Texas Instruments IWR1443BOOST User manual

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IWR1443BOOST Evaluation Module mmWave Sensing Solution
User's Guide
SWRU518D–May 2017–Revised May 2020
IWR1443BOOST Evaluation Module mmWave Sensing
Solution

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Contents
1 Getting Started............................................................................................................... 3
1.1 Introduction .......................................................................................................... 3
1.2 Key Features ........................................................................................................ 3
1.3 What is Included .................................................................................................... 3
2 Hardware...................................................................................................................... 4
2.1 Block Diagram....................................................................................................... 5
2.2 Connecting BoosterPack™ to LaunchPad™ or MMWAVE-DEVPACK ..................................... 6
2.3 Power Connections................................................................................................. 7
2.4 Connectors .......................................................................................................... 7
2.5 PC Connection..................................................................................................... 11
2.6 Antenna............................................................................................................. 12
2.7 Jumpers, Switches, and LEDs .................................................................................. 14
3 Design Files and Software Tools......................................................................................... 16
3.1 Software, Development Tools, and Example Codes ........................................................ 16
4 Mechanical Mounting of PCB............................................................................................. 16
5 PCB Storage and Handling Recommendations........................................................................ 17
6 Regulatory Information .................................................................................................... 17
7 Troubleshooting ............................................................................................................ 17
List of Figures
1 EVM Front View.............................................................................................................. 4
2 EVM Rear View.............................................................................................................. 5
3 IWR14xxBOOST Block Diagram .......................................................................................... 5
4 3V3 and 5-V Mark on the LaunchPad™ (White Triangle).............................................................. 6
5 Power Connector ............................................................................................................ 7
6 20-Pin BoosterPack™ Connectors (J5 and J6).......................................................................... 7
7 High Density Connector (60 Pin) .......................................................................................... 9
8 CAN Connector............................................................................................................. 10
9 XDS110 Ports............................................................................................................... 11
10 PCB Antenna ............................................................................................................... 12
11 Antenna Pattern in H-Plane............................................................................................... 13
12 Antenna Pattern in E-Plane............................................................................................... 13
13 SOP Jumpers............................................................................................................... 14
14 Current Measurement Point .............................................................................................. 14
15 Vertical Assembly of the EVM............................................................................................ 16
List of Tables
1 20-Pin Connector Definition (J6)........................................................................................... 8
2 20-Pin Connector Definition (J5)........................................................................................... 8
3 HD Connector Pin Definition ............................................................................................... 9
4 Pin Names .................................................................................................................. 11
5 SOP Modes................................................................................................................. 14
6 Push Buttons................................................................................................................ 15
7 LEDs ......................................................................................................................... 15

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(1) BoosterPack, LaunchPad are trademarks of Texas Instruments.
(2) ARM is a registered trademark of ARM Limited.
(3) Windows is a registered trademark of Microsoft Corporation.
(1)(2)(3)
1 Getting Started
1.1 Introduction
The IWR1443 BoosterPack™ is an easy-to-use evaluation board for the single-chip IWR1443 mmWave
sensing device from TI, with direct connectivity to the TI MCU LaunchPad™ ecosystem. The evaluation
board contains everything needed to start developing on a low-power ARM®-R4F controller. The
evaluation board includes onboard emulation for programming and debugging, onboard buttons, and
LEDs, for quick integration of a simple user interface. The standard 20-pin BoosterPack headers make the
evaluation board compatible with a wide variety of TI MCU LaunchPads and enables easy prototyping.
1.2 Key Features
• 40-pin LaunchPad standard that leverages the LaunchPad ecosystem
• XDS110-based JTAG emulation with serial port, for onboard QSPI flash programming
• Backchannel UART through USB to PC, for logging purposes
• Onboard antenna
• 60-pin high density (HD) connector, for raw ADC data over CSI, or the high-speed debug interface
• Onboard CAN transceiver
• One button and two LEDs, for user interaction
• 5-V power jack, to power the board
1.3 What is Included
1.3.1 Kit Contents
• IWR1443BOOST
• Mounting brackets, screws, and nuts, to allow placing the PCB vertical
• Micro USB cable to connect to the PC
NOTE: Not included: 5 V, >2.5-A supply brick with 2.1-mm barrel jack (center positive). TI
recommends using an external power supply that complies with applicable regional safety
standards such as UL, CSA, VDE, CCC, PSE, and so on. The cable length of the power cord
must be < 3 m.
1.3.2 mmWave Proximity Demo
TI provides sample demo codes to easily get started with the IWR1443 evaluation module and experience
the functionality of the IWR1443 mmWave sensor. For details on getting started with these demos, see
the mmWave SDK User Guide.

