XIMEA xiX-Xtreme User manual

xiX-Xtreme
[ksi-x-treme:] or [sai-ex:tri:m]
•Camera series with detachable sensor head
Ximea cameras •
Technical Manual •
Version v230927 •

Introduction
About this manual
Dear customer,
Thank you for purchasing a product from XIMEA.
We hope that this manual can answer your questions, but should you have any further questions or if you wish to claim a service or warranty
case, please contact your local dealer or refer to the XIMEA Support on our website:
www.ximea.com/support
The purpose of this document is to provide a description of the Ximea cameras and to describe the correct way to install related software
and drivers and run it successfully. Please read this manual thoroughly before operating your new Ximea cameras for the rst time. Please
follow all instructions and observe the warnings.
This document is subject to change without notice.
About XIMEA
XIMEA is one of the worldwide leaders for innovative camera solutions with a 30-year history of research, development and production
of digital image acquisition systems. Based in Slovakia, Germany and the US and with a global distributor network, XIMEA offers their
cameras worldwide. In close collaboration with customers XIMEA has developed a broad spectrum of technologies and cutting-edge, highly
competitive products.
XIMEA’s camera centric technology portfolio comprises a broad spectrum of digital technologies, from data interfaces such as USB 2.0,
USB 3.1 and PCIe to cooled digital cameras with CCD, CMOS and sCMOS sensors, as well as X-ray cameras.
XIMEA has three divisions – generic machine vision and integrated vision systems, scientic imaging and OEM/custom.
XIMEA cameras nd use in many industrial applications, such as motion control, robotics, or quality control in manufacturing. The broad
spectrum of cameras also includes thermally stabilized X-ray cameras, and specialty cameras for medical applications, research, surveil-
lance and defense.
Contact XIMEA
XIMEA is a worldwide operating company
Headquarters, Sales worldwide Sales America R&D, Production
XIMEA GmbH
Am Mittelhafen 16
48155 Münster
Germany
Tel: [phone]
Fax: [phone]
XIMEA Corp.
12600 W Colfax Ave., Suite A-130
Lakewood, CO 80215
USA
Tel: [phone]
Fax: [phone]
XIMEA s.r.o.
Lesná 52
900 33 Marianka
Slovakia
Tel: [phone]
Fax: [phone]
Web
General inquiries
Sales
Support
www.ximea.com
[email protected]
[email protected]
XIMEA Support
XIMEA Technical Manual, Version: v230927 i

Standard conformity
The cameras have been tested using the following equipment:
TBD
Warning: Changes or modications to the product or the environment may render it ineligible for operation under CE, FCC or other juris-
dictions. XIMEA recommends using the above conguration to ensure compliance with the following standards.
CE conformity
Note: TBD Models have not been certied, yet.
For customers in the US: FCC conformity
Note: TBD Models have not been certied, yet.
For customers in Canada
Note: TBD - Models have not been certied, yet.
RoHS conformity
The xiX-Xtreme cameras comply with the requirements of the RoHS (Restriction of Hazardous Substances) Directive 2015/863/EU.
WEEE conformity
The xiX-Xtreme cameras comply with the requirements of the WEEE (waste electrical and electronic equipment) Directive 2012/19/EU.
GenICam GenTL API
GenICam standard transport layer interface, grabbing images. GenICam/GenTL provides an agnostic transport layer interface to acquire
images or other data and to communicate with a device. Each XIMEA camera can be GenTL Producer.
XIMEA Technical Manual, Version: v230927 ii

Helpful links
XIMEA Homepage http://www.ximea.com/
XIMEA Registration http://www.ximea.com/en/products/register
XIMEA Support https://www.ximea.com/support/wiki/allprod/Contact_Support
Frequently Asked Questions http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions
Knowledge Base http://www.ximea.com/support/wiki/allprod/Knowledge_Base
XIMEA Software Package https://www.ximea.com/support/wiki/apis/APIs#Software-packages
Vision Libraries http://www.ximea.com/support/projects/vision-libraries/wiki
XIMEA General Terms & Conditions http://www.ximea.com/en/corporate/generaltc
XIMEA Technical Manual, Version: v230927 iii

