Texas Instruments TPS6507 EVM Series User manual

User's Guide
SLVU291B–April 2010–Revised September 2011
TPS6507xEVM
This user’s guide describes the characteristics, operation, and use of the TPS6507xEVM-430 evaluation
module (EVM). The TPS6507xEVM-430 is a fully assembled and tested platform for evaluating the
performance of the TPS6507x single-chip power management devices. This document includes schematic
diagrams, a printed circuit board (PCB) layout, bill of materials, and test data. Throughout this document,
the abbreviations EVM,TPS6507xEVM, and the term evaluation module are synonymous with the
TPS6507xEVM-430 unless otherwise noted.
Contents
1 Introduction .................................................................................................................. 2
2 TPS6507xEVM Electrical Performance Specifications ................................................................. 4
3 TPS6507xEVM Schematic ................................................................................................. 6
4 Connector and Test Point Descriptions .................................................................................. 8
5 Setup ........................................................................................................................ 12
6 EVM Assembly Drawings and Layout .................................................................................. 13
7 Bill of Materials ............................................................................................................. 19
List of Figures
1 TPS6507xEVM Schematic (Sheet 1)..................................................................................... 6
2 TPS6507xEVM Schematic (Sheet 2)..................................................................................... 7
3 TPS6507xEVM Hardware Connection.................................................................................. 12
4 TPS6507xEVM Component Placement (Viewed from Top) ......................................................... 13
5 TPS6507xEVM Silkscreen (Viewed from Top) ........................................................................ 14
6 TPS6507xEVM Top Copper (Viewed from Top) ...................................................................... 15
7 TPS6507xEVM Bottom Copper (X-Ray View from Top) ............................................................. 16
8 TPS6507xEVM Internal 1 (X-Ray View from Top).................................................................... 17
9 TPS6507xEVM Internal 2 (X-Ray View from Top).................................................................... 18
List of Tables
1 TPS6507xEVM Ordering Information .................................................................................... 3
2 TPS6507xEVM Performance Characteristics ........................................................................... 4
3 TPS65070EVM-430 Bill of Materials ................................................................................... 19
OMAP is a trademark of Texas Instruments.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
I2C is a trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
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Introduction www.ti.com
1 Introduction
The TPS6507x are a series of single-chip power management ICs for portable applications consisting of a
battery charger with Power Path management for a single lithium-ion (Li-Ion) or lithium-polymer
(Li-Polymer) cell. The charger can be supplied either by a USB port on the device USB pin or by a dc
voltage from a wall adapter connected to the device AC pin. Three highly-efficient, 2.25-MHz step-down
converters provide the core voltage, memory, and input/output (I/O) voltage in a processor-based system.
The step-down converters enter a low-power mode under light loads for maximum efficiency across the
widest possible range of load currents. In addition, there are two 200-mA low-dropout regulators (LDOs).
For low-noise applications, these devices can be forced into fixed-frequency PWM using the I2C™
interface. The I2C interface allows the user to adjust various settings of the charger, the Power Path, the
dc-to-dc converters, and the LDOs. The step-down converters allow the use of small inductors and
capacitors in order to achieve a small total solution size.
1.1 Features
•Battery charger with Power Path management
•Up to 2.0-A output current on the Power Path
•Three step-down converters
•Two LDOs (200-mA output current)
•wLED boost converter
•Up to 25 mA per string with internal current sink
•10-Bit analog-to-digital converter (ADC)/Touch screen interface
•I2C-compatible interface
1.2 Applications
•Portable navigation systems
•PDAs, pocket PCs
•OMAP™and low-power DSP supply
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www.ti.com Introduction
1.3 Requirements
In order to operate this EVM properly, the related software and hardware must be connected and properly
configured. All components and connectors are installed on the EVM as shipped, except for the host
computer and the dc power supply.
The most current version of the software must be downloaded from the TI website at www.ti.com.
1.3.1 Software
To download the software that is necessary to operate the TPS6507xEVM, check the TPS6507x product
folder on the TI Web site.
