Texas Instruments TPIC8101 User manual

User's Guide
SLIU012–December 2015
TPIC8101 Evaluation Module
This user's guide describes the characteristics, operation, and use of the TPIC8101 Evaluation Module
(EVM). This EVM helps designers evaluate the operation and performance of the TPIC8101 dual-channel
knock sensor interface IC. A complete circuit description, schematic diagram, and bill of materials are also
included.
Contents
1 Introduction ................................................................................................................... 2
2 Setup .......................................................................................................................... 2
3 Ranges and Typical Setup for Evaluation................................................................................ 7
4 Board Layout ................................................................................................................ 9
5 Schematic ................................................................................................................... 10
6 TPIC8101EVM Bill of Materials........................................................................................... 11
List of Figures
1 TIGER Communication Board (Left) and IC EVM Board (Right)...................................................... 2
2 GUI : Default SPI Mode..................................................................................................... 4
3 GUI : Advanced SPI Mode ................................................................................................. 5
4 Sample Waveforms.......................................................................................................... 6
5 GUI Inputs .................................................................................................................... 7
6 Typical EVM Waveforms.................................................................................................... 8
7 Top Assembly Layer......................................................................................................... 9
8 Bottom Layer Routing....................................................................................................... 9
9 EVM Schematic............................................................................................................. 10
List of Tables
1 Device and Package Configurations ...................................................................................... 2
2 TPIC8101 EVM Jumpers ................................................................................................... 2
3 TPIC8101 EVM Test Points ................................................................................................ 3
4 Ranged for GUI Variables .................................................................................................. 7
5 TPIC8101EVM Bill of Materials........................................................................................... 11
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Introduction www.ti.com
1 Introduction
The Texas Instruments TPIC8101EVM evaluation module set helps designers evaluate the operation and
performance of the TPIC8101 dual-channel knock sensor interface IC. The EVM set contains one TI
communication board (TIger), one IC EVM board and TPIC8101 IC (see Table 1).
Table 1. Device and Package Configurations
Converter IC Package
U1 TPIC8101DWG4 DW-20
2 Setup
This section describes the setup of EVM, including EVM hardware and GUI operation.
2.1 EVM Hardware Connections
The TI communication board should be connected to the IC EVM board via a 30-pin connector in the
shipment box. Connect them if they are not connected yet, as shown in Figure 1.
Figure 1. TIGER Communication Board (Left) and IC EVM Board (Right)
Table 2 and Table 3 show the various jumpers and test points on the TPIC8101 EVM. Note that not all of
the test points are installed.
Table 2. TPIC8101 EVM Jumpers
Jumper Jumper Description
Designator Label
JP1 VDD_SEL Installed (default): When the USB is connected, the TI communication board supplies the 5-V VDD
rail.
Uninstalled: The 5-V rail must be supplied externally to the VIN test point.
JP2 CLK_SEL Installed (default): When USB is connected, the TI communication board supplies a clock signal to
the TPIC8101. The GUI can adjust the frequency.
Uninstalled: The clock must be supplied externally to the XCLK test point.
JP3 INT/H Installed (default): When the USB is connected, the TI communication board supplies the INT/H
square wave signal at the period specified in the GUI.
Uninstalled: The INT/H signal must be supplied externally to the INT/H jumper pin 2.
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www.ti.com Setup
Table 3. TPIC8101 EVM Test Points
Jumper Jumper Description
Designator Label
TP1 CH1 Channel 1 knock sensor input
TP2 CH2 Channel 2 knock sensor input
TP3 CH1N Connects to CH1N pin of TPIC8101
TP4 CH2N Connects to CH2N pin of TPIC8101
TP5 VREF Connects to VREF, CH1P, and CH2P pins of TPIC8101
TP6 CH1FB Connects to CH1FB pin of TPIC8101
TP7 CH2FB Connects to CH2FB pin of TPIC8101
TP8 TEST Connects to /TEST pin of TPIC8101
TP9 SCLK SPI clock line
TP10 SDI SPI slave data in line
TP11 SDO SPI slave data out line
TP12 /CS SPI chip select line
TP13 OUT Analog output of the TPIC8101
TP14 XCLK Clock input
TP15 VIN Connects to VDD pin of TPIC8101. Can be used to externally supply 5V if TI communication board is
not used.
