Texas Instruments TPS274C65 User manual

User’s Guide
TPS274C65 Evaluation Module
ABSTRACT
The TPS274C65EVM is a hardware evaluation module (EVM) used to enable hardware engineers to evaluate
the full performance and functionality of the TPS274C65 industrial high side switch. The TPS274C65EVM
contains everything needed to test and assess the TPS274C65 before designing it into part of a greater
application's power system. The TPS274C65EVM is compatible with AS and BS version of TPS274C65. To
use the SPI interface of TPS274C65AS and TPS274C65BS correctly, the evaluation module is designed to
either use external microcontroller with jumper wires or in conjunction with an underlying Texas Instruments
microcontroller by using the standardized BoosterPack™ headers. A wide range of application features such as
SPI communication, adjustable current limiting, and various protection and diagnostics are enabled and visible
through use of this evaluation module.
Table of Contents
1 Introduction.............................................................................................................................................................................2
2 Compatibility Across Silicon Versions................................................................................................................................. 3
3 BoosterPack™ Operation....................................................................................................................................................... 4
4 TPS274C65EVM Schematic................................................................................................................................................... 5
5 Connection Descriptions....................................................................................................................................................... 6
6 TPS274C65EVM Assembly Drawings and Layout............................................................................................................... 8
7 Bill of Materials......................................................................................................................................................................11
List of Figures
Figure 4-1. TPS274C65EVM Schematic Drawing....................................................................................................................... 5
Figure 6-1. 3D Representation.................................................................................................................................................... 8
Figure 6-2. Top Layer...................................................................................................................................................................8
Figure 6-3. Ground Layer............................................................................................................................................................ 9
Figure 6-4. Power Layer.............................................................................................................................................................. 9
Figure 6-5. Bottom Layer........................................................................................................................................................... 10
List of Tables
Table 2-1. Device Comparison Table........................................................................................................................................... 3
Table 2-2. EVM Considerations Across Silicon Versions.............................................................................................................3
Table 3-1. Connected BoosterPack™ Header Pins on TPS274C65EVM.................................................................................... 4
Table 5-1. Connections and Test Points...................................................................................................................................... 6
Table 5-2. Jumper Configurations................................................................................................................................................6
Table 5-3. ADDCFG DIP Switch Configurations.......................................................................................................................... 7
Table 7-1. TPS274C65 Bill of Materials..................................................................................................................................... 11
Trademarks
BoosterPack™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
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TPS274C65 Evaluation Module 1
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1 Introduction
The Texas Instruments TPS274C65EVM is an evaluation module that is used to demonstrate and showcase all
of the features of the underlying TPS274C65AS and TPS274C65BS industrial high side switch. This evaluation
board provides a seamless way to connect a set of power supplies to the inputs of the TPS274C65, connect
loads to the output channels, and switch on and off the device through SPI communication. An on-board 3.3-V
buck-converter LMR36506 is included on the EVM to showcase the use of external VDD. Additionally this EVM
includes BoosterPack headers allowing the user to easily connect the TPS274C65 high side switch to either
external microcontroller with jumper wires or a Texas Instruments microcontroller and write software to control
and configure the device through SPI communication.
Features of the TPS274C65EVM include:
• BoosterPack pins for SPI communication
• On-board 3.3-V buck-converter allowing for external VDD and lower device Iq
• Ability to support versions AS and BS of the TPS274C65
• On-board DIP switches for addressable SPI address configurations
• Analog sensing configuration with potentiometer or fixed resistor
• On-board LEDs to demostrate LED driving capabilities (AS version)
• On-board Reverse Current Blocking (RCB) FETs to demostrate reverse current blocking driver functionality
(AS version)
Introduction www.ti.com
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2 Compatibility Across Silicon Versions
Table 2-1. Device Comparison Table
Device Version Part Number Interface Reverse Current
Blocking (RCB)
Integrated LED
Driver Integrated ADC Fault Diagnosis
AS TP274C65AS SPI Yes Yes Yes
Global fault output
and single channel
information
available through
SPI
BS TP274C65BS SPI No No No
Global fault output
and single channel
information
available through
SPI
CP TP274C65CP GPIO Yes No No Per channel fault
output
Table 2-1 shows the comparison across different device versions. Please note that TPS274C65EVM supports
version AS and BS.