1.3.2 Host Computer
A computer with an available USB port is required to operate this EVM. The TPS6507xEVM software runs
on the personal computer and communicates with the EVM via the PC USB port and the USB to GPIO
interface. The PC must meet these minimum system requirements:
•Microsoft®Windows®2000 or XP operating system
•Available USB port
•Minimum of 30 MB of free hard disk space (100 MB recommended)
•Minimum of 256 MB of RAM
1.3.3 Power Supply
A dc power supply capable of delivering 5 V at 3 A is required to operate this EVM.
1.3.4 Ordering Options
Table 1 provides the ordering information for the various EVM options.
Table 1. TPS6507xEVM Ordering Information
Output Voltage Output Voltage Output Current
Device Part DCDC1 / DCDC2 DCDC1 / DCDC2 / Supported
LDO1 / LDO2
Orderable EVM Number Number / DCDC3 DCDC3 Processor
TPS65070EVM-430 TPS65070 3.3 V 1.8 V / 1.2 V 0.6 A / 1.5 A / 1.5 A OMAP-L1x8
1.8 V / 3.3 V
1.0 V / 1.2 V
TPS65072EVM-430 TPS65072 1.8 V / 1.2 V 1.2 V / 1.2 V 0.6 A / 0.6 A / 0.6 A Atlas IV
TPS65073EVM-430 TPS65073 1.8 V 1.8 V / 1.8 V 0.6 A / 0.6 A / 1.5 A OMAP35xx
1.2 V / 1.8 V
1.2 V / 1.35 V
TPS650731EVM-430 TPS650731 1.8 V 1.8 V / 1.8 V 0.6 A / 0.6 A / 1.5 A OMAP35xx
1.2 V / 1.8 V
1.2 V / 1.35 V
TPS650732EVM-430 TPS650732 1.8 V 1.8 V / 1.8 V 0.6 A / 0.6 A / 1.5 A OMAP3505
1.8 V / 3.3 V
1.2 V / 1.35 V
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TPS6507xEVM Electrical Performance Specifications www.ti.com
2 TPS6507xEVM Electrical Performance Specifications
Table 2 summarizes the TPS65070EVM-430 performance specifications.
Table 2. TPS6507xEVM Performance Characteristics
Parameter Symbol Notes and Conditions Min Nom Max Units
Input Characteristics
Input Voltage, AC VAC 4.3 17 V
Input Voltage, USB VUSB 4.3 5.8 V
Input Voltage, AC, USB 4.3 5.8 V
charging
Input Voltage, DCDC1, VIN_DCDC 2.8 6.3(1) V
DCDC2, DCDC3
Input Voltage, LDO1, LDO2 VIN_LDO 1.8 6.3(1) V
Output Characteristics
DCDC1
Default Output Voltage VOUT_DCDC1 TPS65070, TPS65072 3.3 V
DCDC1
Default Output Voltage VOUT_DCDC1 TPS65073, TPS650731, TPS650732 1.8 V
DCDC1
Output Voltage Range 3.3V or VIN_DCDC
0.725 V
Adjustable with I2C
DCDC1 (whichever is less)
Output Current DCDC1 VIN = Min to max 600 mA
DCDC2
DEFDCDC2 = Low 1.8 V
TPS65070,
VOUT_DCDC2 DEFDCDC2 =
TPS650732 3.3 V
High
DEFDCDC2 = Low 1.8 V
Default Output Voltage VOUT_DCDC2 TPS65072 DEFDCDC2 =
DCDC2 2.5 V
High
DEFDCDC2 = Low 1.2 V
TPS65073,
VOUT_DCDC2 DEFDCDC2 =
TPS650731 1.8 V
High
Output Voltage Range 3.3V or VIN_DCDC
0.725 V
Adjustable with I2C
DCDC2 (whichever is less)
TPS65072, TPS65073, TPS650731, 600 mA
TPS650732
Output Current DCDC2 TPS65070 1500 mA
DCDC3
DEFDCDC3 = Low 1 V
VOUT_DCDC3 TPS65070 DEFDCDC3 = 1.2 V
High
DEFDCDC3 = Low 1.2 V
Default Output Voltage VOUT_DCDC3 TPS65072 DEFDCDC3 =
DCDC3 1.4 V
High
DEFDCDC3 = Low 1.2 V
TPS65073,
VOUT_DCDC3 TPS650731, DEFDCDC3 = 1.35 V
TPS650732 High
TPS65072 600 mA
Output Current DCDC2 TPS65070, TPS65073, TPS650731, 1500 mA
TPS650732
(1) 6.3 V or VSYS, whichever is less.
