TYAN TN73-B8037 Quick start guide

TN73-B8037
Service Engineer’s Manual

PREFACE
Copyright
This publication, including all photographs, illustrations, and software, is protected
under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced without
written consent of manufacturer.
Copyright 2020 MITAC COMPUTING TECHNOLOGY CORPORATION. All rights
reserved. TYAN®is a registered trademark of MITAC COMPUTING TECHNOLOGY
CORPORATION.
Version 1.0b
Disclaimer
Information contained in this document is furnished by MITAC COMPUTING
TECHNOLOGY CORPORATION and has been reviewed for accuracy and reliability
prior to printing. MITAC assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of TYAN®products including liability
or warranties relating to fitness for a particular purpose or merchantability. MITAC
retains the right to make changes to produce descriptions and/or specifications at
any time, without notice. In no event will MITAC be held liable for any direct or
indirect, incidental or consequential damage, loss of use, loss of data or other
malady resulting from errors or inaccuracies of information contained in this
document.
Trademark Recognition
All registered and unregistered trademarks and company names contained in this
manual are property of their respective owners including, but not limited to the
following.
TYAN®is a trademark of MITAC COMPUTING TECHNOLOGY CORPORATION.
AMD®is a trademark of AMD® Corporation.
AMI®, AMIBIOS® and combinations thereof are trademarks of AMI Technologies.
Microsoft®, Windows®are trademarks of Microsoft Corporation.
IBM®, PC®, AT®and PS/2®are trademarks of IBM Corporation.
Winbond®is a trademark of Winbond Electronics Corporation.

●FCC Declaration
Notice for the USA
Compliance Information Statement (Supplier’s Declaration of Conformity, SDoC)
FCC Part 15: This device complies with part 15 of the FCC Rules.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following conditions:
‧This device may not cause harmful interference.
‧This device must accept any interference received, including interference that may
cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at his
own expense.
Notice for Canada
This Class A digital apparatus complies with Canadian ICES-003. Cet appareil
numérique de la Classe A est conforme àla norme NMB-003 du Canada.
●Notice for Europe (CE Mark)
This product is in conformity with the Council Directive 2014/30/EU and 2014/35/EU.

Warning
This equipment is compliant with Class A of CISPR 32. In a residential environment
this equipment may cause radio interference.
CAUTION
Lithium battery included with this board. Do not puncture, mutilate, or dispose of
battery in fire. There will be danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by manufacturer.
Dispose of used battery according to manufacturer instructions and in accordance
with your local regulations.
●VCCI-A
この装置は、クラスＡ機器です。この装置を住宅環境で使用すると電波妨害を引き
起こすことがあります。この場合には使用者が適切な対策を講ずるよう要求される
ことがあります。 VCCI-A
●Safety: IEC/EN 62368-1
This equipment is compliant with CB/LVD of Safety: IEC/EN 62368-1.

About this Manual
This manual is intended for skilled person with hardware knowledge of computers.
Components inside the compartments should be serviced only by a skilled person.
This manual is aimed to provide you with instructions on installing your TYAN
TN73-B8037.
How this guide is organized
This guide contains the following parts:
Chapter 1: Overview
This chapter provides an introduction to the TYAN TN73-B8037 barebones and
standard parts list, describes the external components, gives an overview of the
product from different angles.
Chapter 2: Setting Up
This chapter covers procedures on installing the memory modules, hard drivers and
other optional parts.
Chapter 3: Replacing the Pre-installed Components
This chapter covers the removal and replacement procedures for pre-installed
components.
Appendix:
This chapter provides the cable connection table, how to install IO plate for OCP
Card, the FRU parts list for reference of system setup, and technical support in case
a problem arises with your system.

