Toshiba FDX4343R Instruction manual

X-Ray FLAT PANEL IMAGER
FDX4343R
Sup. Symbol /B
Active Area: 430(H)×439(V)mm
(16.9″×17.3″)
★The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA ELECTRON TUBES & DEVICES CO., LTD. (TETD) for any infringements of patents or other rights of the
third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TETD or others.
★The information contained herein may be changed without prior notice. It is therefore advisable to contact TETD before proceeding with the design of
equipment incorporating this product.
Technical Data
T
D
No.TE-FDX4343R/B 2011-11-01
FEATURING:
●High MTF
●High Sensitivity
●High Contrast
●Short Cycle Time
This product is FLAT PANEL IMAGER (hereafter called FPI) designed for medical radiographic
diagnosis. Featuring excellent image quality by implementing in-house produced Cesium Iodide (CsI)
for X-ray scintillator. It has large effective size area of 43×43cm, which is suitable for radiographic
procedures such as chest screenings etc.
– High Resolution and High DQE CsI Phosphor Screen –
• TETD has long experience to develop and manufacture fine and thick pillar structure of CsI
phosphor screen with high resolution and high sensitivity.
– Low Noise ROIC and Analog Circuit –
• ROIC and analog circuit are designed and specified to be suitable for high sensitivity X-ray
conversion layer.

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COMPONENTS AND CHARACTERISTICS
Flat Panel Sensor Unit:
Sensor Protection Plate....................................................................................... Carbon Fiber Plate
Cooling ................................................................................................................ Natural Air Cooling
Input.......................................................................................... DC24V (from AC/DC Power Supply)
Power Consumption .................................................................................................. Maximum 20W
Overall Dimensions................................................................ 512×495×43mm (W(H)×D(V)×(H))
Weight ......................................................................................................................... 9 kg (approx.)
Power Supply Unit:
Input........................................................................................................... AC100 to 240V, 50/60Hz
Output.................................................................................................................... DC24V 1.3A 60W
Overall Dimensions................................................................ 126×200×60mm (W(H)×D(V)×(H))
Weight ......................................................................................................................... 1 kg (approx.)
Dimensional Outline:
Refer to pages 25 to 27.
Environmental:
Under delivery and stock Under operating
Temperature -15 ~55 ℃+10 ~35 ℃
Humidity 10 ~90 %
(Non-Condensing)
30 ~85 %
(Non-Condensing)
Pressure 50 ~106 kPa 70 ~106 kPa

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ACCESSORIES
Cables:
AC Cable ............................................................................................................................... 1.8m×1
GND Cable ............................................................................................................................. 3m×2
OPTION ACCESSORIES
DC Cable (Sensor Unit - Power Supply Unit)
Name Length
1ECB-F002A/G 2m
2ECB-F002A-10/G 10m
3ECB-F002A-20/G 20m
* Please contact to our local sales for further information.

FDX4343R
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MAIN CHARACTERISTICS
Image Format:
X-ray Conversion Layer ................... Cesium Iodide (Csl) with Amorphous Silicon (a-Si) Photodiode
Active Area ............................................................................ 430(H)×439(V)mm (16.9×17.3 inch)
Pixel Matrix ........................................................................................................... 3008(H)×3072(V)
Pixel Pitch............................................................................................................................ 143 μm
Cycle Time............................................................................................................ Shot to Shot 6sec.
Performance:
Limiting Resolution .................................................................................................... 3.7 Lp/mm typ.
MTF (2.0 Lp/mm, 70 kVp, 1×1) ......................................................................................... 36 % typ.
DQE (DQE (0), Quantum - Limited)........................................................................................ > 70 %
A/D Conversion......................................................................................................................... 14 bit
Ratings:
Energy Range............................................................................................................... 40~150 kVp
Maximum Entrance Dose (low Gain) ............................................................................ 4 mR / frame
Interface:
Data Output ................................................................. 16 bit Digital Output Ethernet (1000BASE-T)
Command Control.......................................................................................... Ethernet (1000BASE-T)
X-ray Synchronization Control .............................................................................................. External
Power Input ............................................................................. DC24V 2A (from Power Supply Unit)
Image Acquisition Mode Table:
Mode Frame rate
(Frame/s) Binning/Non-Binning X-ray period (ms)
3072 lines
Full Scan mode 1(approx) Non-binning
Standard: 500
(Variable between 50 to 500)
Optional: 1000, 2300, 3200 or 4000

