Viking Slim SATA User manual

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SATA 6Gb/s
Industrial
Slim SATA
Manual
Slim SATA is a non-volatile, solid-state storage device. With its Serial
ATA interface and Slim SATA (MO-297) form factor, it is a drop in
replacement for hard disk drives. Slim SATA delivers extremely high
levels of performance, reliability and ruggedness for I/O intensive or
environmentally challenging applications.

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Revision History
Date
Revision
Description
Checked By
2/7/17
A
Initial release
2/14/17
B
Update PN table
3/14/17
C
modified from SFEM1XXXGSXXX_H
for Viking format with new PN’s
performance, block diagram, TBW,
power consumption.

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Legal Information
Legal Information
Copyright© 2017 Sanmina Corporation. All rights reserved. The information in
this document is proprietary and confidential to Sanmina Corporation. No part of
this document may be reproduced in any form or by any means or used to make
any derivative work (such as translation, transformation, or adaptation) without
written permission from Sanmina. Sanmina reserves the right to revise this
documentation and to make changes in content from time to time without
obligation on the part of Sanmina to provide notification of such revision or
change.
Sanmina provides this documentation without warranty, term or condition of any
kind, either expressed or implied, including, but not limited to, expressed and
implied warranties of merchantability, fitness for a particular purpose, and non-
infringement. While the information contained herein is believed to be accurate,
such information is preliminary, and should not be relied upon for accuracy or
completeness, and no representations or warranties of accuracy or
completeness are made. In no event will Sanmina be liable for damages arising
directly or indirectly from any use of or reliance upon the information contained in
this document. Sanmina may make improvements or changes in the product(s)
and/or the program(s) described in this documentation at any time.
Sanmina, Viking Technology, Viking Modular Solutions, and Element logo are
trademarks of Sanmina Corporation. Other company, product or service names
mentioned herein may be trademarks or service marks of their respective
owners.

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Ordering Information: Slim SATA SSD Solid-State Drive
Part Number
Interface
User
GB
Temp
NAND
VPFEM1032GZCDMTL
SATA 6GB
32
(0 to +70'c)
TSB 15nm L-die, MLC
VPFEM1064GZCDMTL
SATA 6GB
64
(0 to +70'c)
TSB 15nm L-die, MLC
VPFEM1128GZCBMTL
SATA 6GB
128
(0 to +70'c)
TSB 15nm L-die, MLC
VPFEM1256GZCAMTL
SATA 6GB
256
(0 to +70'c)
TSB 15nm L-die, MLC
Notes:
Higher capacity points may be available based on customer application. Consult your local Viking Field Application
Engineer.
SSD’s ship unformatted from the factory unless otherwise requested.

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Product Picture(s)
Slim SATA

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Client/Industrial SSD’s –Viking’s Client/Industrial SSD contains sophisticated
provisions to protect firmware and data from corruption due to unexpected power
loss. However, an Industrial SSD by industry definition does not contain on-board
capacitance. Should power fail unexpectedly, “in-flight” write data may be lost.
Industrial SSD’s are best used in designs that manage power fail events at the
system level.

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Table of Contents
1INTRODUCTION 10
1.1 Features 10
1.2 Block Diagram 11
1.3 SATA Interface 12
2PRODUCT SPECIFICATIONS 13
2.1 Capacity and LBA count 13
2.2 Performance 13
2.3 Timing 14
2.3.1 STANDBY IMMEDIATE Command 14
2.4 Electrical Characteristics 15
2.4.1 Absolute Maximum Ratings 15
2.4.2 Supply Voltage 15
2.4.3 Power Consumption 16
2.5 Environmental Conditions 16
2.5.1 Temperature 16
2.5.2 Shock and Vibration 16
2.5.3 Electromagnetic Immunity 17
2.6 Reliability 17
3MECHANICAL INFORMATION 18
3.1 Slim SATA SSD Weight 19
4PIN AND SIGNAL DESCRIPTIONS 19
4.1 Pin Locations 19
4.2 Signal and Power Description Tables 19
4.3 Hot Plug Support 20
5COMMAND SETS 20

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5.1 ATA Commands 20
5.1.1 48-Bit Address Command Set 21
5.1.2 ATA General Feature Command Set 22
5.1.3 Device Configuration Overlay Command Set 22
5.1.4 General Purpose Log Command Set 22
5.1.5 Host Protected Area Command Set 22
5.1.6 Power Management Command Set 23
5.1.7 Security Mode Feature Set 23
5.1.8 Identify Device Data 24
5.1.1 S.M.A.R.T. Support 27
5.1.2 SATA 3.0 S.M.A.R.T. Command Set 28
5.2 SATA Commands 32
5.2.1 Native Command Queuing (NCQ) 32
6REFERENCES 32
7GLOSSARY 33