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Table 2. TPS6507xEVM Performance Characteristics (continued)
Parameter Symbol Notes and Conditions Min Nom Max Units
LDO1, LDO2
TPS65070 1.8 mA
Default Output Voltage LDO1, TPS65072 1.2 mA
LDO2 TPS65073, TPS650731, TPS650732 1.8 mA
TPS65070 1.2 mA
Default Output Voltage LDO2, TPS65072 1.2 mA
LDO2 TPS65073, TPS650731, TPS650732 1.8 mA
Output Current LDO1, LDO2 200 mA
wLED Boost Converter and Current Sinks
Switching frequency wLED 1125 kHz
boost
Input voltage at ISINK1 , ISINK2 16 V
Internal overvoltage 35 37 39 V
protection
Maximum boost factor 9 10 V
(VIN/VOUT)
PWM dimming resolution 1 %
Tolerance between current sinks ISINK1, ISINK2 5 %
ADC Converter
Input voltage range AD_IN1 0 2.25 V
to AD_IN4
ADC resolution 10 Bits
Differential linearity error ±1 LSB
Offset error 1 5 LSB
Gain error ±8 LSB
Sampling rime 220 µs
Conversion time 19 µs
Reference voltage on –1 2.26 +1 %
BYPASS
Power Path
Minimum battery voltage VBATMIN 2.75 V
Input overvoltage protection V(OVP) 5.8 6.0 6.3 V
Switching from AC to BAT TSW(ACBAT) 200 µs
Switching from USB to BAT TSW(USBBAT) 200 µs
Switching from AC to USB TSW(ACUSB) 200 µs
From power applied to start of power-up
SYS power-up delay 11 ms
sequence
Dropout voltage AC to SYS ILIMITAC = 2500 mA, ISYS = 1000 mA 150 mV
Dropout voltage USB to SYS ILIMITUSB = 13000 mA, ISYS = 800 mA 160 mV
Dropout voltage USB to SYS VBAT = 3.0 V, ISYS = 1000 mA 85 100 mV
Charger
Battery discharge current 2 A
Battery charge voltage Set in internal register 4.1 4.25 V
Battery fast-charge current Set with external resistor 100 1500 mA
range
Pre-charge current IPRECHG 0.08 ×ICHG 0.10 ×ICHG 0.12 ×ICHG
Charge termination current ITERM 0.08 ×ICHG 0.10 ×ICHG 0.12 ×ICHG
Switching frequency fSW 1950 2250 2550 kHz
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TPS6507xEVM Schematic www.ti.com
3 TPS6507xEVM Schematic
Figure 1 and Figure 2 show the two sheets of the TPS65070EVM-430 schematic.
NOTE: These diagrams are provided for reference only. See Table 3, the Bill of Materials, for
specific component values.
Figure 1. TPS6507xEVM Schematic (Sheet 1)
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www.ti.com TPS6507xEVM Schematic
Figure 2. TPS6507xEVM Schematic (Sheet 2)
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Connector and Test Point Descriptions www.ti.com
4 Connector and Test Point Descriptions
4.1 Input / Output Connector Descriptions
4.1.1 J1: VINLDO1, 2, GND
J1 pin 1 is the input supply for LDO1 and LDO2. In the default configuration, VINLDO1,2 is connected to
SYS with R1. To connect VINLDO1,2 to any other voltage source, remove R1 and connect the
VINLDO1,2 supply between J1 pin 1 (positive connection) and J1 pin 2 (GND connection).
4.1.2 J2: AC, GND
A power supply can be connected between J2 pin 1 (AC) and J2 pin 2 (GND). The AC pin is one of the
EVM inputs. Note that the voltage rating on the AC pin ranges from 4.3 V up to 17 V. The allowable
voltage range on both the AC and USB pins for charging is from 4.3 V up to 5.8 V. If the voltage on the
AC pin exceeds 5.8 V, the charger goes into overvoltage lockout.
The input current on the Power Path input AC pin is current-limited. The current limit can be changed in
User Register PPATH1 (01h). The default input current limit is set to 2500 mA. For more information, refer
to the respective device data sheet, available for download at www.ti.com.