Version AS and BS are using SPI interface. AS has full features sets including LED driver, RCB blocking FET
driver and integrated ADC for digital current, temperature and voltage senses. The BS version is using SPI
communication, but does not have LED driver, RCB blocking FET driver or integrated ADC. Version CP is using
traditional GPIO interface with RCB driver.
A table of the versions of TPS274C65 and considerations that have to be taken can be found in Table 2-2.
Table 2-2. EVM Considerations Across Silicon Versions
TPS274C65 Version EVM Considerations
AS
Default version populated on EVM. Leave J19, J20, J21, J22 open to enable the
RCB FETs. Make sure R1 and R5 are populated to enable LED driving. For the
rest of the connections, follow desired settings from Connection Descriptions.
BS
Populate J19, J20, J21, J22 to bypass the RCB FETs. Do not populate R1 and
R5 as there is no LED driving capability for this version. For the rest of the
connections, follow desired settings from Connection Descriptions.
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3 BoosterPack™ Operation
BoosterPack headers (J5, J10) are used to communicate with TPS274C65's SPI interface. The header can
be used to easily communicate with a Texas Instruments microcontroller, or can be paired with a custom
microcontroller with jumper wires. A list of pins connected to the BoosterPack header can be seen below in Table
3-1:
Table 3-1. Connected BoosterPack™ Header Pins on TPS274C65EVM
BoosterPack Pin Function Note
1 3.3-V power rail 3.3-V output from microcontroller
6Current sensing through the SNS pin for version BS
(current sense for AS is through SPI line) Optional for AS
7 SPI CLK from microcontroller The maximum SPI clock rate is 10MHz
12 CS_IC from microcontroller SPI chip select
14 SDI_BP
Serial data input for microcontroller, must be connected to
SDO of the IC if using addressable SPI. Alternatively, it can be
connected to SDI of the IC for daisy chain operations.
15 SDO_BP
Serial data input for microcontroller, must be connected to
SDI of the IC if using addressable SPI. Alternatively, it can be
connected to SDO of the IC for daisy chain operations.
17 Configure DO_EN pin Setting this pin low disables ALL the inputs.
18 Configure DSPI pin Pulling this pin high enables daisy chain SPI mode. Pulling
this pin low enables addressable SPI mode.
33 READY pin output from IC Logic low output indicating the IC is ready for SPI
communication.
34 FAULT pin output from IC Optional for AS and BS as the fault output is available through
SPI
Note that there are no series resistors with I/O ports for reverse current protection due to the high speed of SPI
communications. Please use diode or TI's ideal diode solutions for reverse current protection.
To power the attached LaunchPad from the on-board buck converter of the TPS274C65EVM, use a 1 × 3 shunt
to connect J16. Note that this feeds the output of the buck converter on the TPS274C65EVM into the 3.3-V rail
on the LaunchPad. If there is another power supply trying to power the LaunchPad (such as the integrated USB
power on the LaunchPad itself) this can potentially cause issues with the separate power sources fighting for
contention.
Jumpers J14 is used to manually configure the control signals going into the TPS274C65. When using a
microcontroller to control these signals, these jumpers must be unpopulated to allow for the microcontroller to
drive them high or low.
The current sense value can be reported digitally through internal ADC. However, current sense value can be
read directly without SPI through pin 34. Please make sure D3 is populated to clamp the pin voltage properly.
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4 TPS274C65EVM Schematic
VDD_IC
VS +3.3V
1
Analog_In
2
LP_UART_RX
3
LP_UART_TX
4
GP IO !
5
Analog In
6
S P I_CLK
7
GP IO !
