NEO-5-HardwareIntegrationManualPreliminaryContents
GPS.G5-MS5-08003-A2u-bloxproprietaryPage 6
your position is our focus
2.8 AntennaandAntennaSupervisor ....................................................................................................... 24
2.8.1 PassiveAntenna .......................................................................................................................... 24
2.8.2 ActiveAntenna ........................................................................................................................... 25
2.8.3 ActiveAntennaSupervisor........................................................................................................... 25
3Product Handling........................................................................................................26
3.1 Packaging........................................................................................................................................... 26
3.1.1 Reels ........................................................................................................................................... 26
3.1.2 Tapes .......................................................................................................................................... 27
3.2 Shipment,StorageandHandling ........................................................................................................ 27
3.2.1 Handling ..................................................................................................................................... 27
3.2.2 Shipment..................................................................................................................................... 27
3.2.3 Storage ....................................................................................................................................... 28
3.2.4 Handling ..................................................................................................................................... 28
3.2.5 FloorLife ..................................................................................................................................... 29
3.3 Processing .......................................................................................................................................... 30
3.3.1 MoisturePreconditioning ............................................................................................................ 30
3.3.2 SolderingPaste............................................................................................................................ 30
3.3.3 ReflowSoldering ......................................................................................................................... 31
3.3.4 OpticalInspection........................................................................................................................ 32
3.3.5 Cleaning...................................................................................................................................... 33
3.3.6 RepeatedReflowSoldering.......................................................................................................... 33
3.3.7 WaveSoldering ........................................................................................................................... 33
3.3.8 HandSoldering ........................................................................................................................... 33
3.3.9 Rework........................................................................................................................................ 33
3.3.10 ConformalCoating ..................................................................................................................... 34
3.3.11 Casting........................................................................................................................................ 34
3.3.12 GroundingMetalCovers ............................................................................................................. 34
3.3.13 UseofUltrasonicProcesses.......................................................................................................... 34
4Product Testing...........................................................................................................35
4.1 u-bloxIn-SeriesProductionTest.......................................................................................................... 35
4.2 TestParametersforOEMManufacturer.............................................................................................. 35
4.3 SystemSensitivityTest ........................................................................................................................ 36
4.3.1 GuidelinesforSensitivityTests..................................................................................................... 36
4.3.2 ‘Go/Nogo’testsforintegrateddevices........................................................................................ 36
AMigration to u-blox 5 receivers.................................................................................37
A.1 MigrationfromNEO-4StoNEO-5....................................................................................................... 37
