Ublox MAX-7 Series Quick setup guide

MAX-7 / NEO-7 / LEA-7
u-blox 7 GPS/GNSS modules
Hardware Integration Manual
Abstract
This document describes the features and specifications of the cost
effective and high-performance MAX-7, NEO-7 and LEA-
7
GPS/GLONASS/QZSS modules featuring the u-
blox 7 positioning
engine.
These compact, easy to integrate stand-
alone GPS/GNSS receiver
modules combine exceptional GPS/GNSS performance with highly
flexible power, design, and connectivity options. Their compact
form factors and SMT pads allow fully automated assembly with
standard pick & place and reflow soldering equipment for cost-
efficient, high-volume production enabling short time-to-market.
locate, communicate, accelerate
www.u-blox.com

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Document Information
Title MAX-7 / NEO-7 / LEA-7
Subtitle u-blox 7 GPS/GNSS modules
Document type Hardware Integration Manual
Document number GPS.G7-HW-11006-1
Document status Objective Specification
Document status information
Objective
Specification
This document contains target values. Revised and supplementary data will be published
later.
Advance
Information
This document contains data based on early testing. Revised and supplementary data will
be published later.
Preliminary This document contains data from product verification. Revised and supplementary data
may be published later.
Released This document contains the final product specification.
This document applies to the following products:
Name Type number ROM/FLASH version PCN reference
MAX-7C-0 All ROM1.00
MAX-7Q-0 All ROM1.00
MAX-7W-0 All ROM1.00
NEO-7N-0 All FLASH1.00
NEO-7M-0 All ROM1.00
LEA-7N-0 All FLASH1.00
This document and the use of any information contained therein, is subject to the acceptance of the u-blox
terms and conditions. They can be downloaded from www.u-blox.com.
u-blox makes no warranties based on the accuracy or completeness of the contents of this document and
reserves the right to make changes to specifications and product descriptions at any time without notice.
u-blox reserves all rights to this document and the information contained herein. Reproduction, use or
disclosure to third parties without express permission is strictly prohibited. Copyright © 2012, u-blox AG.
u-blox®is a registered trademark of u-blox Holding AG in the EU and other countries. ARM®is the registered
trademark of ARM Limited in the EU and other countries.

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Preface
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
•GPS Compendium: This document, also known as the GPS book, provides a wealth of information
regarding generic questions about GPS system functionalities and technology.
•Receiver Description including Protocol Specification: Messages, configuration and functionalities of
the u-blox 7 software releases and positioning modules are explained in this document.
•Hardware Integration Manual: This Manual provides hardware design instructions and information on
how to set up production and final product tests.
•Application Note: document provides general design instructions and information that applies to all u-blox
GPS/GNSS positioning modules. See section Related documents for a list of Application Notes related to your
GPS/GNSS receiver.
How to use this Manual
The MAX-7, NEO-7 and LEA-7 Hardware Integration Manual provides the necessary information to successfully
design in and configure these u-blox 7-based positioning modules. For navigating this document, please note
the following:
This manual has a modular structure. It is not necessary to read it from the beginning to the end. To help in
finding needed information, a brief section overview is provided below
1. Hardware description: This chapter introduces the basics of function and architecture of the u-blox 7
modules.
2. Design: This chapter provides the information necessary for a successful design.
3. Product handling: This chapter defines packaging, handling, shipment, storage and soldering.
4. Product testing: This chapter provides information about testing of OEM positioning modules in
production.
5. Migration to u-blox-7 modules: includes guidelines on how to successfully migrate to u-blox 7 designs.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively influence or damage the module.
Questions
If you have any questions about u-blox 7 Hardware Integration, please:
•Read this manual carefully.
•Contact our information service on the homepage http://www.u-blox.com
•Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com

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Technical Support
Worldwide Web
Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and
helpful FAQ can be accessed 24h a day.
By E-mail
If you have technical problems or cannot find the required information in the provided documents, contact the
nearest of the Technical Support offices by email. Use our service pool email addresses rather than any personal
email address of our staff. This ensures that we process your request as soon as possible. You will find the
contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support please have the following information ready:
•Receiver type (e.g. NEO-7N-0-000), Datacode (e.g. 172100.0100.000) and firmware version (e.g. ROM1.0)
•Receiver configuration
•Clear description of your question or the problem together with a u-center logfile
•A short description of the application
•Your complete contact details

