XIMEA xiMU MU181CR-ON User manual

xiMU
[ksi-mju: or sai-mju:]
•subminiature USB2.0 camera series
•subminiature USB3.1 Gen 1 camera series
Technical Manual
Version 2.10, June 2021

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1. Introduction
1.1. About This Manual
Dear customer,
Thank you for purchasing a product from XIMEA.
We hope that this manual can answer your questions, but should you have any further questions or if you wish to claim a
service or warranty case, please contact your local dealer or refer to the XIMEA Support on our website:
www.ximea.com/support
The purpose of this document is to provide a description of the XIMEA xiMU-Series cameras and to describe the correct way to
install related software and drivers and run it successfully. Please read this manual thoroughly before operating your new
camera for the first time. Please follow all instructions and observe the warnings.
This document is subject to change without notice.
1.2. About XIMEA
XIMEA is one of the worldwide leaders for innovative camera solutions with a 25-year history of research, development and
production of digital image acquisition systems. Based in Slovakia, Germany and the US and with a global distributor network,
XIMEA offers their cameras worldwide. In close collaboration with customers XIMEA has developed a broad spectrum of
technologies and cutting-edge, highly competitive products.
XIMEA's camera centric technology portfolio comprises a broad spectrum of digital technologies, from data interfaces such as
USB 2.0, USB 3.1 and PCIe to cooled digital cameras with CCD, CMOS and sCMOS sensors, as well as X-ray cameras.
XIMEA has three divisions –generic machine vision and integrated vision systems, scientific imaging and OEM/custom.
XIMEA cameras find use in many industrial applications, such as motion control, robotics, or quality control in manufacturing.
The broad spectrum of cameras also includes thermally stabilized X-ray cameras, and specialty cameras for medical
applications, research, surveillance and defense.
1.2.1. Contact XIMEA
XIMEA is a worldwide operating company.
Headquarters
Sales worldwide
XIMEA GmbH
Am Mittelhafen 16
48155 Münster
Germany
Tel: [phone]
Fax: [phone]
Sales America
XIMEA Corp.
12600 W Colfax Ave., Suite A-130
Lakewood, CO 80215
USA
Tel: [phone]
Fax: [phone]
R&D, Production
XIMEA s.r.o.
Lesna 52
900 33 Marianka
Slovakia
Internet www.ximea.com
General inquiries [e-mail]
Sales [e-mail]
Support https://www.ximea.com/support/wiki/allprod/Contact_Support

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1.3. Standard Conformity
The xiMU cameras MU9Px-MH have been tested using the following equipment:
•MU-MINIUSB-Adapter
•A shielded USB 2.0 cable (1.5m)
The xiMU cameras MU181CR-ON have been tested using the following equipment:
•ADPT-MU-TC-V
•A shielded USB 3.0 cable (3.0m)
Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the
user's authority to operate this equipment.
XIMEA recommends to use the same configuration to ensure the compliance with the following standards:
1.3.1. CE Conformity
The xiMU MU9Px-MH and MU181CR-ON cameras described in this manual comply with the requirements of the
•EC EMC Directive 2014/30/EU electromagnetic compatibility of equipment
1.3.2. For customers in the US: FCC Conformity
The xiMU MU9Px-MH and MU181CR-ON cameras described in this manual have been tested and found to comply with Part 15
of the FCC rules, which states that:
Operation is subject to the following two conditions:
•This device may not cause harmful interference, and
•This device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for Class A digital device, pursuant to part 15 of the FCC
rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in
a commercial environment. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used
in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the users will be required to correct the interference at
their own expense.
You are cautioned that any changes or modifications not expressly approved in this manual could void your authority to operate
this equipment under above jurisdictions. The shielded interface cable recommended in this manual must be used with this
equipment in order to comply with the limits for a computing device pursuant to Subpart J of Part 15 of FCC Rules.
1.3.3. For customers in Canada
The xiMU MU9Px-MH and MU181CR-ON cameras comply with the Class A limit s for radio noise emissions set out in Radio
Interference Regulations.
1.3.4. RoHS Conformity
The xiMU cameras comply with the requirements of the RoHS (Restriction of Hazardous Substances) Directive 2011/65/EU.

