Ublox LEA-6 series Quick setup guide

LEA-6 / NEO-6
u-blox 6 GPS Modules
Hardware Integration Manual
Abstract
This document describes the features and specifications of the cost
effective and high-performance LEA-6 and NEO-
6 GPS modules
featuring the u-blox 6 positioning engine.
These compact, easy to integrate stand-
alone GPS receiver modules
combine exceptional GPS performance with highly flexible power,
design, and connectivity options. Their compact form factors and
SMT pads allow fully automated assembly with standard pick &
place and reflow soldering equipment for cost-efficient, high-
volume production enabling short time-to-market.
locate, communicate, accelerate
www.u-blox.com
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GPS.G6-HW-09007-A Page 2 of 62
Document Information
Title LEA-6 / NEO-6
Subtitle u-blox 6 GPS Modules
Document type Hardware Integration Manual
Document number GPS.G6-HW-09007-A
Document status Preliminary
Document status information
Objective
Specification
This document contains target values. Revised and supplementary data will be published
later.
Advance
Information
This document contains data based on early testing. Revised and supplementary data will
be published later.
Preliminary This document contains data from product verification. Revised and supplementary data
may be published later.
Released This document contains the final product specification.
This document applies to the following products:
Name Type number ROM/FLASH version
LEA-6H All FW6.02
LEA-6S All ROM6.02
LEA-6A All ROM6.02
LEA-6T All ROM6.02
LEA-6R All FW DR 1.0
NEO-6G All ROM6.02
NEO-6Q All ROM6.02
NEO-6M All ROM6.02
This document and the use of any information contained therein, is subject to the acceptance of the u-blox terms and conditions. They
can be downloaded from www.u-blox.com.
u-blox makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make
changes to specifications and product descriptions at any time without notice.
u-blox reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without
express permission is strictly prohibited. Copyright © 2010, u-blox AG.
u-blox®is a registered trademark of u-blox Holding AG in the EU and other countries. ARM®is the registered trademark of ARM Limited in
the EU and other countries.
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LEA-6 / NEO-6 - Hardware Integration Manual
GPS.G6-HW-09007-A Preliminary Preface
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Preface
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
•GPS Compendium: This document, also known as the GPS book, provides a wealth of information
regarding generic questions about GPS system functionalities and technology.
•Receiver Description including Protocol Specification: Messages, configuration and functionalities of
the u-blox 6 software releases and receivers are explained in this document.
•Hardware Integration Manual: This Manual provides hardware design instructions and information on
how to set up production and final product tests.
•Application Note: document provides general design instructions and information that applies to all u-blox
GPS receivers. See Section Related documents for a list of Application Notes related to your GPS receiver.
How to use this Manual
The LEA-6 / NEO-6 Hardware Integration Manual provides the necessary information to successfully design in
and configure these u-blox 6-based GPS receiver modules. For navigating this document please note the
following:
This manual has a modular structure. It is not necessary to read it from the beginning to the end. To help in
finding needed information, a brief section overview is provided below:
1. Hardware description: This chapter introduces the basics of function and architecture of the u-blox 6
modules.
2. Design-in: This chapter provides the Design-In information necessary for a successful design.
3. Product handling: This chapter defines packaging, handling, shipment, storage and soldering.
4. Product testing: This chapter provides information about testing of OEM receivers in production.
5. Appendix: The Appendix includes guidelines on how to successfully migrate to u-blox 6 designs, and useful
information about the different antenna types available on the market and how to reduce interference in
your GPS design.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
Questions
If you have any questions about u-blox 6 Hardware Integration, please:
•Read this manual carefully.
•Contact our information service on the homepage http://www.u-blox.com
•Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com
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GPS.G6-HW-09007-A Preliminary Preface
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Technical Support
Worldwide Web
Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and
helpful FAQ can be accessed 24h a day.
