Texas Instruments SimpleLink CC3301 User manual

EVM User's Guide: BP-CC3301
SimpleLink™ CC3301 Wi-Fi 6 and Bluetooth® Low Energy
BoosterPack™ Plug-in Module (BP-CC3301)
Description
The SimpleLink™ CC3301 Wi-Fi 6 and Bluetooth®
Low Energy devices enable affordable, reliable and
secure connectivity in embedded applications with
a processor host running Linux® or an MCU host
running RTOS. The CC3301 BoosterPack™ plug-in
module (BP-CC3301) is a test and development
board that can be easily connected to TI LaunchPad™
development kits or processor boards; thus enabling
rapid software development.
Features
• CC3301 Wi-Fi 6 and Bluetooth Low Energy
companion IC in QFN package
• 2x20 pin stackable connectors (BoosterPack plug-
in module headers) to connect to TI LaunchPad
development kits and other BoosterPack plug-in
modules
• Onboard chip antenna with option for SMA/U.FL
based testing
• SWD interface for standalone operation and RF
testing
Figure 1-1. BP-CC3301 Front Side
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Table of Contents
Description................................................................................................................................................................................. 1
Features......................................................................................................................................................................................1
1 Evaluation Module Overview................................................................................................................................................. 4
1.1 Introduction........................................................................................................................................................................ 4
1.2 Kit Contents........................................................................................................................................................................4
1.3 Specification.......................................................................................................................................................................4
1.4 Device Information............................................................................................................................................................. 4
2 Hardware................................................................................................................................................................................. 4
2.1 Hardware Features............................................................................................................................................................ 5
2.2 Connector and Jumper Descriptions..................................................................................................................................6
2.3 Power............................................................................................................................................................................... 12
2.4 Clocking........................................................................................................................................................................... 14
2.5 Performing Conducted Testing.........................................................................................................................................15
3 Evaluation Setups.................................................................................................................................................................17
3.1 MCU and RTOS............................................................................................................................................................... 17
3.2 Processor and Linux........................................................................................................................................................ 18
3.3 Standalone RF Testing.....................................................................................................................................................20
4 Radio Tool BP-CC3301 Hardware Setup.............................................................................................................................21
4.1 Option 1: LP-XDS110.......................................................................................................................................................22
4.2 Option 2: XDS110 JTAG Debug Probe............................................................................................................................ 23
4.3 Option 3: SimpleLink Launchpad and 10 pin Cable......................................................................................................... 26
5 Hardware Design Files......................................................................................................................................................... 26
5.1 Schematics.......................................................................................................................................................................26
5.2 PCB Layouts.................................................................................................................................................................... 26
5.3 Bill of Materials (BOM)..................................................................................................................................................... 27
6 Compliance and Certifications............................................................................................................................................ 27
7 Trademarks............................................................................................................................................................................27
List of Figures
Figure 1-1. BP-CC3301 Front Side..............................................................................................................................................1
Figure 1-1. BP-CC3301 Block Diagram.......................................................................................................................................4
Figure 2-1. BP-CC3301 Overview............................................................................................................................................... 5
Figure 2-2. LEDs D4 & D5........................................................................................................................................................... 6
Figure 2-3. Reset Push-Button.................................................................................................................................................... 6
Figure 2-4. BP-CC3301 BoosterPack Header Pinout..................................................................................................................7
Figure 2-5. ARM 10 pin JTAG Connector (J10)......................................................................................................................... 10
