your position is our focus
2.6.1 SchematicDesign-InChecklistforu-blox5 .................................................................................. 23
2.6.2 AMY-5MDesign ......................................................................................................................... 24
2.6.3 DesignforAMY-5M .................................................................................................................... 25
2.7 LayoutDesign-InChecklist.................................................................................................................. 27
2.8 Layout ................................................................................................................................................ 28
2.8.1 Footprint ..................................................................................................................................... 28
2.8.2 PasteMask.................................................................................................................................. 28
2.8.3 Placement ................................................................................................................................... 29
ESDProtectionMeasures............................................................................................................................... 30
2.9.1 ESDPrecautionsforUSB.............................................................................................................. 30
2.9.2 ESDPrecautionsforAntennas ..................................................................................................... 30
3Product Handling........................................................................................................31
3.1 Packaging........................................................................................................................................... 31
3.1.1 Reels ........................................................................................................................................... 31
3.1.2 Tapes .......................................................................................................................................... 32
3.2 Shipment,StorageandHandling ........................................................................................................ 32
3.2.1 Handling ..................................................................................................................................... 32
3.2.2 Shipment..................................................................................................................................... 32
3.2.3 Storage ....................................................................................................................................... 33
3.2.4 Handling ..................................................................................................................................... 33
3.2.5 FloorLife ..................................................................................................................................... 34
3.3 Processing .......................................................................................................................................... 35
3.3.1 MoisturePreconditioning ............................................................................................................ 35
3.3.2 SolderingPaste............................................................................................................................ 35
3.3.3 ReflowSoldering ......................................................................................................................... 36
3.3.4 OpticalInspection........................................................................................................................ 37
3.3.5 Cleaning...................................................................................................................................... 38
3.3.6 RepeatedReflowSoldering.......................................................................................................... 38
3.3.7 WaveSoldering ........................................................................................................................... 38
3.3.8 HandSoldering ........................................................................................................................... 38
3.3.9 Rework........................................................................................................................................ 38
3.3.10 ConformalCoating ..................................................................................................................... 39
3.3.11 Casting........................................................................................................................................ 39
3.3.12 GroundingMetalCovers ............................................................................................................. 39
3.3.13 UseofUltrasonicProcesses.......................................................................................................... 39
3.4 ESDHandlingPrecautions................................................................................................................... 40
