Vincotech flowSCREW4w User manual

flowSCREW 4w packages
Copyright Vincotech
Handling Instruction
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Handling Instructions
for all flowSCREW 4w module housing types:
flowSCREW4w, 2xflowSCREW4w, 3xflowSCREW4w

flowSCREW 4w packages
Copyright Vincotech
Handling Instruction
03
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Table of contents:
1General remarks.........................................................................................................................................................4
2Specification for the driver PCB ..................................................................................................................................5
2.1 PCB assembly with press-fit technology ........................................................................................................................6
2.2 PCB assembly with soldered Press-fit pin modules........................................................................................................6
3Base plate surface specification..................................................................................................................................6
4Heatsink specification ................................................................................................................................................8
5Thermal grease specification ......................................................................................................................................8
5.1 Option 1: Uniform layer of thermal paste .....................................................................................................................8
5.2 Option 2: Module with pre-applied thermal phase change material ............................................................................8
6Screw and torque specifications for fastening the module to the heatsink.................................................................9
7Screw specification for fastening main terminals to bus bars ...................................................................................11
8flowSCREW 4w modules in parallel mode ................................................................................................................11
8.1 Mounting the M4 hex nut-holder for side connection.................................................................................................11
8.2 Interconn PCB ..............................................................................................................................................................12
9Press-fitting ..............................................................................................................................................................13
9.1 Press-in setup ..............................................................................................................................................................13
9.1.1 Press-in tool .......................................................................................................................................................14
9.1.2 Support plate .....................................................................................................................................................14
9.2 Press-fitting parameters ..............................................................................................................................................14
9.2.1 Basic requirements for press-fitting ..................................................................................................................15
9.3 Process control parameters .........................................................................................................................................15
9.4 Disassembling a driver PCB .........................................................................................................................................16
10 Recommendation for soldering ................................................................................................................................17
10.1 Wave soldering modules with solder pins ..............................................................................................................17
10.2 Hand soldering parameters ....................................................................................................................................18
11 Accessories and application support ........................................................................................................................18
12 ESD protection..........................................................................................................................................................18
13 Disclaimer ................................................................................................................................................................18

flowSCREW 4w packages
Copyright Vincotech
Handling Instruction
03
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Table of figures:
Figure 1: Module with driver PCB and heatsink...................................................................................................4
Figure 2: Height of the pinhead's center line from the bottom of the base plate .............................................5
Figure 3: Recommended hole and cutout sizes on the driver PCB ...................................................................5
Figure 4: Scratch and etching hole dimensions ..................................................................................................7
Figure 5: Polished surface...................................................................................................................................... 7
Figure 6: Surface discoloration.............................................................................................................................. 7
Figure 7: Fingerprint on the surface...................................................................................................................... 8
Figure 8: Thermal paste in a honeycomb pattern ....................................................Error! Bookmark not defined.
Figure 9: Screws positions in sequence.............................................................................................................10
Figure 10: Mounting an M4 hex nut holder ......................................................................................................... 11
Figure 11: Interconn PCB...................................................................................................................................... 12
Figure 12: Recommended setup for press-fitting .............................................................................................. 13
Figure 13: Recommended dimensions for the press-in tool............................................................................. 14
Figure 14: Press-in depth in a PCB......................................................................................................................15
Figure 15: Diagram of a typical press-fitted 20-pin module..............................................................................16
Figure 16: Cutting edge......................................................................................................................................... 16
Figure 17: Plated through hole, well soldered.................................................................................................... 17
Figure 18: Typical profile for wave soldering.....................................................................................................17

flowSCREW 4w packages
Copyright Vincotech
Handling Instruction
03
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1 General remarks
Figure 1 shows the basic structure of the flowSCREW 4w type module. It attaches to a
heatsink with the driver PCB to be mounted on the top of the module. Electrical connections
between the module and driver PCB are soldered or press-fitted. Fasten main terminals to bus
bars using the screw types specified in section 7. The hex nut holders shown in Figure 1 are
used for applications where modules operate in multiphase systems or in parallel. An optional
connector PCB is available on demand for such applications. See section 9 for details.
Figure 1: Module with driver PCB and heatsink

flowSCREW 4w packages
Copyright Vincotech
Handling Instruction
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The distance between the top of the heatsink and the center plane of the driver PCB is
20.68±0.2 mm centered on the pinhead as shown in Figure 2.
Figure 2: Height of the pinhead's center line from the bottom of the base plate
During PCB assembly, do not pull or push auxiliary press-fit or soldered pins more than ±0.2
mm, nor exert a force greater than 35 N except when press-fitting pins. Press-fit pins are
designed to prevent pin deformations greater than 0.1 mm when they are pressed in.
After mounting, pin tension may not exceed ±5 N at a maximum substrate temperature of
100 C.
2 Specification for the driver PCB
Printed board material must comply with IEC 61249-2-7.
There is no limit as to the maximum number of conductive layers.
The driver PCB attaches to the module with four type BN82428 (screws D=2.5 mm and
L=6mm). The recommended mounting torque is 0.4Nm. Figure 3 shows the recommended
holes and cutouts on the driver PCB.
Figure 3: Recommended hole and
cutout sizes on the driver PCB