By E-mail
If you have technical problems or cannot find the required information in the provided documents, contact the
nearest of the Technical Support offices by email. Use our service pool email addresses rather than any personal
email address of our staff. This makes sure that your request is processed as soon as possible. You will find the
contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support please have the following information ready:
•Receiver type (e.g. LEA-6A-0-000), Datacode (e.g. 160200.0300.000) and firmware version (e.g. FW6.02)
•Receiver configuration
•Clear description of your question or the problem together with a u-center logfile
•A short description of the application
•Your complete contact details
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LEA-6 / NEO-6 - Hardware Integration Manual
GPS.G6-HW-09007-A Preliminary Contents
Page 5 of 62
Contents
Preface ................................................................................................................................3
Contents..............................................................................................................................5
1Hardware description ..................................................................................................8
1.1 Overview .............................................................................................................................................. 8
1.2 Architecture.......................................................................................................................................... 8
1.3 Power management ............................................................................................................................. 9
1.3.1 Connecting power ........................................................................................................................ 9
1.3.2 Operating modes ........................................................................................................................ 10
1.4 Antenna supply -V_ANT (LEA-6) ....................................................................................................... 11
1.5 System functions ................................................................................................................................ 11
1.5.1 EXTINT - External interrupt pin..................................................................................................... 11
1.5.2 System monitoring ...................................................................................................................... 11
1.6 Interfaces............................................................................................................................................ 11
1.6.1 UART........................................................................................................................................... 11
1.6.2 USB ............................................................................................................................................. 11
1.6.3 Display Data Channel (DDC) ........................................................................................................ 12
1.6.4 SPI (NEO-6).................................................................................................................................. 14
1.7 I/O pins............................................................................................................................................... 17
1.7.1 RESET_N...................................................................................................................................... 17
1.7.2 EXTINT0 ...................................................................................................................................... 17
1.7.3 AADET_N (LEA-6) ........................................................................................................................ 17
1.7.4 Configuration pins (LEA-6S/6A, NEO-6) ....................................................................................... 17
2Design-in.....................................................................................................................18
2.1 Design-in checklist .............................................................................................................................. 18
2.1.1 Layout design-in checklist............................................................................................................ 18
2.1.2 Design considerations.................................................................................................................. 20
2.2 LEA-6 design ...................................................................................................................................... 21
2.2.1 LEA-6 passive antenna design...................................................................................................... 21
2.2.2 Pin description for antenna designs (LEA-6) ................................................................................. 22
2.3 NEO-6 design ..................................................................................................................................... 24
2.3.1 Passive antenna design (NEO-6)................................................................................................... 24
2.4 Layout ................................................................................................................................................ 25
2.4.1 Footprint and paste mask ............................................................................................................ 25
2.4.2 Placement ................................................................................................................................... 26
2.4.3 Antenna connection and grounding plane design ....................................................................... 28
2.4.4 Antenna micro strip..................................................................................................................... 29
2.5 Antenna and antenna supervisor ........................................................................................................ 30
2.5.1 Passive antenna........................................................................................................................... 31
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2.5.2 Active antenna (LEA-6) ................................................................................................................ 31
2.5.3 Active antenna (NEO-6) ............................................................................................................... 32
2.5.4 Active antenna bias power (LEA-6) .............................................................................................. 33
2.5.5 Active antenna supervisor (LEA-6)................................................................................................ 33
3Product handling........................................................................................................38
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 38
3.2 Soldering ............................................................................................................................................ 38
3.2.1 Soldering paste............................................................................................................................ 38
3.2.2 Reflow soldering ......................................................................................................................... 38
3.2.3 Optical inspection........................................................................................................................ 39
3.2.4 Cleaning...................................................................................................................................... 40
3.2.5 Repeated reflow soldering........................................................................................................... 40
3.2.6 Wave soldering............................................................................................................................ 40
3.2.7 Hand soldering............................................................................................................................ 40
3.2.8 Rework........................................................................................................................................ 40
