with 10in Input Channel and Minimal Output Channel ... 16
Trademarks
All trademarks are the property of their respective owners.

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DS280MB810EVM User’s Guide
1 Features
• 8-Channel Unidirectional Repeater operating at rates up to 28 Gbps; 4 channels available for EVM
testing
• Linear Equalization that allows for support of link training protocols
• Programmed by external EEPROM or SMBus interfaces
• Single supply operation: 2.5V ± 5% or 3.3 V ± 5%
2 Applications
• Front-Port Eye Opener for Optical (28G-VSR and CAUI-4) and Copper Cables (100G-CR4)
• Backplane Reach Extension (100G-KR4)
• SFP28, QSFP28, CFP2/CFP4, CDFP
3 Ordering Information
Table 1. DS280MB810 Ordering Information
EVM ID DEVICE ID DEVICE PACKAGE
DS280MB810EVM DS280MB810 nfBGA (135)
NOTE: Huber+Suhner MXP cable assembles are not provided with this EVM. Users are expected to
provide cabling to connect to other boards and test equipment. For MXP cabling
recommendations please see Section 8.

EEPROM
Config headers
DS280MB810
(top view)
I2C debug
header
3.3V
(Optional)
GND
2.5V
Test loops for
supplies close
to device
2.5v
Reg
Disable
LED
LED
USB
A1
RX0 RX1 RX2 RX3 RX4 RX5 RX6 RX7
TX0 TX1 TX2 TX3 TX4 TX5 TX6 TX7
REFCLK in
SMA
25
MHz
REFCLK out
SMA
MSP430
On
Off
SMBusAddress
and
3.3V Æ2.5V
regulator
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DS280MB810EVM User’s Guide
4 Setup
This section describes the jumpers and connectors on the EVM as well as how to connect, set up, and
use the DS280MB810EVM.
Figure 2. DS280MB810EVM Block Diagram.
4.1 Modes of Programmable Communication
The DS280MB810EVM can be programmed in one of two modes:
1. SMBus Mode – Provides full access to the DS280MB810 status and control settings via the on-board
USB2ANY. ADDR0 and ADDR1 pins are used to set the SMBus slave address.
2. External EEPROM – Provides access to the DS280MB810’s EEPROM programmable control settings
via an 8 pin EEPROM. Only a subset of SMBus slave register bits is written to EEPROM. The
EEPROM can program up to 16 slave devices.
For convenient use, a USB-to-Mini cable provides a direct connection via J27.

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4.2 Configuration Overview
The following tables provide a description of the connectors on the DS280MB810EVM.
Table 2. Description of SMBus and EEPROM Connections
Component Name Description
J18.1, J18.2, J18.3, J18.4, J18.5,
J18.6, J18.7, J18.8 RXN3, RXP3, RXN2, RXP2, RXN1, RXP1, RXN0, RXP0 High-speed differential input pairs
J19.1, J19.2, J19.3, J19.4, J19.5,
J19.6, J19.7, J19.8 TXP0, TXN0, TXP1, TXN1, TXP2, TXN2, TXP3, TXN3 High-speed differential output pairs
J14.1, J14.3 SDA, SCL SMBus Access (OPTIONAL)
J6 ADDR0 4-level strap pins used to set
J11 ADDR1 the SMBus address
J209 EN_SMB 4-level input to select between SMBus
master (float) or slave mode (high)
J211 READ_EN_N Weak pull up for SMBus Master or Slave
Mode
U2 EEPROM 8-pin DIP Socket for EEPROM
J1 CAL_CLK_IN External 25MHz Calibration Clock Input
J2 CAL_CLK_OUT External 25MHz Calibration Clock Output
J208 PWR 2.5 V for DC Power
J14 PWR 3.3 V for DC Power
J19 GND Ground
J27 USB2ANY USB connection for EVM software control
Table 3. Test Point Connections (Output Voltage)
Component Name Description
TP4 GND Common Ground
TP5 VDD +2.5 V Input
TP6 GND Common Ground
TP7 VDD +3.3 V Input
4.3 Software Setup with SigCon Architect
The general procedure for setting up and testing with the DS280MB810EVM is as follows. For hardware
setup and connections in the steps below, reference the illustrations in Figure 2 and Figure 4 to implement
the appropriate setup.
1. (One-time step) Choose one of the TI SigCon Architect installers to download from the SigCon
Architect Tools Folder on TI.com. Follow the prompts to install software.
•SNLC055: With LabVIEW RTE embedded. Download this folder to install SigCon Architect on a
computer without Internet access.
•SNLC054: Without LabVIEW RTE embedded. Download this folder to install SigCon Architect on a
computer with Internet access.
2. (One-time step)Download the relevant zip folder for the desired profile. For this evaluation module,
select the zip folder for all available repeater profiles.
•SNLC056: Repeater profile updaters.