4.1.3 J3: USB, GND
Connect your power supply positive terminal to J3 pin 1. Connect your power supply negative terminal to
J3 pin 2. Note that the voltage rating on the USB input ranges from 4.3 V up to 17 V. The allowable
voltage range on both the AC and USB pins for charging is from 4.3 V up to 5.8 V. If the voltage on the
AC pin exceeds 5.8 V, the charger goes into overvoltage lockout.
The input current on the Power Path input USB pin is current-limited. The current limit can be changed in
User Register PPATH1 (01h). The default input current limit is set to 500 mA. For more information, refer
to the respective device data sheet, available for download at www.ti.com.
4.1.4 J4: SYS
J4 is connected to the output of the Power Path (SYS). When the TPS6507x device is turned off and there
is no voltage source applied at either the AC or USB pins, the SYS output is disconnected internally from
the battery. When the TPS6507x is turned on by pulling PB_IN low, the voltage at SYS ramps up. If there
is no voltage applied at either the AC or USB pin, SYS remains connected to VBAT internally. If there is a
voltage applied at either the AC or USB pin, SYS is connected to this input. If both input supplies are
connected, the AC input has priority. The voltage at SYS is not regulated.
4.1.5 J5: GND
J5 is connected to GND.
4.1.6 J6: VBAT, GND, TS
Connect your single-cell Li-Ion or Li-Polymer cell positive connection to J6 pins 1 and 2. Connect your
battery negative connection between J6 pins 3 and 4. If your battery provides a thermistor (NTC)
connection, you can connect the thermistor to J6 pin 5. Note that the factory default EVM configuration
includes a 10-kΩresistor connected from TS to GND (R5). If you wish to use the battery internal resistor,
R5 must first be removed. The thermistor type is defined in User Register CHGCONFIG1 with the bit
SENSOR TYPE. Two different thermistor types can be selected: 100 kΩand 10 kΩ; the default selection
is 10 kΩ.
A resistor in parallel to the thermistor (NTC) is required for linearization (see the TPS6507x data sheet for
details). Note that the factory default EVM configuration uses a 75-kΩresistor for linearization (R6).
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4.1.7 J7: VLDO1, GND
J7 pins 1 and 2 are connected to the positive output of linear regulator LDO1. J7 pins 2 and 4 are the
GND connection for LDO1. A load can be connected between J7 pins 1 and 2 (VLDO1) and J13 pins 3
and 4 (GND).
LDO1 is able to supply a load current up to 200 mA.
4.1.8 J8: VLDO2, GND
J8 pins 1 and 2 are connected to the positive output of linear regulator LDO2. J8 pins 2 and 4 are the
GND connection for LDO2. A load can be connected between J8 pins 1 and 2 (VLDO2) and J8 pins 3 and
4 (GND).
LDO2 is able to supply a load current up to 200 mA.
4.1.9 J9: VDCDC1, GND
J9 pins 3 and 4 are connected to the positive output of the step-down converter DCDC1. J9 pins 1 and 2
are the GND connection of DCDC1. A load can be connected between J9 pins 3 and 4 (VDCDC1) and J9
pins 1 and 2 (GND).
Refer to Table 2 for information on the maximum output current and default output voltage of DCDC1.
4.1.10 J10: VDCDC2, GND
J10 pins 3 and 4 are connected to the positive output of the step-down converter DCDC2. J10 pins 1 and
2 are the GND connection of DCDC2. A load can be connected between J10 pins 3 and 4 (VDCDC2) and
J10 pins 1 and 2 (GND).
Refer to Table 2 for information on the maximum output current and default output voltage of DCDC2.
4.1.11 J11: VDCDC3, GND
J11 pins 3 and 4 are the positive output of the step-down converter DCDC3. J11 pins 1 and 2 are the
GND connection of DCDC3. A load can be connected between J11 pins 3 and 4 (VDCDC3) and J11 pins
1 and 2 (GND).
Refer to Table 2 for information on the maximum output current and default output voltage of DCDC3.
4.1.12 J12: I2C Interface
J12 is a 10-pin interface connector to connect to the I2C interface.
