XIMEA xiX MX023MG-SY-X2G2 User manual

xiX
[ksi-x: or sai-ex:]
•PCI Express cameras for integration
Technical Manual
Version 1.3, August, 2018

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1. Introduction
1.1. About This Manual
Dear customer,
Thank you for purchasing a product from XIMEA.
We hope that this manual can answer your questions, but should you have any further questions or if you wish to claim a
service or warranty case, please contact your local dealer or refer toXIMEA Support on our website: www.ximea.com/support
The purpose of this document is toprovide a description of the XIMEA xiX-Series cameras and to describe the correct way to
install related software anddrivers and run it successfully. Please read thismanual thoroughly before operating your new
camera for the first time. Please follow all instructions and observe the warnings.
Thisdocument is subject to change without notice.
1.2. About XIMEA
XIMEA is one of the worldwide leaders for innovative camera solutions with a 20-year history of research, development and
production of digital imageacquisition systems. Based in Slovakia, Germany and the US and with a global distributor network,
XIMEA offers their cameras worldwide. In close collaboration with customers XIMEA has developed a broad spectrum of
technologies and cutting-edge, highly competitive products.
XIMEA's camera centric technology portfolio comprises a broad spectrum of digital technologies, from data interfaces such as
PCI express, USB 2.0, 3.0 and USB 3.1, to cooled digital cameras with CCD and CMOS sensors, as well as X-ray cameras.
XIMEAhas threedivisions – generic machine vision and integratedvision systems, scientific imaging and OEM/custom.
XIMEA cameras find usein many industrial applications, such asmotion control, robotics, or quality control in manufacturing.
The broad spectrum of cameras also includes thermally stabilized X-ray cameras, and specialty cameras for medical
applications, research, surveillance and defense.
1.2.1. Contact XIMEA
XIMEA is a worldwide operating Company
Headquarters, Sales worldwide
XIMEA GmbH
Am Mittelhafen 16
48155 Münster
Germany
Tel: [phone]
Fax: [phone]
Sales America
XIMEA Corp.
8725 W 14th Ave, Ste 110
Lakewood, CO 80215
USA
Tel: [phone]
Fax: [phone]
R&D, Production
XIMEA s.r.o.
Lesna 52
900 33 Marianka
Slovakia
Internet www.ximea.com
General inquiries [e-mail]
Sales [e-mail]
Support [e-mail]

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1.3. Standard Conformity
The xiX cameras have been testedusing the followingequipment:
•List equipment: To be added
1.3.1. CE Conformity
To be added
1.3.2. For customers in the US: FCC Conformity
To be added
1.3.3. For customers in Canada
The xiX cameras comply with the ClassA limits for radio noise emissions set out in Radio Interference Regulations.

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1.3.4. RoHS Conformity
The xiX cameras comply with the requirements of the RoHS (Restriction of Hazardous Substances)Directive 2011/65/EU.
1.3.5. WEEE Conformity
The xiX cameras comply with therequirements of the WEEE (waste electrical and electronic equipment) Directive 2003/108/EC.
1.3.6. GenICam GenTL API
GenICam standard transport layer interface, grabbing images. GenICam/GenTL provides an agnostic transport layer interface
to acquire images or otherdata and to communicate with a device. Each XIMEA camera can be GenTL Producer.
1.4. Helpful Links
•XIMEA Homepage http://www.ximea.com/
•PCIe zone https://www.ximea.com/en/pci-express-camera/pcie-camera-zone
•xiAPI stable versions download https://www.ximea.com/support/documents/4
•xiAPI beta versions download https://www.ximea.com/support/documents/14
•Frequently Asked Questions http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions
•Knowledge Base http://www.ximea.com/support/wiki/allprod/Knowledge_Base
•Vision Libraries http://www.ximea.com/support/projects/vision-libraries/wiki
•XIMEA Registration http://www.ximea.com/en/products/register
•XIMEA Live Support http://www.ximea.com/support/wiki/allprod/XIMEA_Live_Support
•XIMEA General Terms& Conditions http://www.ximea.com/en/corporate/generaltc