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Contents
Preface ................................................................................................................................3
Contents..............................................................................................................................5
1Quick reference ............................................................................................................8
2Hardware description ..................................................................................................8
2.1 Overview .................................................................................................................................................................................8
2.2 Architecture.............................................................................................................................................................................8
2.3 Operating modes .....................................................................................................................................................................9
2.3.1 Continuous Mode................................................................................................................................................................9
2.3.2 Power Save Mode................................................................................................................................................................9
2.4 Configuration ..........................................................................................................................................................................9
2.5 Connecting power ...................................................................................................................................................................9
2.5.1 VCC: Main Supply Voltage ...................................................................................................................................................9
2.5.2 VCC_IO: IO Supply Voltage (MAX-7)...................................................................................................................................10
2.5.3 V_BCKP: Backup Supply Voltage ........................................................................................................................................10
2.5.4 VDD_USB: USB interface power supply (NEO-7/LEA-7).........................................................................................................10
2.5.5 VCC_RF: Output Voltage RF section....................................................................................................................................10
2.5.6 V_ANT: Antenna supply (NEO-7/LEA-7)...............................................................................................................................11
2.6 Interfaces...............................................................................................................................................................................11
2.6.1 UART ................................................................................................................................................................................11
2.6.2 USB...................................................................................................................................................................................11
2.6.3 Display Data Channel (DDC)...............................................................................................................................................13
2.6.4 SPI (NEO-7)........................................................................................................................................................................13
2.7 I/O pins..................................................................................................................................................................................13
2.7.1 RESET_N: Reset input.........................................................................................................................................................13
2.7.2 EXTINT: External interrupt ..................................................................................................................................................13
2.7.3 D_SEL: Interface select (NEO-7)...........................................................................................................................................14
2.7.4 TX-ready signal ..................................................................................................................................................................14
2.7.5 ANT_ON: Antenna ON (LNA enable) (NEO-7N, MAX-7Q, MAX-7C)......................................................................................14
2.7.6 Antenna Short circuit detection (LEA-7N, MAX-7W) ............................................................................................................14
2.7.7 Antenna open circuit detection ..........................................................................................................................................14
2.7.8 TIMEPULSE ........................................................................................................................................................................14
3Design .........................................................................................................................15
3.1 Design checklist .....................................................................................................................................................................15
3.1.1 Schematic checklist............................................................................................................................................................15
3.1.2 Layout checklist .................................................................................................................................................................16
3.1.3 Antenna checklist ..............................................................................................................................................................16
3.2 Design considerations for minimal designs ..............................................................................................................................16
3.2.1 Minimal design (NEO-7N)...................................................................................................................................................17
3.2.2 Minimal design (MAX-7Q)..................................................................................................................................................19
3.2.3 Minimal design (LEA-7N)....................................................................................................................................................20
3.3 Layout ...................................................................................................................................................................................21
3.3.1 Footprint and paste mask...................................................................................................................................................21
3.3.2 Placement .........................................................................................................................................................................22
3.3.3 Antenna connection and ground plane design ....................................................................................................................23