FDX4343R
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Product Components and Interface:
NOTE:
Do not disconnect Ethernet connection while DC24V is operating and supplying to Sensor Unit.
LED Display Mode:
Name Status
Power Turn on when power on
Healthy Turn on when self check is good
Network FPI system can communicate with PC
Imaging Turn on when acquisition and flashing during data read
Sensor Unit
PC (User)
X-ray Control Unit (User)
TFT Panel
Gate Driver ROIC Unit
Control Board
Ethernet
X-ray Sync
Power
Supply
Unit
DC24V
Image Data
&Control

FDX4343R
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Image Acquisition Communication Block Diagram:
Communication Availability:
Signal Name Type Ethernet Command Control
(PC)
D-Sub Signal Control
(X-ray Controller)
EXP_REQ INPUT OK OK
EXP_OK OUTPUT N.A OK
*EXP_REQ Command Response
CPU
FPI
X-ray Controller
D-SUB
Connector
Ethernet
Connector
PC
Command
Signal IO module
Ethernet
module
D-Sub
Connector
FPIPC
X-ray Controller

FDX4343R
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Image Acquisition Control Interface:
D-Sub Signal Control Interface Operation Sequence
Description of the sequence
1. By receiving “EXP_REQ” during “Refresh” status proceeds to “Exposure” after completion of
“Refresh”.
2. Continues “EXP_OK” signal ON during “Exposure”. ON period is defined by Image Acquisition
mode table.
3. Proceeds to “Data Read” after completion of Exposure.
4. After “Read”, FPI proceeds to status of “Refresh”.
5. When use “Double Exposure ”, please repeat from 1 to 4.
(1) Single Exposure
A: EXP_REQ width
Minimum 1ms
B: Refresh period
For line drive (3072 Line scan), 36.9ms
C: EXP period
Set value: see the Image acquisition mode table (50 to 500ms, 1000ms, 2300ms, 3200ms and
4000ms, standard 500ms) selectable by command.
D: Read period
For line drive (3072 Line Scan) 1222 ms
①:EXP_REQ-EXP_OK period......................................................................... Maximum 40 ms
②:EXP_REQ-DATA STORAGE period ...........Maximum 2000 ms (case EXPOSURE 500 ms)
③:POWER ON-EXP_REQ period .................................................................. Minimum 520 ms
FPI Drive
#1 #1
EXP_REQ <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STORAGE
Ref Ref RefRefRead RefExposure RefRef
Data
Ref
A
C
D
CB
③
①
②
POWER ON

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(2) Double Exposure
A: EXP_REQ width
Minimum 1ms.
B: Refresh period
For line drive (3072 Line scan) 36.9ms.
C: EXP period
Set value: see the Image Acquisition mode table (50 to 500ms, 1000ms, 2300ms, 3200ms
and 4000ms, Standard 500ms) selectable by command.
D: Read period
For line drive (3072 Line Scan) 1222ms.
①:EXP_REQ-EXP_OK period.......................................................................... Maximum 40ms
②:Double EXPOSURE cycle period .................... Maximum 2000ms (case EXPOSURE 500ms)
③:POWER ON-EXP_REQ period ................................................................... Minimum 520ms
FPI Drive
1st 1st 2nd 2nd
EXP_REQ <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STORAGE 2nd Image data
Ref
1st image deta
Ref RefRead ExposureRef Ref RefReadExposure RefRef
A
C
D
CB
①
②
POWER ON
D
C
C
③