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Figure 3. Repeater Profile Updater Installers.
Choose the Updater.exe profile for the relevant device. In this case, install “DS280MB810
Updater.exe.” Follow the prompts to install.
Once SigCon Architect and the correct updater profiles are installed, close any existing instance of
SigCon Architect again.
3. Connect 2.5 V power via banana plugs to VIN on J208 and GND to GND on J13, or connect 3.3 V
power via banana plugs to VIN on J14 and GND to GND on J13.
• For VDD = 2.5 V: Tie J198 jumper pins 1-2.
• For VDD = 3.3 V: Remove jumper shunt between pins 1 and 2 on J198. Tie J207 jumper pins 10-
9, 8-7, 6-5, 4-3, and 2-1.
4. Install the appropriate jumper shunt to operate with an internal or external calibration clock.
NOTE: The Reference Clock is not required for DS280MB810 operation.
5. Install the appropriate jumper shunts to operate in default configuration with VDD = 2.5 V in SMBus
Slave Mode or EEPROM Master Mode. The default configuration for the DS280MB810EVM operates
in SMBus Slave Mode, as shown below in Figure 4.
• J6 and J11: Tie jumper pins 10-9 in order to set the device slave address = 0x30. For all other
SMBus slave addresses, reference the DS280MB810 data sheet.
• J25: Tie jumper pins 3-1 and 4-2 in order to connect the SMBUS signals.
• J10: Tie jumper pins 3-1 and 4-2.
• J8: Tie jumper pins 2-1 and 4-3.
•(SMBus Only) J209: Tie jumper pins 6-5 to set ENSMB = 1 (1 kΩto VDD).
•(EEPROM Only) J209: Float the jumper shunt to set ENSMB=F.

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Figure 4. DS280MB810EVM Default Configuration.
NOTE: The jumper on J211 (if present) is connected only to pin 12, which is the pin in the white
box in Figure 4 (the top right pin).
6. Connect a PC to DS280MB810EVM with a USB-to-Mini cable via J27.
7. Open SigCon Architect, and navigate to the “Configuration” page of DS280MB810 via the “Selection”
column. Choose “Slave Address” “0x30” from the drop down menu. Verify the “USB2ANY Details”
specify “USB2ANY 0," and click “Apply." Successful connection is indicated by the green
“CONNECTED” indicator on the bottom of the application, as seen below in Figure 5. Once connection
is successfully established, users can read and write various settings to the device in real-time, as
described in the following steps.

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Figure 5. SigCon Architect Configuration Page.
8. In order to read and write to all registers on the DS280MB810, navigate to the “Low Level Page," as
shown below in Figure 6. Only in SMBus Slave Mode can the user read and write to all programmable
registers. Click “Read All” in order to load the data in each register from the device to the “Register
Map."
•Read Register: Type the readable address in the “Current Address” text box. Click “Read
Register." The data in this register will appear in the “Data” text box.
•Write Register: Type the writable address in the “Current Address” text box, and type the data to
write to this address in the “Data” text box. Click “Write Register.”
Figure 6. SigCon Architect Low Level Page.