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1.5. Table of Contents
1. Introduction................................................................................................................................................................2
1.1. About This Manual.............................................................................................................................................2
1.2. About XIMEA.....................................................................................................................................................2
1.2.1. Contact XIMEA..........................................................................................................................................2
1.3. Standard Conformity..........................................................................................................................................3
1.3.1. CE Conformity...........................................................................................................................................3
1.3.2. For customers in the US: FCCConformity...................................................................................................3
1.3.3. For customers in Canada...........................................................................................................................3
1.3.4. RoHS Conformity.......................................................................................................................................4
1.3.5. WEEE Conformity......................................................................................................................................4
1.3.6. GenICam GenTL API..................................................................................................................................4
1.4. Helpful Links......................................................................................................................................................4
1.5. Table of Contents...............................................................................................................................................5
2. xiX Camera Series ....................................................................................................................................................11
2.1. What is xiX......................................................................................................................................................11
2.2. Advantages.....................................................................................................................................................11
2.3. PCI Express Vision Camera Applications............................................................................................................12
2.4. Common features............................................................................................................................................12
2.5. What is xSWITCH.............................................................................................................................................13
2.5.1. xSWITCH examples.................................................................................................................................15
2.6. Model Nomenclature........................................................................................................................................16
2.7. Models Overview, sensor and models................................................................................................................17
2.8. Accessories.....................................................................................................................................................18
3. Hardware Specification.............................................................................................................................................19
3.1. Power Supply..................................................................................................................................................19
3.2. General Specification.......................................................................................................................................19
3.2.1. Environment...........................................................................................................................................19
3.2.2. Firmware / Host driver / API features........................................................................................................19
3.3. Mounting points...............................................................................................................................................20
3.4. Lens Mount.....................................................................................................................................................21
3.4.1. Screws...................................................................................................................................................22
3.5. Optical path.....................................................................................................................................................23
3.5.1. Filter glasses..........................................................................................................................................23
3.5.2. Monochrome and near infrared extended camera models (MX X2G2 models only)......................................23
3.5.3. Color camera models (MXX2G2 models only)...........................................................................................24
3.6. Model Specific Characteristics..........................................................................................................................25
3.6.1. MX023xG-SY-X2G2-Fx............................................................................................................................25
3.6.1.1. Sensor and camera parameters......................................................................................................25
3.6.1.2. Quantum efficiency curves [%]........................................................................................................26
3.6.1.3. Drawings MX023xG-SY-X2G2-FL (C-mount [with C/CS mount module B]).........................................27
3.6.1.4. Drawings MX023xG-SY-X2G2-FV (C-mount [with C/CS mount module B]).........................................27
3.6.1.5. Referenced documents...................................................................................................................28
3.6.1.6. Sensor features..............................................................................................................................28
3.6.2. MX031xG-SY-X2G2-Fx............................................................................................................................29
3.6.2.1. Sensor and camera parameters......................................................................................................29