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Safety and Compliance Information
Before installing and using TYAN TN73-B8037, take note of the following
precautions:
·Read all instructions carefully.
·Do not place the unit on an unstable surface, cart, or stand.
·Do not block the slots and opening on the unit, which are provided for
ventilation.
·Only use the power source indicated on the marking label. If you are not
sure, contact the power company.
·The unit uses a three-wire ground cable, which is equipped with a third pin to
ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.
·Do not place anything on the power cord. Place the power cord where it will
not be in the way of foot traffic.
·Follow all warnings and cautions in this manual and on the unit case.
·Do not push objects in the ventilation slots as they may touch high voltage
components and result in shock and damage to the components.
·When replacing parts, ensure that you use parts specified by the
manufacturer.
·When service or repairs have been done, perform routine safety checks to
verify that the system is operating correctly.
·Avoid using the system near water, in direct sunlight, or near a heating
device.
·Cover the unit when not in use.

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Safety Information
Retain and follow all product safety and operating instructions provided with your
equipment. In the event of a conflict between the instructions in this guide and the
instructions in equipment documentation, follow the guidelines in the equipment
documentation.
Observe all warnings on the product and in the operating instructions. To reduce the
risk of bodily injury, electric shock, fire and damage to the equipment, observe all
precautions included in this guide.
You must become familiar with the safety information in this guide before you install,
operate, or service TYAN products.
Symbols on Equipment
Caution. This symbol indicates a potential hazard.
The potential for injury exists if cautions are not
observed. Consult equipment documentation for
specific details.
Caution. Slide-mounted equipment is not to be
used as a shelf or a work space.
Warning. This symbol indicates the presence of
hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.
Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.
To reduce risk of injury from a hot component,
allow the surface to cool before touching.
CAUTION: Risk of Explosion if Battery is replaced
by an Incorrect Type. Dispose of Used Batteries
According to the Instructions.
ATTENTION: Risque d’explosion si la batterie est
remplacée par un type incorrect. Mettre au rebus
les batteries usagées selon les instructions.
Multiple power connections. Prior to servicing,
disconnect all power cords.
Raccordements de puissance multiples. Avant
l’entretien, vous devez débranchez tous les
cordons d’alimentation.

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General Precautions
·Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.
Machine Room Environment
·This device is for use only in a restricted access location, such as a
machine room or IT room.
 ·Make sure that the area in which you install the system is properly
ventilated and climate-controlled.
·Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.
·Do not install the system in or near a plenum, air duct, radiator, or heat
register.
·Never use the product in a wet location.
Equipment Chassis
·Do not block or cover the openings to the system.
·Never push objects of any kind through openings in the equipment.
Dangerous voltages might be present.
·Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.
·Lift equipment using both hands and with your knees bent.
Equipment Racks
To avoid injury or damage to the equipment:
·Observe local occupational health and safety requirements and guidelines
for manual materials handling.
·Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.
·Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.
·Do not attempt to move a rack on an incline that is greater than 10 degrees

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from the horizontal.
·Make sure the rack is properly secured to the floor or ceiling.
·Make sure the stabilizing feet are attached to the rack if it is a single-rack
installation.
·Make sure racks are coupled together if it is a multiple-rack installation.
·Make sure the rack is level and stable before installing an appliance in the
rack.
·Make sure the leveling jacks are extended to the floor.
·Make sure the full weight of the rack rests on the leveling jacks.
·Always load the rack from the bottom up. Load the heaviest component in
the rack first.
·Make sure the rack is level and stable before pulling a component out of the
rack.
·Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.
To avoid damage to the equipment:
·The rack width and depth must allow for proper serviceability and cable
management.
·Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.
·The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.
·If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.
·Make sure the product is properly matted with the rails. Products that are
improperly matted with the rails might be unstable.
·Verify that the AC power supply branch circuit that provides power to the
rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.

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Equipment Power Cords
·Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.
·Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.
·In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can
cause an electrical shock due to high leakage currents.
·Do not place objects on AC power cords or cables. Arrange them so that no
one might accidentally step on or trip over them.
·Do not pull on a cord or cable. When unplugging from the electrical outlet,
grasp the cord by the plug.
·To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.
·Connection the equipment protective earthing conductor to the installation
protective earthing conductor. (for example, by means of a power cord
connected to a socket-outlet with earthing connection).
Equipment Batteries
·The system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.
·Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.
·Do not expose the battery to temperatures higher than 60°C (140°F).
·The system battery is not replaceable. If the battery is replaced by an
incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.
·Do not attempt to recharge the battery.
·Dispose of used batteries according to the instructions of the manufacturer.
Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.