Figure 2-6. 20 pin LP-XDS110 Connector (J11).........................................................................................................................11
Figure 2-7. Low Current Measurement......................................................................................................................................12
Figure 2-8. Active Current Measurement...................................................................................................................................13
Figure 2-9. 40 MHz XTAL (Y1)...................................................................................................................................................14
Figure 2-10. Rework for External Slow Clock Use.....................................................................................................................14
Figure 2-11. RF Path on BP-CC3301........................................................................................................................................ 15
Figure 2-12. U.FL Connector..................................................................................................................................................... 16
Figure 2-13. SMA/U.FL option................................................................................................................................................... 16
Figure 3-1. BP-CC3301 with LP-AM243....................................................................................................................................17
Figure 3-2. BeagleBone Black Board........................................................................................................................................ 18
Figure 3-3. Top View of BP-CC3301 + BBB with Adapter Board...............................................................................................18
Figure 3-4. Side View of BP-CC3301 and BBB with Adapter Board In Between.......................................................................18
Figure 3-5. Adapter Board for the BBB......................................................................................................................................19
Figure 3-6. Top View of Modified BBB....................................................................................................................................... 19
Figure 3-7. Bottom View of Modified BBB..................................................................................................................................20
Figure 4-1. BP-CC3301 Connected to LP-XDS110................................................................................................................... 22
Figure 4-2. XDS110 Debug probe kit.........................................................................................................................................23
Figure 4-3. XDS110 20 pin debug cable with ARM 10 pin Adapter........................................................................................... 23
Figure 4-4. BP-CC3301 ARM 10 pin JTAG connector (J10)......................................................................................................24
Figure 4-5. BP-CC3301 Connected to XDS110.........................................................................................................................25
Figure 4-6. BP-CC3301 Connected to LAUNCHXL-CC3235SF................................................................................................26
List of Tables
Table 2-1. LEDs........................................................................................................................................................................... 6
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Table 2-2. Jumper Settings..........................................................................................................................................................7
Table 2-3. P1 Header Pin Assignment.........................................................................................................................................8
Table 2-4. P2 Header Pin Assignment.........................................................................................................................................9
Table 2-5. ARM 10 pin JTAG Connector (J10) Assignment.......................................................................................................10
Table 2-6. 20 Pin LP-XDS110 Connector (J11) Assignment...................................................................................................... 11
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1 Evaluation Module Overview
1.1 Introduction
The CC3301 BoosterPack™ plug-in module (BP-CC3301) is a test and development board that can easily be
connected to TI LaunchPad™ or processor boards; thus enabling rapid software development.
This user's guide is intended to explain the various hardware configurations and features of the BP-CC3301. For
more information about the CC3301 device, please refer to ti.com CC3301 product folder.
1.2 Kit Contents
• One BP-CC3301 Board
• EVM disclaimer Read Me
1.3 Specification
The BP-CC3301 is a board designed to enable rapid and easy software and hardware development for the
CC3301 device. The block diagram for the BP-CC3301 is shown below.
Figure 1-1. BP-CC3301 Block Diagram
This kit can be used in three configurations:
1. MCU and RTOS evaluation: BP-CC3301 + LaunchPad with the MCU running TCP/IP like the LP-AM243.
2. Processor and Linux evaluation: BP-CC3301 + BP-CC33-BBB-ADAPT + BEAGL-BONE-BLACK.
3. RF-testing with PC tools: BP-CC3301 + LP-XDS110.
In addition, the BP-CC3301 can also be wired to any other Linux or RTOS host board running TCP/IP stack.
Refer to Section 3 for more information.
1.4 Device Information
The purpose of the BP-CC3301 is to showcase the hardware and software capabilities of the CC3301 device.
The other components on the board are populated for testing and support of this main device.
2 Hardware
Figure 2-1 shows the overview of the BP-CC3301.
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Figure 2-1. BP-CC3301 Overview
2.1 Hardware Features
• CC3301 Wi-Fi 6 and Bluetooth® Low Energy combo device which can interface with MPU or MCU systems;
adding connectivity
• Two 20-pin stackable connectors (BoosterPack Standard)
• On-board chip dual-band antenna with on-board SMA/U.FL connector for conducted RF testing
• Power from on board dual rail (3.3 V and 1.8 V) LDO using USB or LaunchPad
• 3 level shifters for voltage translation (3.3 V to 1.8 V)
• JTAG header pins for SWD interface with XDS110 or LP-XDS110
• One push-button for reset
• Jumper for current measurement on both power supplies (3.3 V and 1.8 V) with provision to mount 0.1 ohm
(0603) resistors for measurement with voltmeter
• 32 kHz oscillator for lower power evaluation
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2.2 Connector and Jumper Descriptions
2.2.1 LEDs and Push-Buttons
Table 2-1 lists the LED descriptions.
