Texas Instruments TPD3S716-Q1EVM User manual

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TPD3S716-Q1 Evaluation Module
User's Guide
SLVUAL9–April 2016
TPD3S716-Q1 Evaluation Module
This user's guide describes the characteristics, operation, and use of the TPD3S716-Q1EVM evaluation
module (EVM). This EVM includes four TPD3S716-Q1s in various configurations for testing.
• IEC61000-4-2 compliance testing on the connector-side pin
• USB 2.0 Type A input and output connectors for throughput analysis
• ESD clamping waveforms during an electrostatic discharge (ESD) event
Contents
1 Introduction ................................................................................................................... 2
2 Definitions..................................................................................................................... 2
3 Setup .......................................................................................................................... 3
4 Board Layout ................................................................................................................ 6
5 Schematics and Bill Of Materials .......................................................................................... 7
List of Figures
1 Ideal Contact Discharge Waveform of the Output Current of the ESD Simulator at 4-kV ......................... 3
2 System Level ESD Test Setup............................................................................................. 5
3 TPD3S716-Q1EVM Top Components and Silkscreen.................................................................. 6
4 TPD3S716-Q1EVM Layer Two - GND Plane............................................................................ 6
5 TPD3S716-Q1EVM Layer Three - 5-V Power Plane ................................................................... 6
6 TPD3S716-Q1EVM Bottom Layer......................................................................................... 6
7 TPD3S716-Q1EVM Schematic ............................................................................................ 7
List of Tables
1 EVM Configuration........................................................................................................... 2
2 IEC61000-4-2 Test Levels ................................................................................................. 2
3 Waveform Parameters in Contact Discharge Mode..................................................................... 2
4 /VEN and /EN Jumper Configurations .................................................................................... 3
5 +5-V and +3.3-V Jumper Configurations ................................................................................. 3
6 Bill of Materials............................................................................................................... 8

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TPD3S716-Q1 Evaluation Module
1 Introduction
Texas Instrument’s TPD3S716-Q1 evaluation module helps designers evaluate the operation and
performance of the TPD3S716-Q1 device. The TPD3S716-Q1 is a single-chip solution for a USB
connector’s VBUS and data line protection. The nFET switch ensures safe current flow in host mode
operation while protecting the internal system circuits from any over-voltage conditions at the VBUS_CON, VD,
and VD– pins. On these pins, this device can protect against over-voltage up to 18 V. The VBUS_CON pin
also protects against shorts to ground. The TPD3S716-Q1 is designed to operate over an ambient air
temperature range of -40°C to +125°C.
The TPD3S716-Q1EVM contains four TPD3S716-Q1s labeled U1 through U4. U1 is configured with two
USB2.0 connectors (USB1 and USB2) for capturing system level tests. U2 is configured with four SMA
(S1 – S4) connectors for 4-port analysis with a vector network analyzer. U3 is configured with test points
for striking ESD to the protection pins. U3 is also configured for capturing clamping waveforms using J3
with an oscilloscope during an ESD test. Caution must be taken when capturing clamping waveforms
during an ESD event so as not to damage the oscilloscope. A proper procedure is outlined in Section 3
section. U4 is pinned out for device level tests. Devices U1 and U4 have Kelvin connections (TP4 – TP5
and TP7 – TP8) around the nFET for measuring RON.
Table 1. EVM Configuration
Reference Designator TI Part Number Configuration
U1 TPD3S716-Q1 USB 2.0 System Level
U2 TPD3S716-Q1 S-Parameters
U3 TPD3S716-Q1 IEC61000-4-2 ESD Tests
U4 TPD3S716-Q1 Pinned out device
2 Definitions
Contact Discharge — a method of testing in which the electrode of the ESD simulator is held in contact
with the device-under-test (DUT).
Air Discharge — a method of testing in which the charged electrode of the ESD simulator approaches
the DUT, and a spark to the DUT actuates the discharge.
ESD simulator — a device that outputs IEC61000-4-2 compliance ESD waveforms shown in Figure 1
with adjustable ranges shown in Table 2 and Table 3.
IEC61000-4-2 has 4 classes of protection levels. Classes 1 – 4 are shown in Table 2. Stress tests
should be incrementally tested to level 4 as shown in Table 3 until the point of failure. If the DUT
does not fail at 8 kV, testing can continue in 2 kV increments until failure.
Table 2. IEC61000-4-2 Test Levels
Contact Discharge Air Discharge
Class Test Voltage [± kV] Class Test Voltage [± kV]
1212
2424
3638
4 8 4 15
Table 3. Waveform Parameters in Contact Discharge Mode
Stress Level Step Simulator Voltage
[kV] Ipeak ±15% [A] Rise Time ±25% [nS] Current at 30-ns ±30% [A] Current at 60-ns ±30% [A]
1 2 7.5 0.8 4 2
2 4 15 0.8 8 4
3 6 22.5 0.8 12 6
4 8 30 0.8 16 8