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Equipment Modifications
·Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has been
modified.
Equipment Repairs and Servicing
·The installation of internal options and routine maintenance and service of
this product should be performed by skilled person who are knowledgeable
about the procedures, precautions, and hazards associated with equipment
containing hazardous energy levels.
·Do not exceed the level of repair specified in the procedures in the product
documentation. Improper repairs can create a safety hazard.
·Allow the product to cool before removing covers and touching internal
components.
·Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.
·Do not use conductive tools that could bridge live parts.
·Use gloves when you remove or replace system components; they can
become hot to the touch.
·Retain all screws or other fasteners when removing access cover(s). Upon
completion of accessing inside the product, refasten access cover with
original screws or fasteners.
·If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service include:
–The power cord, extension cord, or plug has been damaged.
–Liquid has been spilled on the product or an object has fallen into the
product.
–The product has been exposed to rain or water.
–The product has been dropped or damaged.
–The product does not operate normally when you follow the operating
instructions.

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Table of Contents
Chapter 1: Overview ........................................................................15
1.1 About the TYAN TN73-B8037................................................ 15
1.2Product Model ........................................................................ 15
1.3 Features.................................................................................. 16
1.4 Standard Parts List................................................................. 22
1.4.1 Box Contents................................................................... 22
1.4.2 Accessories..................................................................... 22
1.5 About the Product................................................................... 23
1.5.1 System Front View .......................................................... 23
1.5.2 System Rear View........................................................... 25
1.5.3 System Top View............................................................. 28
1.5.4 Chassis Dimensions........................................................ 29
Chapter 2: Setting Up ......................................................................30
2.0.1 Before you Begin............................................................. 30
2.0.2 Work Area........................................................................ 30
2.0.3 Tools................................................................................ 30
2.0.4 Precautions...................................................................... 31
2.1Installing Motherboard Components ...................................... 32
2.1.1 Removing the Chassis Cover.......................................... 32
2.1.2 Removing the Air Duct..................................................... 33
2.1.3Installing the CPU and Heatsink...................................... 34
2.1.4 Installing the Memory ...................................................... 37
2.1.5Installing Hard Drives ...................................................... 38
2.1.6 Installing the PCI-E Card................................................. 40
2.2 Rack Mounting........................................................................ 43
2.2.1 Installing the Server in a Rack......................................... 43
2.2.2 Removing the Server from Rack ..................................... 48
Chapter 3: Replacing Pre-Installed Components.........................51
3.1 Introduction............................................................................. 51
3.2 Disassembly Flowchart........................................................... 51
3.3 Removing the Cover............................................................... 52
3.4 Replacing Motherboard Components..................................... 52
3.4.1 Replacing the Riser Card ................................................ 52
3.4.2 PCI-E Riser Cards Specification ..................................... 54
3.4.3 Connector Pin Definition (M8037T73-L16-1L) ................ 54
3.4.4 Connector Pin Definition (M8037T73-R16-1L)................ 54
3.5Replacing the Front Panel Board ........................................... 55
3.5.1 Front Panel Board Features............................................ 57