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3.6.2.2. Quantum efficiency curves [%]........................................................................................................30
3.6.2.3. Drawings MX031xG-SY-X2G2-FL (C-mount [with C/CS mount module B]).........................................31
3.6.2.4. Drawings MX031xG-SY-X2G2-FV (C-mount [with C/CS mount module B]).........................................31
3.6.2.5. Referenced documents...................................................................................................................32
3.6.2.6. Sensor features..............................................................................................................................32
3.6.3. MX050xG-SY-X2G2-Fx............................................................................................................................33
3.6.3.1. Sensor and camera parameters......................................................................................................33
3.6.3.2. Quantum efficiency curves [%]........................................................................................................34
3.6.3.3. Drawings MX050xG-SY-X2G2-FL (C-mount [with C/CS mount module B]).........................................35
3.6.3.4. Drawings MX050xG-SY-X2G2-FV (C-mount [with C/CS mount module B]).........................................35
3.6.3.5. Referenced documents...................................................................................................................36
3.6.3.6. Sensor features..............................................................................................................................36
3.6.4. MX089xG-SY-X2G2-Fx............................................................................................................................37
3.6.4.1. Sensor and camera parameters......................................................................................................37
3.6.4.2. Quantum efficiency curves [%]........................................................................................................38
3.6.4.3. Drawings MX089xG-SY-X2G2-FL (C-mount [with C/CS mount module B]).........................................39
3.6.4.4. Drawings MX089xG-SY-X2G2-FV (C-mount [with C/CS mount module B]).........................................39
3.6.4.5. Referenced documents...................................................................................................................40
3.6.4.6. Sensor features..............................................................................................................................40
3.6.5. MX124xG-SY-X2G2-Fx............................................................................................................................41
3.6.5.1. Sensor and camera parameters......................................................................................................41
3.6.5.2. Quantum efficiency curves [%]........................................................................................................42
3.6.5.3. Drawings MX124xG-SY-X2G2-FL (C-mount [with C mount module B]) ..............................................43
3.6.5.4. Drawings MX124xG-SY-X2G2-FV (C-mount [with C mount module B])..............................................43
3.6.5.5. Referenced documents...................................................................................................................44
3.6.5.6. Sensor features..............................................................................................................................44
3.6.6. MX120xG-CM-X4G2-Fx..........................................................................................................................45
3.6.6.1. Sensor and camera parameters......................................................................................................45
3.6.6.2. Quantum efficiency curves [%]........................................................................................................46
3.6.6.3. Drawings MX120xG-CM-X4G2-FL...................................................................................................47
3.6.6.4. Drawings MX120xG-CM-X4G2-FV..................................................................................................47
3.6.6.5. Referenced documents...................................................................................................................48
3.6.6.6. Sensor features..............................................................................................................................48
3.6.7. MX200xG-CM-X4G2-Fx..........................................................................................................................49
3.6.7.1. Sensor and camera parameters......................................................................................................49
3.6.7.2. Quantum efficiency curves [%]........................................................................................................50
3.6.7.3. Drawings MX200xG-CM-X4G2-FL...................................................................................................51
3.6.7.4. Drawings MX200xG-CM-X4G2-FV..................................................................................................51
3.6.7.5. Referenced documents...................................................................................................................52
3.6.7.6. Sensor features..............................................................................................................................52
3.6.8. MX500xG-CM-X4G2-Fx..........................................................................................................................53
3.6.8.1. Sensor and camera parameters......................................................................................................53
3.6.8.2. Quantum efficiency curves [%]........................................................................................................54
3.6.8.3. Drawings MX500xG-CM-X4G2-FL...................................................................................................55
3.6.8.4. Drawings MX500xG-CM-X4G2-FV..................................................................................................55
3.6.8.5. Referenced documents...................................................................................................................56

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3.6.8.6. Sensor features..............................................................................................................................56
3.7. User interface – LEDs......................................................................................................................................57
3.8. xiX X2G2 Interface connector............................................................................................................................58
3.8.1. Interface connector location.....................................................................................................................58
3.8.2. Pinning...................................................................................................................................................58
3.8.3. Inserting / detaching FPC cable................................................................................................................59
3.9. xiX X4G2 Interface connector............................................................................................................................62
3.9.1. Interface connector location.....................................................................................................................62
3.9.2. Pinning...................................................................................................................................................62
3.9.3. Inserting / detaching FFC cable................................................................................................................64
3.10. xiX Digital Input / Output (GPIO) Interface...........................................................................................................66
3.10.1. Optically isolated Digital Input..................................................................................................................66
3.10.1.1. Digital Input – signal levels.............................................................................................................66
3.10.1.2. Digital Input – Internal Schematic....................................................................................................67
3.10.1.3. Digital Input – Wiring......................................................................................................................67
3.10.1.4. Digital Input – Timing.....................................................................................................................68
3.10.2. Optically isolated Digital Output................................................................................................................68
3.10.2.1. Optically isolated Digital Output - General info..................................................................................68
3.10.2.2. Optically isolated Digital Output Delay..............................................................................................68
3.10.2.3. Optically isolated Digital Output – Internal schematic........................................................................69
3.10.2.4. Digital Output – Wiring...................................................................................................................69
3.10.2.5. Digital Output – Timing...................................................................................................................74
3.10.3. Non-isolated Digital Lines........................................................................................................................75
3.10.3.1. Non-isolated Digital Input/Output (INOUT)General info......................................................................75
3.11. Heat Dissipation...............................................................................................................................................76
3.12. CBL-MX-X2G2-0M07/ CBL-MX-X2G2-0M10/ CBL-MX-X2G2-0M25/ CBL-MX-X2G2-0M50................................76
3.13. CBL-MX-X4G2-0M10 / CBL-MX-X4G2-0M25 / CBL-MX-X4G2-0M50................................................................76
3.14. MX camera adapters........................................................................................................................................77
3.15. Tripod Adapter.................................................................................................................................................78
3.15.1. Tripod Adapter MX X2G2 (MECH-MC-BRACKET-KIT).................................................................................78
3.15.2. Drawings................................................................................................................................................78
3.15.3. Tripod Adapter MX X4G2.........................................................................................................................79
3.15.4. Drawings................................................................................................................................................79
3.16. xiX X4G2 Lens adapter – MECH-60MM-EF-ADAPTER........................................................................................80
4. Operation.................................................................................................................................................................81
4.1. System Requirements......................................................................................................................................81
4.1.1. Software Requirements...........................................................................................................................81
4.1.2. Hardware Requirements..........................................................................................................................81
4.1.2.1. System Configuration.....................................................................................................................81
4.2. Video Formats.................................................................................................................................................83
4.2.1. Full Resolution........................................................................................................................................83
4.2.2. ROIs – Region Of Interest........................................................................................................................83
4.2.3. Downsampling Modes.............................................................................................................................83
4.2.3.1. Binning..........................................................................................................................................83
4.2.3.2. Skipping........................................................................................................................................83
4.2.4. Image Data Output Formats.....................................................................................................................84

