Toshiba FDX3543RP Instruction manual

X-Ray FLAT PANEL IMAGER
FDX3543RP
Active Area: 35(H)×43(V)cm
(14″×17″)
★The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA ELECTRON TUBES & DEVICES CO., LTD. (TETD) for any infringements of patents or other rights of the
third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TETD or others.
★The information contained herein may be changed without prior notice. It is therefore advisable to contact TETD before proceeding with the design of
equipment incorporating this product.
Technical Data T
D
No.TE-FDX3543RP 2012-08-16
FEATURING:
●Excellent Sensitivity & Resolution
●Excellent Image Quality
●Excellent Reliability
– Excellent Sensitivity & Resolution –
●Toshiba’s advanced and proven fine structured CsI:Tl and direct vapor deposition
technology deliver higher sensitivity and better resolution.
●Reflection coating on CsI:Tl screen enables excellent Detective Quantum Efficiency (DQE)
and low noise.
●A high Modulation Transfer Function (MTF) FPD is the result of these outstanding
technologies diagnostic images, while delivering the benefits of lower radiation dose to the
patient. The FDX3543RP achieves a new level of functionality and reliability in developing
functional FPD’s for system manufacturers.
– Excellent Image Quality –
●Achieves a raw image with a low-noise through the use of Toshiba’s own circuit technology.
●Images have a shorter lag time with an improved refresh function, suitable for radiographic
double exposure.
●Driver software (attached to the product) provides excellent, clear raw images, adopting
ghost image correction , offset correction, gain correction and defect corrections.
– Excellent Reliability –
●Excellent durability by using CsI:Tl screen direct vapor deposition method.
●The structure is highly reliable and protected from degradation due to the use of a unique
moisture-proof sealing method for the CsI:Tl screen

FDX3543RP
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COMPONENTS AND CHARACTERISTICS
Flat Panel Sensor Unit:
Sensor Protection Plate....................................................................................... Carbon Fiber Plate
Cooling ................................................................................................................ Natural Air Cooling
Input....................................................................................................... DC15V (from Interface Box)
Power Consumption .................................................................................................. Maximum 10W
Overall Dimensions................................................................ 384×460×15mm (W(H)×D(V)×(H))
Weight ......................................................................................................................... 3 kg (approx.)
Interface Box:
Input........................................................................................................... AC100 to 240V, 50/60Hz
Output.................................................................................................................. DC15V 2.6A 30VA
Overall Dimensions................................................................ 115×185×85mm (W(H)×D(V)×(H))
Weight ......................................................................................................................... 1 kg (approx.)
Dimensional Outline:
Refer to pages 24 to 25.
Environmental:
Under delivery and stock
Temperature ............................................................................................................ -15 ～55 ℃
Humidity........................................................................................ 10 ～90 %(Non-Condensing)
Pressure ................................................................................................................ 50 ～106 kPa
Under operating
Temperature ........................................................................................................... +10 ～35 ℃
Humidity....................................................................................... 10 ～85 % (Non-Condensing)
Pressure ................................................................................................................ 70 ～106 kPa
ACCESSORIES
Cables:
AC Cable ............................................................................................................................ 1.8 m×1
GND Cable ............................................................................................................................ 3 m×1
CD:
CD（Defect map, SDK）............................................................................................................. 1 pcs
OPTION ACCESSORIES
Sensor Unite Cable (Sensor Unit - Interface Unit)
ECB-F035A-09/G......................................................................................................................... 9 m
ECB-F035A-14/G....................................................................................................................... 14 m