Contents
About this manual ............................................................................................................... i
About XIMEA .................................................................................................................... i
Contact XIMEA .................................................................................................................. i
Standard conformity............................................................................................................. ii
Helpful links ..................................................................................................................... iii
1 xiX-Xtreme camera series ...................................................................................................... 1
1.1 What is xiX-Xtreme ....................................................................................................... 1
1.2 Advantages............................................................................................................... 2
1.3 Camera applications ...................................................................................................... 2
1.4 Common features......................................................................................................... 3
1.5 Model nomenclature ...................................................................................................... 4
1.6 Models and sensors overview ............................................................................................. 5
1.7 Accessories overview ..................................................................................................... 6
2 Hardware specication ......................................................................................................... 7
2.1 Power supply ............................................................................................................. 7
2.2 General specication...................................................................................................... 7
2.2.1 Environment ..................................................................................................... 7
2.3 Lens mount............................................................................................................... 8
2.3.1 C mount ......................................................................................................... 8
2.4 Mounting points .......................................................................................................... 9
2.5 Screws ................................................................................................................... 9
2.6 Optical path............................................................................................................... 10
2.7 Sensor and camera characteristics........................................................................................ 11
2.7.1 List of used sensors and lters................................................................................... 11
2.7.2 Sensor and camera parameters of particular models . . .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. . . . 12
2.7.3 Quantum efciency curves....................................................................................... 18
2.8 Mechanical characteristics................................................................................................ 20
2.8.1 Dimensions and mass ........................................................................................... 20
2.8.2 Dimensional drawings ........................................................................................... 21
2.9 User interface – LEDs..................................................................................................... 23
2.10 Camera interface ......................................................................................................... 24
2.10.1 PCIe / FireFly interface........................................................................................... 24
2.11 Digital input / output (GPIO) interface...................................................................................... 27
2.11.1 Location ......................................................................................................... 27
2.11.2 Pinning .......................................................................................................... 28
2.11.3 Optically isolated digital input .................................................................................... 29
2.11.4 Optically isolated digital output................................................................................... 31
2.11.5 Non-isolated digital lines......................................................................................... 37
2.12 Accessories............................................................................................................... 38
2.12.1 CBL-PB4-PWR-0M15............................................................................................ 38
2.12.2 CBL-PB6-IO-xM ................................................................................................. 38
2.12.3 CBL-ECUE-X4G3-xM............................................................................................. 38
2.12.4 CBL-HQCD-xM .................................................................................................. 39
2.12.5 CB-X8G3-FAN-COOLER-KIT...................................................................................... 39
2.12.6 CB-X8G3-WAT-COOLER-KIT ..................................................................................... 40
2.12.7 MECH-60MM-BRACKET-T ....................................................................................... 41
2.12.8 MQ-BRACKET-T ................................................................................................. 42
2.12.9 ADPT-MX-X4G3-FF-X4G3-MTP .................................................................................. 43
2.12.10 ADPT-MX-X4G3-FF-X4G3-SFF................................................................................... 46
2.12.11 FireFly MTP adapters ............................................................................................ 49
2.12.12 PCIe host adapters............................................................................................... 51
3 General features ................................................................................................................ 53
3.1 Camera features .......................................................................................................... 53
3.1.1 ROIs – Region of interest ........................................................................................ 53
3.1.2 Downsampling modes ........................................................................................... 53
XIMEA Technical Manual, Version: v230927 iv