8
I2C_SCL
9
I2C_SDA
10
+5V 21
GND 22
Analog_In 23
Analog_In 24
Analog_In 25
Analog_In 26
Analog_In/I2S _WS 2 7
Analog_In/I2S _S CLK 28
Analog_O ut/I2S _S Dout 29
Analog_O ut/I2S _S Din 30
J5
SS Q-110-03-T-D
GP IO ! 31
GP IO ! 32
GP IO ! 33
GP IO ! 34
Time r_Ca p/GP IO ! 35
Time r_Ca p/GP IO ! 36
P WM/GP IO ! 37
P WM/GP IO ! 38
P WM/GP IO ! 39
P WM/GP IO ! 40
GP IO !
11
S P I_CS /G P IO !
12
S P I_CS /G P IO !
13
S P I_MIS O
14
S P I_MOS I
15
RS T
16
GP IO
17
GP IO !
18
P WM/GP IO !
19
GND
20
J10
SS Q-110-03-T-D
Gre e n
12
S1
Re d
12
F4
36V
D2
SMBJ36A-13-F
GND
100nF
100V
C9
J2
571-0500
Gre e n
1 2
S2
Gre e n
12
S3
Gre e n
1 2
S4
Re d
1 2
F3
Re d
12
F2
Re d
1 2
F1
uC_3V3
FLT_IC
FLT_IC
4.7k
R2
VDD_IC
1
2
J13
961102-640 4-AR
Configura tion J umpe rs
J3
571-0500
REG_ EN_IC
REG_ EN_IC
GND
Lea ve floa ting to e n a ble inte rna l regulator
DO_EN_IC
1
2
J14
961102-640 4-AR
DO_EN_IC
VDD_IC
Conn e ct to e na ble S P I ba se d o utput
4
7,8 1 ,2,3
5,6 ,
Q1 CS D18543Q3A
4
7,8 1 ,2,3
5,6 ,
Q2
CS D18543Q3A
4
7,8
1,2,3
5,6,
Q3
CS D18543Q3A
4
7,8 1 ,2,3
5,6 ,
Q4
CS D18543Q3A
2.2 µF
50V
C7
GND
DSP I_IC
1
2
3
J15
961103-680 4-AR
DSP I_IC
VDD_IC
GND
ADDCFG_IC
GND
Cha nge the DIP s witch to cha nge S P I addre s s
22nF
100V
C10
22nF
100V
C11
22nF
100V
C12
22nF
100V
C13
GND
GND
GND
GND
TP3
TP9
TP13
5010
TP17
READY_IC
READY_IC
Pull HI to e na b le Da isy Cha in S P I
uC Conne ction
SCLK_IC
CS _ IC
ISNS _IC
4.7k
R10
100V
100pF
C14
GND
SNS _uC
Analog Sens ing
3.3 V
D3
MMSZ52 26B-7-F
SNS _uC
SDI_BP
SDO_BP
1
2
3
J17
961103-680 4-AR
1
2
3
J18
961103-680 4-AR
SDI_IC SDO_IC
Conn e ct 2 a nd 3 for Addre s s a ble SP I
Conn e ct 1 a nd 2 for e ve ry othe r EVM for Daisy Cha in
TP5
TP11
TP14
5011
TP20
390
R1
390
R5
J4
J7
J8
J9
J6
571-0100
TP7
5011
TP8
5011
TP2
5010
TP1
5010
TP18
5126
GND
GND
SCLK_IC
SDI_IC
SDO_ IC
CS _ IC
49.9
R3
49.9
R4
49.9
R6
49.9
R7
TP4
TP10
TP15
TP19
TP22
5126
RCB_1_1 RCB_1_2
RCB_2_1 RCB_2_2
RCB_3_1 RCB_3_2
RCB_4_1 RCB_4_2
TP6
TP12
TP16
TP21
RCB_1_1
RCB_1_2
RCB_2_1
RCB_2_2
RCB_3_1
RCB_3_2
RCB_4_1
RCB_4_2
Conn e ct to s hort RCB FET
4.7 nF
100V
C8
1 3
D1 BAS21-7-F
3.3V BUCK
1
2
3
J16
961103-680 4-AR
VDD_IC
uC_3V3
BUCK_3V3
TP24
5011
SDO_BP
SDI_BP
SDI_BP
SDO_BP
Resistor Value(kΩ) ADDCFG Code
13.3 000
17.8 001
23.7 010
31.6 011
44.2 100
59 101
78.7 110
110 111
TP25
TP23
TP26
TP28
VDD
4
RCB1 40
RCB2 31
RCB3 11
RCB4 20
OUT1 38
OUT1 39
OUT2 32
OUT2 33
OUT3 12
OUT3 13
OUT4 18
OUT4 19
VS
14