0
10
20
30
0 20 40 60 80 100
Current (A)
Time (ns)
IPEAK
90% IPEAK
10% IPEAK
800 ps 90/10 rise time
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Figure 1. Ideal Contact Discharge Waveform of the Output Current of the ESD Simulator at 4-kV
3 Setup
This section describes the intended use of the EVM. A generalized outline of the procedure given in IEC
61000-4-2 is described here. IEC 61000-4-2 should be referred to for a more specific testing outline. Basic
configurations for collecting s-parameters, eye diagrams, and ESD clamping waveforms are outlined as
well.
Table 4. /VEN and /EN Jumper Configurations
Jumper Off On
(U1, U2, U3) /VEN disable the VBUS switch
for U1 – U3 enable the VBUS switch for U1 – U3
(U1, U2, U3) /DEN disable the data switch
for U1 – U3 enable the data switch for U1 – U3
/VEN_U4 disable the VBUS switch
for U4 enable the VBUS switch for U4
/DEN_U4 disable the data switch
for U4 enable the data switch for U4
Table 5. +5-V and +3.3-V Jumper Configurations
U1 U2 U3 U4 Power Supply
Connection
Shunt to supply 5 V to U1 Shunt to supply 5 V to U2 Shunt to supply 5 V to U3 Shunt to supply 5 V to U4 +5 V
Shunt to supply 3.3 V to
U1 Shunt to supply 3.3 V to U2 Shunt to supply 3.3 V to U3 Shunt to supply 3.3 V to U4 +3.3 V
Power should be supplied to +5V, +3.3V, and GND connectors, except if powering U1 through the USB
connector. When testing DUT U1 shunt both jumpers (JP1 and JP5) but 5 V can only be supplied by
either the test point labeled “+5V” or the USB male connector (USB2) on VBUS. All other DUTs require a
power supply to be attached to both test points labeled “+3.3V” and “+5V” with the appropriate shunts set
per Table 5. Power can be distributed to each TPD3S716-Q1 by setting the shunts in place for each DUT
(U1 – U4) according to Section 3.2.1. All shunts in Table 5 can be set at the same time or only for the
device under test.

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3.1 U1
A single TPD3S716-Q1 (U1) is configured with two USB2.0 Type A connectors (USB1 and USB2) for
capturing Eye Diagrams and other system level tests. All system level tests should use USB1 as the sink
and USB2 as the source. +5V can be supplied to VBUS using either the male USB connector (USB2) or by
attaching 5V to the test point labeled “+5V.” If supplying 5 V by the USB connector (USB2) then do not
attach a power supply to the test point labeled “+5V” and do shunt JP1 to supply the pull-up resistor
for /FLT. Kelvin connections (TP4 and TP5) are provided for accurate voltage measurements of VBUS_SYS
and VBUS_CON during load tests.
Different resistor values are provided to connect to pin 16, Iadj, to ground by setting a shunt on one of the
jumpers J9 – J11. Pin 16 can also be connected directly to +5-V or ground using J6. Only one shunt
should be connected at a time.
3.2 U2
TPD3S716-Q1 (U2) is configured with four SMA (S1 – S4) connectors to allow 4-port analysis with a
vector network analyzer. Connect Port 1 to S1, Port 2 to S2, Port 3 to S3, and Port 4 to S4. This
configuration allows for the following terminology in 4 port analysis:
• S11: Return loss
• S21: Insertion loss
• S31: Near end cross talk
• S41: Far end cross talk
A calibration section is included using four SMA (SP1 – SP4) connectors with the same PCB trace
geometry
U3
One TPD3S716-Q1 (U3) can be used for destructive IEC 61000-4-2 ESD pass/fail ESD strikes. TP2 has
an added SMB (J3) connector for capturing clamping waveforms with an oscilloscope during an ESD
strike. Caution must be taken when capturing clamping waveforms during an ESD event so as not to
damage the oscilloscope.
3.2.1 Oscilloscope Setup for Clamping Waveforms
Without a proper procedure, capturing ESD clamping waveforms exposes the oscilloscope to potential
voltages higher than the rating of the equipment. Proper methodology can mitigate any risk in this
operation.
Recommended equipment:
• Minimum of 1-GHz bandwidth oscilloscope.
• Either of the following:
– Two 10X 50 Ωattenuators and a 0 Ωresistor (to be installed at R1).
– One 10X 50 Ωattenuator and a 150 Ωresistor (already installed at R1).
• 50 Ωshielded SMB cable.
Procedure
In order to protect the oscilloscope, attenuation of the measured signal is required. Here are two
possible procedures for testing U3:
1. Using two 10X attenuators:
• Install a 0-Ωresistor in R1.
• Attach two 10X attenuators to the oscilloscope channel being used.
• Attach the 50-Ωshielded SMB cable between J5 and the attenuator.
• Set the scope attenuation factor to 100X.
• Set the oscilloscope to trigger on a positive edge for (+) ESD and a negative edge for (–) ESD
strikes. The magnitude should be set to 20 V.
• Following Section 3.2.2, strike contact ESD to TP1.