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4.2.5. Digitization bit depth................................................................................................................................85
4.3. Acquisition modes............................................................................................................................................86
4.3.1. Free-Run................................................................................................................................................86
4.3.2. Triggered Acquisition ..............................................................................................................................86
4.3.2.1. Software Trigger............................................................................................................................86
4.3.2.2. Hardware Trigger...........................................................................................................................86
4.3.2.3. Triggered acquisition - single frame................................................................................................87
4.3.2.4. Triggered acquisition - burst of frames............................................................................................88
4.3.2.5. Exposure defined by trigger pulse length..........................................................................................88
4.3.2.6. Multiple exposures in one frame......................................................................................................89
4.4. Camera Parameters and Features.....................................................................................................................90
4.4.1. Exposure Time........................................................................................................................................90
4.4.2. Gain.......................................................................................................................................................90
4.5. Host-Assisted Image Processing Parameters Available in xiAPI...........................................................................90
4.5.1. Auto Exposure – Auto Gain......................................................................................................................90
4.5.2. White Balance........................................................................................................................................90
4.5.2.1. Assisted Manual White Balance......................................................................................................90
4.5.2.2. Auto White Balance........................................................................................................................90
4.5.3. Gamma..................................................................................................................................................90
4.5.4. Sharpness..............................................................................................................................................90
4.5.5. Color Correction Matrix............................................................................................................................91
4.5.6. Sensor Defect Correction.........................................................................................................................91
4.5.7. HDR.......................................................................................................................................................92
5. Software..................................................................................................................................................................95
5.1. Accessing the Camera.....................................................................................................................................95
5.1.1. Proprietary API........................................................................................................................................95
5.1.2. Standard Interface..................................................................................................................................95
5.1.2.1. GenICam.......................................................................................................................................95
5.1.3. Vision Library Integration.........................................................................................................................95
5.2. XIMEA CamTool...............................................................................................................................................96
5.3. Supported Vision Libraries................................................................................................................................98
5.3.1. Libraries maintained by XIMEA.................................................................................................................98
5.3.1.1. MathWorks MATLAB......................................................................................................................98
5.3.1.2. MVTec HALCON.............................................................................................................................98
5.3.1.3. National Instruments LabVIEW Vision Library....................................................................................98
5.3.1.4. OpenCV.........................................................................................................................................98
5.4. XIMEA Windows Software Package...................................................................................................................99
5.4.1. Contents.................................................................................................................................................99
5.4.2. Installation..............................................................................................................................................99
5.5. XIMEA Linux Software Package.......................................................................................................................102
5.5.1. Contents...............................................................................................................................................102
5.5.2. Installation............................................................................................................................................102
5.6. XIMEA macOS Software Package....................................................................................................................104
5.6.1. Contents...............................................................................................................................................104
5.6.2. Installation............................................................................................................................................104
5.6.3. Start XIMEA CamTool............................................................................................................................105