4.1.13 J13: I2C Interface
J13 is a 14-pin interface connector to connect to the I2C interface. This connector is not assembled in the
factory default EVM setup.
4.1.14 J14: AD_IN1–4, BYPASS, INT_LDO, GND
AD_IN1, AD_IN2, AD_IN3, and AD_IN4 are the external inputs of the 10-bit ADC. Connect an external
voltage source or touch screen (If configured as touch screen controller) to these pins. See the respective
device data sheet for additional information on the touch screen interface and ADC input configuration.
J14 pin 5 is connected to BYPASS. BYPASS can be used as an internal reference for the ADC. A 10-µF
capacitor is connected from BYPASS to GND (C10).
J14 pin 6 is connected to the output of the internal LDO, INT_LDO. This LDO provides power for the touch
screen controller (TSREF). A 2.2-µF capacitor is connected from INT_LDO to GND (C13).
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4.1.15 J15: PB_IN, PB_OUT, POWER_ON, PGOOD, RESET/EN_EXTLDO, INT
J15, pin 1: PB_IN
J15 pin 1 is connected to PB_IN. Pulling PB_IN low starts up all dc-dc converters and LDOs according
to the internal power-up sequence. Refer to Table 9 in the data sheet (SLVS950) for information on the
internal power-up sequence. Note that if PB_IN is released high, all dc-dc converters and LDOs shut
down if the POWER_ON input is low. If POWER_ON is pulled high before PB_IN is released high
again, the dc-dc converters and LDOs remain on. Note that PB_IN is also connected to S1. PB_IN is
pulled up to AVDD6 with an internal 50-kΩpull-up resistor. Pressing the Push-Button S1 pulls PB_IN
low.
J15, pin 2: PB_OUT
J15 pin 2 is connected to the open drain output PB_OUT. PB_OUT is driven by the status of PB_IN. If
PB_IN is low, PB_OUT is also low. If PB_IN is high, PB_OUT is driven to a high impedance state.
PB_OUT is pulled up to a pull-up voltage with resistor R37. In the factory default configuration, VSYS
is selected as the pull-up voltage. In addition, VOUT_DCDC1 and VOUT_DCDC2 can be configured as
pull-up voltages with R22 and R23, respectively.
J15, pin 3: POWER_ON
The POWER_ON pin must be pulled high before PB_IN is released high again to keep the dc-dc
converters and LDOs enabled once PB_IN is released high. Pulling POWER_ON low disables all dc-dc
converters and LDOs. POWER_ON is pulled up to a pull-up voltage with R32. In the factory default
configuration, VSYS is selected as the pull-up voltage. In addition, VOUT_DCDC1 and VOUT_DCDC2
can be configured as pull-up voltages with R22 and R23, respectively.
J15, pin 4: PGOOD
J15 pin 4 is connected to the open drain output PGOOD. PGOOD goes low depending on the setting
in the PGOODMASK register. In this register, different PGOOD bits of each dc-dc converter and LDO
can be connected to the PGOOD open drain output. PGOOD is connected to a pull-up voltage with
resistor R34. In the factory default EVM configuration, VSYS is selected as the pull-up voltage with
R21. In addition, VOUT_DCDC1 and VOUT_DCDC2 can be configured as pull-up voltages with R22
and R23, respectively.
J15, pin 6: RESET/EN_EXTLDO
J15 pin 5 is connected to the open drain output RESET. The TPS65070, TPS65073, TPS650731, and
TPS650732 each contain circuitry that can generate a reset pulse for a processor. The voltage at the
THRESHOLD pin is sensed; if this voltage goes above the threshold voltage of 1.0 V (typ), the RESET
output goes to a high impedance state after a delay time defined in the PGOOD register. If the voltage
at the THRESHOLD pin is below the threshold voltage, the PGOOD output is pulled low.
In the TPS65072, this pin is an active high push-pull output called EN_EXTLDO. This pin is controlled
internally and only used for sequencing the Sirf Prima or Atlas IV processors.
J15, pin 6: INT
J15 pin 6 is connected to the open drain output INT. The INT output indicates if there is an interrupt
active. The interrupts can be configured in the INT register. Different events can be masked as an
interrupt (for example, AC pin or USB pin power removed or applied), or as a touch screen Interface,
PB_IN.