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Table of Tables
Table 2-1: Maximum Sustained Read and Write Bandwidth ____________________________ 13
Table 2-2: Random Read and Write Input/Output Operations per Second (IOPS) ___________ 14
Table 2-3: Timing Specifications _________________________________________________ 14
Table 2-4: STANDBY IMMEDIATE Timing _________________________________________ 14
Table 2-5: Absolute Maximum Ratings ____________________________________________ 15
Table 2-6: Operating Voltage ____________________________________________________ 15
Table 2-7: Typical Power Consumption ____________________________________________ 16
Table 2-8: Temperature and Altitude Related Specifications____________________________ 16
Table 2-9: Shock and Vibration Specifications_______________________________________ 17
Table 2-10: Reliability Specifications ______________________________________________ 17
Table 4-1: Serial ATA Connector Pin Signal Definitions _______________________________ 19
Table 4-2: Serial ATA Power Pin Definitions ________________________________________ 20
Table 5-1: Supported ATA Commands ____________________________________________ 20
Table 5-2: List of Device Identification _____________________________________________ 24
Table 5-3: S.M.A.R.T. Command Set______________________________________________ 28
Table 5-4: Extended SMART Attribute Table________________________________________ 28
Table 5-5: Extended SMART Attribute Actual Data ___________________________________ 29
Table 5-6: Supported S.M.A.R.T. EXECUTE OFF-LINE IMMEDIATE Subcommands ________ 31
Table of Figures
Figure 1-1: High-Level Block Diagram _____________________________________________ 11
Figure 3-1: Dimensions ________________________________________________________ 18
Figure 4-1: Layout of Signal and Power Segment Pins ________________________________ 19

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1 Introduction
Viking’s rugged industrial designed SSD’s offer the highest flash storage
reliability and performance in harsh environments such as shock, vibration,
humidity, altitude, ESD, and extreme temperatures.
1.1 Features
The SSD delivers the following features:
Offers seamless SATA Revision 3.0 interface support for SATA up to
6Gb/s
Low overall SSD power consumption
Supports Native Command Queuing (NCQ) to 32 commands
Compatible with all major SLC and MLC flash technologies
S.M.A.R.T.
Superior wear-leveling algorithm
Efficient error recovery
TRIM

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1.2 Block Diagram
Figure 1-1: High-Level Block Diagram
Notes:
1.Support for up to 2-channels and 2 CE in the NAND Flash interface
2
2

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1.3 SATA Interface
The Serial ATA (SATA) interface is compliant with the SATA IO Serial
ATA specification, revision 3.0 that supports SATA up to 6Gb/s.
The SATA interface connects the host computer to the SSD subsystem.
The SATA interface runs at a maximum speed of 6 Gbps (Giga-bits per
second). If the host computer is unable to negotiate a speed of 6 Gbps,
the SATA interface automatically renegotiates to a speed of 3 Gbps or 1.5
Gbps.
For a list of supported commands and other specifics, please see Chapter 5.

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2 Product Specifications
2.1 Capacity and LBA count
Raw Capacity
(GB)
User Capacity
(GB)
LBA Count
16
14
27,370,224
16
16
31,277,232
32
30
58,626,288
32
32
62,533,296
64
60
117,231,408
64
64
125,045,424
128
120
234,441,648
128
128
250,069,680
256
240
468,862,128
256
256
500,118,192
Notes:
1. Per LBA1-03 spec, LBA counts = (97,696,368) + (1,953,504 * (Advertised Capacity in GBytes –50))
2.2 Performance
Table 2-1: Maximum Sustained Read and Write Bandwidth
Capacity
Flash Structure
Performance
CrystalDiskMark
ATTO
Read
Write
Read
Write
(MB/s)
(MB/s)
(MB/s)
(MB/s)
30/32GB
32GBx1, BGA, TSB 15nm
560
165
560
540
60/64GB
32GBx2, BGA, TSB 15nm
560
315
560
540
120/128GB
64GBx2, BGA, TSB 15nm
560
465
560
540
240/256GB
128GBx2, BGA, TSB 15nm
560
465
560
540
480/512GB
256GBx2, BGA, TSB 15nm
560
465
560
540
Notes:
1.Performance measured using CrystalDiskMark.
2.Performance may vary from flash configuration, SDR configuration, and platform.
3.Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology.
4.Data is based on SSD’s using Toshiba A15nm Toggle NAND devices