Onboard Antenna
IWR1443
Flash
60-Pin HD Connector
Micro USB Connector
CAN Connector
GPIO1 SW NRST SW SOP Controls
5-V Power
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2 Hardware
Figure 1 and Figure 2 show the front and rear views of the evaluation board, respectively.
Figure 1. EVM Front View

IWR14xx
Power and 2 GPIO
LED Indicators
4 RX and 3 TX PCB Antennas
PMIC
LDO1
LDO2
QSPI
Flash
EN Control
from the MCU
Current
Measurement
5 V i/p
from jack/
MCU
Option for 3.3 V from
the MCU LaunchPad
2.3 V 1.8 V
1.3 V
1.8 V
1.2 V
3.3 V (IO)
60-Pin
HD
CSI2I/ LVDS Lanes
JTAG + Trace
40
Mhz
BP CONN
UART and JTAG
SPI, UART, I2C,
Rst, Nerrs, SOP,
Loggers, CAN,
GPIOs
XDS110
PC Interface
Over USB
CAN
SOP
Jumpers
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Figure 2. EVM Rear View
2.1 Block Diagram
Figure 3. IWR14xxBOOST Block Diagram

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2.2 Connecting BoosterPack™ to LaunchPad™ or MMWAVE-DEVPACK
This BoosterPack can be stacked on top of the Launchpad, or the MMWAVE-DEVPACK, using the two
20-pin connectors. The connectors do not have a key to prevent the misalignment of the pins or reverse
connection. Therefore, ensure reverse mounting does not take place. On the IWR1443 BoosterPack, we
have provided 3V3 marking near pin 1 (see Figure 4). This same marking is provided on compatible
LaunchPads which must aligned before powering up the boards.
Figure 4. 3V3 and 5-V Mark on the LaunchPad™ (White Triangle)

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2.3 Power Connections
The BoosterPack is powered by the 5-V power jack (5-A current limit). As soon as the power is provided,
the NRST and 5-V LEDs glow, indicating that the board is powered up (see Figure 5).
Figure 5. Power Connector
NOTE: After the 5-V power supply is provided to the EVM, TI recommends pressing the NRST
switch (SW2) once to ensure a reliable boot up state.
2.4 Connectors
2.4.1 20-Pin BoosterPack™ Connectors
The BoosterPack has the standard LaunchPad connectors (J5 and J6) which enable the BoosterPack to
be directly connected to all TI MCU LaunchPads (see Table 1). While connecting the BoosterPack to other
LaunchPads, ensure the pin 1 orientation is correct by matching the 3V3 and 5-V signal marking on the
boards (see Figure 6).
Figure 6. 20-Pin BoosterPack™ Connectors (J5 and J6)

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Table 1 and Table 2 provide the connector-pin information.
Table 1. 20-Pin Connector Definition (J6)
Pin Number Description Pin Number Description
1 AR_NERR_OUT 2 GND
3 AR_NERRIN 4 NC
5 AR_MCUCLKOUT 6 AR_CS1
7 NC 8 AR_GPIO_1
9 AR_MSS_LOGGER 10 AR_NRST_MCU
11 AR_WARMRST 12 AR_MOSI1
13 AR_BSS_LOGGER 14 AR_MISO1
15 MCU_SOP2 16 AR_HOSTINTR1
17 MCU_SOP1 18 AR_GPIO_2
19 MCU_SOP0 20 NC
Table 2. 20-Pin Connector Definition (J5)
Pin Number Description Pin Number Description
1 MCU_3V3 2 MCU_5v (5V_IN)
3 NC 4 GND
5 AR_RS232TX 6 AR_ANATEST1
7 AR_RS232RX 8 AR_ANATEST2
9 AR_SYNC_IN 10 AR_ANATEST3
11 NC 12 AR_ANATEST4
13 AR_SPICLK1 14 PGOOD (onboard VIO)
15 AR_GPIO_0 16 PMIC_EN1
17 AR_SCL 18 AR_SYNC_OUT_SOP1
19 AR_SDA 20 AR_PMIC_CLKOUT_SOP2
• PGOOD – This signal indicates the state of the onboard VIO supply for the IWR device coming from
the onboard PMIC. A high on the PGOOD signal (3.3 V) indicates that the supply is stable. Because
the IOs are not failsafe, the MCU must ensure that it does not drive any IO signals to the IWR device
before this IO supply is stable. Otherwise, there could be leakage current into the IOs.
• PMIC Enable – This signal goes onboard PMIC enable. The MCU can use this signal to completely
shut down the PMIC and IWR device to save power. The power up of the PMIC takes approximately 5
ms once the Enable signal is released.
NOTE: To enable this feature, the R102 resister must be populated on the EVM.
• ANA1/2/3/4 – These are inputs to the GPADCs (general purpose ADC) available on the IWR1443
device.