INT is connected to a pull-up voltage with resistor R38. In the factory default EVM configuration, VSYS
is selected as the pull-up voltage with R21. In addition, VOUT_DCDC1 and VOUT_DCDC2 can be
configured as pull-up voltages with R22 and R23, respectively.
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4.2 Enable Jumpers / Switches
4.2.1 S1: PB_IN
S1 is connected to PB_IN. Pressing the switch S1 pulls the PB_IN pin of the TPS6507x low, starting up all
dc-dc converters and LDOs according to the device internal sequence. Note that if S1 is released, all
dc-dc converters and LDOs shut down if the POWER_ON input is low. If POWER_ON is pulled high
before PB_IN is released high again, the dc-dc converters and LDOs remain on.
JP1: EN_DCDC1
Connect a shorting bar between EN_DCDC1 and ON to pull the EN_DCDC1 pin high (VSYS) and
enable the step-down converter DCDC1. Connect a shorting bar between EN_DCDC1 and OFF to pull
the EN_DCDC1 pin low (GND) and disable DCDC1.
Note that the enable pins of all dc-dc converters and LDOs that are part of the internal automatic
sequence should be terminated to GND. To control the converters with the respective individual
ENABLE pins, the power sequence for the dc-dc converters DCDC_SQ must be set to '101' in User
Register CON_CTRL1 (0Dh).
JP2: EN_DCDC2
Connect a shorting bar between EN_DCDC2 and ON to pull the EN_DCDC2 pin high (VSYS) and
enable the step-down converter DCDC2. Connect a shorting bar between EN_DCDC2 and OFF to pull
the EN_DCDC2 pin low (GND) and disable DCDC2.
Note that the enable pins of all dc-dc converters and LDOs that are part of the internal automatic
sequence should be terminated to GND. To control the converters with the respective individual
ENABLE pins, the power sequence for the dc-dc converters DCDC_SQ must be set to '101' in User
Register CON_CTRL1 (0Dh).
JP3: EN_DCDC3
Connect a shorting bar between EN_DCDC3 and ON to pull the EN_DCDC3 pin high (VSYS) and
enable the step-down converter DCDC3. Connect a shorting bar between EN_DCDC3 and OFF to pull
the EN_DCDC3 pin low (GND) and disable DCDC3.
Note that the enable pins of all dc-dc converters and LDOs that are part of the internal automatic
sequence should be terminated to GND. To control the converters with the respective individual
ENABLE pins, the power sequence for the dc-dc converters DCDC_SQ must be set to '101' in User
Register CON_CTRL1 (0Dh).
JP4: DEFDCDC2
Connecting a shorting bar between DEFDCDC2 and LOW selects the output voltage set in User
Register DEFDCDC2_LOW (11h). Connecting a shorting bar between DEFDCDC2 and HIGH selects
the output voltage set in User Register DEFDCDC2_HIGH (12h).
Refer to Table 2 for information on the default output voltages on DCDC2. After start-up, the user can
adjust the LOW/HIGH output voltage of DCDC2 in the corresponding User Registers. Refer to the
device data sheet for detailed information.
JP5: DEFDCDC3
Connecting a shorting bar between DEFDCDC3 and LOW selects the output voltage set in the User
Register DEFDCDC3_LOW (13h). Connecting a shorting bar between DEFDCDC3 and HIGH selects
the output voltage set in the User Register DEFDCDC3_HIGH (14h).
Refer to Table 2 for information on the default output voltages on DCDC3. After start-up, the user can
adjust the LOW/HIGH output voltage of DCDC3 in the corresponding User Registers. Refer to the
device data sheet for detailed information.
JP6: POWER_ON
The POWER_ON pin must be pulled high before PB_IN is released high again to keep the dc-dc
converters and LDOs enabled once PB_IN is released high. Pulling POWER_ON low disables all dc-dc
converters and LDOs. Connect a shorting bar between POWER_ON and Hi to pull the POWER_ON
pin high. The pull-up source can be selected with resistors R45 (VDCDC2), R46 (VDCDC1) and R47
(SYS). In the factory default configuration, R45 and R46 are open, while R47 is assembled. This
configuration selects SYS as the pull-up source. Connect a shorting bar between POWER_ON and
GND to pull the POWER_ON pin low. This configuration disables all dc-dc converters and LDOs.