VS
15
VS
16
VS
17
VS
34
VS
35
VS
36
VS
37
CS
10
FLT
2
READY 1
ADDCFG
30
DO_EN
3
DSPI
28
ISNS 6
PowerPad 41
REG_EN
29
SDO
7SDI
8SCLK
9
LEDOUT1
22
LEDOUT2
23
LEDOUT3
24
LEDOUT4
25
NC 26
NC 27
GND 5
GND 21
TPS 274C65AS
U2
DO_EN_IC
DSP I_IC
GND
GND
Re d
12
F5
4.7k
R8
GND
1
2
J19
TSW-102-23-T-S
1
2
J20
TSW-102-23-T-S
1
2
J21
TSW-102-23-T-S
1
2
J22
TSW-102-23-T-S
ADDCFG_IC
13.3k
R12
17.8k
R13
23.7k
R14
J11
571-0100
TP27
5011
31.6k
R15
44.2k
R16
59.0k
R17
78.7k
R18
110k
R19
GND
1
2
3
J12
961103-680 4-AR
1.0 0k
R9
5k
R11
3296Y-1-502 LF
GND
ISNS _IC
TP29
5126
RT
1
P GO O D
2
EN/UVLO
3
VIN
4
S W 5
BOO T 6
VCC
7
VOUT/BIAS 8
GND 9
LMR3650 6R3RP ET
U1
1
2
3
J1
961103-680 4-AR
GND
100V
2.2 uF
C3
100nF
100V
C2
100V
1uF
C6
100nF
50V
C1
15uH
L1
10V
22uF
C4
10V
22uF
C5
GND
BUCK_3V3
C
1 2 3 4 5 6 7 8
SW1
STV08
Figure 4-1. TPS274C65EVM Schematic Drawing
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5 Connection Descriptions
Table 5-1 shows the test points populated on the board as well as the signal connectors.
Table 5-1. Connections and Test Points
Connector and Test Point Description
J2, TP1 Supply Voltage VS
J3, TP2 VDD voltage. Connect a supply if internal regulator is disabled
J4, TP3 Output voltage 1 (VOUT1)
TP4 RCB1 signal
J7, TP9 Output voltage 2 (VOUT2)
TP10 RCB2 signal
J8, TP13 Output voltage 3 (VOUT3)
TP15 RCB3 signal
J9, TP17 Output voltage 4 (VOUT4)
TP19 RCB4 signal
J5, J10 BoosterPack headers. Can be used to connect to TI microcontroller directly, or use jumpers to pair with
other microcontrollers.
J6, J11, TP5, TP7, TP8, TP11,
TP14, TP20, TP24, TP27 Ground
TP18 FAULT Signal
TP22 ADDCFG pin
TP23 SCLK pin on IC
TP25 SDI pin on IC
TP26 SDO pin on IC
TP28 CS pin on IC
TP29 ISNS pin on IC
Table 5-2 shows the relevant configuration jumpers of the TPS274C65EVM as well as the associated values.
Please refer to the TPS274C65 data sheet for detailed information on each pin's functionality.
Please note that a white mark on the jumper silkscreen is reflecting the position 1 of the jumper.
Table 5-2. Jumper Configurations
Jumper Function/Settings
J1 Connect 1 and 2 to disable on-board buck converter; connect 2 and 3 to enable on-board buck converter.
J12 Connect 1 and 2 to use fixed 1-kΩ resistor; connect 2 and 3 to use on-board potentiometer.
J13 Disconnect to use the internal regulator; do not use external VDD. Connect to disable the internal regulator;
use external VDD in this case.