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2.4.2 60-Pin High Density (HD) Connector
The 60-pin HD connector provides high speed CSI/LVDS data, and controls signals (SPI, UART, I2C,
NRST, NERR, and SOPs) and JTAG debug signals (see Table 3). This connector can be connected to the
MMWAVE-DEVPACK board and interface with the TSW1400 (see Figure 7).
Figure 7. High Density Connector (60 Pin)
Table 3. HD Connector Pin Definition
Pin Number Description Pin Number Description
1 5 V 2 5V_IN
3 5 V 4 AR_TDO_SOP0
5 AR_TDI 6 AR_TCK
7 AR_CS1 8 AR_TMS
9 AR_SPICLK1 10 AR_HOSTINTR1
11 AR_MOSI1 12 AR_MISO1
13 PGOOD (onboard VIO) 14 AR_NERR_OUT
15 NC 16 AR_SYNC_IN
17 NC 18 GND
19 NC 20 AR_LVDS_VALIDP
21 NC 22 AR_LVDS_VALIDM
23 NC 24 GND
25 NC 26 AR_LVDSSCSI_FRCLKP
27 NC 28 AR_LVDSSCSI_FRCLKM
29 NC 30 GND
31 NC 32 AR_LVDSSCSI_3P
33 NC 34 AR_LVDSSCSI_3M
35 NC 36 GND
37 NC 38 AR_LVDSSCSI_2P
39 NC 40 AR_LVDSSCSI_2M
41 NC 42 GND
43 NC 44 AR_LVDSSCSI_CLKP

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Table 3. HD Connector Pin Definition (continued)
Pin Number Description Pin Number Description
45 NC 46 AR_LVDSSCSI_CLKM
47 NC 48 GND
49 NC 50 AR_LVDSSCSI_1P
51 AR_SDA 52 AR_LVDSSCSI_1M
53 AR_SCL 54 GND
55 AR_RS232RX 56 AR_LVDSSCSI_0P
57 AR_RS232TX 58 AR_LVDSSCSI_0M
59 AR_NRST_MCU 60 GND
PGOOD – This signal indicates that the state of the onboard VIO supply for the IWR device coming from
the onboard PMIC. A high on the PGOOD signal (3.3 V) indicates the supply is stable. Because the I/Os
are not failsafe, the MCU must ensure that it does not drive any I/O signals to the IWR device before this
I/O supply is stable, to avoid leakage current into the I/Os.
2.4.3 CAN Interface Connector
The J3 connector provides the CAN_L and CAN_H signals (see Figure 8) from the onboard CAN
transceiver (SN65HVDA540). These signals can be directly wired to the CAN bus.
Because the digital CAN signals (TX and RX) are muxed with the SPI signals on the IWR device, one of
the two paths must be selected. To enable the CAN interface, the R11 and R12 resisters muct be
populated with 0 Ω, and the R4, R6, R28, and R63 resisters must be removed to disconnect the SPI path.
Figure 8. CAN Connector