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MAIN CHARACTERISTICS
Image Format:
X-ray Conversion Layer ................... Cesium Iodide (Csl) with Amorphous Silicon (a-Si) Photodiode
Active Area ........................................................................................ 35(H)×43(V)cm (14×17 inch)
Pixel Matrix ........................................................................................................... 2448(H)×2984(V)
Pixel Pitch............................................................................................................................ 143 μm
Cycle Time............................................................................................................. Shot to Shot 6sec
Performance:
Limiting Resolution .................................................................................................... 3.7 Lp/mm typ.
MTF (2.0 Lp/mm, 70 kVp, 1×1) ......................................................................................... 36 % typ.
DQE (DQE (0), Quantum - Limited)........................................................................................ > 70 %
A/D Conversion......................................................................................................................... 16 bit
Ratings:
Energy Range............................................................................................................... 40～150 kVp
Maximum Entrance Dose (low Gain)（Linear Output Range）....................................... 4 mR / frame
Interface (Interface Box):
Sensor Unit
UNIT Interface ............................................................................................. Connect to InterfaceBox
Interface Box
Unit Interface ................................................................................................Connect to Sensor Unit
Data Output ................................................................. 16 bit Digital Output Ethernet (1000BASE-T)
Command Control.......................................................................................... Ethernet (1000BASE-T)
X-ray Synchronization Control .............................................................................................. External
Power Input .............................................................................................. AC100 to 240V, 50/60 Hz
Image Acquisition Exposure period:
X-ray period (ms)........................................................Standard: 500 (Variable between 500 to 2000)

FDX3543RP
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Product Components and Interface:
NOTE:
Do not disconnect Ethernet connection while DC15V is operating and supplying to Sensor Unit.
LED Display Mode:
Name Status
POWER Turn on when power on
ETHERNET Turn on when Connect Ethernet
Detector
PC (User)
TFT Panel
Gate Drive
r
ROIC Unit
Control Board
Ethernet
Interface
Box
DC15V
Image Data
&Control
X-ray
Control Unit (User)
X-ray Sync

FDX3543RP
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Image Acquisition Communication Block Diagram:
Communication Availability:
Signal Name Type Ethernet Command Control
(PC)
D-Sub Signal Control
(X-ray Controller)
EXP_REQ INPUT OK OK
EXP_OK OUTPUT N.A OK
＊EXP_REQ Command Response
Di
g
ital Unit
Interface Box
Generator Panel Unit
Sensor unit
Power Unit
PC Image Data
Image Data
Image Data
DC Power DC Power
DC Power
X-ra
y
S
y
nc

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FPI Drive
EXP_RE <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STRAGE
Ready
Data
Ref Ready RefExposure Read
FPI ENABLED
1st 1st
②
①
A
BCD
C
Image Acquisition Control Interface:
D-Sub Signal Control Interface Operation Sequence
Description of the sequence
1. By receiving “EXP_REQ” during “Refresh” status proceeds to “Exposure” after completion of
“Refresh”.
2. Continues “EXP_OK” signal ON during “Exposure”. ON period is defined by Image Acquisition
mode table.
3. Proceeds to “Data Read” after completion of Exposure.
(1) Single Exposure
A: EXP_REQ width
Minimum 1ms
B: Refresh period
For line drive (2984 Line scan), 80 ms
C: EXP period
Set value: see the Image acquisition mode table (500 to 2000 ms (by 500 ms step),
standard 500 ms).
D: Read period
For line drive (2984 Line Scan) 240 ms
①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms
②：EXP_REQ－DATA STORAGE period ...........Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP
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FPI Drive
EXP_RE <IN>
EXP_O
K
<OUT>
EXPOSURE
DATA_STRAGE
Ready
1st image data 2nd image data
Exposure Read Exposure ReadRef Ref
FPI ENABLED
1st 1st
②
①
2nd 2nd
CD
A
B
C
CD
C
(2) Double Exposure
A: EXP_REQ width
Minimum 1ms
B: Refresh period
For line drive (2984 Line scan) 80 ms
C: EXP period
Set value: see the Image Acquisition mode table (500 to 2000 ms (by 500 ms step),
standard 500 ms).
D: Read period
For line drive (2984 Line Scan) 240 ms
①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms
②：Double EXPOSURE cycle period...................Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP
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FPI Drive Ref Re
f
EXP_RE <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STRAGE
Ready
Data
ReadyExposure Read
FPI ENABLED
1st 1st
②
①
Image Acquisition Control Interface:
Ethernet Interface Command Control Operation Sequence
Description of the sequence
1. By receiving “EXP_REQ” request command during “Refresh” status proceeds to “Exposure”
after completion of “Refresh”.
2. Continues “EXP_OK” signal ON during “Exposure”. ON period is defined by Image Acquisition
mode table.
3. Proceeds to “Data Read” after completion of Exposure.
(1) Single Exposure
①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms
②：EXP_REQ－DATA STORAGE period ...........Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP
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FPI Drive Ref Ref
EXP_RE <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STRAGE
Ready Exposure Read Exposure Read
FPI ENABLED
1st 1st
②
①
2nd 2nd
(2) Double Exposure
①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms
②：Double EXPOSURE cycle period...................Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP
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2-M2.6×0.45
1 5
6 9
FPI Side
User System Side
Pin 2
Pin 7
D-Sub 9 Pin
Connector
Image Acquisition Control Interface of Interface Box:
1. Pins assign
Pin No Signal name I/O Contents
1 NC - Not connected
2 EXP_REQ+ Input
Image acquisition (X-ray exposure)
Request signal +
3 0_TEXP_OK+ Output
Image acquisition (X-ray exposure)
Period signal +
4 0_EXP_OK+ (OC) Output Open Collector +
5 NC - Not connected
6 NC - Not connected
7 EXP_REQ- Input
Image acquisition (X-ray exposure)
Request signal -
8 0_TEXP_OK- Output
Image acquisition (X-ray exposure)
Period signal -
9 0_EXP_OK- (OC) Output Open Collector-
*1 Please put the protective resistance more than 1.4 kΩin the series.
*2 Maximum sink current is 20 mA.
2. External Interface (EXT-INF)
D-Sub 9pin female (Front View)
3. Input Circuit
Symbol Min. Typ. Max. Unit
Input Voltage Vih 5 - 28 V
Vil 0 - 1 V
2- №4-40UNC