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9. In order to view a high level summary of the device status and control settings, navigate to the “High
Level Page," and remain on the “Device Status tab” as shown below in Figure 7. Click “Refresh From
Device” to ensure the settings shown are from the device. The settings on this page are not editable.
•Signal Detect Status: For each channel the device status is displayed as “Signal Not Detected” if
there is not a signal present at the RX side of this channel or “Signal Detected” if there is a signal
present at the RX side of this channel.
•Driver Power: The Driver Power can be turned on or off and the current status is displayed on the
Device Status page. The Driver Power is detected at the TX side of each channel.
•Control Settings: The remaining control settings are programmable through SigCon Architect.
The displayed values are the current settings programmed on the device. Step 10 describes how
to edit these settings.
Figure 7. SigCon Architect High Level Page: Device Status.

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10. In order to program high level settings, navigate to the “Block Diagram” tab on the “High Level Page”
as shown below in Figure 8. The EQ Settings and Output Configurations are programmable from this
page. In order to navigate to specific channels use the “Channel Select” drop down menu. Click
“Refresh from Device” to apply the device’s current settings to the control setting boxes. Click “Apply to
Channel” to program the device from the “Block Diagram” page. After programming the device, the
changed settings can be verified on the “Device Status” page, Figure 7. The CAL_CLK Detected
indicator provides a visual representation of whether a calibration clock is active.
•EQ Settings:
– The Equalizer works as a high pass filter compensating for input channel loss.
– The EQ Boost 1, EQ Boost 2, and EQ Boost BW values respectively apply boost to their
respective segments as shown below on the block diagram.
– The EQ DC Gain setting can be either Low or High Gain.
•Driver Output:
– A linear equalizer does not utilize a limiting amplifier. Linear equalizers are necessary for an
application with link training or end to end equalization.
– Driver VOD and EQ DC Gain settings can be changed on this page. The Approximate DC gain
in dB ranges from -4.5 to +5.0 dB.
Figure 8. SigCon Architect High Level Page: Block Diagram.

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11. In order to program each of the internal 2x2 crosspoints, navigate to the “Crosspoint Switch” tab on
the “High Level Page” as shown below in Figure 9. The Crosspoint Switch Status of the entire device is
displayed on the right-hand side. The colors help to show the configuration of each channel in the
DS280MB810.
•Crosspoint Configuration:
– Default: Results in a 1:1 function.
– Fanout: Results in a 1:2 function
– Lane Crossing: Swaps the outputs within the 2x2 crosspoint
Figure 9. SigCon Architect High Level Page: Crossspoint Switch.
Figure 10. SigCon Architect High Level Page: Crosspoint Switch.

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12. In order to create a Hex file programmable to an EEPROM, navigate to the “EEPROM Page," as
shown in Figure 11. In order to update the settings from the device click “Update Slot from Device." In
order to create the programmable hex file, click “Write to EEPROM Hex." The evaluation module does
not include an EEPROM, but an external EEPROM can be used. SigCon Architect cannot directly
program the EEPROM. The EEPROM Hex File can be burned on the EEPROM via I2C
communication (i.e. AARDVARK or equivalent interface adapter). The EEPROM control settings are
described in greater detail below.
•Output Configurations: If this box is checked, all channels receive the same configuration.
Different devices can receive different configurations, but within one device, all channels will
receive the same configuration. If this box is unchecked, then the EEPROM will store the
configurations as unique channel configurations. Each of the four channels can receive a unique
configuration.
•EEPROM > 256:
– This setting must be enabled if there are more than 4 EEPROM slots.
– When this box is checked, the “EEPROM Size” drop down menu is automatically populated by
512 Bytes if previously populated by 256 Bytes.
– When this box is unchecked, the “EEPROM Size” drop down menu is automatically populated
by 256 Bytes. Up to 4 EEPROM slots can be programmed.
•Enable CRC: If enabled, each device will have a CRC value specific to the base header, address
map header, and data. If disabled, the CRC is not computed.
•Slot Update Details: The number of slots refers to the total number of unique SMBus register
settings to load from the EEPROM. The user can choose to update all slots, or which slot number
to update the SigCon Architect EEPROM page from.
•EEPROM Size: The EEPROM size must be set to 256, 512, or 1024 bytes. A single external
EEPROM can be used by up to 16 x DS280MB810 devices.
– The first 3 bytes of EEPROM data is the base header. The base header contains the CRC
Enable Bit, Aaddress Map Header Enable Bit, EEPROM > 256 Bytes Enable Bit, device count,
and maximum EEPROM burst size settings.
– If multiple devices are programmed, an address map header is needed for each device. The
address map header specifies the CRC value and the Device EEPROM Start Address.
– If EEPROM Size > 256 Bytes Enable Bit is NOT set:
• EEPROM Size = 3 Bytes (Base Header) + Number of devices x 8 Bytes/device (Address
Header) + Number of slots x 66 Bytes/slot (Data)
– If EEPROM Size > 256 Bytes Enable Bit is set:
• EEPROM Size = 3 Bytes (Base Header) + Number of devices x 12 Bytes/device (Address
Header) + Number of slots x 66 Bytes/slot (Data)