J14 Connect to enable SPI communications.
J15 Connect 1 and 2 to enable daisy chain mode SPI communication; connect 2 and 3 to use addressable SPI.
J16 Connect 2 and 3 to power VDD using internal buck converter; connect 1 and 2 to power VDD with
microcontroller voltage output; leave open when using internal regulator.
J17 Connect 2 and 3 if using addressable SPI; connect 1 and 2 for every other EVM if using multiple EVMs in
daisy chain mode.
J18 Connect 2 and 3 if using addressable SPI; connect 1 and 2 for every other EVM if using multiple EVMs in
daisy chain mode.
J19, J20, J21, J22 Connect to bypass the RCB FETs; leave open for reverse current blocking.
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Please refer to Table 5-3 for ADDCFG DIP switch configuration.
Table 5-3. ADDCFG DIP Switch Configurations
DIP Switch Position Resistor Value ADDCFG Code
1 110 kΩ 111
2 78.7 kΩ 110
3 59 kΩ 101
4 44.2 kΩ 100
5 31.6 kΩ 011
6 23.7 kΩ 010
7 17.8 kΩ 001
8 13.3 kΩ 000
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6 TPS274C65EVM Assembly Drawings and Layout
Figure 6-1. 3D Representation
Figure 6-2. Top Layer
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Figure 6-3. Ground Layer
Figure 6-4. Power Layer
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Figure 6-5. Bottom Layer
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7 Bill of Materials
Table 7-1 lists the TPS274C65 Bill of Materials.
Table 7-1. TPS274C65 Bill of Materials
Designator Value Description Package Reference Part Number Manufacturer
C1 0.1 uF CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R, 0603 0603 C1608X7R1H104K080AA TDK
C2 0.1 uF CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R, 0805 0805 C0805C104K1RACTU Kemet
C3 2.2 uF CAP, CERM, 2.2 uF, 100 V, +/- 10%, X7R, 1210 1210 C1210C225K1RACTU Kemet
C4, C5 22 uF CAP, CERM, 22 uF, 10 V, +/- 10%, X7R, 1206 1206 GRM31CR71A226KE15L MuRata
C6 1 uF CAP, CERM, 1 uF, 100 V, +/- 10%, X7R, 1210 1210 C3225X7R2A105K200AA TDK
C7 2.2 uF CAP, CERM, 2.2 uF, 50 V, +/- 10%, X7R, AEC-Q200
Grade 1, 0805 0805 CGA4J3X7R1H225K125AB TDK
C8 4700 pF CAP, CERM, 4700 pF, 100 V, +/- 10%, X7R, AEC-Q200
Grade 1, 0603 0603 CGA3E2X7R2A472K080AA TDK
C9 0.1 uF CAP, CERM, 0.1 uF, 100 V,+/- 10%, X7R, AEC-Q200
Grade 1, 0603 0603 GCJ188R72A104KA01D MuRata
C10, C11, C12, C13 0.022 uF CAP, CERM, 0.022 uF, 100 V, +/- 10%, X7R, AEC-Q200
Grade 1, 0603 0603 CGA3E2X7R2A223K080AA TDK
C14 100 pF CAP, CERM, 100 pF, 100 V, +/- 5%, C0G/NP0, AEC-Q200
Grade 1, 0603 0603 GCM1885C2A101JA16D MuRata
D1 200 V Diode, Switching, 200 V, 0.2 A, SOT-23 SOT-23 BAS21-7-F Diodes Inc.
D2 36 V Diode, TVS, Uni, 36 V, 58.1 Vc, SMB SMB SMBJ36A-13-F Diodes Inc.
D3 3.3 V Diode, Zener, 3.3 V, 500 mW, SOD-123 SOD-123 MMSZ5226B-7-F Diodes Inc.