3.1.3 Image data output formats....................................................................................... 54
3.2 Acquisition modes ........................................................................................................ 55
3.2.1 Free-Run ........................................................................................................ 55
3.2.2 Trigger controlled acquisition/exposure........................................................................... 55
3.3 Exposure time ............................................................................................................ 57
3.4 Gain ...................................................................................................................... 57
3.5 Dual ADC modes.......................................................................................................... 58
3.5.1 Non-combined mode ............................................................................................ 59
3.5.2 Combined mode ................................................................................................. 60
3.6 API Features .............................................................................................................. 61
3.6.1 Exposure – Auto gain ............................................................................................ 61
3.6.2 White balance ................................................................................................... 61
3.6.3 Gamma.......................................................................................................... 61
3.6.4 Sharpness....................................................................................................... 61
3.6.5 Color correction matrix........................................................................................... 61
3.6.6 Sensor defect correction ......................................................................................... 61
4 Operation ....................................................................................................................... 62
4.1 System requirements ..................................................................................................... 62
4.1.1 Software requirements........................................................................................... 62
4.1.2 Hardware requirements.......................................................................................... 62
4.1.3 Connection and cables........................................................................................... 62
4.2 XIMEA software packages................................................................................................. 63
4.2.1 XIMEA Windows software package............................................................................... 63
4.2.2 XIMEA Linux software package................................................................................... 66
4.2.3 XIMEA macOS software package................................................................................. 68
4.3 XIMEA CamTool........................................................................................................... 71
4.4 XIMEA control panel ...................................................................................................... 72
4.5 Supported vision libraries ................................................................................................. 73
4.5.1 MathWorks MATLAB............................................................................................. 73
4.5.2 MVTec HALCON ................................................................................................. 73
4.5.3 National Instruments LabVIEW vision library ...................................................................... 73
4.5.4 OpenCV ......................................................................................................... 73
4.6 Programming ............................................................................................................. 74
4.6.1 Standard interface ............................................................................................... 74
4.6.2 xiAPI............................................................................................................. 74
5 Appendix ....................................................................................................................... 78
5.1 Troubleshooting and support .............................................................................................. 78
5.1.1 Worldwide support............................................................................................... 78
5.1.2 Before contacting technical support.............................................................................. 78
5.2 Frequently Asked Questions............................................................................................... 78
5.3 Product service request (PSR)............................................................................................. 79
5.3.1 Step 1 – Contact support ........................................................................................ 79
5.3.2 Step 2 – Create product service request (PSR) ................................................................... 79
5.3.3 Step 3 – Wait for Product Service Request (PSR) approval .. .. . .. .. .. . .. .. .. . .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. . . . .. .. 79
5.3.4 Step 4 – Sending the camera to XIMEA .......................................................................... 79
5.3.5 Step 5 – Waiting for service conclusion .......................................................................... 79
5.3.6 Step 6 – Waiting for return delivery .............................................................................. 79
5.4 Safety instructions and precautions ....................................................................................... 80
5.4.1 Disassembly..................................................................................................... 80
5.4.2 Mounting / Screws............................................................................................... 80
5.4.3 Connections ..................................................................................................... 80
5.4.4 Power supply .................................................................................................... 80
5.4.5 Environment / protection against water........................................................................... 80
5.4.6 Recommended light conditions................................................................................... 80
5.4.7 Protection of optical components................................................................................. 81
5.4.8 Mechanical loads ................................................................................................ 81
5.4.9 Camera / lens cleaning .......................................................................................... 81
XIMEA Technical Manual, Version: v230927 v

5.4.10 Protect against static discharge (Electrostatic discharge (ESD)) . . .. .. .. . .. .. .. . .. .. . . . .. .. . .. .. .. . .. .. .. . .. .. .. . .. 81
5.4.11 Safety instruction for board level cameras........................................................................ 81
5.5 Warranty.................................................................................................................. 82
5.5.1 Disclaimer of Warranty........................................................................................... 82
5.6 Standard Terms & Conditions of XIMEA GmbH............................................................................. 83
5.7 List of Trademarks ........................................................................................................ 89
5.8 Copyright ................................................................................................................. 89
Glossary ............................................................................................................................ 90
List of gures ....................................................................................................................... 91
List of tables ........................................................................................................................ 93
XIMEA Technical Manual, Version: v230927 vi

