Ublox AMY-5M User manual

AMY-5M
u-blox 5 GPS Modules
Hardware Integration Manual
Abstract
This document describes the hardware features and specifications of
the cost effective and high-performance AMY-5M ROM-Based GPS
module featuring the u-blox 5 positioning engine.
The AMY-5M module boasts the industry’s smallest form factor and
is a fully tested standalone solution that requires no host
integration.
This module combines exceptional GPS performance with highly
flexible power, design, and serial communication options
locate, communicate, accelerate
www.u-blox.com

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Document Information
Title
AMY-5M
Subtitle
u-blox 5 GPS Modules
Document type
Hardware Integration Manual
Document number
GPS.G5-MS5-08207-A3
Document status
Preliminary
This document contains preliminary data, revised and supplementary data may be
published later.
This document applies to the following products:
Name
Type number
ROM/FLASH version
PCN reference
AMY-5M
AMY-5M-0-003
ROM5.00
n/a
This document and the use of any information contained therein, is subject to the acceptance of the u-blox terms and conditions. They
can be downloaded from www.u-blox.com.
u-blox makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make
changes to specifications and product descriptions at any time without notice.
u-blox reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without
express permission is strictly prohibited. Copyright © 2010, u-blox AG.
u-blox®is a registered trademark of u-blox Holding AG in the EU and other countries. ARM®is the registered trademark of ARM Limited in
the EU and other countries.

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Preface
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
GPS Compendium: This document, also known as the GPS book, provides a wealth of information
regarding generic questions about GPS system functionalities and technology.
Receiver Description including Protocol Specification: Messages, configuration and functionalities of
the u-blox 5 software releases and receivers are explained in this document.
Hardware Integration Manual: This Manual provides hardware design instructions and information on
how to set up production and final product tests.
Application Note: document provides general design instructions and information that applies to all u-blox
GPS receivers. See Section Related documents for a list of Application Notes related to your GPS receiver.
How to use this Manual
The AMY-5M Hardware Integration Manual provides the necessary information to successfully design in and
configure these u-blox 5-based GPS/GALILEO receiver modules. For navigating this document please note the
following:
This manual has a modular structure. It is not necessary to read it from the beginning to the end. To help in
finding needed information, a brief section overview is provided below:
1. Hardware description: This chapter introduces the basics of function and architecture of the u-blox 5
modules.
2. Design-in: This chapter provides the Design-In information necessary for a successful design.
3. Product handling: This chapter defines packaging, handling, shipment, storage and soldering.
4. Product testing: This chapter provides information about testing of OEM receivers in production.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
Questions
If you have any questions about u-blox 5 Hardware Integration, please:
Read this manual carefully.
Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com
Contact our information service on the homepage http://www.u-blox.com
Technical Support
Worldwide Web
Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and
helpful FAQ can be accessed 24h a day.

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By E-mail
If you have technical problems or cannot find the required information in the provided documents, contact the
nearest of the Technical Support offices by email. Use our service pool email addresses rather than any personal
email address of our staff. This makes sure that your request is processed as soon as possible. You will find the
contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support please have the following information ready:
Receiver type (AMY-5M) and firmware version (e.g. V5.00)
Receiver configuration
Clear description of your question or the problem together with a u-center logfile
A short description of the application
Your complete contact details

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Contents
Preface ................................................................................................................................3
Contents..............................................................................................................................5
1Hardware description ..................................................................................................8
1.1 Overview .............................................................................................................................................. 8
1.2 Architecture.......................................................................................................................................... 8
2Design-in.......................................................................................................................9
2.1 Power management ............................................................................................................................. 9
2.1.1 Overview ....................................................................................................................................... 9
2.1.2 Power management configuration .............................................................................................. 11
2.1.3 System power consumption ........................................................................................................ 11
2.1.4 How to connect the power supply pins ....................................................................................... 12
2.1.5 Single 2.5…3.6 V supply ............................................................................................................. 12
2.1.6 Single 1.75…2.0 V supply ........................................................................................................... 13
2.1.7 Separate supplies of 1.8 V (1.75…2.0V) and 1.4 V (1.4…3.6 V) .................................................. 14
2.1.8 Separate supplies of 3.0 V (2.5…3.6 0V) and 1.4 V (1.4…3.6 V) ................................................. 15
2.1.9 Power modes .............................................................................................................................. 15
2.1.10 Active antenna supply ................................................................................................................. 16
2.2 System functions ................................................................................................................................ 17
2.2.1 EXTINT - external interrupt pin..................................................................................................... 17
2.2.2 System monitoring ...................................................................................................................... 17
2.3 Interfaces............................................................................................................................................ 17
2.3.1 Serial ........................................................................................................................................... 17
2.3.2 USB ............................................................................................................................................. 17
2.3.3 Display Data Channel (DDC) ........................................................................................................ 18
2.4 I/O Pins ............................................................................................................................................... 23
2.4.1 Peripheral Input Output (PIO)....................................................................................................... 23
2.4.2 Configuration Pins....................................................................................................................... 23
2.4.3 SAFEBOOT_N .............................................................................................................................. 26
2.4.4 RTC ............................................................................................................................................. 26
2.5 Increasing interference immunity ........................................................................................................ 26
2.6 Active antenna supervisor ................................................................................................................... 26
2.7 Design-in checklist .............................................................................................................................. 27