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1.3.5. WEEE Conformity
The xiMU cameras comply with the requirements of the WEEE (waste electrical and electronic equipment) Directive
2012/19/EU.
1.3.6. GenICam GenTL API
GenICam standard transport layer interface, grabbing images. GenICam/GenTL provides an agnostic transport layer interface
to acquire images or other data and to communicate with a device. Each XIMEA camera can be GenTL Producer.
1.4. Helpful Links
•XIMEAHomepage http://www.ximea.com/
•xiAPI stable versions download https://www.ximea.com/support/documents/4
•xiAPI beta versions download https://www.ximea.com/support/documents/14
•Frequently Asked Questions http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions
•Knowledge Base http://www.ximea.com/support/wiki/allprod/Knowledge_Base
•Vision Libraries http://www.ximea.com/support/projects/vision-libraries/wiki
•XIMEA Registration http://www.ximea.com/en/products/register
•XIMEA Live Support http://www.ximea.com/support/wiki/allprod/XIMEA_Live_Support
•XIMEA General Terms & Conditions http://www.ximea.com/en/corporate/generaltc

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1.4.1. Table of Contents
1. Introduction................................................................................................................................................................2
1.1. About This Manual.............................................................................................................................................2
1.2. About XIMEA .....................................................................................................................................................2
1.2.1. Contact XIMEA..........................................................................................................................................2
1.3. Standard Conformity ..........................................................................................................................................3
1.3.1. CE Conformity...........................................................................................................................................3
1.3.2. For customers in the US: FCC Conformity ...................................................................................................3
1.3.3. For customers in Canada...........................................................................................................................3
1.3.4. RoHS Conformity.......................................................................................................................................3
1.3.5. WEEE Conformity ......................................................................................................................................4
1.3.6. GenICam GenTL API..................................................................................................................................4
1.4. Helpful Links .....................................................................................................................................................4
1.4.1. Table of Contents......................................................................................................................................5
2. xiMU USB2.0 and USB3.1 Gen 1 Camera Series.........................................................................................................10
2.1. What is xiMU ...................................................................................................................................................10
2.2. Advantages .....................................................................................................................................................11
2.3. Camera Applications ........................................................................................................................................11
2.4. Common features ............................................................................................................................................11
2.5. Models Overview .............................................................................................................................................12
2.5.1. USB2.0 models.......................................................................................................................................12
2.5.2. USB3.1 Gen 1 models.............................................................................................................................12
2.6. Accessories.....................................................................................................................................................13
3. xiMU Hardware Specification .....................................................................................................................................14
3.1. General Specification .......................................................................................................................................14
3.1.1. Environment ...........................................................................................................................................14
3.1.2. Heat dissipation ......................................................................................................................................14
3.1.3. Firmware / Host driver / API features........................................................................................................14
3.1.4. Power Supply .........................................................................................................................................14
3.1.5. Optical path............................................................................................................................................15
3.2. xiMU USB2.0 specification................................................................................................................................15
3.2.1. Sensor and camera parameters ...............................................................................................................15
3.2.2. Quantum efficiency curves [%] ................................................................................................................16
3.2.3. Dimensional drawings (without Lens Mount Adapter).................................................................................17
3.2.4. Referenced documents............................................................................................................................17
3.2.5. Camera features .....................................................................................................................................17
3.2.6. MU9 Lens Mount Adapters ......................................................................................................................18
3.2.6.1. MECH-MU9-MH-ADAPT-M, dimensional drawing.............................................................................18
3.2.6.2. MECH-MU9-MH-ADAPT-L, dimensional drawing..............................................................................19
3.2.7. MU9 Camera connector (USB / IO Interface) .............................................................................................20
3.2.7.1. Location and Pinout........................................................................................................................20
3.2.7.2. Signal description...........................................................................................................................21
3.2.7.3. GXn DC electrical characteristics.....................................................................................................22
3.2.8. MU9 Patch cable ....................................................................................................................................23
3.2.8.1. Signal Description (USB 2.0 connector)............................................................................................23
3.2.8.2. Signal Description (IO connector).....................................................................................................23