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Figure 11. SigCon Architect EEPROM Page.
NOTE: Profile versions 1.0.1.0 and earlier do not support CRC with EEPROM size set to larger 256
bytes. This feature will be available in future releases.

Note 1: Only lower 4-channels shown
Note 2: Internal RX AC coupling capacitors
RX2P
RX2N TX2P TX2N
RX3P
RX3N TX3P TX3N
RX0P
RX0N TX0P TX0N
RX1P
RX1N TX1P TX1N
DS280MB810EVM
X
X
INPUT
CHANNELS OUTPUT
CHANNELS
DATA
SOURCE
(up to 28 Gbps)
SCOPE
or
BERT
(up to 28 Gbps)
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5 Example Hardware Test Setup
In order to test the functionality of the DS280MB810EVM, connect TXP0 and TXN0 with MXP cable
assemblies to DC blocking capacitors and a Keysight DCA-x Oscilloscope or equivalent (50 Ωterminated).
Connect the data source, high speed BERT or other device with MXP cable assemblies to RXP0 and
RXN0. Add input and output channels as desired to emulate a system topology. Use the Jitter/Noise and
Eye/Mask functions on the Oscilloscope to view the output. The test set up can be seen below in
Figure 12.
Figure 12. Example Test Set Up

Time (6.46 ps/DIV)
Voltage (162 mV/DIV)
Time (16.16 ps/DIV)
Voltage (162 mV/DIV)
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5.1 Equalizing Moderate Pre-Channel Loss
The following is an example test setup configuration which demonstrates the DS280MB810 equalizing for
moderate pre-channel insertion loss introduced by an FR4 channel at 25.78125 Gbps and 10.3125 Gbps.
Figure 13. 25.78125 Gbps CAUI-4 Eye Mask with 5in input
channel and minimal output channel Figure 14. 10.3125 Gbps nPPI Eye Mask with 5in Input
Channel and Minimal Output Channel
Table 4. Settings and Measurements for CAUI-4 and nPPI with 5in Input Channel and Minimal
Output Channel
25.78125 Gbps (CAUI-4) 10.3125 Gbps (nPPI)
Transmission Line 1 5 in 5 mil FR4 + 8in SMA cable 5 in 5 mil FR4 + 8 in SMA cable
DS280MB810 Rx Channel Loss 14 dB @ 12.9 GHz
(includes 4 dB from the EVM and
Huber+Suhner cable assembly)
6 dB @ 5.2 GHz
(includes 2 dB from the EVM and
Huber+Suhner cable assembly)
DS280MB810 Tx Channel Loss 4.5 dB @ 12.9 GHz
(includes 4 dB from the EVM and
Huber+Suhner cable assembly)
2 dB @ 5.2 GHz
(attributed to the EVM and Huber+Suhner
cable assembly)
EQ BST1 3 3
EQ BST2 0 0
EQ BW 3 3
VOD 3 2
EQ DC Gain Mode Low Low
Total Jitter @ 1E-15 11.9psP-P 13.0psP-P
Differential Eye Height @ 1E-15 338mVP-P 544mVP-P
Mask violations 0 0