FDX4343R
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Image Acquisition Control Interface:
Ethernet Interface Command Control Operation Sequence
Description of the sequence
1. By receiving “EXP_REQ” request command during “Refresh” status proceeds to “Exposure”
after completion of “Refresh”.
2. Continues “EXP_OK” signal ON during “Exposure”. ON period is defined by Image Acquisition
mode table.
3. Proceeds to “Data Read” after completion of Exposure.
4. After “Read”, FPI proceeds to status of “Refresh”.
5. When use “Double Exposure ”, please repeat from 1 to 4.
(1) Single Exposure
①:EXP_REQ-EXP_OK period.......................................................................... Maximum 40ms
②:EXP_REQ-DATA STORAGE period .............Maximum 2000ms (case EXPOSURE 500ms)
③:POWER ON-EXP_REQ period ................................................................... Minimum 520ms
FPI Drive
#1 #1
EXP_REQ <IN>
EXP_OK <OUT>
(DSUB)
EXPOSURE
DATA_STORAGE
#1
Ref
Data
Ref Ref Exposure RefRefRead RefRef Ref
③
①
②
POWER ON

FDX4343R
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(2) Double Exposure
①:EXP_REQ-EXP_OK period.......................................................................... Maximum 40ms
②:EXP_REQ-DATA STORAGE period .............Maximum 2000ms (case EXPOSURE 500ms)
③:POWER ON-EXP_REQ period ................................................................... Minimum 520ms
FPI Drive
1st 1st 2nd 2nd
EXP_REQ <IN>
EXP_OK <OUT>
EXPOSURE
DATA_STORAGE
Ref Ref RefReadExposure RefRef
2nd Image data
Ref
1st image deta
Ref RefRead Exposure
①
②
POWER ON
③

FDX4343R
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Symbol Min Typ Max Unit
Vih 5 28 V
Vil 0 1 V
Input Voltage
Image Acquisition Control Interface:
1. Pins assign
Pin No Signal name I/O Contents
1 TEST+ - Don’t connect. This pin is used for TEST.
2 EXP_REQ+ Input
Image acquisition (X-ray exposure)
Request signal +
3 EXP_OK+ Output
Image acquisition (X-ray exposure)
Period signal +
4 EXP_OK+ (OC) Output Open Collector +
5 NC - Not connected
6 TEST- - Don’t connect. This pin is used for TEST.
7 EXP_REQ- Input
Image acquisition (X-ray exposure)
Request signal -
8 EXP_OK- Output
Image acquisition (X-ray exposure)
Period signal -
9 EXP_OK- (OC) Output Open Collector-
*1 Please put the protective resistance more than 1.4kΩin the series.
*2 Maximum sink current is 20mA.
2. External Interface (EXT-INF)
D-Sub 9pin female (Front View)
3. Input Circuit
User system side FPI side
D-Sub 9pin
connector
Pin2
Pin7
1 5
6 9
2-M2.6X0.45

FDX4343R
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4.Output Circuit
4.1 5V CMOS Level Type
4.2 Open Collector Type
Protective resistance more than 1.4kΩmust be inserted in series.
Power Supply Connector
- Pins assign
Pin No Signal name I/O Contents
1 DC INPUT + Input DC24V Positive Voltage Input
2 DC INPUT + Input DC24V Positive Voltage Input
3 DC INPUT - Input DC24V Negative Voltage Input
4 DC INPUT - Input DC24V Negative Voltage Input
5 FG - Frame Ground
IP Address Select Switch
Select IP address
IP0 192.168.95.30
IP1 192.168.95.31
*Please use “HUB” when you connect two sensor units (Dual use).
User system side
FPI side 5V
D-Sub
9pin
Pin3
Pin8
User system side
FPI side
protective resistance
22Ω
D-Sub
9pin
Max Voltage 28V
Pin4
Pin9