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3.2.8.3. Connection of patch cable ..............................................................................................................23
3.2.9. MU-MINIUSB ..........................................................................................................................................24
3.2.10. ADPT-MU9P-USB2-UB-V.........................................................................................................................26
3.2.11. ME-ADPT-MU-T......................................................................................................................................28
3.2.11.1. Dimensional drawing......................................................................................................................28
3.2.12. CBL-MQSYNC-3M0 ................................................................................................................................29
3.2.13. Scope of delivery (MU9Px-MH).................................................................................................................30
3.2.14. Scope of delivery (MU9Px-MH-KIT)...........................................................................................................30
3.2.15. Scope of delivery (MU9PX-MBRD) ............................................................................................................30
3.2.16. Scope of delivery MU-MINIUSB ................................................................................................................30
3.2.17. Scope of delivery ADPT-MU9P-USB2-UB-V...............................................................................................31
3.3. xiMU USB3.1 Gen1 Specification ......................................................................................................................32
3.3.1. Sensor and camera parameters ...............................................................................................................32
3.3.2. Quantum efficiency curves [%] ................................................................................................................33
3.3.3. Dimensional drawings .............................................................................................................................34
3.3.4. Camera features .....................................................................................................................................35
3.3.5. MU181 Lens Mount Adapters ..................................................................................................................36
3.3.5.1. ME-LA-MU-M12-M, dimensional drawing........................................................................................36
3.3.5.2. ME-LA-MU-M12-L, dimensional drawing.........................................................................................37
3.3.6. MU181CR-ON Camera connector (USB / IO Interface) ...............................................................................38
3.3.6.1. Location and Pinout........................................................................................................................38
3.3.6.2. Signal description...........................................................................................................................39
3.3.6.3. GXn electrical characteristics ..........................................................................................................40
3.3.7. ADPT-MU-FL, ADPT-MU-FV ....................................................................................................................41
3.3.7.1. Flex Connection Location................................................................................................................41
3.3.7.2. Pinning..........................................................................................................................................42
3.3.7.3. IO lines specification ......................................................................................................................43
3.3.7.4. IO Connection to camera ................................................................................................................44
3.3.7.5. Inserting / detaching FPC cable.......................................................................................................45
3.3.8. ADPT-MU-TC-V ......................................................................................................................................48
3.3.8.1. IO connector Pinout........................................................................................................................48
3.3.9. ME-ADPT-MU-T......................................................................................................................................49
3.3.10. CBL-MQSYNC-3M0 ................................................................................................................................49
3.3.11. CBL-MQ-FL-0M1, CBL-MQ-FL-0M25 ......................................................................................................49
3.3.12. CBL-USB3FLEX-0M10, CBL-USB3FLEX-0M25, CBL-USB3FLEX-0M50 ......................................................49
3.3.13. BOB-MQ-FL............................................................................................................................................50
3.3.14. Scope of delivery MU181CR-ON models...................................................................................................51
3.3.15. Scope of delivery ADPT-MU-FL/ADPT-MU-FV ...........................................................................................51
3.3.16. Scope of delivery ADPT-MU-TC-V ............................................................................................................51
3.3.17. Scope of delivery ME-ADPT-MU-T kit .......................................................................................................52
4. Operation.................................................................................................................................................................53
4.1. System Requirements ......................................................................................................................................53
4.1.1. Software Requirements ...........................................................................................................................53
4.1.2. Hardware Requirements..........................................................................................................................53
4.2. Video Formats .................................................................................................................................................53
4.2.1. Full Resolution ........................................................................................................................................53