FDX3543RP
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5V
Pin 3
Pin 8
User System SideFPI Side
D-Sub 9 Pin
Connector
Max Voltage 28V
Protective
resistance
Pin 9
Pin 4
22Ω
User System SideFPI Side
D-Sub 9 Pin
Connector
4. Output Circuit
4.1 5V CMOS Level Type
4.2 Open Collector Type
Protective resistance more than 1.4kΩmust be inserted in series.
IP Address Select Switch
Select IP address
IP0 192.168.95.52
IP1 “192.168.95.53” or User defined IP address
＊Please use “HUB” when you connect two sensor units (Dual use).

FDX3543RP
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The information about EMC conformity (IEC60601-1-2:2007)
Guidance and manufacturer’s declaration - electromagnetic emissions
The X-Ray FLAT PANEL IMAGER (hereafter called FPI) is intended for use in the electromagnetic
specified below.
The customer or the user of the FPI should assure that it is used in such an environment.
Emissions test Compliance Electromagnetic environment - guidance
RF emissions
CISPR 11
Group1 The FPI uses RF energy only for its internal function.
Therefore, its RF emissions are very low and are not
likely to cause any interference in nearby electronic
equipment.
RF emissions
CISPR 11
Class A The FPI is suitable for use in all establishments other
than domestic and those directly connected to the
public low-voltage power supply network that supplies
building used for domestic purposes.
Harmonic emissions
IEC61000-3-2
Not applicable
Voltage fluctuations/
flicker emissions
IEC61000-3-3
Not applicable
Note The FPI is not allowed to use the cables or components differ from the
originally attached.
If the different cables or components are used, they may deteriorate the
performance of electromagnetic emissions.
The limited length of cables for conforming EMC (IEC60601-1-2:2007)
Cables Cable length (Max.)
Sensor Unit Cable 14 m
GND Cable 3 m
Refer to Product Components and Interface about wiring and connection of these cables.