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J11
J9
J3J2
J8
J6
J10
J13
TPS6507xEVM-430
Oscilloscope
DC Voltmeter
DCDC3
DCDC1 DCDC2
LDO1
LDO2
AC
TS +-USB
Lithium-Ion
Battery
DC
Power Supply
+
-
USB to GPIO Interface
PC
Setup www.ti.com
5 Setup
CAUTION
Many of the components on the TPS6507xEVM-430 are susceptible to damage
by electrostatic discharge (ESD). Customers are advised to observe proper
ESD handling precautions when unpacking and handling the EVM, including
the use of a grounded wrist strap, bootstraps, or mats at an approved ESD
workstation. An electrostatic smock and safety glasses should also be worn.
5.1 Software Setup
To download the software required to operate the TPS6507xEVM, check the TPS6507x product folder on
the TI web site (www.ti.com).
Download the software and execute it; follow the on-screen instructions to complete the installation.
5.2 Hardware Setup
Figure 3 shows a typical hardware test configuration.
Figure 3. TPS6507xEVM Hardware Connection
5.3 Running the Software
Click on the TPS6507x software icon to start the software. If no icon appears on the host computer
desktop, use the Start button in the lower left corner of the screen to browse the program folders to find
the installed software. The default directory for the software installation is Program Files\Texas
Instruments\TPS6507xEVM.
For details on how to use the software, refer to application note SLVA418,Using the TPS6507x Software.
12 TPS6507xEVM SLVU291B–April 2010–Revised September 2011
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6 EVM Assembly Drawings and Layout
Figure 4 through Figure 9 show the design of the TPS65070EVM-430 printed circuit boards. This EVM
has been designed using a four-layer, 1-ounce copper-clad PCB with all components in an active area on
the top side of the board.
NOTE: Board layouts are not to scale. These figures are intended to show how the board is laid out;
they are not intended to be used for manufacturing TPS65070EVM-430 PCBs.
Figure 4. TPS6507xEVM Component Placement (Viewed from Top)
13
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Figure 5. TPS6507xEVM Silkscreen (Viewed from Top)
14 TPS6507xEVM SLVU291B–April 2010–Revised September 2011
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Figure 6. TPS6507xEVM Top Copper (Viewed from Top)
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Figure 7. TPS6507xEVM Bottom Copper (X-Ray View from Top)
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Figure 8. TPS6507xEVM Internal 1 (X-Ray View from Top)
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Figure 9. TPS6507xEVM Internal 2 (X-Ray View from Top)
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7 Bill of Materials
Table 3 lists the bill of materials for the TPS6507xEVM.
Table 3. TPS65070EVM-430 Bill of Materials
EVM Device Option: Count
-001 -002 -003 -004 -005 RefDes Value Description Size Part Number MFR
C1, C13, Capacitor, Ceramic,
4 4 4 4 4 2.2 µF 0805 GRM21BR60J225KA01K muRata
C17, C18 6.3 V, X5R, 10%
C19, C20, Capacitor, Ceramic, Taiyo
0 0 0 0 0 open 0805 JMK212BJ106M
C21 6.3 V, X5R, 20% Yuden
Capacitor, Ceramic, Taiyo
1 1 1 1 1 C2 4.7 µF 1210 GRM32ER71H475KA
50 V, X7R, 10% Yuden
C22, C23, Capacitor, Ceramic,
