Texas Instruments OMAP35x User manual

May 22, 2009
OMAP35x EVM
Getting Started Guide
V02.01.01

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EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI
to be a finished end-product fit for general consumer use. Persons handling the
product(s) must have electronics training and observe good engineering practice
standards. As such, the goods being provided are not intended to be complete in terms
of required design-, marketing-, and/or manufacturing-related protective considerations,
including product safety and environmental measures typically found in end products
that incorporate such semiconductor components or circuit boards. This evaluation
board/kit does not fall within the scope of the European Union directives regarding
electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC,
CE or UL, and therefore may not meet the technical requirements of these directives or
other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User's
Guide, the board/kit may be returned within 30 days from the date of delivery for a full
refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY
SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED,
IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY
OR FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the
goods. Further, the user indemnifies TI from all claims arising from the handling or use
of the goods. Due to the open construction of the product, it is the user's responsibility
to take any and all appropriate precautions with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER
PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our
arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in
the User's Guide prior to handling the product. This notice contains important safety
information about temperatures and voltages. For additional information on TI's
environmental and/or safety programs, please contact the TI application engineer or
visit www.ti.com/esh.

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No license is granted under any patent right or other intellectual property right of TI
covering or relating to any machine, process, or combination in which such TI products
or services might be or are used.
Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI
to be a finished end-product fit for general consumer use. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of
computing devices pursuant to part 15 of FCC rules, which are designed to provide
reasonable protection against radio frequency interference. Operation of this equipment
in other environments may cause interference with radio communications, in which case
the user at his own expense will be required to take whatever measures may be
required to correct this interference.

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Preface
About This Guide
The OMAP35x EVM is an evaluation platform that showcases the OMAP
architecture and lets users evaluate the power and performance of OMAP as
a flexible general purpose platform.
This guide gives you overview information about the board and the software
provided with the board. It is intended to be used as an introductory
document for the EVM. Other documents provide more in-depth information.
See the EVM documentation section of the release notes for a complete list
of documents that have been included with the product.
Notational Conventions
This document uses the following conventions:
Program listings, program examples, and interactive displays are shown in a mono-spaced
font. Examples use bold for emphasis, and interactive displays use bold to distinguish commands that
you enter from items that the system displays (such as prompts, command output, error messages, etc.).
Square brackets ( [ and ] ) identify an optional parameter. If you use an optional parameter, you
specify the information within the brackets. Unless the square brackets are in a bold typeface, do not
enter the brackets themselves.

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Trademarks
The Texas Instruments logo and Texas Instruments are registered trademarks of Texas
Instruments. Trademarks of Texas Instruments include: TI, OMAP, the OMAP logo, XDS, Code
Composer, Code Composer Studio, Probe Point, Code Explorer, DSP/BIOS, RTDX, Online DSP
Lab, OMAP, TMS320, TMS320C54x, TMS320C55x, TMS320C62x, TMS320C64x, TMS320C67x,
TMS320C5000, and TMS320C6000.
MS-DOS, Windows, and Windows NT are trademarks of Microsoft Corporation.
UNIX is a registered trademark of The Open Group in the United States and other countries.
Linux is a registered trademark of Linus Torvalds.
CodeSourcery and CodeSourcery’s Sourcery G++ are trademarks or registered trademarks of
CodeSourcery, Inc.
Solaris, SunOS, and Java are trademarks or registered trademarks of Sun Microsystems, Inc.
All other brand, product names, and service names are trademarks or registered trademarks of their
respective companies or organizations.