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5.7. Programming.................................................................................................................................................106
5.7.1. XIMEA APIs...........................................................................................................................................106
5.7.2. xiAPI Overview......................................................................................................................................106
5.7.3. xiAPI Functions Description....................................................................................................................106
5.7.4. xiAPI Parameters Description.................................................................................................................107
5.7.5. xiAPI Examples.....................................................................................................................................107
5.7.5.1. Connect Device............................................................................................................................107
5.7.5.2. Parameterize Device.....................................................................................................................107
5.7.5.3. Acquire Images............................................................................................................................108
5.7.5.4. Control Digital Input / Output (GPIO)...............................................................................................108
5.7.6. xiAPI Auto Bandwidth Calculation...........................................................................................................109
5.7.7. GenICam..............................................................................................................................................109
5.8. XIMEA Control Panel......................................................................................................................................110
6. Appendix................................................................................................................................................................111
6.1. Troubleshooting and Support..........................................................................................................................111
6.1.1. Worldwide Support................................................................................................................................111
6.1.2. Before Contacting Technical Support......................................................................................................111
6.1.3. Frequently Asked Questions...................................................................................................................111
6.1.3.1. What is PCIe Gen2?.....................................................................................................................111
6.1.3.2. What is the real transfer speed?....................................................................................................112
6.1.3.3. Why can I not achieve maximum transfer speed?...........................................................................112
6.1.3.4. What voltage should beapplied to Digital Input of xiXto turn it on/off?.............................................112
6.1.3.5. What is the implementation of Digital Output (VDO) of xiX? .............................................................112
6.2. Product service request (PSR).........................................................................................................................113
6.2.1. Step 1 - Contact Support.......................................................................................................................113
6.2.2. Step 2 - Create Product Service Request (PSR).......................................................................................113
6.2.3. Step 3 - Wait for PSR Approval..............................................................................................................113
6.2.4. Step 4 - Sending the camera to XIMEA...................................................................................................113
6.2.5. Step 5 - Waiting for Service Conclusion..................................................................................................113
6.2.6. STEP 6 - Waiting for return delivery........................................................................................................113
6.3. Safety instructions and precautions.................................................................................................................114
6.3.1. Disassembling......................................................................................................................................114
6.3.2. Mounting / Screwing.............................................................................................................................114
6.3.3. Connections.........................................................................................................................................114
6.3.4. Power supply........................................................................................................................................114
6.3.5. Environment / protect against water.......................................................................................................114
6.3.6. Recommended light conditions..............................................................................................................114
6.3.7. Protect the optical components..............................................................................................................115
6.3.8. Mechanical loads..................................................................................................................................115
6.3.9. Camera / lens cleaning..........................................................................................................................115
6.3.10. Protect against static discharge (ESD)....................................................................................................115
6.4. Warranty.......................................................................................................................................................115
6.5. Disclaimer of Warranty...................................................................................................................................116
6.6. List Of Trademarks........................................................................................................................................116
6.7. Standard Terms & Conditions of XIMEA GmbH.................................................................................................116
6.8. Copyright ......................................................................................................................................................121

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6.9. Revision History.............................................................................................................................................121
7. Glossary.................................................................................................................................................................122
8. list of figures..........................................................................................................................................................123
9. list of tables............................................................................................................................................................126

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2. xiX Camera Series
2.1. What is xiX
xiX [ksi-x: orsai-ex:]] is an ultra-compact PCI expressindustrial camera family with outstanding features:
•extremely small footprint
•sensors: 2.3 MP, 3.1 MP, 5.0 MP, 8.9 MP and 12.4 MP, b/w, color Sony sensors
as well as color, monochrome and some NIR AMS/CMOSIS sensors: CMV12000, CMV20000
•frame rates: 3.1 MP @ 218 fps to 20 MP @ 32 fps
The main point behind the xiX family is a flat all-in-one cable with fast data interface, power and triggering signals. This is ideal
for embedded andhigh-density applications. All standard connectors- like iPass, USB, Type-C - are much bigger than that and
require 2 cables for data and power/IO.
The xiX camera line comes with two form factors. Small (1inch square) with smaller sensors and interface PCIe x2 Gen2
(10Gbits/s) and C/CSlens mount. Large (60x60mm) with interface PCIex4 Gen2 (20Gbit/s) and active Canon EF-mount.
2.2. Advantages
Industry standard interface PCI express
Small Perfect size and customization options forEmbedded vision system applications
Powerful 20Gb/s interfaceusing standard PCI express hardware (X4G2 models)
Fast High speed,high frame rate: >218fps at 3.1Mpix and 133fps at 12Mpix resolutions
Robust Full metal ‘semi-housed’
Lightweight Facilitates increased performance of robotic arms and gimbals
Connectivity Programmable opto-isolated I/O, and non-isolated digital input and output. 4statusLEDs
Compatibility Support for Windows, Linux and MacOS, various Image ProcessingLibraries
Software interfaces GenICam / GenTL and highly optimizedxiAPI SDK
Economical Excellent value and price, low TCO and fast ROI
Low latency Computer CPU not involved in data transfer, latency from camera to memory is low
Optimized transfer GPU-direct (Linux only) ideal for setupd using GPU for image processing
table 2-1,advantages