3.2.9 Conformal coating ...................................................................................................................... 40
3.2.10 Casting........................................................................................................................................ 40
3.2.11 Grounding metal covers .............................................................................................................. 41
3.2.12 Use of ultrasonic processes.......................................................................................................... 41
3.3 EOS/ESD/EMI Precautions.................................................................................................................... 41
3.3.1 Abbreviations .............................................................................................................................. 41
3.3.2 Electrostatic discharge (ESD) ........................................................................................................ 41
3.3.3 ESD handling precautions............................................................................................................ 41
3.3.4 ESD protection measures............................................................................................................. 42
3.3.5 Electrical Overstress (EOS)............................................................................................................ 43
3.3.6 EOS protection measures............................................................................................................. 43
3.3.7 Electromagnetic interference (EMI) .............................................................................................. 43
3.3.8 GSM applications ........................................................................................................................ 44
3.3.9 Recommended parts ................................................................................................................... 46
4Product testing ...........................................................................................................47
4.1 u-blox in-series production test........................................................................................................... 47
4.2 Test parameters for OEM manufacturer.............................................................................................. 47
4.3 System sensitivity test ......................................................................................................................... 48
4.3.1 Guidelines for sensitivity tests ...................................................................................................... 48
4.3.2 ‘Go/No go’ tests for integrated devices........................................................................................ 48
Appendix ..........................................................................................................................49
AAbbreviations .............................................................................................................49
BMigration to u-blox-6 receivers.................................................................................49
B.1 Checklist for migration ....................................................................................................................... 49
B.2 Software migration............................................................................................................................. 51
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B.3 Hardware Migration ........................................................................................................................... 52
B.3.1 Hardware Migration: ANTARIS 4 u-blox 6 ............................................................................... 52
B.3.2 Hardware Migration: u-blox 5 u-blox 6 ................................................................................... 52
B.4 Migration of LEA modules .................................................................................................................. 52
B.4.1 Migration from LEA-4 to LEA-6 ................................................................................................... 52
B.4.2 Migration from LEA-5 to LEA-6 ................................................................................................... 54
B.5 Migration of NEO modules ................................................................................................................. 54
B.5.1 Migration from NEO-4S to NEO-6................................................................................................ 54
B.5.2 Migration from NEO-5 to NEO-6 ................................................................................................. 55
CInterface Backgrounder .............................................................................................56
C.1 DDC Interface..................................................................................................................................... 56
C.1.1 Addresses, roles and modes ........................................................................................................ 56
C.1.2 DDC troubleshooting .................................................................................................................. 57
C.2 SPI Interface........................................................................................................................................ 58
C.2.1 SPI basics..................................................................................................................................... 58
Related documents...........................................................................................................61
Revision history................................................................................................................61
Contact..............................................................................................................................62
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LEA-6 / NEO-6 - Hardware Integration Manual
GPS.G6-HW-09007-A Preliminary Hardware description
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1Hardware description
1.1 Overview
The LEA-6 and NEO-6 modules are standalone GPS receivers featuring the high performance u-blox-6 positioning
engine. These compact, easy to integrate modules combine exceptional GPS performance with highly flexible
power, design, and connectivity options. Their compact form factors and SMT pads allow fully automated
assembly with standard pick & place and reflow-soldering equipment for cost-efficient, high-volume production
enabling short time-to-market.
u-blox GPS modules are not designed for life saving or supporting devices or for aviation and should not be used
in products that could in any way negatively impact the security or health of the user or third parties or that
could cause damage to goods.
1.2 Architecture
LEA-6 and NEO-6 modules consist of two functional parts - the RF and the Baseband sections. See Figure 1 and
Figure 2 for block diagrams of the modules.
The RF Front-End includes the input matching elements, the SAW bandpass filter, the u-blox 6 RF-IC (with
integrated LNA) and the frequency source.
The Baseband section contains the u-blox 6 Baseband processor, the RTC crystal and additional elements such as
the optional FLASH Memory for enhanced programmability and flexibility.
RF Front-End
with
Integrated LNA
Baseband Processor
Power
Management
TCXO or
Crystal (optional)
RTC
Cry st a l
FLASH EPROM
(optional)
Antenna
Supervision
& Supply
Power Control
RF_IN
V_ANT
AADET_N
VCC_RF
VCC
V_BCKP
G ND
VCC_OUT
UART
EXTINT
RESET_N
USB V2.0
CFG
Digital
IF Filter
Backup
RAM
ROM Code
GPS/GALILEO
Engine
ARM7TDMI-S
®
SRAM
TIMEPULSE
SAW
Filter
RTC
DDC
Figure 1: LEA-6 block diagram
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GPS.G6-HW-09007-A Preliminary Hardware description
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RF Front-End
with
Integrated LNA
Baseband Processor
Power
Management
T CXO o r Cry st a l
RTC
RF_IN
Digital
IF Filter
Backup
RAM
ROM Code
GPS
Engine
ARM7TDMI-S
®
SRAM
SAW
Filter
RTC
VCC_RF
VCC
V_BCKP
GND
SPI (optional)
DDC
TIMEPULSE
EXTINT
UART
USB V2.0
CFG
V_RESET
Figure 2: NEO-6 block diagram
1.3 Power management
1.3.1 Connecting power
u-blox 6 receiver modules have three power supply pins: VCC, V_BCKP and VDDUSB.