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3.3.4 General design recommendations: .....................................................................................................................................24
3.3.5 Antenna micro strip ...........................................................................................................................................................25
3.4 Antenna and Antenna supervision ..........................................................................................................................................26
3.4.1 Antenna design with passive antenna.................................................................................................................................26
3.4.2 Active antenna design not using antenna supervisor (NEO-7N, NEO-7M, MAX-7C, MAX-7Q) ...............................................27
3.4.3 Antenna design with active antenna using antenna supervisor (LEA-7N, MAX-7W) ..............................................................28
3.4.4 Design with GLONASS / GPS active antenna .......................................................................................................................33
3.4.5 Design with GLONASS / GPS passive antenna .....................................................................................................................34
3.5 Recommended parts ..............................................................................................................................................................35
3.5.1 Recommended GPS & GLONASS active antenna (A1) ..........................................................................................................36
3.5.2 Recommended GPS & GLONASS passive patch antenna ......................................................................................................36
3.5.3 Recommended GPS & GLONASS passive chip antenna ........................................................................................................36
4Migration to u-blox-7 modules .................................................................................37
4.1 Migrating u-blox 6 designs to a u-blox 7 module.....................................................................................................................37
4.2 Hardware migration ...............................................................................................................................................................38
4.2.1 Hardware compatibility: .....................................................................................................................................................38
4.2.2 Hardware migration NEO-6 -> NEO-7 .................................................................................................................................39
4.2.3 Hardware migration MAX-6 -> MAX-7 ...............................................................................................................................40
4.2.4 Hardware migration LEA-6N -> LEA-7N ..............................................................................................................................41
4.3 Software migration ................................................................................................................................................................42
4.3.1 Software compatibility .......................................................................................................................................................42
4.3.2 Messages no longer supported...........................................................................................................................................42
5Product handling........................................................................................................43
5.1 Packaging, shipping, storage and moisture preconditioning .....................................................................................................43
5.2 Soldering ...............................................................................................................................................................................43
5.2.1 Soldering paste..................................................................................................................................................................43
5.2.2 Reflow soldering................................................................................................................................................................43
5.2.3 Optical inspection ..............................................................................................................................................................44
5.2.4 Cleaning ...........................................................................................................................................................................44
5.2.5 Repeated reflow soldering..................................................................................................................................................44
5.2.6 Wave soldering..................................................................................................................................................................45
5.2.7 Hand soldering ..................................................................................................................................................................45
5.2.8 Rework .............................................................................................................................................................................45
5.2.9 Conformal coating.............................................................................................................................................................45
5.2.10 Casting .........................................................................................................................................................................45
5.2.11 Grounding metal covers ................................................................................................................................................45
5.2.12 Use of ultrasonic processes ............................................................................................................................................46
5.3 EOS/ESD/EMI precautions .......................................................................................................................................................46
5.3.1 Electrostatic discharge (ESD)...............................................................................................................................................46
5.3.2 ESD handling precautions...................................................................................................................................................46
5.3.3 ESD protection measures ...................................................................................................................................................47
5.3.4 Electrical Overstress (EOS)...................................................................................................................................................47
5.3.5 EOS protection measures ...................................................................................................................................................47
5.3.6 Electromagnetic interference (EMI) .....................................................................................................................................48
5.3.7 Applications with wireless modules LEON / LISA..................................................................................................................49
6Product testing ...........................................................................................................51
6.1 u-blox in-series production test ...............................................................................................................................................51
6.2 Test parameters for OEM manufacturer ..................................................................................................................................51
6.3 System sensitivity test .............................................................................................................................................................52

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6.3.1Guidelines for sensitivity tests.............................................................................................................................................52
6.3.2 ‘Go/No go’ tests for integrated devices ...............................................................................................................................52
Appendix ..........................................................................................................................53
AAbbreviations .............................................................................................................53
Related documents...........................................................................................................53
Revision history................................................................................................................54
Contact..............................................................................................................................55

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1Quick reference
When using this manual for a design, make sure you also have the Data Sheet for the specific positioning
module (see the Related documents section).
For information about new designs, see section 3.1.
For information about migration, see sections 4.2.3 (MAX-7), 4.2.2 (NEO-7) and 4.2.4 (LEA-7).
Layout Power Interfaces I/Os Antenna
See section 3.3 See sections 2.3
and 2.4 See section 2.6 See section 2.7 See sections 2.5.6, 3.4, 3.5
Table 1: Quick guide to this document
2Hardware description
2.1 Overview
u-blox 7 modules are standalone GPS/GNSS positioning modules featuring the high performance u-blox 7
positioning engine. Available in industry standard form factors in leadless chip carrier (LCC) packages, they are
easy to integrate and combine exceptional positioning performance with highly flexible power, design, and
connectivity options. SMT pads allow fully automated assembly with standard pick & place and reflow-soldering
equipment for cost-efficient, high-volume production enabling short time-to-market.
For product features see the module Data Sheet.
To determine which u-blox product best meets your needs, see the product selector tables on the u-blox
website (www.u-blox.com).
2.2 Architecture
u-blox 7 modules consist of two functional parts - the RF block and the digital block (see Figure 1).
The RF block includes the input matching elements, the SAW band pass filter, the integrated LNA and the
oscillator, while the digital block contains the u-blox 7 GPS/GNSS engine, the RTC crystal and additional
elements such as the optional FLASH Memory for enhanced programmability and flexibility.
Figure 1: u-blox-7 block diagram