F1, F2, F3, F4, F5 Red LED, Red, SMD SMD, 2-Leads, Body
1.3x0.8mm LS L29K-G1J2-1-Z OSRAM
J1, J12, J15, J16, J17, J18 Header, 2.54mm, 3x1, Gold, TH Header, 2.54mm, 3x1, TH 961103-6804-AR 3M
J2, J3, J4, J7, J8, J9 Standard Banana Jack, insulated, 10A, red 571-0500 571-0500 DEM Manufacturing
J5, J10 Receptacle, 2.54mm, 10x2, Tin, TH 10x2 Receptacle SSQ-110-03-T-D Samtec
J6, J11 Standard Banana Jack, insulated, 10A, black 571-0100 571-0100 DEM Manufacturing
J13, J14 Header, 2.54mm, 2x1, TH Header, 2.54mm, 2x1, TH 961102-6404-AR 3M
J19, J20, J21, J22 Header, 2.54mm, 2x1, Tin, TH Header, 2.54mm, 2x1, TH TSW-102-23-T-S Samtec
L1 15 uH Inductor, Shielded Drum Core, Ferrite, 15 uH, 1.1 A, 0.08
ohm, SMD
SMD, 2-Leads, Body
6.8x6.8mm 744062150 Wurth Elektronik
Q1, Q2, Q3, Q4 60 V MOSFET, N-CH, 60 V, 35 A, DNH0008A (VSONP-8) DNH0008A CSD18543Q3A Texas Instruments
R1, R5 390 RES, 390, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603390RJNEA Vishay-Dale
R2, R8, R10 4.7 k RES, 4.7 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 ERJ-3GEYJ472V Panasonic
R3, R4, R6, R7 49.9 RES, 49.9, 1%, 0.063 W, 0402 0402 RC0402FR-0749R9L Yageo America
R9 1.00 k RES, 1.00 k, 1%, 0.25 W, 0805 0805 ERJ-P06F1001V Panasonic
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Table 7-1. TPS274C65 Bill of Materials (continued)
Designator Value Description Package Reference Part Number Manufacturer
R11 5k TRIMMER, 5k ohm, 0.5W, TH 9.5x10x4.8mm 3296Y-1-502LF Bourns
R12 13.3 k RES, 13.3 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2RKF1332X Panasonic
R13 17.8 k RES, 17.8 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040217K8FKED Vishay-Dale
R14 23.7 k RES, 23.7 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2RKF2372X Panasonic
R15 31.6 k RES, 31.6 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040231K6FKED Vishay-Dale
R16 44.2 k RES, 44.2 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040244K2FKED Vishay-Dale
R17 59.0 k RES, 59.0 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040259K0FKED Vishay-Dale
R18 78.7 k RES, 78.7 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040278K7FKED Vishay-Dale
R19 110 k RES, 110 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW0402110KFKED Vishay-Dale
S1, S2, S3, S4 Green LED, Green, SMD 1.7x0.65x0.8mm LG L29K-G2J1-24-Z OSRAM
SH-J1, SH-J2, SH-J3, SH-
J4, SH-J5, SH-J6, SH-J7 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G Samtec
SW1 Dip Switch SPST 8 Position Through Hole Slide
(Standard) Actuator 10mA 5VDC DIP8 STV08 TE Connectivity
TP1, TP2, TP3, TP6, TP9,
TP12, TP13, TP16, TP17,
TP21
Test Point, Multipurpose, Red, TH Red Multipurpose Testpoint 5010 Keystone
TP4, TP10, TP15, TP18,
TP19, TP22, TP23, TP25,
TP26, TP28, TP29
Test Point, Multipurpose, Green, TH Green Multipurpose Testpoint 5126 Keystone
TP5, TP7, TP8, TP11,
TP14, TP20, TP24, TP27 Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 5011 Keystone
U1 LMR36503/06-Q1 Wide Input 60-V Synchronous, DC-DC
Buck Converter, RPE0009A (VQFN-9) RPE0009A LMR36506R3RPET Texas Instruments
U2 65-mΩ, Quad-Channel Smart High-Side Switch with SPI
interface and Diagnostics VQFN40 TPS274C65AS Texas Instruments
Bill of Materials www.ti.com
12 TPS274C65 Evaluation Module SLVUCI0 – MAY 2022
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