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4.2.2. ROIs –Region Of Interest ........................................................................................................................53
4.2.3. Downsampling Modes.............................................................................................................................53
4.2.3.1. Binning..........................................................................................................................................54
4.2.3.2. Skipping/Decimation ......................................................................................................................54
4.2.4. Color and Mono Modes ...........................................................................................................................54
4.3. Acquisition modes ...........................................................................................................................................55
4.3.1. Free-Run................................................................................................................................................55
4.3.2. Triggered Acquisition ..............................................................................................................................55
4.3.2.1. Software Trigger ............................................................................................................................55
4.3.2.2. Hardware Trigger ...........................................................................................................................55
4.3.2.3. Triggered mode .............................................................................................................................56
4.4. Sensor Shutter Modes......................................................................................................................................58
4.4.1. Rolling Shutter Mode...............................................................................................................................58
4.4.2. Global Reset Release Mode .....................................................................................................................59
4.4.3. How to Freeze the Motion........................................................................................................................60
4.5. Camera Parameters and Features.....................................................................................................................60
4.5.1. Exposure ................................................................................................................................................60
4.5.2. Gain.......................................................................................................................................................60
4.6. Host-Assisted Image Processing Parameters Available in xiAPI. ..........................................................................60
4.6.1. Auto Exposure –Auto Gain ......................................................................................................................60
4.6.2. White Balance ........................................................................................................................................60
4.6.2.1. Assisted Manual White Balance ......................................................................................................60
4.6.2.2. Auto White Balance........................................................................................................................61
4.6.3. Gamma..................................................................................................................................................61
4.6.4. Sharpness ..............................................................................................................................................61
4.6.5. Color Correction Matrix............................................................................................................................61
4.6.6. Bad pixel Correction ................................................................................................................................61
4.7. MU9 USB2.0 Transfer Modes ...........................................................................................................................61
4.7.1. Transfer mode ........................................................................................................................................61
4.7.2. Packet Size Setting .................................................................................................................................61
4.7.3. Bandwidth control ...................................................................................................................................62
4.7.4. USB HUBs ..............................................................................................................................................62
4.7.5. Using multiple MU9 cameras ...................................................................................................................62
4.8. Connecting Two MU9 Cameras with Synchronized Acquisition............................................................................62
4.8.1. Interconnect Cameras .............................................................................................................................62
4.8.2. Connect Cameras to PC ..........................................................................................................................63
4.8.3. Control the Cameras with xiAPI ................................................................................................................63
5. Software ..................................................................................................................................................................65
5.1. Accessing the Camera .....................................................................................................................................65
5.1.1. Proprietary API........................................................................................................................................65
5.1.2. Standard Interface ..................................................................................................................................65
5.1.2.1. GenICam .......................................................................................................................................65
5.1.3. Vision Library Integration .........................................................................................................................65
5.2. XIMEA CamTool...............................................................................................................................................66
5.3. Supported Vision Libraries................................................................................................................................68
5.3.1. Libraries maintained by XIMEA.................................................................................................................68

