Toshiba FDX3543RP Instruction manual

X-Ray FLAT PANEL IMAGER
FDX3543RP
Active Area: 35(H)×43(V)cm
(14″×17″)
★The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA ELECTRON TUBES & DEVICES CO., LTD. (TETD) for any infringements of patents or other rights of the
third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TETD or others.
★The information contained herein may be changed without prior notice. It is therefore advisable to contact TETD before proceeding with the design of
equipment incorporating this product.
Technical Data T
D
No.TE-FDX3543RP 2012-08-16
FEATURING:
●Excellent Sensitivity & Resolution
●Excellent Image Quality
●Excellent Reliability
– Excellent Sensitivity & Resolution –
●Toshiba’s advanced and proven fine structured CsI:Tl and direct vapor deposition
technology deliver higher sensitivity and better resolution.
●Reflection coating on CsI:Tl screen enables excellent Detective Quantum Efficiency (DQE)
and low noise.
●A high Modulation Transfer Function (MTF) FPD is the result of these outstanding
technologies diagnostic images, while delivering the benefits of lower radiation dose to the
patient. The FDX3543RP achieves a new level of functionality and reliability in developing
functional FPD’s for system manufacturers.
– Excellent Image Quality –
●Achieves a raw image with a low-noise through the use of Toshiba’s own circuit technology.
●Images have a shorter lag time with an improved refresh function, suitable for radiographic
double exposure.
●Driver software (attached to the product) provides excellent, clear raw images, adopting
ghost image correction , offset correction, gain correction and defect corrections.
– Excellent Reliability –
●Excellent durability by using CsI:Tl screen direct vapor deposition method.
●The structure is highly reliable and protected from degradation due to the use of a unique
moisture-proof sealing method for the CsI:Tl screen

FDX3543RP
-2-
COMPONENTS AND CHARACTERISTICS
Flat Panel Sensor Unit:
Sensor Protection Plate....................................................................................... Carbon Fiber Plate
Cooling ................................................................................................................ Natural Air Cooling
Input....................................................................................................... DC15V (from Interface Box)
Power Consumption .................................................................................................. Maximum 10W
Overall Dimensions................................................................ 384×460×15mm (W(H)×D(V)×(H))
Weight ......................................................................................................................... 3 kg (approx.)
Interface Box:
Input........................................................................................................... AC100 to 240V, 50/60Hz
Output.................................................................................................................. DC15V 2.6A 30VA
Overall Dimensions................................................................ 115×185×85mm (W(H)×D(V)×(H))
Weight ......................................................................................................................... 1 kg (approx.)
Dimensional Outline:
Refer to pages 24 to 25.
Environmental:
Under delivery and stock
Temperature ............................................................................................................ -15 ～55 ℃
Humidity........................................................................................ 10 ～90 %(Non-Condensing)
Pressure ................................................................................................................ 50 ～106 kPa
Under operating
Temperature ........................................................................................................... +10 ～35 ℃
Humidity....................................................................................... 10 ～85 % (Non-Condensing)
Pressure ................................................................................................................ 70 ～106 kPa
ACCESSORIES
Cables:
AC Cable ............................................................................................................................ 1.8 m×1
GND Cable ............................................................................................................................ 3 m×1
CD:
CD（Defect map, SDK）............................................................................................................. 1 pcs
OPTION ACCESSORIES
Sensor Unite Cable (Sensor Unit - Interface Unit)
ECB-F035A-09/G......................................................................................................................... 9 m
ECB-F035A-14/G....................................................................................................................... 14 m

FDX3543RP
-3-
MAIN CHARACTERISTICS
Image Format:
X-ray Conversion Layer ................... Cesium Iodide (Csl) with Amorphous Silicon (a-Si) Photodiode
Active Area ........................................................................................ 35(H)×43(V)cm (14×17 inch)
Pixel Matrix ........................................................................................................... 2448(H)×2984(V)
Pixel Pitch............................................................................................................................ 143 μm
Cycle Time............................................................................................................. Shot to Shot 6sec
Performance:
Limiting Resolution .................................................................................................... 3.7 Lp/mm typ.
MTF (2.0 Lp/mm, 70 kVp, 1×1) ......................................................................................... 36 % typ.
DQE (DQE (0), Quantum - Limited)........................................................................................ > 70 %
A/D Conversion......................................................................................................................... 16 bit
Ratings:
Energy Range............................................................................................................... 40～150 kVp
Maximum Entrance Dose (low Gain)（Linear Output Range）....................................... 4 mR / frame
Interface (Interface Box):
Sensor Unit
UNIT Interface ............................................................................................. Connect to InterfaceBox
Interface Box
Unit Interface ................................................................................................Connect to Sensor Unit
Data Output ................................................................. 16 bit Digital Output Ethernet (1000BASE-T)
Command Control.......................................................................................... Ethernet (1000BASE-T)
X-ray Synchronization Control .............................................................................................. External
Power Input .............................................................................................. AC100 to 240V, 50/60 Hz
Image Acquisition Exposure period:
X-ray period (ms)........................................................Standard: 500 (Variable between 500 to 2000)