FDX4343R
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The information about EMC conformity (IEC60601-1-2 Ed2, 2001+AMD.1, 2004)
Guidance and manufacturer’s declaration - electromagnetic emissions
The X-Ray FLAT PANEL IMAGER (hereafter called FPI) is intended for use in the
electromagnetic specified below.
The customer or the user of the FPI should assure that it is used in such an environment.
Emissions test Compliance Electromagnetic environment - guidance
RF emissions
CISPR 11
Group1
The FPI uses RF energy only for its internal function.
Therefore, its RF emissions are very low and are not
likely to cause any interference in nearby electronic
equipment.
RF emissions
CISPR 11
Class A
Harmonic emissions
IEC61000-3-2
Not applicable
Voltage fluctuations/
flicker emissions
IEC61000-3-3
Not applicable
The FPI is suitable for use in all establishments
other than domestic and those directly connected to
the public low-voltage power supply network that
supplies building used for domestic purposes.
Note The FPI is not allowed to use the cables or components differ from
the originally attached.
If the different cables or components are used, they may deteriorate
the performance of electromagnetic emissions.
The limited length of cables for conforming EMC (IEC60601-1-2 Ed2, 2001+AMD.1, 2004)
Cables Cable length (Max.)
DC Cable 20m
GND Cable 3m
Refer to Product Components and Interface about wiring and connection of these cables.

FDX4343R
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Guidance and manufacturer’s declaration – electromagnetic immunity
The FPI is intended for use in the electromagnetic specified below.
The customer or the user of the FPI should assure that it is used in such an environment.
Immunity test IEC60601
test level Compliance level Electromagnetic environment -
guidance
Electrostatic
discharge (ESD)
IEC61000-4-2
±6kV contact
±2/4kV contact
±8kV air
±2/4kV air
±6kV contact
±2/4kV contact
±8kV air
±2/4 kV air
Floors should be wood, concrete
or ceramic tile. If floors are
covered with synthetic material.
The relative humidity should be at
least 30 %.
Electrical fast
transient/burst
IEC61000-4-4
±2 kV for power
supply lines
±1kV for input/
output lines
±2kV for power
supply lines
±1kV for input/
output lines
Mains power quality should be that
of a typical commercial or hospital
environment.
Surge
IEC61000-4-5
±1kV differential
mode
±0.5kV differential
mode
±2kV common
mode
±1kV differential
mode
±0.5kV differential
mode
±2kV common
mode
Mains power quality should be that
of a typical hospital environment.
Voltage dips, short
interruptions and
voltage variations
on power supply
input lines
IEC61000-4-11
<5 % UT
(>95 % dip in, UT)
for 5 sec
<5 % UT
(>95 % dip in, UT)
for 5 sec
Mains power quality should be that
of a typical hospital environment. If
the user of the FPI requires
continued operation during power
mains interruptions, it is
recommended that the FPI be
powered from an uninterruptible
power supply or a battery.
Power frequency
(50/60Hz)
magnetic field
IEC61000-4-8
3A/m 3A/m Power frequency magnetic fields
should be at levels characteristic
of a typical location in atypical
commercial or hospital
environment.
Note:
(1) UTis the a.c.mains voltage prior to application of the test level.
(2) This FPI can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
recommended separation distance between portable and mobile RF communications
equipment and this system.

FDX4343R
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Guidance and manufacturer’s declaration – electromagnetic immunity
The FPI is intended for use in the electromagnetic environment specified below. The customer or
the user of the FPI should assure that it is used such an environment.
Immunity test IEC 60601
test level
Compliance
level
Electromagnetic environment –
guidance
Conducted RF
IEC61000-4-6
Radiated RF
IEC61000-4-3
3Vrms
150kHz to 80MHz
3V/m
80MHz to 2.5GHz
3Vrms
3V/m
Portable and mobile RF communications
equipment should be used no closer to
any part of the FPI, including cables, than
the recommended separation distance
calculated from the equation applicable to
the frequency of the transmitter.
Recommended separation distance
P=d 2.1 150kHz to 80MHz
P=d 2.1 80 MHz to 800 MHz
P=d 3.2 800 MHz to 2.5 GHz
Where P is the maximum output power
rating of the transmitter in watts (W)
according to the transmitter manufacturer
and dis the recommended separation
distance in meters (m).
Field strengths from fixed RF transmitters,
as determined by an electromagnetic site
surveya,should be less than the
compliance level in each frequency
rangeb.
Interference may occur in the vicinity of
equipment marked with the following
symbol:
Note:
(1) At 80 MHz and 800 MHz, the higher frequency range applies.
(2) These guidelines may not apply in all situations. Electromagnetic propagation is affected by
absorption and reflection from structures, object and people.
(3) This FPI can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
electromagnetic immunity.
aField strengths from fixed transmitters, such as base stations for radio (cellular/cordless)
telephones and land mobile radios. Amateur radio, AM and FM radio broadcast and TV broadcast
cannot be predicted theoretically with accuracy. To assess the electromagnetic environment due
to fixed RF transmitters, an electromagnetic site survey should be considered. If the measured
field strength in the location in which the FPI is used exceeds the applicable RF compliance level
above, the FPI should be observed to verify normal operation. If abnormal performance is
observed, additional measures may be necessary, such as reorienting or relocating the FPI .
bOver the frequency range 150 kHz to 80 MHz, field strengths should be less than 3V/m.