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5.3.1.1. MathWorks MATLAB ......................................................................................................................68
5.3.1.2. MVTec HALCON.............................................................................................................................68
5.3.1.3. National Instruments LabVIEW Vision Library....................................................................................68
5.3.1.4. OpenCV.........................................................................................................................................68
5.4. XIMEA Windows Software Package ...................................................................................................................69
5.4.1. Contents ................................................................................................................................................69
5.4.2. Installation..............................................................................................................................................69
5.5. XIMEA Linux Software Package.........................................................................................................................72
5.5.1. Contents ................................................................................................................................................72
5.5.2. Installation..............................................................................................................................................72
5.6. XIMEA macOS Software Package......................................................................................................................74
5.6.1. Contents ................................................................................................................................................74
5.6.2. Installation..............................................................................................................................................74
5.6.3. Start XIMEA CamTool ..............................................................................................................................75
5.7. Programming ..................................................................................................................................................76
5.7.1. XIMEA APIs.............................................................................................................................................76
5.7.2. xiAPI Overview ........................................................................................................................................76
5.7.3. xiAPI Functions Description......................................................................................................................76
5.7.4. xiAPI Parameters Description...................................................................................................................77
5.7.5. xiAPI Examples .......................................................................................................................................77
5.7.5.1. Connect Device..............................................................................................................................77
5.7.5.2. Parameterize Device.......................................................................................................................77
5.7.5.3. Acquire Images..............................................................................................................................78
5.7.5.4. Control Digital Input / Output (GPIO) ................................................................................................78
5.7.6. xiAPI Auto Bandwidth Calculation.............................................................................................................79
5.7.7. GenICam ................................................................................................................................................79
5.8. XIMEA Control Panel ........................................................................................................................................80
6. Appendix..................................................................................................................................................................81
6.1. Troubleshooting and Support............................................................................................................................81
6.1.1. Worldwide Support..................................................................................................................................81
6.1.2. Before Contacting Technical Support........................................................................................................81
6.1.3. Frequently Asked Questions.....................................................................................................................81
6.2. Product service request (PSR)...........................................................................................................................82
6.2.1. Step 1 - Contact Support.........................................................................................................................82
6.2.2. Step 2 - Create Product Service Request (PSR).........................................................................................82
6.2.3. Step 3 - Wait for PSR Approval ................................................................................................................82
6.2.4. Step 4 - Sending the camera to XIMEA.....................................................................................................82
6.2.5. Step 5 - Waiting for Service Conclusion....................................................................................................82
6.2.6. Step 6 - Waiting for return delivery...........................................................................................................82
6.3. Safety instructions and precautions...................................................................................................................83
6.3.1. Disassembling ........................................................................................................................................83
6.3.2. Mounting / Screwing ...............................................................................................................................83
6.3.3. Connections ...........................................................................................................................................83
6.3.4. Power supply..........................................................................................................................................83
6.3.5. Environment / protect against water.........................................................................................................83
6.3.6. Recommended light conditions. ...............................................................................................................83

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6.3.7. Protect the optical components................................................................................................................84
6.3.8. Mechanical loads....................................................................................................................................84
6.3.9. Camera / lens cleaning............................................................................................................................84
6.3.10. Protect against static discharge (ESD) ......................................................................................................84
6.3.11. Safety instructions for board level cameras...............................................................................................84
6.4. Warranty .........................................................................................................................................................85
6.5. Disclaimer of Warranty.....................................................................................................................................85
6.6. List Of Trademarks ..........................................................................................................................................85
6.7. Standard Terms & Conditions of XIMEA GmbH...................................................................................................86
6.8. Copyright ........................................................................................................................................................91
6.9. Revision History ...............................................................................................................................................92
7. Glossary...................................................................................................................................................................93
8. list of figures ............................................................................................................................................................94
9. list of tables .............................................................................................................................................................96

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2. xiMU USB2.0 and USB3.1 Gen 1 Camera Series
2.1. What is xiMU
xiMU [ksi-mju: or sai-mju:] is a subminiature USB Industrial camera family with outstanding features:
•Incredibly small: World smallest USB 2.0 and USB3.1 Gen 1 cameras with GenICam/GenTL support.
•Low power consumption
•triggerable, fully industrial grade
•sensors: OnSemi 5MPixel MT9P031and ONSEMI 18MPixel AR1820HS.
•frame rates: up to 4.6 frames/sec for USB2.0 version and 21.9 frames/sec for USB3.1 Gen 1 version. Multiple binning and
skipping modes with higher frame rates.