GND1 GND1 Ground test point
GND2 GND2 Ground test point
GND3 GND3 Ground test point
2.2 TPIC8101 Quick-Start Guide
Use the following quick-start steps for the EVM:
1. Insert one end of a USB cable into the TIger communication board, the other end to the USB port in a
PC.
2. Connect a 5-V voltage supply
• 5 V is supplied by the TI communication board if the VDD_SEL jumper is connected (default
setting).
• 5 V is also supplied by connecting test point VDD with an external power supply and disconnecting
the VDD_SEL jumper.
3. Connect the high-frequency oscillation input (for example, 8 MHz)
• The high frequency oscillation signal is supplied by the TI communication board if the CLK_SEL
jumper is connected (default setting).
• The high frequency oscillation signal is also supplied by connecting test point XCLK with an
external function generator, and disconnecting the CLK_SEL jumper.
4. Supply the integration window signal (for example, 5 ms)
• The integration window signal is supplied by TI communication board if the INT/H jumper is
connected (default setting).
• The integration window signal is also supplied by removing the INT/H jumper and supplying the
signal externally with a function generator to pin 2 of the INT/H terminal.
5. Connect the knock sensor output signal (for example, 10 KHz)
• Knock sensor output signal is connected at test point CH1 or CH2 (for channel 1 and 2
correspondingly), from a knock sensor, or an external function generator.
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Setup www.ti.com
2.3 GUI Operation
2.3.1 Software Package
Download the TPIC8101 EVM GUI from the TPIC8101 EVM tool folder. After installing, run the executable
file TPIC8101EVM.exe to start the GUI.
Figure 2 illustrates the GUI. By default, the IC will be working on default SPI mode after power up, which
happens after the USB cable is plugged into the PC. If the USB cable is consistently plugged into PC, the
IC stays in either default SPI mode or advanced SPI mode, depending on the last operation. If the IC is in
the advanced SPI mode, restart the IC to return to default SPI mode.
2.3.2 Operation in Default SPI Mode
The SPI is in the default mode on the power up sequence. In this case, the SDO directly equals the SDI
(echo function). In this mode, five commands can be transmitted by the master controller (TI
communication board) to configure the IC. Find setting details on page 13 of the datasheet (SLIS110).
In each setting, select a value from the combo boxes, and press the Send SPI button. The exact same
SPI response should be read, if the IC works correctly.
• Set the prescaler and SDO status
• Select the channel
• Set the bandpass center frequency
• Set the gain
• Set the integration time constant
• Enter advanced SPI mode. Once the advanced mode is entered, there is no way to return to normal
mode, unless the device is restarted.
Figure 2. GUI : Default SPI Mode
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- m
m
t 25 s
HEX =
22 s
www.ti.com Setup
2.3.3 Operation in Advanced SPI Mode
The advanced SPI mode has additional features to the default SPI mode. A control byte is written to the
SDI and shifted with the MSB first. The response byte on the SDO is shifted out with MSB first. The
response byte corresponds to the previous command. Therefore, the SDI shifts in a control byte n and
shifts out a response command byte n −1. Each control/response pair of commands requires two full 8-bit
shift cycles to complete a transmission. The control bytes with the expected response are shown in page
14 of datasheet (SLIS110). In the advanced SPI mode, only a power-down condition resets the SPI mode
to the default state on the subsequent power-up cycle.
Figure 3. GUI : Advanced SPI Mode
2.3.4 Clock and Integration Window Settings
The TI communication board can generate 2 square wave forms, a high frequency one which could be
used as an external clock frequency signal, such as 8 MHz; and a low frequency one which could be used
as a integration window, such as 5 ms.
To use the external clock, check the Enable box and enter a desired frequency in the edit box. Press the
Update Osc button once the settings have been updated.