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3.5.2 Connector Definition........................................................ 58
3.6 Replacing the System Fan ..................................................... 59
3.7 Replacing the HDD Backplane Board .................................. 61
3.7.1 HDD Backplane Board Features..................................... 62
3.8 Replacing the Power Distribution Board................................. 63
3.8.1 Power Distribution Board Features ................................. 64
3.8.2 Connector Definition........................................................ 64
3.9 Replacing the Power Supply .................................................. 66
3.10 Replacing the Power Backplane Board............................ 67
3.10.1 HDD Backplane Board Features................................... 71
3.10.2 Connector Definition...................................................... 72
3.10.3 Connector Definition...................................................... 75
3.10.4 Connector Definition...................................................... 77
3.11 Disconnecting All Motherboard Cables............................ 78
3.11.1 Removing the Motherboard........................................... 79
Chapter 5: Motherboard Information .............................................81
5.1 Board Image....................................................................... 82
5.2 Block Diagram .................................................................... 83
5.3 Motherboard Mechanical Drawing...................................... 84
5.4 Board Parts, Jumpers and Connectors .............................. 85
5.5 Thermal Interface Material.................................................. 90
5.6 Tips on Installing Motherboard in Chassis ......................... 91
5.7 Installing the Memory ......................................................... 93
5.8 Finishing Up........................................................................ 94
Chapter 6: BIOS Setup.....................................................................95
6.1 About the BIOS..................................................................... 95
6.2 Main Menu............................................................................. 97
6.3 Advanced Menu.................................................................... 98
6.4 Chipset Menu...................................................................... 137
6.5 AMD Configuration............................................................. 141
6.6 Security................................................................................ 168
6.7 Boot...................................................................................... 169
6.8 Save & Exit.......................................................................... 171
Appendix I: Installing IO Plate for OCP Card..............................173
Appendix II: Cable Connection Tables........................................177
Appendix III: Fan and Temp Sensors...........................................178
Appendix IV: FRU Parts Table......................................................182
Appendix V: Technical Support....................................................184

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NOTE

http://www.tyan.com
15
Chapter 1: Overview
1.1 About the TYAN TN73-B8037
Congratulations on your purchase of the TYAN®TN73-B8037, a highly optimized
rack-mountable barebone system. The TN73-B8037 is designed to AMD®EPYC™
7002 series Processor, and Up to 2,048GB RDIMM, 4,096GB LRDIMM 3DS MHz
memory. Leveraging advanced technology from AMD®, TN73-B8037 server system
is capable of offering scalable 32 and 64-bit computing, high bandwidth memory
design, providing a rich feature set and incredible performance, and lightning-fast
PCI-E bus implementation. The TN73-B8037 not only empowers your company in
nowadays IT demand but also offers a smooth path for future application usage.
TYAN®also offers the TN73-B8037 in a version that can support up to sixteen
hot-swap 2.5”SATA HDD/SSD, or sixteen hot-swap 2.5”NVMe SSDs. The
TN73-B8037 uses TYAN®’s latest chassis, featuring a robust structure and a solid
mechanical enclosure. All of this provides TN73-B8037 the power and flexibility to
meet the needs of nowadays server application.
1.2Product Model
The system boards within the Tyan barebone systems contain different features and
chipsets, which are defined by the following models:
B8037T73X4-200PE4HR: (2U/4Node/2.5”NVME/SATA)
B8037T73X4-200PV4HR: (2U/4Node/2.5”SATA)

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1.3 Features
B8037T73X4-200PE4HR Specifications
System
Form Factor
2U Rackmount
Chassis Model
TN73
Dimension (D x W x H)
28.74" x 17.32" x 3.44" (730 x 440 x
87.5mm)
Motherboard Name
S8037GM2NE
Gross Weight
48.5 kg (107 lbs)
Net weight
34 kg (75 lbs)
Front Panel
Buttons
(1) PWR, (1) RST, (1) UID
LEDs
(1) HDD, (1) ID, (1) System Event, (2) LAN
activity
I/O Ports
(2) USB 3.1 Gen1 ports
External Drive Bay
Q'ty / Type
(4) 2.5" Hot-Swap HDD/SSD per node
HDD Backplane Support
SAS 12Gb/s, SATA 6Gb/s, NVMe
Supported HDD Interface
(4) SAS 12Gb/s, SATA 6Gb/s
Notification
The SAS/SATA HDD backplane is
connected to onboard SATA connection by
default. Please contact Tyan technical
support if a discrete SAS HBA/RAID
adapter is required.
System Cooling
Configuration
FAN
(3) 4cm fans per node
Power Supply
Type
CRPS
Input Range
AC 200-219V/220-240 10A
Frequency
47-63 Hz
Output Watts
1,800 Watts (200-219Vac input)
1,968 Watts (220-240Vac input)
Efficiency
80 plus Platinum
Redundancy
1+1
Notification
When about 180W CPUs are deployed. The
4-node system may not support redundancy.
Please contact Tyan Technical Support for
additional information.
Processor
Q'ty / Socket Type
(1) AMD Socket SP3 per node
Supported CPU Series
(1) AMD EPYC™ 7002 Series Processor
Configurable Thermal
Design Power (cTDP)
Wattage
Max up to 240W