flowSCREW 4w packages
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Handling Instruction
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2.1 PCB assembly with press-fit technology
The driver PCB may be screwed to the module after press-fitting. This is recommended
if there are cable connectors or plugs on the PCB.
The driver PCB may be no less than 1.6 mm thick.
The PCB is to be covered with solder mask on both sides.
The plated through-hole specification for press-fit pins is as follows:
oHole size prior to plating: 1.6 +/-0.025 mm
oThickness of the PTH wall > 25 μm Cu
oThe plated hole's final size: 1.45 +0.09 / -0.06 mm
oMinimum Cu width of the annular ring > 0.1 mm
Plating material:
oSn: 0.5 µm – 10 µm
The PCB may be disassembled and reused twice.
oAu: 0.05 –0.2 μm over 2.5 –5 μm Ni.
The PCB may be used once only!
(Any other kind of plating needs to be tested.)
Minimum distance between the edge of the PCB and center of the pinhole: 4 mm
Minimum distance between the center of the pinhole and the component on the PCB: 4
mm
2.2 PCB assembly with soldered Press-fit pin modules
The recommended PCB hole diameter is 1.85 ± 0.1 mm for Press-fit pins that are to be
soldered rather than press-fitted. Note that the annular ring has to be designed to the
standards for through-hole components.
For more on this, please read section 11, Recommendation for soldering.
3 Base plate surface specification
The mounted module's thermal properties will not be affected by surface imperfections if the
following rules are observed:
The entire nickel plated surface may be polished (see Figure 5) provided that the
copper is not exposed.
A module is deemed to be scratched when the base plate copper is visible. The
scratch's depth and width may not exceed 200 μm and 800 μm. The length is
undefined, but the total area of scratches may not exceed 5% of the overall substrate
surface.
The diameter and depth of etching holes must be less than 1000 μm and 200 μm as
shown in Figure 4.
Discolorations and fingerprints on the base plate are merely surface imperfections and do not
adversely affect the module's functions (see Figures 6 and 7).

flowSCREW 4w packages
Copyright Vincotech
Handling Instruction
03
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Figure 4: Scratch and etching hole dimensions
Figure 5: Polished surface
Figure 6: Surface discoloration

flowSCREW 4w packages
Copyright Vincotech
Handling Instruction
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Figure 7: Fingerprint on the surface
4 Heatsink specification
The heatsink's surface below the module must be plane, clean and free of particles.
Its flatness must be < 0.025 mm.
Surface roughness is to be less than Rz = 0.01 mm.
5 Thermal grease specification
The recommended means of applying paste is screen printing. Thermal resistance (Rth)
increases if the paste is thicker than recommended. Modules are also available with phase
change material (option -/2/), whereby the Rthc-h is guaranteed, provided that the heatsink
specification remains unchanged.
5.1 Option 1: Uniform layer of thermal paste
Apply a uniform layer of thermal conductive paste with 0.110 ±0.015 mm thickness, fully
covered the bottom of the module.
5.2 Option 2: Module with pre-applied thermal phase change material
flowSCREW 4w modules family is offered with pre-applied phase change material as well.
(bottom surface of the module under the active area is covered with a honeycomb pattern).
In order to receive flowSCREW 4w products with applied phase change material please write:
-/3/
at the end of the product ordering code.
Ordering example:
70-W212NMA600SC-M200P-/3/

flowSCREW 4w packages
Copyright Vincotech
Handling Instruction
03
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6 Screw and torque specifications for fastening the module to the
heatsink
M5 screws (The recommended screw type is DIN 7984.)
Flat washer: D = max. 10 mm, ISO 7092 (DIN 433)
Spring washer: D = max. 10 mm, DIN127 or DIN 128
Mounting torque: 4 Nm < Ma < 6Nm
Thread length into the heatsink: min. 9 mm (depending on the material properties of the
heatsink and screw)
Tighten screws in the sequence given below and shown in Figure 9:
1) Attach the module loosely with two diagonal screws, e.g. 1&3, 1&4 or 1&5.
2) Tighten screws with 0.5 Nm torque in the following sequence:
flowSCREW4w: screw 1 –4 –2 –3
2x flowSCREW4w: screw 2 –5 –1 –6 –3 –4
3x flowSCREW4w: screw 2 –7 –3 –6 –1 –8 –4 –5
3) Tighten the screws with 5 Nm torque in the same sequence.

flowSCREW 4w packages
Copyright Vincotech
Handling Instruction
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Figure 8: Screws positions in sequence