Time (6.46 ps/DIV)
Voltage (160 mV/DIV)
Time (16.16 ps/DIV)
Voltage (140 mV/DIV)
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5.2 Equalizing High Pre-Channel Loss
The following is an example test setup configuration which demonstrates the DS280MB810 equalizing for
high pre-channel insertion loss introduced by an FR4 channel at 25.78125 Gbps and 10.3125 Gbps
Figure 15. 25.78125 Gbps CAUI-4 Eye Mask with 10in
Input Channel and Minimal Output Channel Figure 16. 10.3125 Gbps nPPI Eye Mask with 10in Input
Channel and Minimal Output Channel
Table 5. Settings and Measurements for CAUI-4 and nPPI with 10in Input Channel and Minimal
Output Channel
25.78125 Gbps (CAUI-4) 10.3125 Gbps (nPPI)
Transmission Line 1 10 in 5 mil FR4 + 8in SMA cable 10 in 5 mil FR4 + 8 in SMA cable
DS280MB810 Rx Channel Loss 22 dB @ 12.9 GHz
(includes 4 dB from the EVM and
Huber+Suhner cable assembly)
10 dB @ 5.2 GHz
(includes 2 dB from the EVM and
Huber+Suhner cable assembly)
DS280MB810 Tx Channel Loss 4.5 dB @ 12.9 GHz
(includes 4 dB from the EVM and
Huber+Suhner cable assembly)
2 dB @ 5.2 GHz
(attributed to the EVM and Huber+Suhner
cable assembly)
EQ BST1 6 6
EQ BST2 1 1
EQ BW 3 3
VOD 3 2
EQ DC Gain Mode Low Low
Total Jitter @ 1E-15 11.3psP-P 13.5psP-P
Differential Eye Height @ 1E-15 210mVP-P 532mVP-P
Mask violations 0 0

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6 Common Problems and Possible Solutions
PROBLEM ADDITIONAL INFORMATION POSSIBLE SOLUTIONS
Cannot power on the
EVM.
2.5 Volt Power.
D35 LED is off.
• J198: jumper pins 1-2 tied.
• J207: jumper pins should be set to float.
• Verify configuration with Figure 4 .
3.3 Volt Power.
D35 LED is off. • J198: remove jumper shunt, pins 1-2 cannot be tied in
order to enable 2.5 V regulator.
• J207: jumper pins 10-9, 8-7, 6-5, 4-3, and 2-1 tied.
Cannot program with an
interface adapter in
SMBus Slave Mode.
SigCon Architect is operating in Demo
Mode.
• Verify the jumper settings are correct ( Figure 4).
• Verify the slave address is set to 0x30 for SMBus Slave
Mode.
• Verify the device is powered on.
• Update Firmware on EVM using “USB2ANY Explorer."
Never used SigCon Architect, and cannot
establish connection with device. • Reinstall SigCon Architect. It is essential SigCon
Architect is closed during any portion of the installation
process.
Oscilloscope’s Output
Eye Diagram is not as
expected.
Pattern does not lock on oscilloscope.
• Transmit a signal from the BERTScope with a different
PRBS pattern. Once initial pattern lock is established,
re-attempt desired pattern.
• Transmit a signal from the BERTScope with a lower
frequency. Once initial pattern lock is established, re-
attempt desired frequency.
Eye diagram does not pass mask. • Vary EQ Boost Settings as seen in Figure 8.
Cannot burn EEPROM
Hex File to EEPROM
with SigCon Architect.
• SigCon Architect can only be used to generate the Hex
File. Another interface adapter must be used to burn
the Hex File to the EPPROM. (i.e. AARDVARK or
equivalent ).