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2.7.1 Schematic design-in checklist for u-blox 5 ................................................................................... 27
2.7.2 AMY-5M design .......................................................................................................................... 28
2.7.3 Design for AMY-5M .................................................................................................................... 29
2.8 Layout design-in checklist ................................................................................................................... 31
2.9 Layout ................................................................................................................................................ 32
2.9.1 Footprint ..................................................................................................................................... 32
2.9.2 Paste mask .................................................................................................................................. 32
2.9.3 Placement ................................................................................................................................... 33
2.10 Migration considerations................................................................................................................. 33
2.11 EOS/ESD/EMI precautions................................................................................................................ 34
2.11.1 Abbreviations .............................................................................................................................. 34
2.11.2 Electrostatic Discharge (ESD)........................................................................................................ 34
2.11.3 ESD protection measures............................................................................................................. 34
2.11.4 Electrical Overstress (EOS)............................................................................................................ 35
2.11.5 EOS protection measures............................................................................................................. 35
2.11.6 Electromagnetic Interference (EMI) .............................................................................................. 35
2.11.7 GSM applications ........................................................................................................................ 36
2.11.8 Recommended parts ................................................................................................................... 38
3Product handling & soldering....................................................................................39
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 39
3.2 ESD handling precautions ................................................................................................................... 39
3.3 Soldering ............................................................................................................................................ 40
3.3.1 Soldering paste............................................................................................................................ 40
3.3.2 Reflow soldering ......................................................................................................................... 40
3.3.3 Optical inspection........................................................................................................................ 40
3.3.4 Repeated reflow soldering........................................................................................................... 40
3.3.5 Wave soldering............................................................................................................................ 40
3.3.6 Hand soldering ............................................................................................................................ 40
3.3.7 Rework........................................................................................................................................ 40
3.3.8 Conformal coating ...................................................................................................................... 40
3.3.9 Casting........................................................................................................................................ 41
3.3.10 Use of ultrasonic processes.......................................................................................................... 41
4Product testing ...........................................................................................................42
4.1 Test parameters for OEM manufacturer .............................................................................................. 42
4.2 System sensitivity test ......................................................................................................................... 42
4.2.1 Guidelines for sensitivity tests ...................................................................................................... 42

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4.2.2 ‘Go/No go’ tests for integrated devices........................................................................................ 42
Appendix ..........................................................................................................................43
AComponent selection .................................................................................................43
A.1 RTC crystal (Y2) .................................................................................................................................. 43
A.2 I2C Serial EEPROM memory ................................................................................................................ 43
A.3 USB line protection (D2) ..................................................................................................................... 43
A.4 USB LDO (U3) ..................................................................................................................................... 43
A.5 Operational amplifier (U31) ................................................................................................................ 44
A.6 Dual open-drain buffer (U32).............................................................................................................. 44
A.7 Antenna supervisor switch transistor (T31).......................................................................................... 44
A.8 Ferrite bead filter (FB1) ....................................................................................................................... 44
A.9 Inductor (L) ......................................................................................................................................... 44
A.10 Standard capacitors ........................................................................................................................ 44
A.11 Standard resistors ........................................................................................................................... 45
BReference designs ......................................................................................................46
B.1 Minimum bill of material smart antenna ............................................................................................. 46
B.1.1 Schematic.................................................................................................................................... 47
B.1.2 Bill of material ............................................................................................................................. 48
B.1.3 Layout ......................................................................................................................................... 48
B.2 LEA-5 smart antenna with AMY-5M ................................................................................................... 49
B.2.1 Schematic.................................................................................................................................... 50
B.2.2 Bill of material ............................................................................................................................. 51
B.2.3 Layout ......................................................................................................................................... 52
CGlossary ......................................................................................................................52
Related documents...........................................................................................................53
Revision history................................................................................................................53
Contact..............................................................................................................................54

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1Hardware description
1.1 Overview
The AMY-5M is the GPS industry’s smallest standalone receiver. It is a fully tested ROM-based solution that
features the high performance u-blox 5 positioning engine. The AMY-5M has been developed for easy design
and integration, requires no host integration, which enables extremely short times to market.
The AMY-5M offers three different serial interfaces. The receiver features u-blox SuperSense®Indoor GPS -and
uses a standard Crystal, which provides fast acquisition and tracking performance at an economical price.
Furthermore, 2-layer PCB integration is supported, which brings additional cost savings.
AMY-5M’s miniature size means that it can be integrated into the smallest portable devices. Advanced
interference suppression mechanisms and innovative RF architecture ensure maximum performance even in
hostile signal environments.
1.2 Architecture
The AMY-5M module consists of two functional parts - the RF and the Baseband sections. See Figure 1 for a
block diagram of the AMY-5M.
The RF Front-End includes the DC-block, the input matching elements, the integrated Low Noise Amplifier (LNA),
the SAW bandpass filter, the u-blox 5 RF-IC and the Crystal.
The Baseband section contains the u-blox 5 Baseband processor. The RTC crystal and additional elements such as
the optional external memory for enhanced programmability and flexibility are optional
RF Front-End Baseband
Digital IF Filter
SRAM
ROMCode
ARM7TDMI-S
®
GPS / GALILEO
Engine
Power MGM
RTC
Backup RAM
Interfaces
RTCCrystal
(optional)
GPIO
UART
USB V2.0
DDC
(I
2
C compatible.)
Crystal
F
RF Front-End
Integrated LNA
Fractional
NSynthesizer
Main Power
RF Input
Matching
Active
antenna
SAWFilter
Backup Battery
AMY-5M
Available
Interfaces
Figure 1:AMY-5M hardware block schematic