To use the integration window, check the Enable box and enter a 4-digit hex number in the edit box. Hex
0000 is the fastest square waveform the TI communication board can produce, and hex FFFF
corresponds to the slowest waveform. The waveform is generated by the GPIO of the micro controller,
therefore the frequency is approximate. For example, hex 01C6 generates a 100-Hz square waveform,
which could be used to serve as a 5 ms integration window. An approximate formula that can be used to
calculate the hex value needed for a given time window is as follows:
(1)
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Knock Sensor
Output
Integration
Window
IC Analog
Output
Setup www.ti.com
Sample waveforms of knock sensor output, integration window and IC analog output are shown in
Figure 4.
Figure 4. Sample Waveforms
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www.ti.com Ranges and Typical Setup for Evaluation
3 Ranges and Typical Setup for Evaluation
Table 4 shows the acceptable ranges of values that can be entered for each variable in the GUI.
Table 4. Ranged for GUI Variables
Variable Decimal Range SPI Command Range Number of Options
Set the prescaler and SDO status: Drop-down menu 0x40–0x51 18
Select the channel: Drop-down menu 0xE0–0xE1 2
Set the band-pass center frequency: 0 through 63 0x00–0x3F 64
Set the gain: 0 through 63 0x80–0xBF 64
Set the integration time constant: 0 through 31 0xC0–0xDF 32
EVM external clock frequency 4, 5, 6, 8, 10, 12, 16, 20, Not Applicable 9
24
Integration window setting Not Applicable 0x0000–0xFFFF 65536
Typical test set-up:
• External signal to CH1 or CH2: 300 mV peak to peak, 7.2-kHz signal to Channel 1
• EVM external clock frequency: 6 MHz
• Bandpass center frequency: 7.27 KHz (42nd gain setting (0x22), SPI 0x2A)
• Gain: .381 (34th gain setting (0x22), SPI 0xA2)
• Integration time constant: 106 µs (10th code, SPI 0xCA)
• Integration window setting: 0x0110
Refer to Figure 5 to see how to input these settings into the GUI.
Figure 5. GUI Inputs
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4.48 V
7270 kHz,
300 mVpp
INT,
3 ms
Output
Ranges and Typical Setup for Evaluation www.ti.com
This set-up results in the following:
Figure 6. Typical EVM Waveforms
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www.ti.com Board Layout
4 Board Layout
Figure 7 and Figure 8 show the board layout for the TPIC8101EVM PCB. The board layout and the PCB
for TIGER communication board are not provided.
Figure 7. Top Assembly Layer
Figure 8. Bottom Layer Routing
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VDD
1
GND 2
VREF
3
OUT 4
NC
5
NC
6
INT/HOLD 7
CS 8
XIN 9
XOUT 10
SDO 11
SDI 12
SCLK 13
TEST 14
CH2P
15
CH2N
16
CH2FB
17
CH1FB
18
CH1N
19
CH1P
20
U1
TPIC8101DWR
0.1µF
C5
4.7µF
C4
GND
5V
VIN
0.1µF
C6
GND
1.00MR6 470pF
C7
3300pF
C1
3300pF
C2
1.00k
R5
30.1k
R3
30.1k
R4
0.1µF
C3
GND
30.1k
R1
30.1k
R2
1
3
56
4
2
7
910
8
12 11
14 13
16 15
18 17
20 19
22 21
24 23
26 25
28 27
30 29
J1
PPPC152LFBN-RC
SDO
SCLK
/CS
SDI
5V
TCLK
SCLK
SDI
SDO
/CS
INH
TCLK
INH
0
R7
VIN
GND
GND
GND
TP1
CH1
TP2
CH2
TP15
VIN
TP13
OUT
TP9
TP10
TP11
TP12
TP8
TEST
TP14
XCLK
GND1 GND2 GND3
TP6
CH1FB
TP7
CH2FB
TP5
VREF
TP3
CH1N
TP4
CH2N
JP2
CLK_SEL
JP1
VDD_SEL
JP3
INT/H
Schematic www.ti.com
5 Schematic
Figure 9 illustrates the TPIC8101EVM schematic.
Figure 9. EVM Schematic
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