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2.5 PC Connection
Connectivity is provided using the micro USB connector over the onboard XDS110 (TM4C1294NCPDT)
emulator. This connection provides the following interfaces to the PC:
• JTAG for CCS connectivity
• Control UART for flashing the onboard serial flash, downloading FW using RADAR studio, and getting
application data sent over the UART
• MSS logger UART, which can be used to get MSS code logs on the PC
When the USB is connected to the PC the device manager recognizes the following COM ports, as shown
in Figure 9:
• XDS110 Class Application/User UART →the control UART port
• XDS110 Class Auxiliary Data port →the MSS logger port
Figure 9. XDS110 Ports
If Windows®is unable to recognize the COM ports previously shown, install the emupack available here
Table 4 lists the UART ports corresponding pin names on IWR1443 package.
Table 4. Pin Names
Pin Name Pin Number Signal Name in Data Sheet EVM Signal Reference
Control UART port TX RS232_TX N6 RS232_TX AR_RS232TX
Control UART port RX RS232_RX N5 RS232_RX AR_RS232RX
MSS logger port SPI_CLK_2 R5 MSS_UARTB_TX AR_MSS_LOGGER
2.5.1 Erasing Onboard Serial Flash
Before loading the code to the serial flash or connecting the board to RADAR Studio, TI recommends
completely erasing the onboard serial flash. The instructions to erase the onboard serial flash are in the
mmWave SDK User Guide.
2.5.2 Connection With MMWAVE-DEVPACK
Users may be required to use the DevPack along with the BoosterPack for the following use cases:
• Connecting to RADAR studio. This tool provides capability to configure the mmWave front end from
the PC. This tool is available in the DFP package.
• Capturing high-speed LVDS data using the TSW1400 platform from TI. This device allows the user to
capture raw ADC data over the high-speed debug interface and post process it in the PC. The RADAR
Studio tool provides an interface to the TSW1400 platform as well, so that the front end configurations
and data capture can be done using a single interface. Details on this board can be found at
http://www.ti.com/tool/tsw1400evm
For details on these use cases, see the mmWave-DevPack User Guide.
Mmwave SDK out-of-box demos do not require DevPack. For other labs, check the hardware
requirements of the lab user guide.

RX Antennas
TX Antennas
£/2
£
rx1 rx2 rx3 rx4 tx1 tx2 tx3
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2.6 Antenna
The BoosterPack includes onboard etched antennas for the four receivers and three transmitters, which
enables tracking multiple objects with their distance and angle information. This antenna design enables
estimation of both azimuth and elevation angles, which enables object detection in a 3-D plane (see
Figure 10).
In the mmwave SDK, the antenna configuration is selected using bitmask. For example, 2 transmit
antennas can be enabled through bitmask 0b101 (such as tx1 and tx3). The corresponding physical
location of rx1 to rx4 and tx1 to tx3 and are labeled in Figure 10.
Figure 10. PCB Antenna
The antenna peak gain is > 10.5 dBi across the frequency band of 76 to 81 GHz. The radiation pattern of
the antenna in the horizontal plan (H-plane) and elevation plan (E-plane) is as shown in Figure 11 and
Figure 12.
The beamwidth of the antenna design can be determined from the radiation patterns. For example, at 78
GHz, based on 3-dB drop in the gain as compared to bore sight, the horizontal 3dB-beamwidth is
approximately ±28 degrees (see Figure 11), and elevation 3dB-beamwidth is approximately ±14 degrees
(see Figure 12). Similarly, the horizontal 6dB-beamwidth is approximately ±50 degrees (see Figure 11)
and the elevation 6dB-beamwidth is approximately ±20 degrees (see Figure 12).

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Figure 11. Antenna Pattern in H-Plane
Figure 12. Antenna Pattern in E-Plane

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2.7 Jumpers, Switches, and LEDs
2.7.1 Sense On Power Jumpers
The IWR1443 device can be set to operate in three different modes, based on the state of the SOP
(sense on power) lines (see Figure 13). These lines are only sensed during boot up of the IWR device.
The state of the device is described by Table 5.
A closed jumper refers to a 1and an open jumper refers to a 0state of the SOP signal going to the IWR
device.
Table 5. SOP Modes
Reference Use Comments
P3 (SOP 2) SOP[2:0] 101 (SOP mode 5) = Flash programming
001 (SOP mode 4) = Functional mode
011 (SOP mode 2) = Dev mode
P2 (SOP 1)
P4 (SOP 0)
Figure 13. SOP Jumpers
2.7.2 Current Measurement
The P5 jumper enables measurement of the current being consumed by the reference design (IWR device
+ PMIC + LDOs) at the 5-V level.
To measure the current, R118 must be removed and a series ammeter can be put across the P5 pins (see
Figure 14).
Figure 14. Current Measurement Point