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2.3 Operating modes
u-blox receivers support different power modes. These modes represent strategies of how to control the
acquisition and tracking engines in order to achieve either the best possible performance or good performance
with reduced power consumption.
2.3.1 Continuous Mode
During a cold start, a receiver in Continuous Mode continuously deploys the acquisition engine to search for all
satellites. Once the receiver can calculate a position and track a sufficient number of satellites, the acquisition
engine powers off, resulting in significant power savings. The tracking engine continuously tracks acquired
satellites and acquires other available or emerging satellites. Whenever the receiver can no longer calculate a
position or the number of satellites tracked is below the sufficient number, the acquisition engine powers on
again to guarantee a quick reacquisition. Even if the acquisition engine powers off, the tracking engine
continues to acquire satellites.
For best performance, use continuous mode.
2.3.2 Power Save Mode
Two Power Save Mode (PSM) operations called ON/OFF and Cyclic tracking are available. These use different
ways to reduce the average current consumption in order to match the needs of the specific application. PSM
operations are set and configured using serial commands. For more information, see the u-blox 7 Receiver
Description Including Protocol Specification [4].
The system can shut down an optional external LNA using the ANT_ON signal in order to optimize power
consumption, see section 2.7.5.
Using the USB Interface is not recommended with Power Save Mode since the USB standard does not
allow a device to be non-responsive. Thus, it is not possible to have full advantage of Power Save Mode
operations in terms of saving current consumption.
Power Save Mode is not supported in GLONASS mode.
2.4 Configuration
The configuration settings can be modified using UBX protocol configuration messages. The modified settings
remain effective until power-down or reset. If these settings have been stored in BBR (Battery Backed RAM), then
the modified configuration will be retained, as long as the backup battery supply is not interrupted.
Configuration can be saved permanently in SQI flash.
2.5 Connecting power
u-blox 7 positioning modules have up to five power supply pins: VCC, VCC_IO, V_BCKP, V_ANT and
VDD_USB.
2.5.1 VCC: Main Supply Voltage
The VCC pin provides the main supply voltage. During operation, the current drawn by the module can vary by
some orders of magnitude, especially if enabling low-power operation modes. For this reason, it is important
that the supply circuitry be able to support the peak power (see datasheet for specification) for a short time.
Some u-blox 7 modules integrate a DC/DC converter. This allows reduced power consumption, especially when
using a main supply voltage above 2.5 V.
When switching from backup mode to normal operation or at start-up, u-blox 7 modules must charge
the internal capacitors in the core domain. In certain situations, this can result in a significant current
draw. For low power applications using Power Save and backup modes it is important that the power
supply or low ESR capacitors at the module input can deliver this current/charge.

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Use a proper GND concept. Do not use any resistors or coils in the power line. For ground plane design
see section 3.3.3
2.5.2 VCC_IO: IO Supply Voltage (MAX-7)
VCC_IO from the host system supplies the digital I/Os. The wide range of VCC_IO allows seamless interfacing to
standard logic voltage levels independent of the VCC voltage level. In many applications, VCC_IO is simply
connected to the main supply voltage.
Without a VCC_IO supply, the system will remain in reset state.
2.5.3 V_BCKP: Backup Supply Voltage
In case of a power failure on the module supply, the real-time clock (RTC) and battery backed RAM (BBR) are
supplied by V_BCKP. Use of valid time and the GPS/GNSS orbit data at start up will improve the GPS/GNSS
performance i.e. enables Hotstarts, Warmstarts, AssistNow Autonomous and AssistNow Offline. If no backup
battery is connected, the module performs a Coldstart at power up.
Avoid high resistance on the V_BCKP line: During the switch from main supply to backup supply a short
current adjustment peak can cause high voltage drop on the pin with possible malfunctions.
If no backup supply voltage is available, connect the V_BCKP pin to VCC_IO (or to VCC if not avaiable).
As long as the u-blox 7 module is supplied to VCC and VCC_IO, the backup battery is disconnected
from the RTC and the BBR to avoid unnecessary battery drain (see Figure 2). In this case, VCC supplies
power to the RTC and BBR.
Figure 2: Backup battery and voltage (for exact pin orientation, see data sheet)
2.5.3.1 RTC derived from the system clock; “Single Crystal” feature (MAX-7C)
On MAX-7C, the reference frequency for the RTC clock can be internally derived from the crystal system clock
frequency (26 MHz) when in Hardware Backup Mode. This feature is called “single crystal” operation. The crystal
will be supplied by the backup battery at V_BCKP in the event of a power failure at VDD_IO to derive and
maintain the RTC clock. This makes MAX-7C a more cost efficient solution at the expense of a higher backup
current compared to the usage of an ordinary RTC crystal on other MAX-7 variants. The capacity of the backup
battery at V_BCKP must therefore be increased accordingly if Hardware Backup Mode is needed.
2.5.4 VDD_USB: USB interface power supply (NEO-7/LEA-7)
VDD_USB supplies the USB interface. If the USB interface is not used, the VDD_USB pin must be connected to
GND. For more information about correctly handling the VDD_USB pin, see section 2.6.2.1.
2.5.5 VCC_RF: Output Voltage RF section
The VCC_RF pin can supply an active antenna or external LNA. For more information, see section 3.4.3.2.