Table 2-1. LEDs
Reference Color Usage Comments
D4 Green 3.3V power indication On: 3.3V power rail is up
Off: no 3.3V power supplied
D6 Red 1.8V power indication On: 1.8V power rail is up
Off: no 1.8V power supplied
D5 Yellow nRESET The LED indicates the state of
the nReset pin. If that LED is
on, the device is functional which
means the nReset is high.
Figure 2-2 shows the mentioned LEDs on the board.
Figure 2-2. LEDs D4 & D5
Push-button SW1 can reset the device, as seen in Figure 2-3. Press SW1 to pull the nReset line low and put the
device into a shutdown state. Releasing the button brings the nReset back high and allows the device to start up
as long as power is provided to the board. This button is primarily designed for use without a hosted setup using
Radio tool, when the user wants to reset the device state for initial connection. Refer to Section 3.3 for details
concerning Radio Tool.
Figure 2-3. Reset Push-Button
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2.2.2 Jumper Settings
Table 2-2 lists the jumper settings. To reference the default jumper configurations, see Figure 2-1.
Table 2-2. Jumper Settings
Reference Usage Comments
J1, J2 RF Test SMA connector (J1) or U.FL connector (J2)
for conducted testing in the lab. See Section
2.5.
J3, J4, J5 Boot mode Keep in default jumper configuration to verify
proper boot. Default positions:
J3: 2-3
J4: 2-3
J5: 1-2
J6, J8 Power to board Used to enable power to board for both
supplies. See Section 2.3.
J15, J16 Current measurement Used to measure power to device only. See
Section 2.3.1.
J7 USB connector For powering the BoosterPack standalone
(not connected to LaunchPad)
J10,J11 JTAG connectors Headers to interface with XDS110 debug
probe. See Section 2.2.4.
J9 J11 JTAG header power Enables 5 V power supply to come from LP-
XDS110.
J12, J13, J14 Level shifter host voltage Set to 3.3 V or 1.8 V to enable relevant level
shifters to translate to correct host voltage
level.
P1, P2 BoosterPack header 2 X 20 pins each connected to LaunchPad.
See Section 2.2.3.
2.2.3 BoosterPack Header Assignment
The CC3301 BoosterPack has 2 x 20 pin connectors that provide access to many of the CC3301 pins and
features. The signal assignment on these 2x20 pin connectrors is shown in the figure below and described in
Table 2-3 and Table 2-4.
Figure 2-4. BP-CC3301 BoosterPack Header Pinout
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Table 2-3. P1 Header Pin Assignment
Pin Name (in schematic) Type/ Direction Description
P1.1 VCC_MCU_3V3 Input No functional purpose
P1.2 Reserved N/A N/A
P1.3 UART_TX_3V3 (from CC3301) Output The CC3301 UART TX to host for
BLE host controller interface
P1.4 UART_RX_3V3 (to CC3301) Input The CC3301 UART RX from host
for BLE host controller interface
P1.5 LP_RESET Input Reset line for CC3301 used
to enable/ disable (active
low). Driven by host through
LaunchPad pins.
P1.6 Reserved N/A N/A
P1.7 SDIO_CLK_3V3 Input SDIO clock or SPI clock. Must be
driven by host
P1.8 IRQ_WL_3V3 Output Interrupt request from CC3301 to
host for Wi-Fi activity
P1.9 COEX_GRANT_3V3 Output External coexistence interface -
grant (reserved for future use)
P1.10 ANT_SEL_3V3 Output Antenna select control
P1.21 VCC_MCU_5V Power 5 V supply to board
P1.22 GND GND Board ground
P1.23 Reserved N/A N/A
P1.24 Reserved N/A N/A
P1.25 Reserved N/A N/A
P1.26 Reserved N/A N/A
P1.27 Reserved N/A N/A
P1.28 Reserved N/A N/A
P1.29 COEX_REQ_3V3 Input External coexistence interface -
request (reserved for future use)
P1.30 COEX_PRIORITY_3V3 Input External coexistence interface -
priority (reserved for future use)
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Table 2-4. P2 Header Pin Assignment
Pin Name (in schematic) Type/Direction Description
P2.11 IRQ_BLE_3V3 Output Interrupt request from CC3301 to
host for BLE activity
P2.12 Reserved N/A N/A