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2.7.3 Push Buttons and LEDs
Table 6 and Table 7 list the push button and LED uses, respectively.
Table 6. Push Buttons
Reference Use Comments Image
SW2 RESET
This button is used to reset the
IWR1443 device. This signal is
also brought out on the 20-pin
connector and 60-pin HD
connector, so that an external
processor can control the IWR
device.
The onboard XDS110 can also
use this reset.
SW1 GPIO_1 When this button is pushed,
the GPIO_1 is pulled to Vcc.
Table 7. LEDs
Reference Color Use Comments Image
DS2 Red 5-V supply indication This LED indicates the
presence of the 5-V supply.
DS4 Yellow nRESET
This LED is used to indicate
the state of nRESET pin. If
this LED is on, the device is
out of reset. This LED glows
only after the 5-V supply is
provided.
DS1 Red NERR_OUT This LED turns on if there is any hardware error in the
IWR device.
DS3 Yellow GPIO_1 This LED turns on when the
GPIO is logic-1.

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3 Design Files and Software Tools
The schematics, assembly, and BOM are available here. The design and layout database files are
available here.
NOTE: Boards with a Rev 'C' sticker have had capacitor C56 (VBGAP decoupling capacitor)
changed from 0.22 µF to 0.047 µF (part number CGA2B3X7R1H473K050BB). TI
recommends that customers incorporate this change with an equivalent capacitor in their
designs.
3.1 Software, Development Tools, and Example Codes
To enable quick development of an end application on the R4F core in the IWR1443, TI provides a
software development kit (SDK) which includes demo codes, software drivers, an emulation package for
debug, and so on. The SDK is available at mmwave-sdk.
4 Mechanical Mounting of PCB
The field of view of the radar sensor is orthogonal to the PCB. The L-brackets provided with the IWR1443
EVM kit, along with the screws and nuts help in the vertical mounting of the EVM. Figure 15 shows how
the L-brackets can be assembled.
Figure 15. Vertical Assembly of the EVM

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5 PCB Storage and Handling Recommendations
The immersion silver finish of the PCB provides a better high-frequency performance but is also prone to
oxidation in an open environment. This oxidation causes the surface around the antenna region to
blacken. To avoid this effect, store the PCB in an ESD cover and keep it at controlled room temperature
with low humidity conditions. All ESD precautions must be taken while using and handling the EVM.
6 Regulatory Information
The IWR1443 evaluation module (IWR1443BOOST) is in compliance with Directive 2014/53/EU. The full
text of TI's EU Declaration of Conformity is available here.
The compliance has been verified in the operating bands 76 – 77 GHz and 77 – 81 GHz. Should the user
choose to configure the EVM to operate outside the test conditions, it should be operated inside a
protected or controlled environment, such as a shielded chamber. This evaluation board is intended only
for development, and is not for use in an end product or part of an end product. Developers and
integrators that incorporate the chipset in any end products are responsible for obtaining applicable
regulatory approvals for such an end product.
The European RF exposure radiation limit is fulfilled if a minimum distance of 5 cm between the users
body and the radio transmitter is respected.
NOTE: The EUT has been tested in the 76 – 77 GHz band (2 Tx at a time) at a maximum peak
power of 26 dBm EIRP, and in the 77 – 81 GHz band (1 Tx at a time) with maximum peak
power of 21 dBm EIRP across the temperature range of –20ºC to 60ºC.
7 Troubleshooting
EVM board power-up failure: refer to Section 2.2 for desired power connections. Both the NRST and 5-V
LEDs should glow brightly. When a non-functional or non-sufficient current capacity power supply is used
with this EVM, the EVM LEDs do not turn on. Refer to Section 2.7.3 for LED information.

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Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from April 1, 2018 to May 30, 2020 ................................................................................................................... Page
• Changed UART1 to Control UART. ................................................................................................... 11
• Added Pin Names table................................................................................................................. 11
• Added Signal Name column to Pin Names table. ................................................................................... 11
• Changed MSS Logger Port Pin Name from Reserved to SPI_CLK_2............................................................ 11
• Changed MSS Logger Port Signal Name from SPI_CLK_2 to MSS_UARTB_TX. ............................................. 11
• Updated Connection With MMWAVE-DEVPACK section. ......................................................................... 11
• Updated Antenna section. .............................................................................................................. 12
• Updated PCB Antenna image.......................................................................................................... 12
• Added Note. .............................................................................................................................. 16

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