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2Design-in
In order to obtain good performance with a GPS receiver module, there are a number of points that require
careful attention during the design-in. These include:
Power Supply
Good performance requires a clean and stable power supply.
Interfaces
Ensure correct wiring, rate and message setup on the module and your host system.
Antenna interface
For optimal performance seek short routing, matched impedance and no stubs.
With AMY-5M an external LNA is required if no active antenna is used.
2.1 Power management
2.1.1 Overview
The power supply circuitry can be adapted to various concepts, depending on the intended application.
Figure 2 gives an overview of the power supply features.
AMY-5
VDD_B NC
VDD_IO VDD_IO 1.65...3.6 V
XTAL_IN
XTAL_OUT
V_DCDC
1.4...3.6 V
Main Battery
1.4...3.6 V
Backup Battery V_BCKP
VDD_ANA NC
VDD_LNA NC
V_TH
V_TH=0: V_DCDC=2.5V - 3.6V
V_TH open: V_DCDC=1.75V - 2.0V
VDD_C
Crystal C20
f
XTAL
= 32.768 kHz
Y2
C19
(optional)
VDD_3V
VDD_RF
V_RESET
V_RESETmust be high to run the receiver. C
Figure 2: Power supply diagram
2.1.1.1 Main supply voltage
In operation the base-band supply current is supplied through pin V_DCDC. The built-in LDO generates the
stabilized core voltage V_DDC from V_DCDC. The current at V_DCDC depends heavily on the current system
state and is in general very dynamic.
It is strongly recommended to use a low-impedance supply (<< 1 Ohm) to the V_DCDC pin.

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2.1.1.2 Base-band I/O supply voltage
In general, the digital I/Os of the base-band part are supplied with VDD_IO from the host system. The wide
range of VDD_IO allows seamless interfacing to standard logic voltage levels. VDD_IO must be supplied in any
case with a voltage in the specified range, as some CFG_xx pins are always read during system boot in order to
define the initial configuration of the receiver.
The power management unit does not supervise VDD_IO. External circuitry must guarantee that VDD_IO
is within operating specification before the system boots and that it remains within specification until
the system shuts down. See also section 2.1.1.6.
2.1.1.3 Base-band core voltages
The core voltages VDD_B and VDD_C core are generated separately, in order to enable main supply VDD_C
switch off while the back-up domain VDD_B remains alive. The core voltages are generated by means of internal
LDOs. The input voltage range of the LDOs is wide and allows the use of several types of batteries.
2.1.1.4 Backup power supply
A backup battery can be connected to supply the RTC and the backup RAM in case of power failure at the main
battery (VDD_IO). An internal switch will supply the internal VDD_B power domain in case VDD_IO drops below
the specified minimum value. VDD_IO will supply the VDD_B power domain if a sufficiently high input voltage is
detected. See also section 2.1.1.6.
Limit V_BCKP and VDD_IO to 3.6 V.
2.1.1.5 RF supply voltages
The main supply of the RF unit is 1.8 V supplied to the VDD_RF pin. Optionally, this voltage can be generated
with the internal LDO from the VDD_3V input. Depending on the application, the VDD_3V pin can be supplied
independently, or it can be connected to the V_DCDC via a filter.
VDD_RF must be a clean supply to obtain optimal performance. Since the V_DCDC current is very dynamic, a
supply filter (see Figure 3) is recommended to ensure little or no ripple on VDD_RF.
C10
FB1 V
RF
V
DCDC
Figure 3: Supply filter
2.1.1.6 Built-in supply voltage monitors
Built-in supply voltage monitors ensure that the system always operates within safe limits. The following
conditions need to be met in order for the system to run properly:
1. The core voltages VDD_C and VDD_B need to be within specification. These voltages are supervised by
internal supply monitors.
2. The RF supply voltage VDD_RF needs to be within specification.
3. If external memory is used, its supply voltage, i.e. VDD_IO, needs to be within the specification of this
part. This must be verified since there is no internal monitor of VDD_IO
With respect to points 2 and 3 listed above, the voltage that defines the lowest operational boundary condition
of the system shall be supervised at the V_RESET pin. This is usually either the TCXO supply voltage (VDD_3V) or
the RF IC supply voltage (VDD_RF). In designs using EEPROM memory it may also be VDD_IO. Normally, higher
system supply voltages take longer to rise and fall faster than lower supply voltages, e.g. if in a given application,