1xiX-Xtreme camera series
1.1 What is xiX-Xtreme
xiX-Xtreme [ksi-x-treme: or sai-ex:tri:m] is the high-speed PCI express camera family with detachable sensor heads:
•Sony Pregius S sensors with 16.1 Mpx, 20.3 Mpx, and 24.5 Mpx
•Super-fast 32 Gbit/s data throughput to ensure 105 fps 24.5 Mpx up to 159 fps 16.1 Mpx enabled by PCIe X4G3
•The detachable sensor heads measure only 26 × 26 × 33 mm
–Sensor module is separable from camera electronics over distances up to 1 m
•Special sensor features like Dual ADC (HDR mode), short shutter interval time, and others
The xiX-Xtreme cameras offer the opportunity to reach the full sensor specications while still keeping the smallest possible form factor.
Our innovative approach separates the sensor head from the readout electronics, facilitating integration into the most conned spaces.
This separation not only optimizes spatial utility but also drastically reduces heat accumulation at the sensor, lowering noise levels and
enhancing image quality. The pixel size of 2.74 µm helps to use C-mount lenses thus further improving the cost-effectivity and enabling
miniature size for mobile and multiple camera systems.
XIMEA Technical Manual, Version: v230927 1

1.2 Advantages
Lightweight facilitates increased performance of robotic arms and gimbals or UAV / UAS
Efcient low power consumption and heat dissipation
Robust sturdy full metal jacket, no sheet metal covers
Adaptable customization options via Board level or connectors allow easy integration into OEM solutions
Economical removes bulky constructions and accessories saving energy and space at better prices
Simplistic straightforward way for easy multiple camera system, no workarounds, no frame grabbers
1.3 Camera applications
•automation
•ultra-fast 3D scanning
•miniature and fast robotic arms
•mobile devices
•in-situ optical inspection camera
•material and life science microscopy
•ophthalmology and retinal imaging
•broadcasting
•fast process capture, e.g. golf club swings
•Intelligent Transportations Systems (ITS) and trafc monitoring
•VR and AR
•vinematography
•sports
•unmanned vehicles
•UAV / drones etc
XIMEA Technical Manual, Version: v230927 2

1.4 Common features
Acquisition modes global shutter
Image data formats 8 bit, 10 bit, 12 bit RAW pixel data
Sensor technology CMOS
Sensor versions backside illuminated (BSI)
Partial image readout ROI, Skipping and Binning modes supported (model specic)
Interface PCI Express standard cable connector compliant to PCI Express external cabling specications
Color image processing Host based de-bayering, sharpening, Gamma, color matrix, true color CMS
Hot/blemish pixels correction on camera storage of up to 5000 px coordinates, host assisted correction
Auto adjustments auto white balance, auto gain, auto exposure
Flat eld corrections host assisted pixel level shading and lens corrections - this feature is being developed and tested
General purpose I/O I/O 1x opto-isolated input, 1x opto-isolated output, and 4x non-isolated bidirectional I/O, 4x user
congurable LEDs
Synchronization hardware trigger input, software trigger, exposure strobe output, busy output
Housing and lens mount Standard C-mount convertible to CS mount
Environment operating 0 to 50 ◦C on housing, RH 80 % non-condensing, −25 to 60 ◦C storage
Operating systems Windows, Linux Ubuntu, macOS
Software support xiAPI SDK, adapters and drivers for various image processing libraries
Firmware updates eld rmware update through xiCOP tool
XIMEA Technical Manual, Version: v230927 3

1.5 Model nomenclature
xi-Xtreme MXxxxyT-zz-X4G3-FF
MX xiX family name
xxx: resolution in 0.1 MPixel. E.g. 2.3 MPixel Resolution: xxx = 023
y: Color sensing
C: color model
M: black & white model
T: Sensor technology
G: Global shutter
zz: Vendor of the sensor
SY: Sony
X4G3: Number of PCIe lanes used, 4 for these cameras
PCIe generation, currently at Gen 3 for these cameras
FF: FireFly cable connection
XIMEA Technical Manual, Version: v230927 4

1.6 Models and sensors overview
Resolution Pixel size Bits Dynamic range Sensor diagonal FPS1
MX161MG-SY-X4G3-FF b/w
MX161CG-SY-X4G3-FF Color
MX203MG-SY-X4G3-FF b/w
MX203CG-SY-X4G3-FF Color
MX245MG-SY-X4G3-FF b/w
MX245CG-SY-X4G3-FF Color
Model
5328 × 3040 2.74 µm 8/10/12 70 dB 16.78 mm 160.4
4512 × 4512 2.74 µm 8/10/12 70 dB 17.45 mm 110.1
5328 × 4608 2.74 µm 8/10/12 70 dB 19.27 mm 107.9
1Full resolution, RAW 8 bits
Table 1: xiX-Xtreme models overview
XIMEA Technical Manual, Version: v230927 5