P2.13 Reserved N/A N/A
P2.14 SDIO_D0_3V3 (POCI) Input/Output SDIO data D0 or SPI POCI
P2.15 SDIO_CMD_3V3 (PICO) Input/Output SDIO command or SPI PICO
P2.16 Reserved N/A N/A
P2.17 FAST_CLK_REQ_3V3 Output Fast clock request from CC3301
to host
P2.18 SDIO_D3_3V3 (CS) Input/Output SDIO data D3 or SPI CS
P2.19 SLOW_CLK_IN_3V3 Input Input for external RTC clock
32.768 kHz
P2.20 GND GND Board ground
P2.31 Reserved N/A N/A
P2.32 Reserved N/A N/A
P2.33 Reserved N/A N/A
P2.34 LOGGER_3V3 Output Tracer from CC3301 (UART TX
debug logger)
P2.35 Reserved N/A N/A
P2.36 UART_RTS_3V3 (from CC3301) Output UART RTS from CC3301 to host
for BLE HCI flow control
P2.37 UART_CTS_3V3 (to CC3301) Input UART CTS to CC3301 from host
for BLE HCI flow control
P2.38 SDIO_D1_3V3 Input/Output SDIO data D1
P2.39 SDIO_D2_3V3 Input/Output SDIO data D2
P2.40 Reserved N/A N/A
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2.2.4 JTAG Headers
The BP-CC3301 has 2 JTAG headers (J10, J11) for SWD interface with the XDS110 debug probe. The signal
assignment for these headers are described in the figures and tables below.
Figure 2-5. ARM 10 pin JTAG Connector (J10)
Table 2-5. ARM 10 pin JTAG Connector (J10) Assignment
Pin Signal Name Description
J10.1 VCC_BRD_1V8 1.8V supply for reference voltage to
connector
J10.2 SWDIO Serial wire data in/out
J10.4 SWCLK Serial wire clock
J10.10 RESET_1V8 nReset (Enable line for CC3301)
J10.3, J10.5, J10.7, J10.9 GND Board ground
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Figure 2-6. 20 pin LP-XDS110 Connector (J11)
Table 2-6. 20 Pin LP-XDS110 Connector (J11) Assignment
Pin Signal Name Description
J11.6 SWCLK Serial wire clock
J11.8 SWDIO Serial wire data in/out
J11.10 RESET_1V8 nReset (Enable line for the CC3301)
J11.12 UART_TX_1V8 The CC3301 UART TX to host for BLE host
controller interface
J11.14 UART_RX_1V8 The CC3301 UART RX from host for BLE
host controller interface
J11.16 VCC_BRD_1V8 1.8V supply for reference voltage to
connector
J11.18 VCC_BRD_5V 5 V supply to BP-CC3301 from LP-XDS110
J11.1, J11.7, J11.13, J11.19, J11.20 GND Board ground
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2.3 Power
The board is designed to accept power from a connected LaunchPad kit. Some LaunchPad kits cannot source
the peak current requirements of Wi-Fi, which can be as high as 500 mA. In such cases, the USB connector
on the BP-CC3301 can be used to aid the peak current. The use of Schottky diodes verifies that load sharing
occurs between the USB connectors on the LaunchPad kit and the BoosterPack module without any board
modifications. If J6 or J8 shunts are removed, then the shunts can be used to measure total current consumption
of the entire board for both power rails from the on-board LDO.
2.3.1 Measure the CC3301 Current Draw
2.3.1.1 Low Current Measurement (LPDS)
To measure the current draw of the CC3301 device for both power supplies (3.3 V or 1.8 V), a jumper labeled
J16 (for 3.3 V supply) and a jumper labeled J15 (for 1.8 V supply) is provided on the board. By removing J16,
users can place an ammeter into this path to observe the current on the 3.3 V supply. The same process can
be used for observing the current on the 1.8 V supply with J15. TI recommends this method for measuring the
LPDS.
Jumper J15 is removed, and an ammeter is added in series to measure the LPDS currents (see Figure 2-7).
Similar operation with J16 and 3.3V supply.
Figure 2-7. Low Current Measurement
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2.3.1.2 Active Current Measurement
To measure active current in a profile form, TI recommends using a 0.1-Ω 1% 0603 resistor on the board, and
measuring the differential voltage across the resistor. This measurement can be done using a voltmeter or an
oscilloscope for measuring the current profile for both power supplies (3.3 V or 1.8 V).