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Revision History:
Rev No. Changes Date
1.0 Beta Release March 15, 2008
1.1
Addition of Micron POP Support,
Replace SignXloaderTool w/ signGP,
Updates for new Serial Download Utility,
Move Release notes to separate document,
Addition of new libraries (Freetype, jpeg, png, zlib)
May 13, 2008
1.2 Updated the document for review comments
Added “Booting the New Linux Kernel” Section July 10, 2008
1.3 Updated for PSP LSP Release v1.0.2 Nov 13, 2008
1.4 Updated for PSP LSP Release v02.01.00 Mar 17, 2009
1.5 Updated the directory tree Apr 22, 2009
1.6 Updated for the 02.01.01 release May 12,2009
1.7 Updated nfs bootargs May 22,2009

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Table of contents
1 Overview...............................................................................................................................................10
1.1 What’s in the kit?......................................................................................................................10
1.2 Identifying Board Variations .....................................................................................................11
1.3 What’s on the board? ...............................................................................................................14
1.4 OMAP3503 SDK Contents.......................................................................................................15
1.5 What’s next? ............................................................................................................................18
1.6 Updates & Further information.................................................................................................19
2 EVM Hardware Setup...........................................................................................................................20
2.1 Main Board SW4......................................................................................................................21
2.2 Processor Module SW1 ...........................................................................................................22
2.3 J8..............................................................................................................................................22
2.4 UART1 .....................................................................................................................................22
2.5 Ethernet....................................................................................................................................22
2.6 Audio Out .................................................................................................................................22
2.7 Audio In ....................................................................................................................................23
2.8 Power Selection Switch ...........................................................................................................23
2.9 Power Cable.............................................................................................................................23
3 Running the Demo Software ................................................................................................................24
3.1 Setup Terminal Program ..........................................................................................................25
3.1.1 HyperTerminal Setup .............................................................................................................25
3.1.2 TeraTerm Setup.....................................................................................................................25
3.1.3 Minicom Setup .......................................................................................................................25
3.2 Running the Basic Demo .........................................................................................................27
3.3 Performing an Audio Record and Playback.............................................................................27
3.4 Performing a Touch Screen Test .............................................................................................27
4 Software Setup .....................................................................................................................................28
4.1 Requirements...........................................................................................................................28
4.2 Installing the Software..............................................................................................................28
4.3 Installing the Toolchain ............................................................................................................29
4.3.1 Setting up the Toolchain ........................................................................................................31
5 Updating the Flash Image ....................................................................................................................32
5.1 Requirements...........................................................................................................................32
5.2 Preparing to Install ...................................................................................................................32
5.3 Downloading U-boot via the UART Downloader......................................................................33
5.4 Using U-boot to update the Flash Memory ..............................................................................35

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5.4.1 Setup the TFTP Server..........................................................................................................35
5.4.2 Running the Re-flash Procedure ...........................................................................................36
6 Rebuilding the Software .......................................................................................................................38
6.1 Rebuilding U-boot ....................................................................................................................38
6.2 Rebuilding the Linux Kernel .....................................................................................................39
6.3 Rebuilding the Initial NAND X-loader.......................................................................................39
6.4 Rebuilding the Target-side UART Loader................................................................................40
6.5 Rebuilding the NFS Image.......................................................................................................40
6.6 Rebuilding the Full Ramdisk Image .........................................................................................41
6.7 Rebuilding the JFFS2 File-System Image ...............................................................................42
7 EVM Operation.....................................................................................................................................43
7.1 Using Telnet .............................................................................................................................43
7.2 Booting the New Linux Kernel..................................................................................................43
7.2.1 Checking the TFTP server setup in the Linux development PC............................................43
7.2.2 Using TFTP to boot the New Linux Kernel ............................................................................44
7.2.3 Flashing the New Linux Kernel ..............................................................................................44
7.3 Changing Options in U-boot.....................................................................................................45
7.4 Exporting an NFS Root File-System ........................................................................................46