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2.2. Advantages
smallest
fits into places where no other camera can fit
Robust
full metal housing, no sheet metal covers
Lightweight
facilitates increased performance of robotic arms and handheld devices
Connectivity
Programmable input and output
Compatibility
support for Windows, Linux and MacOS, various Image Processing Libraries
Software interfaces
GenICam / GenTL and highly optimized xiAPI SDK
Economical
excellent value and price, low TCO and fast ROI
Images
Excellent image quality and low light sensitivity
table 2-1, advantages
2.3. Camera Applications
•3D dental applications
•Miniature and fast robotic arms
•Mobile devices
•In-situ and endoscopic inspection camera
•Ophthalmology and Retinal imaging
2.4. Common features
Sensor Technology
CMOS, rolling shutter with Global Reset Release
Acquisition Modes
Continuous, software trigger, hardware trigger
Partial Image Readout
ROI, Skipping and Binning modes supported
Image data formats
8, 10 or 12 bit RAW pixel data
Color image processing
Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS
Hot/blemish pixels correction
On camera storage of 5000+ pixel coordinates, host assisted correction
Auto adjustments
Auto white balance, auto gain, auto exposure
Flat field corrections
Host assisted pixel level shading and lens corrections
Image Data and Control Interface
USB2.0 model: Micro connector with USB 2.0 High-speed and digital I/O
USB3.1 Gen 1 model: Various connectors with USB 3.0 Super-speed and digital I/O
General Purpose I/O
4x IO configurable as input or output
Synchronization
Hardware trigger input, software trigger, exposure active, frame active, trigger ready,
exposure active pulse, busy
Housing and lens mount
Standard S-mount (M12). Two lens mount adapters available
Power requirements
USB2.0 model: Typ. 0.76 W, supplied via USB 2.0 interface
USB3.1 Gen 1 model: Typ. 1.4W, supplied via USB 3.0 interface
Environment
Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 70°C storage
Ingress Protection: IP40
Operating systems
Windows 10 (x86 and x64), Windows 7 SP1 (x86 and x64), Linux Ubuntu, MacOS 10.8
and newer
Software support
xiAPI SDK, adapters and drivers for various image processing packages
USB standard compatible
USB 2.0, Universal Serial Bus Specification Revision 2.0, April 27, 2000
USB 3.0, Universal Serial Bus 3.1 Specification Revision 1.0, July, 2013
table 2-2, common features

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2.5. Models Overview
2.5.1. USB2.0 models
Model
Resolution
Pixel size
ADC [bit]
DR
Optical
size
Sensor
diagonal
FPS
MU9PM-MH
b/w
2592 x 1944
2.2 µm
12
59 dB
1 / 2.5”
7.1 mm
4.46
MU9PC-MH
Color
table 2-3, USB2.0 model overview
USB2.0 models available in board level version as well
Order numbers name conventions for the different models:
Camera with housing:
MU9Px-MH
x: x=C: color model
x=M: black & white model
Board level camera:
MU9Px-MBRD
x: x=C: color model
x=M: black & white model
2.5.2. USB3.1 Gen 1 models
Model
Resolution
Pixel size
ADC [bit]
DR
Optical
size
Sensor
diagonal
FPS
MU181CR-ON
Color
4912 × 3680
1.25 µm
12
57.6 dB
1 / 2.3”
7.6 mm
21.9
table 2-4, USB3.1 Gen 1 model overview
Order numbers name conventions for the different models:
Camera with housing:
MU181CR-ON (for OEM projects)
MU181CR-ON-TC with mounted Type-C adapter
MU181CR-ON-FL with mounted -FL adapter

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2.6. Accessories
The following accessories are available for the USB2.0 models:
Item P/N
Description
MU-MINIUSB
Mini-USB Extension Board for MU9Px-MH
ADPT-MU9P-USB2-UB-V
Expansion board with micro-B USB 2.0 connector and IO connector for MU9px-MH
CBL-MQSYNC-3M0
3.0m xiQ series I/O sync cable can be used with ADPT-MU9P-USB2-UB-V
ME-ADPT-MU-T-KIT
xiMU series tripod mounting bracket with Screws Kit
table 2-5, MU9 accessories
The following accessories are available for the USB3.1 Gen 1 models:
Item P/N
Description
ADPT-MU-TC-V
Type-C adapter with IO for xiMU USB3.1 Gen 1 cameras
ADPT-MU-FL
Flat-flex cable adapter for xiMU USB3.1 Gen 1 connecting from the bottom of the camera
ADPT-MU-FV
Flat-flex cable adapter for xiMU USB3.1 Gen 1 connecting perpendicular to sensor
CBL-MQSYNC-3M0
3.0m xiQ series I/O sync cable can be used with ADPT-MU-TC-V
CBL-MQ-FL-0M1
Cable FPC MQ/MC Flex-Line, 0.1m (gold color)
CBL-MQ-FL-0M25
Cable FPC MQ/MC Flex-Line, 0.25m (gold color)
CBL-USB3FLEX-0M10
Cable FPC MQ/MC Flex-Line, 0.1m (white color)
CBL-USB3FLEX-0M25
Cable FPC MQ/MC Flex-Line, 0.25m (white color)
CBL-USB3FLEX-0M50
Cable FPC MQ/MC Flex-Line, 0.5m (white color)
BOB-MQ-FL
Break Out Board, Flex-Line, Simple Board Level Micro-B USB3.0
ME-ADPT-MU-T-KIT
xiMU series tripod mounting bracket with Screws Kit
table 2-6, MU181 accessories