ESD Simulator
Typical Position for
Direct Discharge
Ground Reference Plane
Power and Ground Connection
DUT or System
Horizontal Coupling
Plane (HCP)
To Wall
Ground
470 kO
470 kO
Non-conducting Table
Insulation
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2. Using one 10X attenuator:
• Attach one 10X attenuator to the oscilloscope.
• Attach the 50-Ωshielded SMB cable between J5 and the attenuator.
• Set the scope attenuation factor to 40X.
• Set the oscilloscope to trigger on a positive edge for (+) ESD and a negative edge for (–) ESD
strikes. The magnitude should be set to 20 V.
• Following Section 3.2.2, strike contact ESD to TP1.
Recommended settings for the time axis is 20 ns/division and for the voltage axis is 10-V/division.
The voltage levels of the ESD applied to TP2 should not exceed 8 kV while capturing clamping
waveforms.
3.2.2 IEC 61000-4-2 Test Method and Set-Up
An example test setup is shown in Figure 2. Details of the testing table and ground planes can be found in
the IEC 61000-4-2 test procedure. Ground the EVM using the banana connector labeled GND. Discharge
the ESD simulator on any of the Test Points TP1 – TP3. Contact and air-gap discharge are tested using
the same simulator with the same discharge waveform. While the simulator is in direct contact with the
test point during contact, it is not during air-gap.
Figure 2. System Level ESD Test Setup
3.2.2.1 Evaluation of Test Results
Connect the tested device on the EVM to a curve tracer both before and after ESD testing. After each
incremental level, if the IV-curve of the ESD protection diode shifts ±0.1 V, or the leakage current
increases by a factor of ten, then the device is permanently damaged by ESD.
U4
TPD3S716-Q1 (U4) is fully pinned out for easy access to device level tests. VBUS_SYS and VBUS_CON are
pinned out using a 3-pin terminal block (J5) for high current tests. Pin J5.1 is VBUS_SYS, J5.2 is GND, and
J5.3 is VBUS_CON. Kelvin connections (TP7 and TP8) are provided for accurate voltage measurements of
VBUS_SYS and VBUS_CON during load tests.

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4 Board Layout
This section provides the TPD3S716-Q1EVM board layout. TPD3S716-Q1EVM is a 4-layer board of FR-4
at 0.062” thickness.
Different resistor values are provided to connect to Iadj (pin 16), to ground by setting a shunt on one of the
jumpers J9 – J11. Iadj can also be connected directly to +5 V or ground using J6. Only one shunt should
be connected at a time.
Figure 3. TPD3S716-Q1EVM
Top Components and Silkscreen Figure 4. TPD3S716-Q1EVM Layer Two - GND Plane
Figure 5. TPD3S716-Q1EVM Layer Three
- 5-V Power Plane Figure 6. TPD3S716-Q1EVM Bottom Layer

www.ti.com Schematics and Bill Of Materials
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5 Schematics and Bill Of Materials
5.1 Schematics
Figure 7. TPD3S716-Q1EVM Schematic