FDX4343R
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Recommended separation distances between portable and mobile RF communications equipment
and the FPI.
The FPI is intended for use in an electromagnetic environment in which radiated RF disturbances
are controlled. The customer or the user of the FPI can help prevent electromagnetic interference
by maintaining a minimum distance between portable and mobile RF communication equipment
(transmitters) and the FPI as recommended below, according to the maximum output power of the
communications equipment.
Separation distance according to frequency of transmitter
m
Rated maximum
output power of
transmitter
W
150kHz to 80MHz
P=d 2.1
80MHz to 800MHz
P=d 2.1
800MHz to 2.5GHz
P=d 3.2
0.01 0.12 0.12 0.23
0.1 0.38 0.38 0.73
1 1.2 1.2 2.3
10 3.8 3.8 7.3
100 12 12 23
For transmitters rated at a maximum output power listed above, the recommended separation
distance din meters (m) can be estimated using the equation applicable to the frequency of the
transmitter. Where Pis the maximum output power rating of the transmitter in watts (W) according
to the transmitter manufacturer.
Note:
(1) At 80MHz and 800MHz, the separation distance for the higher frequency range applies.
(2) These guidelines may not apply in all situations. Electromagnetic propagation is affected by
absorption by absorption and reflection from structures objects and people.
(3) The FPI can only allow to use the designated cables and components.
If the different cables or components are used, they may deteriorate the performance of
recommended separation distance between portable and mobile RF communications
equipment and this system.
CAUTION
CAUTION
DO NOT USE THE ELECTROMAGNETIC DEVICE, SUCH AS (CELLULAR/CORDLESS)
TELEPHONES AND RADIO CONTROLLED TOYS, CLOSE TO THIS SYSTEM. OTHERWISE,
IT MAY CAUSE MALFUNCTION OF THE SYSTEM.

FDX4343R
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INSTALLATION
For installing the FPI in the apparatus, refer to the dimensional outlines.
INSTALLING HOUSING IN APPARATUS:
1. Use the screw holes 10-M4 (Depth 8).
2. The screws should be fixed all screw holes of each part. Also, the screw thread length entering the
screw holes should be each depth of holes.
3. Installation respect of the device that installs FPI should be smooth.
4. It is necessary to clean installation respect of the device before FPI is installed.
5. Tightening torque of screw; 1.35 - 1.65 [Nm].

FDX4343R
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MAINTENANCE AND CHECK
DAILY CHECK ITEMS
Before using the sensor unit, check the following items:
(1) Environment
- The environmental conditions for operation must be adequate.
(2) Appearance
- Wiring and appearance must be free from any abnormality.
(3) Operation
- The sensor unit must operate normally after power on.
(4) Others
- Any abnormalities such as unusual sound and strange odor are not permissible.
PERIODIC CHECK ITEMS
Check the following at a certain interval within one year:
(1) Appearance
- The sensor unit must be free from errors in appearance.
- The outer mounting screws must be free from looseness and slip-off.
- The mounting screws to the equipment must be free from abnormalities such as looseness.
- Each cable must be free from cracks and damages.
- Each cable must be securely connected. Any looseness is not permissible.
(2) Electrical safety
- The protective grounding wire must be accurately connected.
(3) Cleaning
- Cleaning of the outer surface
(4) Functionality
- The sensor unit must operate normally under control.