1.7 Accessories overview
The following accessories are available:
Item P/N Description
CBL-PB4-PWR-0M15 Power cable with barrel connector 15 cm long
CBL-PB6-IO-0M10 IO pig tail cable 10 cm long
CBL-ECUE-X4G3-0M30 Cable Micro Assembly, Low-Prole FireFly, 30 cm
CBL-ECUE-X4G3-1M0 Cable Micro Assembly, Low-Prole FireFly, 100 cm
CBL-ECUE-X4G3-2M0 Cable Micro Assembly, Low-Prole FireFly, 200 cm
HA-1/2P-X4G3-MTP/FF-X8G3 Ximea PCIe Dual FireFly x4 Gen 3 Host Adapter Card
ADPT-1/2/4P-X4G3-FF-X4/8G3-MTP CIe Adapter FireFly to MTP
ADPT-MX-X4G3-FF-X4G3-MTP MTP Adaptor for MX-X4G3-FF camera
CB-X8G3-FAN-COOLER-KIT Heatsink Fan Cooler for X8G3 cameras with screws Kit
CB-X8G3-WAT-COOLER-KIT Heatsink Water Cooler for X8G3 cameras with screws Kit
CBL-HQCD-0M15 Highspeed Coaxial HQCD cable, 15 cm length
CBL-HQCD-0M50 Highspeed Coaxial HQCD cable, 50 cm length
CBL-HQCD-1M0 Highspeed Coaxial HQCD cable, 100 cm length
CBL-HQCD-2M0 Highspeed Coaxial HQCD cable, 200 cm length
MECH-60MM-BRACKET-T-KIT MECH Tripod Bracket 60 mm with Screws Kit
MQ-BRACKET-T-KIT MQ series tripod mounting bracket TYP B with Screws Kit1
1In case of only small sensor board housing
Table 2: accessories overview
Figure 1: camera with accessory/cooling options
XIMEA Technical Manual, Version: v230927 6

2Hardware specication
2.1 Power supply
Depending on the used accessories cameras can be powered either by their respective sync cable or the FireFly connector.
See section PCIe / FireFly interface
2.2 General specication
2.2.1 Environment
Description Symbol Value
Optimal ambient temperature operation Topt 10 to 25 ◦C
Ambient temperature operation Tmax 0 to 50 ◦C
Ambient temperature for storage and transportation Tstorage −25 to 60 ◦C
Relative Humidity, non-condensing RH 80 %
Table 3: environment
Housing temperature must not exceed 65 ◦C.
Note: The following parameters are not guaranteed if the cameras are operated outside the optimum range:
•Dark current
•Dynamic Range
•Linearity
•Acquisition
•Readout noise
•S/N ratio
•Durability
XIMEA Technical Manual, Version: v230927 7

2.3 Lens mount
xi-Xtreme cameras are compatible with c-mount lenses.
2.3.1 C mount
Figure 2: camera with C-Mount lenses
The maximum difference between the ange focal distance and back focal distance for C-mount lenses must not exceed 6mm. Otherwise,
the lens could damage the protective sapphire glass inside the camera or the capability to focus to innity could be limited.
XIMEA Technical Manual, Version: v230927 8

2.4 Mounting points
Mounting points available to the customer are shown below. All are M4 thread.
Figure 3: mounting points
2.5 Screws
All mounting screws are customized M4 screws
Figure 4: mounting screws
Material Stainless steel
Surface Polished
Thread M4 Full thread
Driver IMBUS 3.0
Avail. Lengths 6 – 40 mm
Table 4: custom screws, technical details
XIMEA Technical Manual, Version: v230927 9