4 4 4 4 4 10nF 0805 GRM21BR72A103MA01K muRata
C24, C25 100 V, X7R, 20%
C3, C4, Capacitor, Ceramic,
3 3 3 3 3 4.7 µF 0805 GRM21BR60J475KA11K muRata
C11 6.3 V, X5R, 10%
C5, C7,
C10, C12, Capacitor, Ceramic, Taiyo
7 7 7 7 7 10 µF 0805 JMK212BJ106M
C14, C15, 6.3 V, X5R, 20% Yuden
C16
Capacitor, Ceramic,
2 2 2 2 2 C6, C8 22 µF 0805 JMK212BJ226MG muRata
6.3 V, X5R, 20%
0 0 0 0 0 C9 open 0805 muRata
Diode, Schottky,
1 1 1 1 1 D1 MBR0540L SOD-123 MBR0520L Fairchild
0.5 A, 20 V
D2, D3,
D4, D5,
D6, D7,
D8, D9, Diode, LED, 30-mA, 0.118 x
16 16 16 16 16 Q65110A1931 Q65110A1931 Osram
D10, D11, Common Anode 0.134 inch
D12, D13,
D14, D15,
D16, D17
Inductor, SMT, 0.153 x
1 1 1 1 1 L1 47 µH LPS4018-473MLB Coilcraft
0.56 A, 650 mΩ0.153 inch
Inductor, SMT, 0.118 x
3 3 3 3 3 L2, L3, L4 2.2 µH LPS3015-222ML Coilcraft
2.1 A, 110 mΩ0.118 inch
MOSFET, Pch, -12 V,
0 0 0 0 0 Q1 open SOT23 Si2333 Vishay
–5.7 A, 50 mΩ
R1, R7,
R13, R18, Resistor, Chip,
8 8 8 8 8 0 0805 Std Std
R19, R20, 1/10W, 1%
R21, R26
Resistor, Chip,
1 0 1 1 1 R36 0 0805 Std Std
1/10W, 1%
Resistor, Chip,
2 2 2 2 2 R14, R16 3.30 kΩ0805 Std Std
1/10W, 1%
Resistor, Chip, 1/10W,
1 1 1 1 1 R2 51.1 kΩ0805 Std Std
1%
R24, R25, Resistor, Chip,
4 4 4 4 4 1.00 MΩ0805 Std Std
R27, R28 1/10W, 1%
Resistor, Chip,
1 1 1 1 1 R3 1.00 kΩ0805 Std Std
1/10W, 1%
Resistor, Chip,
0 1 0 0 0 R31 0 Ω0805 Std Std
1/10W, 1%
Resistor, Chip,
1 0 1 1 1 R31 270 kΩ0805 Std Std
1/10W, 1%
R32, R33, Resistor, Chip,
4 4 4 4 4 100 kΩ0805 Std Std
R37, R38 1/10W, 1%
Resistor, Chip,
1 0 1 1 1 R34 100 kΩ0805 Std Std
1/10W, 1%
Resistor, Chip,
1 0 1 1 1 R35 120 kΩ0805 Std Std
1/10W, 1%
Resistor, Chip,
1 1 1 1 1 R4 150 kΩ0805 Std Std
1/10W, 1%
19
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Table 3. TPS65070EVM-430 Bill of Materials (continued)
EVM Device Option: Count
-001 -002 -003 -004 -005 RefDes Value Description Size Part Number MFR
Resistor, Chip,
1 1 1 1 1 R5 10.0 KΩ0805 Std Std
1/10W, 1%
Resistor, Chip,
1 1 1 1 1 R6 75.0 kΩ0805 Std Std
1/10W, 1%
R8, R9,
R10, R11,
R12, R15, Resistor, Chip,
0 0 0 0 0 open 0805 Std Std
R17, R22, 1/10W, 1%
R23, R29,
R30
Switch, SPST, 0.245 X KT11P2J
1 1 1 1 1 S1 KT11P2JM PB Momentary, Sealed KT11P2JM34LFS
0.251 inch M34LFS
Tactile
IC, Power Solution for
1 0 0 0 0 TPS65070RSL TPS65070RSL TI
Navigation Systems
IC, Power Solution for
0 1 0 0 0 TPS65072RSL TPS65072RSL TI
Navigation Systems
IC, Power Solution for
0 0 1 0 0 TPS65073RSL TPS65073RSL TI
Navigation Systems
IC, Power Solution for
0 0 0 1 0 TPS650731RSL TPS650731RSL TI
Navigation Systems
IC, Power Solution for
0 0 0 0 1 TPS650732RSL TPS650732RSL TI
Navigation Systems
Revision History
Changes from Original (April, 2010) to A Revision ......................................................................................................... Page
•Updated Table 1 with correct maximum DC/DC2 output current .................................................................. 3
•Updated Table 2 with correct maximum DC/DC2 output current .................................................................. 4
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
20 Revision History SLVU291B–April 2010–Revised September 2011
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