Bill of Materials www.ti.com
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7 Bill of Materials
# QUANTITY REFERENCE VALUE PART NUMBER DESCRIPTION
1 1 C327 1 uF C0603X5R0J105M030BC CAP CER 1UF 6.3V 20% X5R 0201
2 1 C2 0.1uF C1005X7R1H104K050BB CAP CER 0.1UF 50V 10% X7R 0402
3 12 C68,C69,C70,C71,C329,C330,C
333,C334,C335,C336,C337,C33
8
0.1uF C0603X5R1E104K030BB CAP CER 0.1UF 25V 10% X5R 0201
4 1 C5 10 uF GRM21BR61E106KA73L CAP CER 10UF 25V 10% X5R 0805
5 1 C6 1 uF GRM188R61E105KA12D CAP CER 1UF 25V 10% X5R 0603
5 1 C7 22 uF T491C226M016ZT CAP TANT 22UF 16V 20% 2413
6 1 C18 2.2 nF C0603C222M3RACTU CAP CER 2200PF 25V 20% X7R 0603
7 3 C19,C22,C24 0.1 uF GRM155R71C104KA88D CAP CER 0.1UF 16V 10% X7R 0402
8 2 C20,C21 30 pF GRM1885C1H300JA01D CAP CER 30PF 50V 5% NP0 0603
9 1 C23 0.47 uF EMK107B7474KA-T CAP CER 0.47UF 16V 10% X7R 0603
10 1 C25 0.1 uF C0603C104K4RACTU CAP CER 0.1UF 16V 10% X7R 0603
11 2 C26,C31 220 pF C0603C221K5RACTU CAP CER 220PF 50V 10% X7R 0603
12 1 C27 22 uF EEE-1AA220WR CAP ALUM 22UF 10V 20% SMD
13 1 C28 1 uF C2012X7R1C105K125AA CAP CER 1UF 16V 10% X7R 0805
14 1 C29 0.01 uF CGJ3E2X7R1C103K080AA CAP CER 10000PF 16V 10% X7R 0603
15 1 C30 2.2 uF LMK212B7225KG-T CAP CER 2.2UF 10V 10% X7R 0805
16 2 C299,C332 1 uF CC0603ZRY5V6BB105 CAP CER 1UF 10V Y5V 0603
17 1 C300 47 uF TAJB476K010RNJ CAP TANT 47UF 10V 10% 1210
18 1 C328 10 uF AMK105CBJ106MV-F CAP CER 10UF 4V 20% X5R 0402
19 1 C331 10 uF TAJP106M010RNJ CAP TANT 10UF 10V 20% 0805
20 5 D1,D2,D4,D36,D38 LED LTST-C191KGKT LED GREEN CLEAR THIN 0603 SMD.
21 3 D6,D8,D35 RED-LED LS M67K-J2L1-1-Z LED MINI TOPLED RED 630NM SMD
22 1 D9 1SMB5922BTS 1SMB5922BT3G DIODE ZENER 7.5V 3W SMB
23 1 FB1 BK1608HS600-T BK1608HS600-T FERRITE BEAD 60 OHM 0603
24 2 J1,J2 SMA 142-0701-201 CONN SMA JACK STR 50 OHM PCB
25 2 J5,J210 HEADER_3 87224-3 CONN HEADER VERT .100 3POS 15AU
26 4 J6,J11,J209,J211 HEADER 6X2 87227-6 CONN HEADER VERT .100 12POS 15AU
27 4 J8,J10,J21,J25 HEADER 2X2 87227-2 CONN HEADER VERT .100 4POS 15AU
28 1 J9 4 HEADER 901200764 CONN HEADER 4POS .100" STR GOLD
29 1 J13 Binding Post, Keystone
7007, Black 7007 POST BINDING ECON NYLON-INS BLK
30 2 J14,J208 Binding Post, Keystone
7006, Red 7006 POST BINDING ECON NYLON-INS RED