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1 Overview
This Chapter introduces the OMAP35x EVM and OMAP3503 Software Development Kit.
1.1 What’s in the kit?
The kit comes with the following hardware pieces:
•OMAP35x™ Evaluation Module Target Board
oIncludes dual-mode touch screen LCD display and stylus
•USB cable
•Serial Cable
•Universal Power supply and power cords
The kit comes with the following printed documentation:
•OMAP35x™ Evaluation Module Beta Installation and Registration Instructions
•OMAP3503 EVM Setup Guide
•Mistral OMAP3503 EVM Hardware User’s Guide
•OMAP3503 EVM Getting Started Guide (this document)
The kit comes with the following software CDs:
•OMAP3503 Software Development Kit (SDK) 1 CD-ROM
•Sourcery G++™ evaluation tools from CodeSourcery 1 CD-ROM
Installation and use of the Software Development Kit is described in this document. This document
assumes the use of the LITE version of CodeSourcery tools. This version is an unrestricted command
line toolchain available free of charge from the CodeSourcery web site (see section 4.3 “Installing the
Toolchain”).
Alternatively, a full featured IDE 30 Day time limited version of Sourcery G++ is provided. To install and
use the evaluation version of CodeSourcery Sourcery G++ product, please see the information available
on the provided CD.

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1.2 Identifying Board Variations
There are two variations of the EVM that have been produced. The following section will help you identify
the board you are working with.
The difference in the board variations is the memory used. Both configurations use the package on
package configuration, which places the memory part on top of the OMAP processor. The following table
shows the key differences.

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Samsung Memory Micron Memory
Processor
Board
Sticker
O3530-PB-nnnn O3530-PB-nnnn-M
DDR 128 Mbytes 128 Mbytes
Flash 128 Mbytes OneNAND 256 Mbytes NAND
Processor
Board
Sticker
O3530-PBxx-yyyy-M2
DDR 256 Mbytes
Flash 256 Mbytes NAND

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Different settings are used for the main boards SW4 switch for the two board variations. The switch
setting adjusts the SYS_BOOT signals to the OMAP processor that select the boot processing performed
by the OMAP Boot-ROM. In addition, the other system software (x-loader, u-boot, Linux kernel) uses
these switch settings to identify which type of memory is used on the board.

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1.3 What’s on the board?
The following block diagram shows the major hardware components.
PORT2
OMAP3530
PoP
Memory
TW4030
Level
Shifter
DVI
Tran mitter
LAN9115
ISP1504
Keypad
(15 key )
Power ON
3.7” LCD
with TP Level
Shifter
Level
Shifter
Touch
Screen
Controller
Selection
USB
Connector
DVI
Connector
DSS
SPI
RJ45
GPMC
MMC1
MMC
Connector
ULPI
I
2
C
McBSP
UART1
UART2
PORT1
UART3
V
-
DAC
CVBS
S
-
Video
JT
AG
ETM
Audio In
Audio Out
Power Section
DC-IN AC CHRG
BATT
GPMC, Camera,
I2C and ETM
McBSP,
UART,
SPI,
MMC,
DSS
EXPN
Connector

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1.4 OMAP3503 SDK Contents
The OMAP3503 SDK CD contains an installer binary to be run on a Linux system. The result of running
the installer produces the following directory structure.