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2.3. PCI Express Vision Camera Applications
•Automation
•Ultra-fast 3D scanning
•Miniature and fastrobotic arms
•Mobile devices
•In-situ optical inspection camera
•Material and life science microscopy
•Ophthalmology and retinal imaging
•Broadcasting
•Fast process capture,e.g. golf club swings
•IntelligentTransportations Systems(ITS)and traffic monitoring
•VR and AR
•Cinematography
•Sports
•Unmanned vehicles
•UAV / Drones etc.
2.4. Common features
Sensor Technology CMOS, Global shutter
Acquisition Modes Continuous, software and hardware trigger, fps limiting, triggered exposure and burst
Partial Image Readout ROI, Skipping andBinningmodes supported (model specific)
Image data formats 8, 10 or 12 bit RAW pixel data
Color image processing Host based de-bayering, sharpening, Gamma, color matrix, true color CMS
Hot/blemishpixels correction On camera storageof up to 5000 pixel coordinates, host assisted correction
Auto adjustments Auto white balance,auto gain, auto exposure
Flat field corrections Host assisted pixel level shadingand lens corrections
Image Data and Control Interface Ribbon cable and breakout board options to iPass external PCIe connector
General Purpose I/O X2G2 models - 1x opto-isolated input, 1x opto-isolated output,and 2non-isolated
bidirectional I/O, 4X user configurable LEDs
X4G2 models - 2x opto-isolated input, 2x opto-isolated output, and 4 non-isolated
bidirectional I/O, 4X user configurable LEDs
Synchronization Hardware triggerinput, software trigger, exposure strobe output, busy output
Housingand lens mount Standard C-mount convertible to CS mount, and CanonEF mount
Power requirements External power supply required of 12-24VDC
Environment Operating 0°C to 50°C on housing,RH 80%non-condensing, -30°Cto 60°C storage
Operating systems Windows 10 (x86 and x64), Windows 7 (x86 and x64), Linux Ubuntu, MacOS 10.8
Software support xiAPI SDK, adapters and drivers forvarious image processing packages
Firmware updates Field firmware updatable
table 2-2, common features

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2.5. What is xSWITCH
Utilizing PCIe as a camera interface offers unique camera aggregation options, atextremely high bandwidths: multiple cameras
can be efficiently connected and their respective data streams bundled into a single copper or fiber optic cable connection to a
host computer, writing directly to memory (DMA) at 64 Gbit/s. Flat-flex cables between the cameras and the xSWITCH allow the
most compact integration in tight spaces.
figure 2-1, Example of aggregation of many camera in to one cable
PCIe allows multi camera assembly in to one cable stream with other end connected to expansion slot in host computer. It is
possible to chain several PCIe switches to create optimal infrastructure. Together with the cameras it is also possible to populate
PCIe switch downstream ports with other controllers, like USB 3.0, UART, etc.
figure 2-2, PCI Express Topology

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HIGHLIGHTS
•Maximum compactness: smallest form factor cameras and mini connectors allow closest sensor-to-sensor proximity
•Aggregation into one high bandwidth upstream (up to 64Gbit/s)
•Full utilization of PCIe architecture with point-to-point connection and direct memory access
•Use of standard components allows simple assembly for the creation of a custom platform
•No need for external or additional expansion backplanes
•Multiple example typesof xSWITCH board are already designed
•Shape of theboard canbe can be tailored precisely to application requirements
•Benefit from XIMEA´s unique experience and expertise in the fieldof PCIe
MIX AND MATCH
•Connect multiple various camera models and types of cameras to a single computer
•Select from wide range of sensor resolutions and frame rates
•Combine housed and board level camera types
•Choice of different number of PCIe lanes and PCIe standards (2, 4, 8 lanes / Gen2 or Gen3)
•Choice ofvarious connectors: flat-flex option, board to board or iPass
•Choose between flat-flex connectors with vertical or horizontal orientation
•Bridge small or large distances of >100 m by selecting copper cable or optical fiber cable