www.ti.com Bill of Materials
19
SNLU213A–October 2016–Revised September 2019
Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated
DS280MB810EVM User’s Guide
# QUANTITY REFERENCE VALUE PART NUMBER DESCRIPTION
31 4 J18,J19,J203,J204 1x8A_81_MXP-S50-0-2 1x8A_81_MXP-S50-0-2/111_NE
32 2 J24,J26 HEADER 2 87224-2 CONN HEADER VERT .100 2POS 15AU
33 1 J27 USB_Conn_1734035-2 1734035-2 CONN MINI USB RCPT RA TYPE B SMD
34 1 J198 HEADER, 2-PIN 87224-2 CONN HEADER VERT .100 2POS 15AU
35 1 J207 HEADER 5x2/SM_1 87227-5 CONN HEADER VERT .100 10POS 15AU
36 1 Q1 BSS138 BSS138 MOSFET N-CH 50V 220MA SOT-23
37 3 R1,R3,R48 4.7K ERJ-2GEJ472X RES 4.7K OHM 1/10W 5% 0402 SMD
38 2 R2,R4 100 CRCW0402100RFKEDHP RES 100 OHM .125W 1% 0402 SMD
39 6 R5,R20,R30,R47,R409,R418 249 RC1005F2490CS RES 249 OHM 1/16W 1% 0402
40 3 R6,R7,R8 2.7K ERJ-2GEJ272X RES 2.7K OHM 1/10W 5% 0402 SMD
41 2 R9,R10 0 ERJ-2GE0R00X RES 0.0 OHM 1/10W JUMP 0402 SMD
42 5 R13,R14,R15,R17,R18 2.7K ERJ-2GEJ272X RES 2.7K OHM 1/10W 5% 0402 SMD
43 2 R16,R19 4.7K ERJ-2GEJ472X RES 4.7K OHM 1/10W 5% 0402 SMD
44 8 R21,R27,R33,R37,R406,R408,R
415,R417 1K ERJ-2GEJ102X RES 1.0K OHM 1/10W 5% 0402 SMD
45 4 R26,R36,R407,R416 10K ERJ-2GEJ103X RES SMD 10K OHM 5% 1/10W 0402
46 1 R43 750 ERJ-3GEYJ751V RES 750 OHM 1/10W 5% 0603 SMD
47 1 R45 33k RC0402JR-0733KL RES 33K OHM 1/16W 5% 0402 SMD
48 1 R46 200 ERJ-3GEYJ201V RES 200 OHM 1/10W 5% 0603 SMD
49 1 R49 10.0K ERJ3EKF1002V RES 10K OHM 1/10W 1% 0603 SMD
50 2 R50,R51 33 CRCW040233R2FKEDHP RES 33.2 OHM .125W 1% 0402 SMD
51 1 R52 1.5K CRCW04021K50FKEDHP RES 1.50K OHM .125W 1% 0402 SMD
52 1 R53 33K ERJ-2GEJ333X RES 33K OHM 1/10W 5% 0402 SMD
53 1 R54 1.2M ERJ-2GEJ125X RES 1.2M OHM 1/10W 5% 0402 SMD
54 2 R358,R359 10K CRCW040210K0FKEDHP RES 10.0K OHM .125W 1% 0402 SMD
55 1 R360 360 ERJ-3GEYJ361V RES 360 OHM 1/10W 5% 0603 SMD
56 1 SW1 SW_DIP_SWITCH 76STD01T SWITCH DIP TOGGLE 1POS
57 1 S1 EVQPSD02K EVQ-PSD02K SWITCH TACTILE SPST-NO 0.05A 12V
58 1 TP1 TEST POINT 5002 TEST POINT PC MINI .040"D WHITE
59 3 TP2,TP5,TP7 TEST POINT 5000 TEST POINT PC MINI .040"D RED
60 2 TP4,TP6 TEST POINT 5001 TEST POINT PC MINI .040"D BLACK
61 1 U1 Oscillator, 25 MHz, 2.5V 7C-25.000MCB-T OSC XO 25.000MHZ CMOS SMD
62 1 U2 PDIP 111-43-308-41-001000 IC SOCKET 8PIN .300 SOLDER TAIL
63 1 U6 MSP430 MSP430F5529IPN or
MSP430F5529IPNR IC MCU 16BIT 128KB FLASH 80LQFP
64 1 U7 TXB0108 TXB0108PWR IC 8-BIT TRNSTR 15KV ESD 20TSSOP

Bill of Materials www.ti.com
20 SNLU213A–October 2016–Revised September 2019
Submit Documentation Feedback
Copyright © 2016–2019, Texas Instruments Incorporated
DS280MB810EVM User’s Guide
# QUANTITY REFERENCE VALUE PART NUMBER DESCRIPTION
65 1 U8 TPD4E004DRY TPD4E004DRYR TVS DIODE 6SON
66 1 U9 TPS73533DRB TPS73533DRBT IC REG LDO 3.3V 0.5A 8SON
67 1 U11 DS280MB810
68 1 U16 TPS75725 TPS75725KTTRG3 IC REG LDO 2.5V 3A DDPAK
69 1 Y1 24.0 MHz ECS-240-20-5PX-TR CRYSTAL 24.000MHZ 20PF SMD
70 1 SV601167 REVE BOARD PCB