Jumper J15 shunt is removed and a 0.01 resistor is populated in parallel to measure the active currents on the
1.8V supply (see Figure 2-8). Similar operation with J16 and 3.3V supply.
Figure 2-8. Active Current Measurement
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2.4 Clocking
The BP-CC3301 provides two clock inputs to the CC3301 device:
• Y1 is a 40 MHz crystal for fast clock input.
• Y2 is a 32.768 kHz oscillator for slow clock input.
If the user desires to provide their own external slow clock through the Slow Clock Input pin (P2.19), then some
re-work must be performed. The Y2 oscillator needs to be removed, and populate a 0201 sized, 0 ohm resistor
on R29 pad. See Figure 2-10. The slow clock can also be generated internally to save on BOM.
Figure 2-9. 40 MHz XTAL (Y1)
Figure 2-10. Rework for External Slow Clock Use
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2.5 Performing Conducted Testing
As seen in Figure 2-11, the BP-CC3301 has an on-board SMA connector and component antenna. The SMA
connector (J1) provides a way for testing conducted measurements. Alternately, a track pad for a UF.L connector
(J2) is provided on-board to replace the SMA connector and provide a way to test in the lab using a compatible
cable (see Figure 2-12).
Figure 2-11. RF Path on BP-CC3301
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Figure 2-12. U.FL Connector
A rework can be needed before using the connector on J1/J2. This involves swapping the position of the existing
3.9 pF capacitor to lead the transmission line to the desired connection (see Figure 2-13).
Figure 2-13. SMA/U.FL option
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3 Evaluation Setups
The CC3301 BoosterPack can be used in the following configurations:
• MCU and RTOS evaluation: BP-CC3301 + LaunchPad with the MCU running TCP/IP like the LP-AM243
• Processor and Linux evaluation: BP-CC3301 + BP-CC33-BBB-ADAPT + BEAGL-BONE-BLACK
• RF testing with PC tools: BP-CC3301 + LP-XDS110
In addition, the BP-CC3301 can also be wired to any other Linux or RTOS host board running TCP/IP stack.
3.1 MCU and RTOS
The BP-CC3301 can be used with a MCU running TCP/IP, like the LP-AM243 and can easily integrate with the
LaunchPad by stacking the 40 pin headers, as shown in the figure below.
Figure 3-1. BP-CC3301 with LP-AM243
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3.2 Processor and Linux
The BP-CC3301 can integrate with a host platform running Linux OS, like the BeagleBone Black (BBB). The
BeagleBone Black is a low-cost, community-supported development platform as shown below.
Figure 3-2. BeagleBone Black Board
To interface with the BP-CC3301 with the BeagleBone Black, the user also needs the BP-CC33xx to BBB
Adapter Board.
Figure 3-3. Top View of BP-CC3301 + BBB with Adapter Board
Figure 3-4. Side View of BP-CC3301 and BBB with Adapter Board In Between
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Figure 3-5. Adapter Board for the BBB
To make sure the BeagleBone Black boots up from the SD card, TI recommends to add a 100k Ohm resistor for
R93 on the top of the BBB, and remove the R68 resistor seen on the bottom of the BBB. Alternatively, you can
press and hold the S2 button on the BeagleBone board during power up if the hardware modifications were not
made. (see Figure 3-6 and Figure 3-7).
Lastly, adding a right angle header on the bottom of the BBB to easily connect the FTDI cable is optional. When
the adapter board is attached to the BBB, the FTDI cable can get pinched between the BBB and adapter board,
which can cause communication problems. (see Figure 3-7).
Figure 3-6. Top View of Modified BBB
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Figure 3-7. Bottom View of Modified BBB
3.3 Standalone RF Testing
The BP-CC3301 can be used standalone (without a host) to test RF capabilities, using Radio Tool. For more
information on Radio Tool and where to download, refer to Wi-Fi Toolbox BP-CC3301 Hardware Setup.
The BP-CC3301 has an on-board SMA connector and component antenna, and a U.FL can be populated on the
board, for conducted RF testing using compatible cables (a rework can be needed). For more information, see
Section 2.5.
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