2.6 Optical path
A lter glass is part of the optical path of the camera. Do not use compressed air to clean the camera as this could damage (e.g. scratch)
the lter glass. Distance from the ange to sensor is designed so that the optical distance is 17.86 mm - 0.2 mm (tolerance).
Description Mono Color Unit
IR Filter BK7 IR650 -
Thickness 1.1 1.1 mm
Coating ARx2 ARx2 -
Optical path spot deviation from local average TBD TBD %
Size of the cosmetics defects TBD TBD lines
Table 5: optical path
Figure 5: xiX-xtreme optical path
*FDD is ange focal distance between the front ange surface and the sensor active surface.
XIMEA Technical Manual, Version: v230927 10

2.7 Sensor and camera characteristics
2.7.1 List of used sensors and lters
Table below details which sensor models and lters are tted to each camera model.
Camera model Sensor model Sensor type Filter
MX161CG-SY-X4G3-FF Sony IMX532 Color BayerBG
MX161MG-SY-X4G3-FF Sony IMX532 Monochrome None
MX203CG-SY-X4G3-FF Sony IMX531 Color BayerBG
MX203MG-SY-X4G3-FF Sony IMX531 Monochrome None
MX245CG-SY-X4G3-FF Sony IMX530 Color BayerBG
MX245MG-SY-X4G3-FF Sony IMX530 Monochrome None
Table 6: list of camera models and their respective sensor models and lters
XIMEA Technical Manual, Version: v230927 11

2.7.2 Sensor and camera parameters of particular models
Sensor and camera characteristics of models: MX161CG-SY-X4G3-FF and MX161MG-SY-X4G3-FF
Sensor parameter
Technology
Shutter type
Pixel resolution (H x V) px
Active area size (H X V) mm
Sensor diagonal mm
Optical Format ”
Pixel size (H x V) µm
Image quality parameters
Mode
ADC resolution bit 8 10 12 8 10 12
Saturation capacity ke-2.37 9.56 9.28 2.34 9.88 9.35
Dynamic range dB 53.37 65.38 70.58 61.13 71.85 72.65
SNR Max dB 33.75 39.81 39.68 33.69 39.95 39.71
Conversion gain e-/LSB16 0.62 2.52 2.38 0.04 0.16 0.15
Median read noise e-4.55 4.61 2.21 1.3 1.92 1.6
Dark current e-/s 2.06 2.06 1.21 1.74 2.24 2.12
DSNU e-0.52 0.52 0.45 0.4 0.54 0.6
PRNU % 0.7 0.64 0.66 0.64 0.63 0.65
Linearity % 0.68 0.43 0.54 0.72 0.44 0.88
Camera parameters
Exposure time (EXP)1µs
Analog gain range dB
Refresh rate (MMR) fps 160.43 153.67 112.0 81.74 78.49 56.89
Pwr. consumption W
Pwr. consumption max W
CMOS BSI
Global shutter
5328 × 3040
14.58 × 8.31
16.78
1.1
2.74 × 2.74
Standard Dual ADC
4 to 30 000 000
0 to 24
14.6
14.9
1Dened for maximal bandwidth. Minimal exposure and exposure step (Line Period) could be calculated
in: Camera performance calculator
Table 7: sensor and camera parameters
XIMEA Technical Manual, Version: v230927 12

Binning Decimation Output resolution fps Sensor bit/px
1x1 1x1 5328 × 3040 112.0 12
1x1 1x1 5328 × 3040 153.67 10
1x1 1x1 5328 × 3040 160.43 8
2x211x1 2656 × 1520 417.21 12
2x211x1 2656 × 1520 528.48 10
2x211x1 2656 × 1520 560.69 8
1x121x1 5328 × 3040 56.89 12
1x121x1 5328 × 3040 78.49 10
1x121x1 5328 × 3040 81.74 8
1x131x1 5328 × 3040 56.57 12
1x131x1 5328 × 3040 56.3 12(8)
1x142x2 2656 × 1520 218.28 12
1x142x2 2656 × 1520 298.49 10
1x142x2 2656 × 1520 310.84 8
1x112x2 2656 × 1520 417.22 12
1x112x2 2656 × 1520 528.48 10
1x112x2 2656 × 1520 560.69 8
1Only for cameras with monochrome sensor type
2Full res. Dual ADC W/o combination
3Full res. Dual ADC W combination
4Only for cameras with color sensor type
Table 8: supported standard readout modes
XIMEA Technical Manual, Version: v230927 13