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Memory
Supported DIMM Qty
(8) DIMM slots (per node)
DIMM Type / Speed
DDR4 ECC RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS 3200
Capacity
Up to 2,048GB RDIMM, 4,096GB
LRDIMM 3DS
Memory channel
8 Channels per CPU
Memory voltage
1.2V
Expansion Slots
PCI-E
(2) PCI-E x16 slots
Pre-install TYAN Riser
Card
(PCI-E Gen4)
(1) M8037T73-R16-1L riser card for (1)
HH/HL, (1) M8037T73-L16-1L riser card for
(1) HH/HL
Others
(1) PCI-E Gen3 x16 OCP 2.0 slot
(conn.A+conn.B)
Physical Dimension
Abbreviation
HH/HL (Half-height, Half-length): 2.7" x 6.6"
(68.9 x 167.7mm)
LAN
Q'ty / Port
(2) GbE ports + (1) GbE dedicated for IPMI
Controller
Broadcom BCM5720
PHY
Realtek RTL8211E
Storage
SATA
Connector
(1) SFF-8654 connector for up
to (4) SATA ports
Controller
Direct from AMD EPYC CPU
Speed
6Gb/s
RAID
N/A
NVMe
Connector (M.2)
(2) 22110/2280 (by PCI-E
Gen3 & SATA interface)
Connector (Slim
SAS)
(2) SFF-8654 for (4) NVMe
ports
Graphic
Connector type
D-Sub 15-pin
Resolution
Up to 1920x1200
Chipset
Aspeed AST2500
I/O Ports
USB
(1) USB3.1 TYPE-C (@ rear), (2) USB3.1
Gen1 ports (via Cable)
COM
(1) header ( COM1 )
VGA
(1) D-Sub 15-pin port
RJ-45
(2) GbE ports, (1) dedicated GbE for IPMI
TPM (Optional)
TPM Support
Please refer to our TPM supported list.
System Monitoring
Chipset
Aspeed AST2500

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Temperature
Monitors temperature for CPU & memory &
system environment
Voltage
Monitors voltage for CPU, memory, chipset
& power supply
LED
Over temperature warning indicator, Fan &
PSU fail LED indicator
Others
Watchdog timer support
Server Management
Onboard Chipset
Onboard Aspeed AST2500
AST2500 iKVM Feature
24-bit high quality video compression,
Supports storage over IP and remote
platform-flash, USB 2.0 virtual hub
AST2500 IPMI Feature
IPMI 2.0 compliant baseboard management
controller (BMC), 10/100/1000 Mb/s MAC
interface
BIOS
Brand / ROM size
AMI, 32MB
Feature
Hardware Monitor, SMBIOS 3.0/PnP/Wake
on LAN, Boot from USB device/PXE via
LAN/Storage, Console Redirection, ACPI
6.1, ACPI sleeping states S0, S5, FAN speed
control automatic
Operating System
OS supported list
Please refer to our AVL support lists.
Regulation
FCC (SDoC)
Class A
CE (DoC)
Class A
CB/LVD
Yes
RCM
Class A
VCCI
Class A
Operating
Environment
Operating Temp.
10°C ~ 35°C (50°F~ 95°F)
Non-operating Temp.
- 40°C ~ 70°C (-40°F ~ 158°F)
In/Non-operating Humidity
90%, non-condensing at 35°C
RoHS
RoHS 6/6 Compliant
Yes
Package Contains
Barebone
(1) TN73-B8037 Barebone
Manual
(1) Quick Installation Guide

