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2SNVU599A–February 2019–Revised October 2019
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LM63625EVM EVM User’s Guide
Advance Information
6 Efficiency Without Input Filter AUTO Mode, VOUT = 5 V, fSW = 2.1 MHz .............................................. 6
7 Load Transient 12 VIN, 3.3 VOUT, 0 A to 1 A, COUT = 2 × 22 µF , IOUT Slew Rate = 1 A/µs........................... 6
8 Load Transient 12 VIN, 3.3 VOUT, 0.1 A to 1 A, COUT = 2 × 22 µF, IOUT Slew Rate = 1 A/µs......................... 6
9 Load Transient 12 VIN, 3.3 VOUT, 0 A to 2.5 A, COUT = 2 × 22 µF, IOUT Slew Rate = 1 A/µs......................... 6
10 Load Transient 2 VIN, 3.3 VOUT, 0.1 A to 2.5 A, COUT = 2 × 22 µF, IOUT Slew Rate = 1 A/µs ........................ 6
11 Load Transient 12 VIN, 5 VOUT, 0 A to 1 A, COUT = 2 × 22 µF, IOUT Slew Rate = 1 A/µs.............................. 7
12 Load Transient 2 VIN, 5 VOUT, 0.1 A to 1 A, COUT = 2 × 22 µF, IOUT Slew Rate = 1 A/µs............................. 7
13 Load Transient 12 VIN, 5 VOUT, 0 A to 2.5 A, COUT = 2 × 22 µF, IOUT Slew Rate = 1 A/µs ........................... 7
14 Load Transient 2 VIN, 5 VOUT, 0.1 A to 2.5 A, COUT = 2 × 22 µF, IOUT Slew Rate = 1 A/µs........................... 7
15 Output Voltage Ripple Auto Mode 2 VIN, 3.3 VOUT, 0 A.................................................................. 7
16 Output Voltage Ripple Auto Mode 2 VIN, 5 VOUT, 0 A.................................................................... 7
17 IC Temperature = 48.2°C 2 VIN, 3.3 VOUT, IOUT = 2.5 A, fSW = 2.1 MHz ................................................ 8
18 IC Temperature = 49.1°C 2 VIN, 5 VOUT, IOUT = 2.5 A, fSW = 2.1 MHz .................................................. 8
19 LM63625EVM Schematic................................................................................................... 9
20 Top View of EVM........................................................................................................... 10
21 EVM Top Copper Layer ................................................................................................... 11
22 EVM Mid Layer One ....................................................................................................... 11
23 EVM Mid Layer Two ....................................................................................................... 12
24 EVM Bottom Copper Layer ............................................................................................... 12
List of Tables
1 Device and Package Configurations ...................................................................................... 1
2 BOM for LM63625EVM.................................................................................................... 13
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