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~---OMAP35x-PSP-SDK-MM.mm.pp.bb
| License.html
| Software-manifest.html
+---docs
| |-- Building-RootFs-Arago.html
| |-- DataSheet-MM.mm.pp.bb.pdf
| |-- GettingStarted.pdf
| |-- MigrationGuide-MM.mm.pp.bb.pdf
| |-- ReleaseNotes-MM.mm.pp.bb.pdf
| `-- UserGuide-MM.mm.pp.bb.pdf
+---host-tools
| |-- linux
| | `-- signGP
| |-- src
| | `-- signGP.c
| |-- windows
| | |-- PumpKIN.exe
| | |-- PumpKIN.hlp
| | |-- peripheral-boot-images
| | | |-- Readme.txt
| | | |-- dnld_startup_omap3_evm.bin
| | | `-- peripheral-u-boot.bin
| | |-- utilities
| | | |-- CommunicationInterface.dll
| | | |-- CoreEngine.dll
| | | |-- DownloadUtility.exe
| | | `-- DownloadUtility.ini
|-- images
| |-- boot-strap
| | `-- x-load.bin.ift
| |-- examples
| |-- fs
| | |-- nfs-base.tar.gz
| | |-- nfs.tar.gz
| | |-- ramdisk-base.gz
| | |-- ramdisk.gz
| | |-- rootfs-base.jffs2
| | `-- rootfs.jffs2
| |-- kernel
| | `-- uImage
| |-- u-boot
| | `-- u-boot.bin
| `-- utils
| `-- itbok.bin
|-- scripts
| |-- Readme.txt
| |-- initenv-micron.txt
| |-- initenv-samsung.txt
| |-- reflash-micron.txt
| `-- reflash-samsung.txt
|-- src
| |-- boot-strap
| | |-- ChangeLog-MM.mm.pp.bb
| | |-- ShortLog
| | |-- Unified-patch-MM.mm.pp.bb.gz
| | |-- diffstat-MM.mm.pp.bb

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~---OMAP35x-SDK-MM.mm.pp.bb [Continued]
| | |-- x-loader-patches-MM.mm.pp.bb.tar.gz
| | `-- x-loader-MM.mm.pp.bb.tar.gz
| |-- examples
| | `-- examples.tar.gz
| |-- kernel
| | |-- ChangeLog-MM.mm.pp.bb
| | |-- Readme.txt
| | |-- ShortLog
| | |-- diffstat-MM.mm.pp.bb
| | |-- Unified-patch-MM.mm.pp.bb.gz
| | |-- kernel-patches-MM.mm.pp.bb.tar.gz
| | `-- linux-MM.mm.pp.bb.tar.gz
| |-- u-boot
| | |-- ChangeLog-MM.mm.pp.bb
| | |-- Readme.txt
| | |-- ShortLog
| | |-- Unified-patch-MM.mm.pp.bb.gz
| | |-- diffstat-MM.mm.pp.bb
| | |-- u-boot-MM.mm.pp.bb.tar.gz
| | `-- uboot-patches-MM.mm.pp.bb.tar.gz
| `-- utils
| | |-- Readme.txt
| |-- ITBOK-AND-UBOOT.tar.bz2
| `-- dnld-util-target.tar.bz2
`-- test-suite
|-- lftb-MM.mm.pp.bb.tar.gz
`-- lptb-MM.mm.pp.bb.tar.gz
Note: The values of MM, mm, pp and bb in this illustration will vary across the releases and
actually depends on individual component versions.

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1.5 What’s next?
This document walks the user through the steps of getting started with the OMAP35x EVM and the
OMAP3503 SDK. It is suggested that the user follow the sequence described in the document. The
sequence is outlined below:
Setup EVM HW Connect the various cables and other basic hardware setup
Run the Demo Run the demo application that is pre-installed on the EVM
Setup the SDK and toolchain Setup the development hosts using the SDK CD and the compiler
toolchain
Install the target software Use the supplied, known good software images to re-flash the
EVM.
Rebuild software Rebuild various aspects of the supplied target software
Develop with the EVM and
SDK
The final section covers additional operation information on using
your EVM.

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1.6 Updates & Further information
Please be sure to register your EVM at:
www.ti.com/omapregistration
Once registered you will be able to find software and documentation updates at:
www.ti.com/omapsoftwareupdates
A wiki based information site is available. User contributions are encouraged.
http://wiki.omap.com/index.php?title=OMAP3_Overview

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2 EVM Hardware Setup
This section will guide you through the process of setting up the EVM hardware for the purpose of running
the supplied demo application. The information is the same as in the supplied Setup Guide.
Step Section
1 2.1
2 2.2
Step Section
3 2.3
4 2.4
5 2.5
6 2.6
7 2.7
8 2.8
9 2.9