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2.5.1. xSWITCH examples
By offeringxSWITCH, XIMEA provides a PCB design where quantity, type, location and orientation of PCIe connectors can be
varied to optimize the building of multi-camera systems. Multiplevariations of these PCB designs already exist based on the
concept of empowering rapid customization ofthe final assembly and thusenabling most daring ofcustomer applications.
For more information please contact our sales:[e-mail]
figure 2-3, Variations of Switches for Embedded vision systems

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2.6. Model Nomenclature
Part number convention for the different models:
MXxxxyG-zz-XaGb [-OPT]
MX xiX family name
xxx: Resolution in 0.1 MPixel. E.g. 2.3 MPixel Resolution: xxx = 023
y: y=C: color model
y=M: black & white model
y=R: black & white, Infrared-extended model
G: Global shutter (all xiX cameras are global shutter)
zz: Vendor of the sensor
zz = SY: Sony, CM: AMS/CMOSIS
[-OPT]: Options
OPT = FL: flexline variant, connector parallel to board, semi-housed
OPT = FV: flexline variant, connectorvertical to board, semi-housed
XaGb:
a = Number of PCIe lanes used, currently 2or 4 lanes (b=2 or 4) for xiX cameras
b = PCIe generation, currently at Gen 2 (a=2) for the xiX cameras

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2.7. Models Overview, sensorand models
Model1Resolution Pixel size ADC [bit] DR Optical
size Sensor size [mm] FPS2
MX023MG-SY-X2G2 b/w 1936 x 1216 5.86 µm 10/12 71.7 dB 1/1.2” 11.34x7.13 166
MX023CG-SY-X2G2 Color
MX031MG-SY-X2G2 b/w 2064 x 1544 3.45 µm 8/10/12 70.8 dB 1/1.8” 7.23x5.33 218
MX031CG-SY-X2G2 Color
MX050MG-SY-X2G2 b/w 2464 x 2056 3.45 µm 8/10/12 70.8 dB 2/3” 8.5x7.1 165
MX050CG-SY-X2G2 Color
MX089MG-SY-X2G2 b/w 4112 x 2176 3.45 µm 8/10/12 70.5 dB 1” 14.19x7.51 95
MX089CG-SY-X2G2 Color
MX124MG-SY-X2G2 b/w 4112 x 3008 3.45 µm 8/10/12 70.5 dB 1.1” 14.19x10.38 69
MX124CG-SY-X2G2 Color
table 2-3, X2G2 models overview
Model1Resolution Pixel size ADC [bit] DR Sensor size
[mm] Sensor diagonal FPS2
MX120MG-CM-X4G2 b/w 4096 x 3072 5.5µm 8/10/12 60dB 22.53x16.9 28mm 133
MX120CG-CM-X4G2 Color
MX120RG-CM-X4G2 NIR
MX200MG-CM-X4G2 b/w 5120 x 3840 6.4µm 12 66dB 32.76x24.58 41mm 32
MX200CG-CM-X4G2 Color
MX200MG-CM-X4G2 b/w 7902 x 6004 4.6µm 12 64dB 36.35x27.62 45.6mm 30
MX200CG-CM-X4G2 Color
table 2-4, X4G2 models overview
Note: 1) In the model name please add
-FL for flat-flex cable connecting from the bottomof the camera
-FV for flat-flex cable connecting perpendicular to the sensor
2) Full resolution, 8-bit RAW