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3. xiMU Hardware Specification
3.1. General Specification
3.1.1. Environment
Description
Symbol
Value
Optimum ambient temperature operation
Topt
+10 to +25°C
Housing temperature operation
Tmax
0 - +50°C
Ambient temperature for storage and transportation
Tstorage
-30 - +70°C
Relative Humidity, non-condensing
RH
80 %
table 3-1, environment
Housing temperature must not exceed +65°C. The following parameters are not guaranteed if the camera is operated outside
the optimum range:
•Dark current
•Dynamic Range
•Linearity
•Acquisition
•Readout noise
•S/N ratio
•Durability
Please refer to chapter 3.1.2 Heat dissipation
3.1.2. Heat dissipation
XIMEA strives to offer the smallest cameras with the highest performance. Although the cameras are first in terms of power
efficiency, the high packing density of components can lead to elevated temperatures, and an adequate dissipation of this heat
must be ensured. The cameras rely on adequate surface contact with a thermal mass (tripod, lens, heat sink) of sufficient size for
heat dissipation and this must be provided ensured by the user.
3.1.3. Firmware / Host driver / API features
Description
Value
Interpolation methods
9331, SHT advanced
White balance coefficients ranges
0.0 to 3.9
Sharpness filter
0 to 100 %
Gamma
0.3 to 1.0
Full color correction matrix (3+1)x3 coefficients ranges
-3.9 to 3.9
table 3-2, firmware / API features
More details on API/SDK features are available at XIMEA support pages: https://www.ximea.com/support/wiki/apis/APIs
3.1.4. Power Supply
The xiMU cameras are powered via the USB connector.
The input voltage is 5 V DC (±10%). The typical power consumption is 0.76W for the USB2.0 version and 1.4W for the USB3.1
Gen 1 version.

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3.1.5. Optical path
No additional filter glass.
3.2. xiMU USB2.0 specification
3.2.1. Sensor and camera parameters
xiMU model
MU9PC-MH
MU9PM-MH
Sensor parameter
Brand
Aptina, MT9P031I12STC
Aptina MT9P031I12STM
Color filter
RGB Bayer mosaic
None
Type
Rolling shutter, Global Reset Release
Pixel Resolution (H × V) [pixel]
2592 × 1944
Active area size (H × V) [mm]
5.7 × 4.3
Sensor diagonal [mm]
7.1
Optical format [inch]
1 / 2.5 (4:3)
Pixel Size (H × V) [µm]
2.2 x 2.2
ADC resolution [bit]
12
FWC [ke-]
4.9
Dynamic range [dB]
59
SNR Max [dB]
37
Conversion gain [e-/LSB12]
0.82
Dark noise [e-]
5
DSNU [e-]
0.92
PRNU [%]
2
Linearity [%]
<0.2
Camera parameters
Digitization [bit]
12
Supported bit resolutions [pit/pixel]
8, 10, 12
Exposure time (EXP) 2
20μs … 10sec
Variable Gain Range (VGA) [dB]
18
Refresh rate (MRR) 1[fps]
4.6
Power consumption
typical [W]
0.76
Maximum [W]
0.9
Idle [W]
0.3
Dimensions/Mass MU9Px-MH (with housing)
Height ×width ×depth [mm]
15 ×15 ×8.5
mass [g]
3.4 (without lens mount adapter) / 4.0 (with MECH-MU9-MH-ADAPT-M) /
4.2 (with MECH-MU9-MH-ADAPT-L)
Dimensions/Mass MU9Px-MBRD (board
level)
Height ×width ×depth [mm]
14 ×13.2 ×3.7 (measured w/o connector)
14 ×13.2 ×5.5 (measured with connector)
mass [g]
1.2
table 3-3, MU9 sensor and camera parameters
Notes:
1) The figure indicates the maximum achievable frame rate for full frame readout. The real performance will be
affected by USB controller, number and type of USB devices attached to this controller, system processor and
memory speed and configuration.