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Table 2-2: Random Read and Write Input/Output Operations per Second
(IOPS)
Access Type
IOPS
Read, 4K
TBD
Write, 4K
TBD
Notes:
1. Performance measured using Iometer 08 with queue depth set to 32.
2. Write Cache enabled with DDR cache.
3. Random IOPS cover the entire range of legal logical block addresses (LBA’s). Measurements are
performed on a full drive (all LBA’s have valid content).
4. Performance may vary by NAND type and host.
5. Refer to Application Note AN0006 for Viking SSD Benchmarking Methodology.
6. Data is based on SSD’s using Toshiba A19nm NAND devices
2.3 Timing
Table 2-3: Timing Specifications
Type
Average Latency
Power-On-to-Ready (POR)
TBD
Command to DRQ
TBD
Time to Erase (ATA Secure Erase)
TBD
Notes:
1. Device measured using Drivemaster.
2. Sector Read/Write latency measured up to 2048 block transfers (512B/sector = 1 Block)
3. Queue depth set to 32 for NCQ
4. Sequential IOPS cover the entire range of legal logical block addresses (LBA’s). Measurements are
performed on a full drive (all LBA’s have valid content
5. DRQ (Data Transfer Requested) bit being asserted
2.3.1 STANDBY IMMEDIATE Command
The Power-On-to-Ready time assumes a proper shutdown (power removal
preceded by STANDBY IMMEDIATE command. A STANDBY IMMEDIATE
before power down always performs a graceful shutdown and does not require
the use of the hold-up circuit. Note that SMART attribute 174 "Unexpected Power
Loss" records the number of non-graceful power cycle events.
Table 2-4: STANDBY IMMEDIATE Timing
Power Cycle Endurance
Min
Max
Unit
STANDBY IMMEDIATE to WE completed
-
72.9
ms
Notes: From Standby Immediate command to NAND Write Protect enable.

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2.4 Electrical Characteristics
2.4.1 Absolute Maximum Ratings
Values shown are stress ratings only. Functional operation outside normal
operating values is not implied. Extended exposure to absolute maximum ratings
may affect reliability.
Table 2-5: Absolute Maximum Ratings
Description
Min
Max
Unit
Maximum Voltage Range for Vin
-0.2
6
V
Maximum Commercial Temperature Range
0
70
c
Maximum Industrial Temperature Range
-40
85
c
2.4.2 Supply Voltage
The operating voltage is 5.0v
Table 2-6: Operating Voltage
Description
Min
Max
Unit
Operating Voltage
- 5%
+5%
V

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2.4.3 Power Consumption
All onboard power requirements of the SSD are derived from the 5.0V input rail.
Table 2-7: Typical Power Consumption
Capacity
Flash Structure
Power Consumption
Read
Write
Devslp
(mW)
(mW)
(mW)
30/32GB
32GBx1, BGA, TSB 15nm
1,030
1,210
4.9
60/64GB
32GBx2, BGA, TSB 15nm
1,040
1,215
4.9
120/128GB
64GBx2, BGA, TSB 15nm
1,065
1,480
4.9
240/256GB
128GBx2, BGA, TSB 15nm
1,165
1,535
4.9
480/512GB
256GBx2, BGA, TSB 15nm
1,425
1,740
4.9
Notes:
1. Unit: mW
2. The average value of power consumption is achieved based on 100% conversion efficiency.
3. The measured power voltage is 5V.
4. Samples were built using Toshiba 15nm Toggle MLC, Micron L85A ONFI flash, Micron L95B ONFI flash.
It’s measured under ambient temperature.
5. Sequential R/W is measured while testing 400MB sequential R/W 5 times by CrystalDiskMark. DEVSLP is
measured while entering device sleep mode for 5 minutes.
6. Power Consumption may differ according to flash configuration, SDR configuration, and platform.
2.5 Environmental Conditions
2.5.1 Temperature
Table 2-8: Temperature and Altitude Related Specifications
Conditions
Operating
Shipping
Storage
Commercial
Temperature- Ambient
0 to 70°C
-40 to 85°C
-40 to 85°C
Industrial
Temperature- Ambient
-40 to 85°C
-40 to 85°C
-40 to 85°C
Humidity (non-
condensing)
90% under 40C
93% under 40C
93% under 40C
Notes:
1. SLC flash based products may be available in the following temperature ranges:
2.5.2 Shock and Vibration
SSD products are tested in accordance with environmental specification for
shock and vibration