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B8037T73X4-200PV4HR Specifications
System
Form Factor
2U Rackmount
Chassis Model
TN73
Dimension (D x W x H)
28.74" x 17.32" x 3.44" (730 x 440 x
87.5mm)
Motherboard Name
S8037GM2NE
Gross Weight
48.5 kg (107 lbs)
Net weight
34 kg (75 lbs)
Front Panel
Buttons
(1) PWR, (1) RST, (1) UID
LEDs
(1) HDD, (1) ID, (1) System Event, (2)
LAN activity
I/O Ports
(2) USB 3.1 Gen1 ports
External Drive Bay
Q'ty / Type
(4) 2.5" Hot-Swap HDD/SSD per node
HDD Backplane
Support
SAS 12Gb/s, SATA 6Gb/s
Supported HDD
Interface
(4) SAS 12Gb/s, SATA 6Gb/s
Notification
The SAS/SATA HDD backplane is
connected to onboard SATA
connection by default. Please contact
Tyan technical support if a discrete
SAS HBA/RAID adapter is required.
System Cooling Configuration
FAN
(3) 4cm fans per node
Power Supply
Type
CRPS
Input Range
AC 200-219V/220-240 10A
Frequency
47-63 Hz
Output Watts
1,800 Watts (200-219Vac input)
1,968 Watts (220-240Vac input)
Efficiency
80 plus Platinum
Redundancy
1+1
Notification When about 180W CPUs are
deployed. The 4-node system may
not support redundancy. Please
contact Tyan Technical Support for
additional information.
Processor
Q'ty / Socket Type
(1) AMD Socket SP3 per node
Supported CPU Series
(1) AMD EPYC™ 7002 Series
Processor
Configurable Thermal
Design Power (cTDP)
Wattage
Max up to 240W

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Memory
Supported DIMM Qty
(8) DIMM slots (per node)
DIMM Type / Speed
DDR4 ECC RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS 3200
Capacity
Up to 2,048GB RDIMM, 4,096GB
LRDIMM 3DS
Memory channel
8 Channels per CPU
Memory voltage
1.2V
Expansion Slots
PCI-E
(2) PCI-E x16 slots
Pre-install TYAN Riser
Card
(PCI-E Gen4)
(1) M8037T73-R16-1L riser card for (1)
HH/HL, (1) M8037T73-L16-1L riser
card for (1) HH/HL
Others
(1) PCI-E Gen3 x16 OCP 2.0 slot
(conn.A+conn.B)
Physical Dimension
Abbreviation
HH/HL (Half-height, Half-length): 2.7" x
6.6" (68.9 x 167.7mm)
LAN
Q'ty / Port
(2) GbE ports + (1) GbE dedicated for
IPMI
Controller
Broadcom BCM5720
PHY
Realtek RTL8211E
Storage
SATA
Connector
(1) SFF-8654 connector for
up to (4) SATA ports
Controller
Direct from AMD EPYC
CPU
Speed
6Gb/s
RAID
N/A
NVMe
Connector (M.2)
(2) 22110/2280 (by PCI-E
Gen3 & SATA interface)
Connector (Slim
SAS)
(2) SFF-8654 for (4) NVMe
ports
Graphic
Connector type
D-Sub 15-pin
Resolution
Up to 1920x1200
Chipset
Aspeed AST2500
I/O Ports
USB
(1) USB3.1 TYPE-C (@ rear), (2)
USB3.1 Gen1 ports (via Cable)
COM
(1) header ( COM1 )
VGA
(1) D-Sub 15-pin port
RJ-45
(2) GbE ports, (1) dedicated GbE for
IPMI
TPM (Optional)
TPM Support
Please refer to our TPM supported list.