FDX3543RP
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Guidance and manufacturer’s declaration – electromagnetic immunity
The FPI is intended for use in the electromagnetic specified below.
The customer or the user of the FPI should assure that it is used in such an environment.
Immunity
test
IEC60601
test level
Compliance
level
Electromagnetic environment -
guidance
Electrostatic
discharge (ESD)
IEC61000-4-2
±6kV contact
±8kV air
±6kV contact
±8kV air
Floors should be wood, concrete
or ceramic tile. If floors are
covered with synthetic material.
The relative humidity should be at
least 30 %.
Electrical fast
transient／burst
IEC61000-4-4
±2 kV for power
supply lines
±1kV for input/
output lines
±2kV for power
supply lines
±1kV for input/
output lines
Mains power quality should be that
of a typical commercial or hospital
environment.
Surge
IEC61000-4-5
±1kV differential
mode
±2kV common
mode
±1kV differential
mode
±2kV common
mode
Mains power quality should be that
of a typical hospital environment.
Voltage dips, short
interruptions and
voltage variations
on power supply
input lines
IEC61000-4-11
＜5 % UT
(＞95 % dip in, UT)
for 5 sec
＜5 % UT
(＞95 % dip in, UT)
for 5 sec
Mains power quality should be that
of a typical hospital environment. If
the user of the FPI requires
continued operation during power
mains interruptions, it is
recommended that the FPI be
powered from an uninterruptible
power supply or a battery.
Power frequency
(50/60Hz)
magnetic field
IEC61000-4-8
3A/m 3A/m Power frequency magnetic fields
should be at levels characteristic
of a typical location in atypical
commercial or hospital
environment.
Note:
(1) UTis the a.c.mains voltage prior to application of the test level.
(2) This FPI can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
recommended separation distance between portable and mobile RF communications
equipment and this system.

FDX3543RP
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Guidance and manufacturer’s declaration – electromagnetic immunity
The FPI is intended for use in the electromagnetic environment specified below. The customer or
the user of the FPI should assure that it is used such an environment.
Immunity
test
IEC 60601
test level
Compliance
level
Electromagnetic environment –
guidance
Conducted RF
IEC61000-4-6
Radiated RF
IEC61000-4-3
3Vrms
150kHz to 80MHz
3V/m
80MHz to 2.5GHz
3Vrms
3V/m
Portable and mobile RF communications
equipment should be used no closer to
any part of the FPI, including cables, than
the recommended separation distance
calculated from the equation applicable to
the frequency of the transmitter.
Recommended separation distance
P=d 2.1 150kHz to 80MHz
P=d 2.1 80 MHz to 800 MHz
P=d 3.2 800 MHz to 2.5 GHz
Where P is the maximum output power
rating of the transmitter in watts (W)
according to the transmitter manufacturer
and dis the recommended separation
distance in meters (m).
Field strengths from fixed RF transmitters,
as determined by an electromagnetic site
surveya,should be less than the
compliance level in each frequency
rangeb.
Interference may occur in the vicinity of
equipment marked with the following
symbol:
Note:
(1) At 80 MHz and 800 MHz, the higher frequency range applies.
(2) These guidelines may not apply in all situations. Electromagnetic propagation is affected by
absorption and reflection from structures, object and people.
(3) This FPI can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
electromagnetic immunity.
aField strengths from fixed transmitters, such as base stations for radio (cellular/cordless)
telephones and land mobile radios. Amateur radio, AM and FM radio broadcast and TV
broadcast cannot be predicted theoretically with accuracy. To assess the electromagnetic
environment due to fixed RF transmitters, an electromagnetic site survey should be considered. If
the measured field strength in the location in which the FPI is used exceeds the applicable RF
compliance level above, the FPI should be observed to verify normal operation. If abnormal
performance is observed, additional measures may be necessary, such as reorienting or
relocating the FPI.
bOver the frequency range 150 kHz to 80 MHz, field strengths should be less than 3V/m.