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Table 2-9: Shock and Vibration Specifications
Stimulus
Description
Shock
Acceleration Force: 1500G
Half Sin Pulse Duration: 0.5ms
Vibration
Frequency/Displacement: 20Hz~80Hz/1.52mm
Frequency/Acceleration: 80Hz~2000Hz/20G
X, Y, Z axis/60 min for each
2.5.3 Electromagnetic Immunity
Slim SATA is an embedded product for host systems and is designed not to
impair with system functionality or hinder system EMI/FCC compliance.
2.6 Reliability
Table 2-10: Reliability Specifications
Parameter
Description
MTBF
Over 2,000,000 hours
ECC
72-bit per 1KByte
Read
Endurance
Unlimited
Write
Endurance
32GB
64GB
128GB
256GB
512GB
45 TBW
90 TBW
181 TBW
262 TBW
544 TBW
Data retention
> 90 days at NAND expiration
NOTES:
1. Samples were built using Toshiba 15nm Toggle MLC NAND.
2. TBW may differ according to flash configuration and platform.
3. The endurance of SSD could be estimated based on user behavior, NAND endurance cycles,
and write amplification factor. It is not guaranteed by flash vendor
4. TBW=(GB capacity x DWPD x 365 x years)/1000

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3 Mechanical Information
Raw Capacity (GB)
Height (mm)
Width (mm)
Length (mm)
32 to 256
4.00 max
54 ± 0.15
39 ± 0.15
Figure 3-1: Dimensions
Notes:
All dimensions are in inches [millimeters].
Dimensional tolerance of ± 0.15 millimeters, unless otherwise stated
Refer to JEDEC MO-297 document for details
Max
[39 ± 0.15mm]

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3.1 Slim SATA SSD Weight
The weight of a Slim SATA (MO-297) SSD is approximately 8.0 grams.
4 Pin and Signal Descriptions
4.1 Pin Locations
Figure 4-1: Layout of Signal and Power Segment Pins
Signal Segment S1 Power Segment P1
4.2 Signal and Power Description Tables
Table 4-1: Serial ATA Connector Pin Signal Definitions
Pin
Function
Definition
Mating Order
S1
SGND_1
Signal Ground
1st
S2
RX+ on SSD, TX+ on Host
Differential Signal
2nd
S3
RX- on SSD, TX- on Host
Differential Signal
2nd
S4
SGND_2
Signal Ground
1st
S5
TX- on SSD, RX- on Host
Differential Signal
2nd
S6
TX+ on SSD, RX+ on Host
Differential Signal
2nd
S7
SGND_3
Signal Ground
1st
Notes: Key and spacing separate signal and power segments. Pin locations and layout are consistent with
SATA specification.

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Table 4-2: Serial ATA Power Pin Definitions
Pin
Function
Definition
Mating Order
P1
3.3V_1
3.3VDC Power (See note2)
2nd
P2
3.3V_2
3.3VDC Power (See note2)
2nd
P3
DEVSLP
DEVSLP
1st
P4
GND_1
Ground
1st
P5
GND_2
Ground
1st
P6
GND_3
Ground
1st
P7
5V_1
5VDC Power (pre-charge)
1st
P8
5V_2
5VDC Power
2nd
P9
5V_3
5VDC Power
2nd
P10
GND_4
Ground
1st
P11
Reserved
No connection (See note1)
2nd
P12
GND_5
Ground
1st
P13
12V_1
No connection
1st
P14
12V_2
No connection
2nd
P15
12V_3
No connection
2nd
Notes:
1. Reserved. (was intended for Device Activity Signal) and remote LED application. The LED should to be
tied high thru a current limiting resistor on the host side. If a Remote LED is not implemented, pin 11 may
be connected to GND to allow the ACTIVITY LED to remain on to indicate a Power On condition when
using a standard ATX type power supply.
2. 3.3 volt is No connection (NC)
4.3 Hot Plug Support
Hot Plug insertion and removal are supported in the presence of a proper
connector and appropriate operating system (OS) support as described in the
SATA 2.6 specification. This product supports Asynchronous Signal Recovery
and will issue an unsolicited COMINIT when first mated with a powered
connector to guarantee reliable detection by a host system without hardware
device detection.
5 Command Sets
5.1 ATA Commands
Table 5-1: Supported ATA Commands
Description
Op
Code
Description
Op
Code
Check power mode
E5h
Security Disable Password
F6h
Data Set management
06h
Security Erase Prepare
F3h