Schematics and Bill Of Materials www.ti.com
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Table 6. Bill of Materials
Quantity Designator Description Part Number Manufacturer
1 !PCB Printed Circuit Board Any
1 J3 Connector, SMB,Vertical RCP 0-4GHz, 50
ohm, TH 131-3701-261 Emerson Network Power
1 J4 Standard Banana Jack, Uninsulated, 5.5mm 575-4 Keystone
1 J5 Terminal Block, 5.08 mm, 3x1, Brass, TH ED120/3DS On-Shore Technology
1 R1 RES, 150 ohm, 1%, 0.1W, 0603 CRCW0603150RFKEA Vishay-Dale
1 USB1 Connector, Receptacle, USB TYPE A, 4POS
SMD 896-43-004-00-000000 Mill-Max
1 USB2 Connector, USB Type A, 4POS R/A, SMD 0480371000 Molex
2 D1, D2 Diode, Zener, 20 V, 225 mW, SOT-23 BZX84C20LT1G ON Semiconductor
2 L1, L2 Inductor, Multilayer, Air Core, 10 nH, 0.3 A,
0.26 ohm, SMD LQG15HS10NJ02D MuRata
2 R12, R13 RES, 0, 5%, 0.063 W, 0402 CRCW04020000Z0ED Vishay-Dale
2 R2, R3 RES, 10.0k ohm, 1%, 0.1W, 0603 CRCW060310K0FKEA Vishay-Dale
2 R4, R9 RES, 140 k, 1%, 0.063 W, 0402 CRCW0402140KFKED Vishay-Dale
2 R5, R10 RES, 274 k, 1%, 0.063 W, 0402 CRCW0402274KFKED Vishay-Dale
2 R6, R11 RES, 93.1 k, 1%, 0.063 W, 0402 CRCW040293K1FKED Vishay-Dale
2 R7, R8 RES, 100 k, 5%, 0.063 W, 0402 CRCW0402100KJNED Vishay-Dale
2 TP14, TP15 Test Point, Miniature, Red, TH 5000 Keystone
2 TP6, TP13 Test Point, Miniature, White, TH 5002 Keystone
3 C1, C4, C7 CAP, CERM, 1 µF, 100 V, +/- 10%, X7S, 0805 C2012X7S2A105K125AB TDK
3 TP1, TP2, TP3 TEST POINT. No entry in BOM.
4 C2, C3, C6, C9 CAP, CERM, 100 µF, 10 V, +/- 20%, X5R,
1210 C1210C107M8PACTU Wurth Elektronik
4 C5, C8, C10, C11 CAP, CERM, 10 µF, 6.3 V, +/- 20%, X7R,
0805 C2012X7R0J106M125AB TDK
4 H1, H2, H3, H4 Bumpon, Hemisphere, 0.44 X 0.20, Clear SJ-5303 (CLEAR) 3M
4 S1, S2, S3, S4 SMA Straight PCB Socket Die Cast, 50 Ohm,
TH 5-1814832-1 TE Connectivity
4 TP4, TP5, TP7, TP8 Test Point, Miniature, Yellow, TH 5004 Keystone
4 TP9, TP10, TP11,
TP12 Test Point, Miniature, Orange, TH 5003 Keystone
4 U1, U2, U3, U4 AUTOMOTIVE USB 2.0 Interface Protection
with Short-to-Battery, Short-to-Ground
Protection, and Adjustable Current Limit,
DBQ0016A
TPD3S716QDBQRQ1 Texas Instruments
6 J1, J2, J6, J7, J8, J9 Header, 100mil, 3x1, Tin, TH PEC03SAAN Sullins Connector Solutions
14 JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8,
JP9, JP10, JP11,
JP12, JP13, JP14
Header, 100mil, 2x1, Gold, TH PBC02SAAN Sullins Connector Solutions
14 SH-J1, SH-J2, SH-
JP1, SH-JP2, SH-
JP3, SH-JP4, SH-
JP5, SH-JP6, SH-
JP7, SH-JP8, SH-
JP9, SH-JP10, SH-
JP11, SH-JP12
Shunt, 100mil, Gold plated, Black 969102-0000-DA 3M

STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated

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