FDX3543RP
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Recommended separation distances between portable and mobile RF communications equipment
and the FPI.
The FPI is intended for use in an electromagnetic environment in which radiated RF disturbances
are controlled. The customer or the user of the FPI can help prevent electromagnetic interference
by maintaining a minimum distance between portable and mobile RF communication equipment
(transmitters) and the FPI as recommended below, according to the maximum output power of the
communications equipment.
Rated maximum
output power of
transmitter
W
Separation distance according to frequency of transmitter
m
150kHz to 80MHz
P=d 2.1
80MHz to 800MHz
P=d 2.1
800MHz to 2.5GHz
P=d 3.2
0.01 0.12 0.12 0.23
0.1 0.38 0.38 0.73
1 1.2 1.2 2.3
10 3.8 3.8 7.3
100 12 12 23
For transmitters rated at a maximum output power listed above, the recommended separation
distance din meters (m) can be estimated using the equation applicable to the frequency of the
transmitter. Where Pis the maximum output power rating of the transmitter in watts (W) according
to the transmitter manufacturer.
Note:
(1) At 80MHz and 800MHz, the separation distance for the higher frequency range applies.
(2) These guidelines may not apply in all situations. Electromagnetic propagation is affected by
absorption by absorption and reflection from structures objects and people.
(3) The FPI can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
recommended separation distance between portable and mobile RF communications
equipment and this system.
CAUTION
CAUTION
DO NOT USE THE ELECTROMAGNETIC DEVICE, SUCH AS (CELLULAR/CORDLESS)
TELEPHONES AND RADIO CONTROLLED TOYS, CLOSE TO THIS SYSTEM. OTHERWISE,
IT MAY CAUSE MALFUNCTION OF THE SYSTEM.

FDX3543RP
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INSTALLATION
For installing the FPI in the apparatus, refer to the dimensional outlines.
INSTALLING HOUSING IN APPARATUS:
1. Surface of the base plate that locates FPI on the apparatus should be flat and smooth.
2. It is necessary to clean both surface of FPI and the base plate of the apparatus before FPI is
installed.

FDX3543RP
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MAINTENANCE AND CHECK
DAILY CHECK ITEMS
Before using the sensor unit, check the following items:
(1) Environment
- The environmental conditions for operation must be adequate.
(2) Appearance
- Wiring and appearance must be free from any abnormality.
(3) Operation
- The sensor unit must operate normally after power on.
(4) Others
- Any abnormalities such as unusual sound and strange odor are not permissible.
PERIODIC CHECK ITEMS
Check the following at a certain interval within one year:
(1) Appearance
- The sensor unit must be free from errors in appearance.
- The outer mounting screws must be free from looseness and slip-off.
- The mounting screws to the equipment must be free from abnormalities such as looseness.
- Each cable must be free from cracks and damages.
- Each cable must be securely connected. Any looseness is not permissible.
(2) Electrical safety
- The protective grounding wire must be accurately connected.
(3) Cleaning
- Cleaning of the outer surface
(4) Functionality
- The sensor unit must operate normally under control.

FDX3543RP
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SAFETY PRECAUTIONS AND WARNING
Find this document before using X-Ray FLAT PANEL IMAGER (FPI)
This document describes the attention of equipment manufactures and users to use safety X-Ray
FLAT PANEL IMAGER (hereafter called FPI). Please find the technical data sheet of each product and
this document “SAFETY PRECAUTIONS AND WARNING” and understand these contents before
using FPI. The FPI is used under X-ray exposures. Therefore engineers or service people who have
sufficient technical knowledge and experience shall handle the FPI with enough care. Moreover these
documents are always stored and can be seen in operating place. If you have any questions, please
contact our local sales representatives for further information.
The FPI present a certain number of potential risks by the very nature of the physical principles
included in their manufacture or operation and because of the materials used to make FPI. Therefore
equipment manufacturers and users shall take the responsibility by themselves to protect against
these risk and respect local safety laws and regulations.
1. Electric Shock
In operating, do not touch the lead wires and connectors of the X-Ray FLAT PANEL IMAGER
(FPI). If necessary to touch lead wires and connectors, please turn off the power supply and
confirm no residual voltage exist before connecting, disconnecting and handling them. The
housing of the FPI should always be connected to ground. All ground terminals and ground
wires shall be also done to ground.
2. Ground Connection
Connect all protective earth and cables of the FPI to ground. The housing with protective earth
should be connected to ground. The resistance between protective earth and ground cables
shall be less than 0.1 ohms. The sectional area of the conductor is required for 0.75mm2or
more.
3. Stop Operation During Abnormal Status
Shut down power supply and contact to sales representatives immediately when the FPI stops
operation during abnormal status.
4. Remodeling Electronics Parts
Do not reconstruct FPI electronics parts because it leads to deterioration of images and the
cause of malfunctions.
5. Processing of Housing
Do not process FPI housing because it leads to weakness of housing strength and the cause of
malfunctions.
6. Screws of Housing
As the screws of FPI housing are tightened by proper torque, do not loosen or remove them.