1.3.1.1 VCC - main power
The main power supply is fed through the VCC pin. During operation, the current drawn by the u-blox 6 GPS
module can vary by some orders of magnitude, especially, if low-power operation modes are enabled. It is
important that the system power supply circuitry is able to support the peak power (see datasheet for
specification) for a short time. In order to define a battery capacity for specific applications the sustained power
figure shall be used.
When switching from backup mode to normal operation or at start-up u-blox 6 modules must charge the
internal capacitors in the core domain. In certain situations this can result in a significant current draw. For
low power applications using Power Save and backup modes it is important that the power supply or low
ESR capacitors at the module input can deliver this current/charge.
1.3.1.2 V_BCKP - backup battery
In case of a power failure on pin VCC, the real-time clock and backup RAM are supplied through pin V_BCKP.
This enables the u-blox 6 receiver to recover from a power failure with either a Hotstart or a Warmstart
(depending on the duration of VCC outage) and to maintain the configuration settings saved in the backup
RAM. If no backup battery is connected, the receiver performs a Coldstart at power up.
If no backup battery is available connect the V_BCKP pin to GND.
As long as VCC is supplied to the u-blox 6 receiver, the backup battery is disconnected from the RTC and the
backup RAM in order to avoid unnecessary battery drain (see Figure 3). Power to RTC and BBR is supplied from
VCC in this case.
Avoid high resistance on the on the V_BCKP line: During the switch from main supply to backup supply a
short current adjustment peak can cause high voltage drop on the pin and possible malfunctions.
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GPS.G6-HW-09007-A Preliminary Hardware description
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VCC
V_BCKP
Voltage
Supervisor
Module Voltage Supply
RTC and Battery Backup RAM (BBR)
J1
Figure 3: Backup Battery and Voltage
1.3.1.3 VDD_USB - USB interface power supply
VDD_USB supplies the USB interface. If the USB interface is not used, the VDD_USB pin must be connected to
GND. For more information regarding the correct handling of VDD_USB see section 1.6.2.1
1.3.2 Operating modes
u-blox 6 modules with FW 6.02 or ROM6.02 have two continuous operating modes (Maximum Performance and
Eco) and one intermittent operating mode (Power Save mode). Maximum Performance mode freely uses the
acquisition engine, resulting in the best possible TTFF, while Eco mode optimizes the use of the acquisition
engine to deliver lower current consumption. At medium to strong signals, there is almost no difference for
acquisition and tracking performance in these modes.
1.3.2.1 Maximum Performance mode
In Maximum Performance mode, u-blox 6 receivers use the acquisition engine at full performance to search for
all possible satellites until the Almanac is completely downloaded.
As a consequence, tracking current consumption level will be achieved when:
•A valid GPS position is fixed
•Almanac is entirely downloaded
•Ephemeris for all satellites in view are valid
1.3.2.2 Eco mode
In Eco mode, u-blox 6 receivers use the acquisition engine to search for new satellites only when needed for
navigation:
•In cold starts, u-blox 6 searches for enough satellites to navigate and optimizes use of the acquisition
engine to download their ephemeris.
•In non-cold starts, u-blox 6 focuses on searching for visible satellites whose orbits are known from the
Almanac.
In Eco mode, the u-blox 6 acquisition engine limits use of its searching resources to minimize power
consumption. As a consequence the time to find some satellites at weakest signal level might be slightly
increased in comparison to the Maximum Performance mode.
u-blox 6 deactivates the acquisition engine as soon as a position is fixed and a sufficient number (at least 4) of
satellites are being tracked. The tracking engine continues to search and track new satellites without orbit
information.
1.3.2.3 Power Save mode
LEA-6 and NEO-6 modules include power saving options that allow reducing the average tracking current
consumption by switching off parts of or the complete GPS receiver and waking it up at configurable intervals
from one second to one week. This can be done by using a hardware interrupt or by sending a serial command.
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