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2.8. Accessories
The following accessories areavailable:
Item P/N Description
CBL-MX-X2G2-0M07 0.07m flat ribbon cable for PCIe Gen 2 x2 cable
CBL-MX-X2G2-0M10 0.1m flat ribbon cable for PCIe Gen 2 x2 cable
CBL-MX-X2G2-0M25 0.25m flat ribbon cable for PCIe Gen 2 x2 cable
CBL-MX-X2G2-0M50 0.5m flat ribbon cable for PCIe Gen 2 x2 cable
CBL-MX-X4G2-0M10 0.1m flat ribbon cable for PCIe Gen 2 x4 cable
CBL-MX-X4G2-0M25 0.25m flat ribbon cable for PCIe Gen 2 x4 cable
CBL-MX-X4G2-0M50 0.5m flat ribbon cable for PCIe Gen 2 x4 cable
ADPT-MX-X2G2-IPASS-HOST-Fx2Breakout board from iPass X2G2 to X2G2 flat ribbon
ADPT-MX-X2G2-IPASS-TARGET-Fx2Breakout board from X2G2 flat ribbon cable to iPass X2G2
ADPT-MX-X2G2-M2-Fx2Breakout board from M.2 to X2G2 ribbon cable
ADPT-MX-X2G2-M2SSD-Fx2Breakout board from X2G2 flat ribbon cable to M.2 SSD socket
ADPT-MX-X2G2-MINI-PCIE-Fx2Breakout board from Mini PCIe to X2G2 flat ribbon
ADPT-MX-X2G2-PCIE-Fx2Breakout board from PCIe to X2G2 flat ribbon
ADPT-MX-X2G2-X4G2 Breakout board from X2G2 flat ribbon toX4G2 ribbon (bothdirections)
ADPT-MX-X4G2-IPASS-HOST-Fx2Breakout board from iPass X4G2 to X4G2 flat ribbon
ADPT-MX-X4G2-IPASS-TARGET-Fx2Breakout board from X4G2 flat ribbon cable to iPass X4G2
ADPT-MX-X4G2-M2-Fx2Breakout board from M.2 to X4G2 ribbon cable
ADPT-MX-X4G2-MINI-PCIE-Fx2Breakout board from Mini PCIe to X4G2 flat ribbon
ADPT-MX-X4G2-PCIE-Fx2Breakout board from PCIe to X4G2 flat ribbon
MECH-60MM-BRACKET-T xiB / xiX X4G2 series tripod mounting bracket
MECH-60MM-EF-ADAPTER-KIT1xiB / xiT Canon EF-Mount Adapter
MECH-MC-BRACKET-KIT xiX X2G2 / xiC series tripod mounting bracket
table 2-5,accessories
Notes: 1) This kitis sold separately, however it is possible to order assembling during production. These assemblies are
sold separately. Additional assemblies purchased along with a camera can be added to the order at time of
purchase for assembly with camera head. See table 2-6
2) Adapters are available in vertical (-FV) and horizontal orientation (-FL) of flat ribbon connector
Item P/N Description
A-MECH-60MM-EF-ADAPTER-KIT1Assembly Service for MECH-60MM-EF-ADAPTER-KIT
table 2-6, assembly options
Notes: 1) Available only for MX120 and MX200 models.

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3. Hardware Specification
3.1. Power Supply
The xiX cameras arepowered via flex cable from an external power supply 12-24V withpower consumption up to 10W max
(without power needed forlens). Please read the chapter 3.8xiX X2G2 Interface connector and 3.9 xiX X4G2 Interface connector
regarding camera pinout. Breakout board can be used topower camera see 3.14MX camera adapters
3.2. General Specification
3.2.1. Environment
Description Symbol Value
Optimal ambient temperature operation Topt +10 to +25 °C
Ambient temperature operation Tmax 0 to +50 °C
Ambient temperature for storage and transportation Tstorage -30 to +60 °C
Relative Humidity, non-condensing RH ≤80 %
table 3-1,environment
Housing temperature mustnot exceed +65°C. The following parameters are not guaranteed if the camera is operated outside
the optimum range:
•Dark current
•Dynamic Range
•Linearity
•Acquisition and readoutnoise
•S/N ratio,durability
Please refer to chapter: 3.11 Heat Dissipation
3.2.2. Firmware / Host driver / API features
Description Value
Interpolation methods SHT advanced
White balance coefficients ranges 0.0 to 3.9
Sharpness filter -400 to 400 %
Gamma 0.3 to 1.0
Full color correctionmatrix (3+1)x3 coefficients ranges -3.9 to 3.9
table 3-2, firmware / API features
More details on API/SDK features are available at XIMEA support pages: http://www.ximea.com/support

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3.3. Mounting points
Cameras feature mounting threads enabling to bemounted on construction or via tripodadapter to standard tripod.
MX X2G2
figure 3-1, MX X2G2 mounting points (note 1: models MX089xG and MX124xG do not have this mounting hole)
MX X4G2
figure 3-2,MX X4G2 mounting points