FDX3543RP
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7. Handling
Do not hold the FPI connector and sensor unite cable when lifting and/or moving the FPI.
Please be careful not to drop the FPI. If dropped, check appearance and do not use FPI if it
has abnormality.
8. Ingress of Spill Liquid
Do not spill a liquid (Blood, Body fluid, Cleaning liquid, etc) on the FPI. When spilled a liquid,
please wipe it off with soft cloth promptly, and clean the surface.
When a large quantity of blood or body fluid might attach, please use sanitary cover from a
sanitary point of view.
9. Ingress of Liquid
Do not splash the FPI with any liquid. Occasionally that is a cause of damage.
Wipe of once when it get wet.
10. Cleaning
When cleaning the surface of FPI, please wipe the surface by the soft cloth soaked with water,
oxygenated water or dilution ethanol. Do not use other medicines.
11. Load
Please do not apply excessive load on the FPI.
Maximum load：150 kg @In the whole
100 kg @φ40 mm of the center
12. Unnecessary X-ray, Qualified Personnel
The FPI is used combined with X-ray tube assembly. Only Qualified personnel for X-ray handling
procedures can use the FPI.
For set-ups and services, only knowleged enigineers or special service personnels are able to
handle the FPI.
13. X-ray Shield
When using this device, unnecessary X-ray irradiation must be avoided.
(1) Please follow the "minimum distance between the X-ray tube focal point and X-ray incidence
plane" and "maximum tube voltage" specified in the technical data.
(2) This devise does not absorb 100% X-ray.
It requires X-ray protection measures for X-ray system to comply with the IEC 60601-1-3.
14. X-ray Specifications
Please follow the ratings below.
(1) Maximum tube voltage ........................................................................................... 150 kV
(2) Minimum tube voltage ···········································································40 kV
(3) Maximum X-ray incident dose rate......................................... 8.73 x 10-3Gy/min [1R/min]
(4) Minimum distance between the X-ray tube focal point and X-ray incidence plane.. 73 cm

FDX3543RP
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15. Stop Operation
A limited operating life and the possibility of random failures are inherent to FPI and shall be
taken into account for the protection of personnel and equipment. The operation of FPI under
inappropriate conditions, either due to the lack of care or knowledge, can lead to grave risk to
the life and limb of personnel, independent of the risk of FPI and/or equipment damage.
16. Mechanical Shock and Vibration
Do not give a mechanical shock or vibration to the FPI housing. It may cause the malfunction of
FPI due to break down of TFT panel.
17. Protection of Input Plate
The FPI input plate consists of a thin carbon plate (CFRP). Therefore it shall never receive
shock or pressure.
18. Environmental Temperature, Humidity and Atmosphere (Electromagnetic Waves)
The specified temperature and humidity in operating and storage are described at the technical
data sheet and the specification. Moreover, FPI shall not experience large and fast temperature
and humidity change. Do not use and set the FPI in an atmosphere of inflammable and/or
corrosion gasses.
Do not install FPI at around any electromagnetic wave noise sources.
19. Condensation
Do not let FPI in condensation situation at any time. It may cause malfunctions of electronics
circuit and deterioration of images.
20. Dust and Particles
Do not use FPI in the environment where dust and particles exist.
21. Power Supply
(1) Use the Interface Box attached to FPI.
(2) Do not remodel the power supply. Use the power supply as delivered.
22. Adjustment
The FPI requires adjustment (ex. Gain and image processing calibrations) according to input
X-ray conditions. Be sure to start using the FPI with equipment after adjustment. In the case of
exchanging X-ray tube assembly or change of X-ray intensity distribution, adjustment of the FPI
is necessary.
23. Memory
A memory chip is mounted on this device. The memory contents may be cleared due to
electrical shock as ESD, Donot apply major stress such as ESD.
24. Environment Temperature
Use the FPI under specified temperature conditions. This is in order to prevent deterioration of
FPI characteristics and the cause of malfunctions due to lowering cooling availability.