TYAN S5630 User manual

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1
S5630
Version 1.0b
Copyright
Copyright © 2017 MiTAC International Corporation. All rights reserved. No part of
this manual may be reproduced or translated without prior written consent from
MiTAC International Corporation.
Trademark
All registered and unregistered trademarks and company names contained in this
manual are property of their respective owners including, but not limited to the
following.
TYAN®is a trademark of MiTAC International Corporation.
Intel®is a trademark of Intel®Corporation.
AMI, AMI BIOS are trademarks of AMI Technologies.
Microsoft®, Windows®are trademarks of Microsoft Corporation.
Winbond®is a trademark of Winbond Electronics Corporation.
Notice
Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to printing.
MiTAC assumes no liability whatsoever, and disclaims any express or implied
warranty, relating to sale and/or use of TYAN®products including liability or
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to product descriptions and/or specifications at
any time, without notice. In no event will MiTAC be held liable for any direct or
indirect, incidental or consequential damage, loss of use, loss of data or other
malady resulting from errors or inaccuracies of information contained in this
document.

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Contents
S5630............................................................................................................1
Before you begin…....................................................................................3
Chapter 1: Instruction ................................................................................4
1.1 Congratulations .................................................................................4
1.2 Hardware Specifications....................................................................4
1.3 Software Specifications...................................................................13
Chapter 2: Board Installation...................................................................14
2.1 Board Image....................................................................................15
2.2 Block Diagram.................................................................................16
2.3 Motherboard Mechanical Drawing...................................................17
2.4Board Parts, Jumpers and Connectors...........................................18
2.5 LED Definitions................................................................................28
2.6Installing the Processor and Heatsink.............................................30
2.7Thermal Interface Material...............................................................33
2.8Tips on Installing Motherboard in Chassis ......................................34
2.9Installing the Memory......................................................................36
2.10 Attaching Drive Cables..................................................................40
2.11 Installing Add-In Cards..................................................................41
2.12 Connecting External Devices ........................................................42
2.13 Installing the Power Supply...........................................................43
2.14 Finishing Up...................................................................................43
Chapter 3: BIOS Setup .............................................................................44
3.1 About the BIOS................................................................................44
3.2 Main Menu.......................................................................................46
3.3 Advanced Menu...............................................................................48
3.4 Platform Configuration.....................................................................77
5.5 Socket Configuration.......................................................................89
5.6 Server Management......................................................................116
5.7 Security..........................................................................................121
5.8 Boot ...............................................................................................126
5.9 Save & Exit....................................................................................129
Chapter 4: Diagnostics...........................................................................131
4.1 Flash Utility....................................................................................131
4.2 AMIBIOS Post Code (Aptio)..........................................................132
Appendix I: How to recover UEFI BIOS................................................139
Appendix II: Fan and Temp Sensors ....................................................141
Glossary...................................................................................................145
Technical Support ..................................................................................151

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Before you begin…
Check the box contents!
The retail motherboard package should contain the following:
S5630 Motherboard x 1
SATA Single Cable x 2
Rear IO shielding x 3
1 x S5630 Quick Installation Guide
1 x TYAN®Driver CD
M.2 Screw kit x2
IMPORTANT NOTE:
Sales samples may not come with any of the accessories listed above.
If you have ordered a sales sample and you are missing any of the above items,
please contact your sales representative to help order accessories.

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Chapter 1: Instruction
1.1 Congratulations
You have purchased the powerful TYAN® S5630 motherboard, based on the Intel®
C621/C622 chipset. The S5630 is designed to support Intel®Xeon®Scalable family
series Processor, and Up to 384GB RDIMM/ 768GB LRDIMM/ 1,536GB RDIMM
3DS/LRDIMM 3DS DDR4 2666 MHz memory. Leveraging advanced technology
from Intel®, the S5630 is capable of offering scalable 32 and 64-bit computing, high-
bandwidth memory design, and lightning-fast PCI-E bus implementation.
The S5630 not only empowers you in today’s demanding IT environment but also
offers a smooth path for future application upgradeability. All of these rich feature
sets provide the S5630 with the power and flexibility to meet demanding
requirements for today’s IT environments.
Remember to visit the TYAN® website at http://www.tyan.com. There you can find
all the information on all TYAN®products as well as all the supporting documentation,
FAQs, Drivers and BIOS upgrades.
1.2 Hardware Specifications
S5630GMR Specifications
Processor
Socket Type / Q'ty
LGA3647/ (1)
Supported CPU
Series
Intel Xeon Scalable Processor
Family
Thermal Design
Power (TDP)
wattage
Max up to 205W
Chipset
PCH
Intel C621
Memory
Supported DIMM
Qty
(12) DIMM slots
DIMM Type /
Speed
DDR4 RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS 2666
Capacity
Up to 384GB RDIMM/ 768GB
LRDIMM/ 1,536GB RDIMM
3DS/LRDIMM 3DS *Follow latest
Intel DDR4 Memory POR
Memory channel
6 Channels
Memory voltage
1.2V

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Expansion Slots
PCI-E
(1) PCI-E Gen3 x16 slot
Others:
(1) PCI-E Gen3 x8 OCP 2.0 slots
(con.A+con.B)
LAN
Port Q'ty
(1) PHY
PHY
Realtek RTL8211E
Storage
SATA
Connector
(2) Mini-SAS HD (8-
ports)
Controller
Intel C621
Speed
6.0 Gb/s
RAID
RAID 0/1/10/5 (Intel
RSTe)
sSATA
Connector
(2) 8-pin SATA/SATA-
DOM, (1) Mini-SAS
HD (4-ports)
Controller
Intel C621
Speed
6.0 Gb/s
RAID
RAID 0/1/10/5 (Intel
RSTe)
Graphic
Connector type
D-Sub 15-pin
Resolution
Up to 1920x1200
Chipset
Aspeed AST2500
Input /Output
USB
(5) USB3.0 ports (2 at rear, 2 via
cable, Type-A)
COM
(1) DB-9 COM Connector (at
rear, COM1) + (1) Header
(COM2)
VGA
(1) D-Sub 15-pin VGA port (at
rear)
RJ-45
(1) GbE port dedicated for IPMI
Audio
Line-in, Line-out, Mic-in,
Surround, Side surround,
CEN/LFE at rear
Front Panel
(1) 2x12-pin SSI front panel
header
SATA
(2) 8-pin SATA/SATA-DOM
connectors + (3) Mini-SAS HD
(4-in-1) connectors