FDX4343R
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SAFETY PRECAUTIONS AND WARNING
Find this document before using X-Ray FLAT PANEL IMAGER (FPI)
This document describes the attention of equipment manufactures and users to use safety X-Ray
FLAT PANEL IMAGER (hereafter called FPI). Please find the technical data sheet of each product
and this document “SAFETY PRECAUTIONS AND WARNING” and understand these contents
before using FPI. The FPI is used under X-ray exposures. Therefore engineers or service people
who have sufficient technical knowledge and experience shall handle the FPI with enough care.
Moreover these documents are always stored and can be seen in operating place. If you have any
questions, please contact our local sales representatives for further information.
The FPI present a certain number of potential risks by the very nature of the physical principles
included in their manufacture or operation and because of the materials used to make FPI.
Therefore equipment manufactures and users shall take on themselves the responsibility because
of protecting against these risk and respecting local safety laws and regulations.
1. Electric Shock
In operating, do not touch the lead wires and connectors of the X-Ray FLAT PANEL IMAGER
(FPI). If necessary to touch lead wires and connectors, please turn off the power supply and
confirm no residual voltage exist before connecting, disconnecting and handling them. The
housing of the FPI should always be connected to ground. All ground terminals and ground
wires shall be also done to ground.
2. Ground Connection
Connect all ground terminals and cables of the FPI to ground. The housing with ground terminal
should be connected to ground. The resistance between ground terminal and ground cables
shall be less than 0.1 ohms. The sectional area of the conductor is required for 0.75 square
meters or more.
3. Stop Operation During Abnormal Status
Shut down power supply and contact to sales representatives immediately when the FPI stops
operation during abnormal status.
4. Remodeling Electronics Parts
Do not reconstruct FPI electronics parts because it leads to deterioration of images and the
cause of malfunctions.
5. Processing of Housing
Do not process FPI housing because it leads to weakness of housing strength and the cause of
malfunctions.
6. Screws of Housing
As the screws of FPI housing are tightened by proper torque, do not loosen or remove them.

FDX4343R
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7. Installing to the Equipment
Installing FPI housing to the equipment by according to the technical data sheet or the
specification. It will prevent dropping off of FPI from the equipment.
8. Shipping and Handling
The weight of FPI is mentioned at technical data sheet or the specification. Please take into
account on this weight for preventing any dangers during usage.
9. Unnecessary X-ray, Qualified Personnel
The FPI is used combined with X-ray tube assembly. Only Qualified personnel for X-ray handling
procedures can use the FPI.
For set-ups and services, only knowleged enigineers or special service personnels are able to
handle the FPI.
10. X-ray Shield
When using this device, unnecessary X-ray irradiation must be avoided.
(1) Please follow the "minimum distance between the X-ray tube focal point and X-ray incidence
plane" and "maximum transmission tube voltage" specified in the technical data.
(2) This devise has X-ray shield only for electronic circuit protection and does not comply with the
international safety standard IEC 60601-1-3. Therefore, it requires additional X-ray protection
measures for X-ray system to comply with the IEC 60601-1-3.
11. X-ray Specifications
Please follow the ratings below.
(1) Maximum transmission tube voltage .......................................................................... 150kV
(2) Maximum X-ray incident dose rate ............................................. 8.73 x 10-3Gy/min [1R/min]
(3) Minimum distance between the X-ray tube focal point and X-ray incidence plane ...... 73cm
12. Stop Operation
A limited operating life and the possibility of random failures are inherent to FPI and shall be
taken into account for the protection of personnel and equipment. The operation of FPI under
inappropriate conditions, either due to the lack of care or knowledge, can lead to grave risk to
the life and limb of personnel, independent of the risk of FPI and/or equipment damage.
13. Contact to Patient
The FPI is not for equip to the patients. Install the FPI not to contact or touch the patients.
14. Installation
Be sure to install the FPI not to touch the patients during operation.
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