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2) Minimal exposure depends on readout mode and bandwidth limitation. For full resolution minimal exposure is
110μs
Binning/skipping
pixels
fps
Bit/px
1x1
2592 x 1944
4.6
12
2x2 bin
1296 x 972
14.3
12
4x4 bin
648 x 486
31.6
12
2x2 skip
1296 x 972
18.3
12
4x4 skip
648 x 486
71.9
12
6x6 skip
430 x 324
142
12
7x7 skip
368 x 376
172
12
7x7 skip/clip
320 x 240
200
12
table 3-4, MU9 readout modes (with compatible USB packet size –see 4.7.2 Packet Size Setting)
3.2.2. Quantum efficiency curves [%]
figure 3-1, MT9P031 mono and color, quantum efficiency curve, ©Aptina

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3.2.3. Dimensional drawings (without Lens Mount Adapter)
figure 3-2, MU9Px-MH, image front and rear side
figure 3-3, MU9Px-MH, dimensional drawing
3.2.4. Referenced documents
•Aptina Datasheet MT9P031_DS - Rev. F 5/11 EN
•Aptina Outgoing Defect Specification, MT9P031_ODS.fm - Rev. A 9/07 EN
3.2.5. Camera features
feature
Note
Binning
Yes: 2x2 and 4x4
Skipping
Yes: 2x2, 4x4, 6x6, 7x7 and 7x7 skip/clip
ROI
Yes, 4-pixel granularity
HW Trigger
Trigger without overlap usable (see 4.3.2.3 Triggered mode)
Image formats
RAW, (RGB24, RGB32 –only color models)
table 3-5, MU9 sensor features

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3.2.6. MU9 Lens Mount Adapters
There are two lens mount adapters available (S-Mount, M12 x 0.5 thread).
3.2.6.1. MECH-MU9-MH-ADAPT-M, dimensional drawing
figure 3-4, lens mount adapter MECH-MU9-MH-ADAPT-M, image
figure 3-5, lens mount adapter MECH-MU9-MH-ADAPT-M, drawing
Geometric Back-focal Distance (measured from the top of the flange to the top of the sensor die): 7.39 mm.

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3.2.6.2. MECH-MU9-MH-ADAPT-L, dimensional drawing
figure 3-6, lens mount adapter MECH-MU9-MH-ADAPT-L image
figure 3-7, lens mount adapter MECH-MU9-MH-ADAPT-L, drawing
Geometric Backfocal Distance (measured from the top of the flange to the top of the sensor die): 10.39 mm.

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3.2.7. MU9 Camera connector (USB / IO Interface)
figure 3-8 MU9 camera connector
The connector mounted on the camera PCB is a
•HRS DF12E(3.5)-20DP
3.2.7.1. Location and Pinout
The camera connector is located on the back side of the camera:
figure 3-9, MU9 camera connector, location and pin-out
MU9P_MH
Connector pinout
GX4_2+3V3
GND
+3V3
GND
GND
GND
+5V/VBUS
SGND
USB_D_P
GND
USB_D_N
GND
GX1
GX2
GX3
GX4
GX3_2
XX1
XX2
M3 thread