FDX3543RP
-4-
Product Components and Interface:
NOTE:
Do not disconnect Ethernet connection while DC15V is operating and supplying to Sensor Unit.
LED Display Mode:
Name Status
POWER Turn on when power on
ETHERNET Turn on when Connect Ethernet
Detector
PC (User)
TFT Panel
Gate Drive
r
ROIC Unit
Control Board
Ethernet
Interface
Box
DC15V
Image Data
&Control
X-ray
Control Unit (User)
X-ray Sync

FDX3543RP
-5-
Image Acquisition Communication Block Diagram:
Communication Availability:
Signal Name Type Ethernet Command Control
(PC)
D-Sub Signal Control
(X-ray Controller)
EXP_REQ INPUT OK OK
EXP_OK OUTPUT N.A OK
＊EXP_REQ Command Response
Di
g
ital Unit
Interface Box
Generator Panel Unit
Sensor unit
Power Unit
PC Image Data
Image Data
Image Data
DC Power DC Power
DC Power
X-ra
y
S
y
nc

FDX3543RP
-6-
FPI Drive
EXP_RE <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STRAGE
Ready
Data
Ref Ready RefExposure Read
FPI ENABLED
1st 1st
②
①
A
BCD
C
Image Acquisition Control Interface:
D-Sub Signal Control Interface Operation Sequence
Description of the sequence
1. By receiving “EXP_REQ” during “Refresh” status proceeds to “Exposure” after completion of
“Refresh”.
2. Continues “EXP_OK” signal ON during “Exposure”. ON period is defined by Image Acquisition
mode table.
3. Proceeds to “Data Read” after completion of Exposure.
(1) Single Exposure
A: EXP_REQ width
Minimum 1ms
B: Refresh period
For line drive (2984 Line scan), 80 ms
C: EXP period
Set value: see the Image acquisition mode table (500 to 2000 ms (by 500 ms step),
standard 500 ms).
D: Read period
For line drive (2984 Line Scan) 240 ms
①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms
②：EXP_REQ－DATA STORAGE period ...........Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP
-7-
FPI Drive
EXP_RE <IN>
EXP_O
K
<OUT>
EXPOSURE
DATA_STRAGE
Ready
1st image data 2nd image data
Exposure Read Exposure ReadRef Ref
FPI ENABLED
1st 1st
②
①
2nd 2nd
CD
A
B
C
CD
C
(2) Double Exposure
A: EXP_REQ width
Minimum 1ms
B: Refresh period
For line drive (2984 Line scan) 80 ms
C: EXP period
Set value: see the Image Acquisition mode table (500 to 2000 ms (by 500 ms step),
standard 500 ms).
D: Read period
For line drive (2984 Line Scan) 240 ms
①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms
②：Double EXPOSURE cycle period...................Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP
-8-
FPI Drive Ref Re
f
EXP_RE <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STRAGE
Ready
Data
ReadyExposure Read
FPI ENABLED
1st 1st
②
①
Image Acquisition Control Interface:
Ethernet Interface Command Control Operation Sequence
Description of the sequence
1. By receiving “EXP_REQ” request command during “Refresh” status proceeds to “Exposure”
after completion of “Refresh”.
2. Continues “EXP_OK” signal ON during “Exposure”. ON period is defined by Image Acquisition
mode table.
3. Proceeds to “Data Read” after completion of Exposure.
(1) Single Exposure
①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms
②：EXP_REQ－DATA STORAGE period ...........Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP
-9-
FPI Drive Ref Ref
EXP_RE <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STRAGE
Ready Exposure Read Exposure Read
FPI ENABLED
1st 1st
②
①
2nd 2nd
(2) Double Exposure
①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms
②：Double EXPOSURE cycle period...................Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP
-10-
2-M2.6×0.45
1 5
6 9
FPI Side
User System Side
Pin 2
Pin 7
D-Sub 9 Pin
Connector
Image Acquisition Control Interface of Interface Box:
1. Pins assign
Pin No Signal name I/O Contents
1 NC - Not connected
2 EXP_REQ+ Input
Image acquisition (X-ray exposure)
Request signal +
3 0_TEXP_OK+ Output
Image acquisition (X-ray exposure)
Period signal +
4 0_EXP_OK+ (OC) Output Open Collector +
5 NC - Not connected
6 NC - Not connected
7 EXP_REQ- Input
Image acquisition (X-ray exposure)
Request signal -
8 0_TEXP_OK- Output
Image acquisition (X-ray exposure)
Period signal -
9 0_EXP_OK- (OC) Output Open Collector-
*1 Please put the protective resistance more than 1.4 kΩin the series.
*2 Maximum sink current is 20 mA.
2. External Interface (EXT-INF)
D-Sub 9pin female (Front View)
3. Input Circuit
Symbol Min. Typ. Max. Unit
Input Voltage Vih 5 - 28 V
Vil 0 - 1 V
2- №4-40UNC