XIMEA xiX-Xtreme User manual

xiX-Xtreme
[ksi-x-treme:] or [sai-ex:tri:m]
•Camera series with detachable sensor head
Ximea cameras •
Technical Manual •
Version v230927 •

Introduction
About this manual
Dear customer,
Thank you for purchasing a product from XIMEA.
We hope that this manual can answer your questions, but should you have any further questions or if you wish to claim a service or warranty
case, please contact your local dealer or refer to the XIMEA Support on our website:
www.ximea.com/support
The purpose of this document is to provide a description of the Ximea cameras and to describe the correct way to install related software
and drivers and run it successfully. Please read this manual thoroughly before operating your new Ximea cameras for the rst time. Please
follow all instructions and observe the warnings.
This document is subject to change without notice.
About XIMEA
XIMEA is one of the worldwide leaders for innovative camera solutions with a 30-year history of research, development and production
of digital image acquisition systems. Based in Slovakia, Germany and the US and with a global distributor network, XIMEA offers their
cameras worldwide. In close collaboration with customers XIMEA has developed a broad spectrum of technologies and cutting-edge, highly
competitive products.
XIMEA’s camera centric technology portfolio comprises a broad spectrum of digital technologies, from data interfaces such as USB 2.0,
USB 3.1 and PCIe to cooled digital cameras with CCD, CMOS and sCMOS sensors, as well as X-ray cameras.
XIMEA has three divisions – generic machine vision and integrated vision systems, scientic imaging and OEM/custom.
XIMEA cameras nd use in many industrial applications, such as motion control, robotics, or quality control in manufacturing. The broad
spectrum of cameras also includes thermally stabilized X-ray cameras, and specialty cameras for medical applications, research, surveil-
lance and defense.
Contact XIMEA
XIMEA is a worldwide operating company
Headquarters, Sales worldwide Sales America R&D, Production
XIMEA GmbH
Am Mittelhafen 16
48155 Münster
Germany
Tel: [phone]
Fax: [phone]
XIMEA Corp.
12600 W Colfax Ave., Suite A-130
Lakewood, CO 80215
USA
Tel: [phone]
Fax: [phone]
XIMEA s.r.o.
Lesná 52
900 33 Marianka
Slovakia
Tel: [phone]
Fax: [phone]
Web
General inquiries
Sales
Support
www.ximea.com
[email protected]
[email protected]
XIMEA Support
XIMEA Technical Manual, Version: v230927 i

Standard conformity
The cameras have been tested using the following equipment:
TBD
Warning: Changes or modications to the product or the environment may render it ineligible for operation under CE, FCC or other juris-
dictions. XIMEA recommends using the above conguration to ensure compliance with the following standards.
CE conformity
Note: TBD Models have not been certied, yet.
For customers in the US: FCC conformity
Note: TBD Models have not been certied, yet.
For customers in Canada
Note: TBD - Models have not been certied, yet.
RoHS conformity
The xiX-Xtreme cameras comply with the requirements of the RoHS (Restriction of Hazardous Substances) Directive 2015/863/EU.
WEEE conformity
The xiX-Xtreme cameras comply with the requirements of the WEEE (waste electrical and electronic equipment) Directive 2012/19/EU.
GenICam GenTL API
GenICam standard transport layer interface, grabbing images. GenICam/GenTL provides an agnostic transport layer interface to acquire
images or other data and to communicate with a device. Each XIMEA camera can be GenTL Producer.
XIMEA Technical Manual, Version: v230927 ii

Helpful links
XIMEA Homepage http://www.ximea.com/
XIMEA Registration http://www.ximea.com/en/products/register
XIMEA Support https://www.ximea.com/support/wiki/allprod/Contact_Support
Frequently Asked Questions http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions
Knowledge Base http://www.ximea.com/support/wiki/allprod/Knowledge_Base
XIMEA Software Package https://www.ximea.com/support/wiki/apis/APIs#Software-packages
Vision Libraries http://www.ximea.com/support/projects/vision-libraries/wiki
XIMEA General Terms & Conditions http://www.ximea.com/en/corporate/generaltc
XIMEA Technical Manual, Version: v230927 iii

Contents
About this manual ............................................................................................................... i
About XIMEA .................................................................................................................... i
Contact XIMEA .................................................................................................................. i
Standard conformity............................................................................................................. ii
Helpful links ..................................................................................................................... iii
1 xiX-Xtreme camera series ...................................................................................................... 1
1.1 What is xiX-Xtreme ....................................................................................................... 1
1.2 Advantages............................................................................................................... 2
1.3 Camera applications ...................................................................................................... 2
1.4 Common features......................................................................................................... 3
1.5 Model nomenclature ...................................................................................................... 4
1.6 Models and sensors overview ............................................................................................. 5
1.7 Accessories overview ..................................................................................................... 6
2 Hardware specication ......................................................................................................... 7
2.1 Power supply ............................................................................................................. 7
2.2 General specication...................................................................................................... 7
2.2.1 Environment ..................................................................................................... 7
2.3 Lens mount............................................................................................................... 8
2.3.1 C mount ......................................................................................................... 8
2.4 Mounting points .......................................................................................................... 9
2.5 Screws ................................................................................................................... 9
2.6 Optical path............................................................................................................... 10
2.7 Sensor and camera characteristics........................................................................................ 11
2.7.1 List of used sensors and lters................................................................................... 11
2.7.2 Sensor and camera parameters of particular models . . .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. . . . 12
2.7.3 Quantum efciency curves....................................................................................... 18
2.8 Mechanical characteristics................................................................................................ 20
2.8.1 Dimensions and mass ........................................................................................... 20
2.8.2 Dimensional drawings ........................................................................................... 21
2.9 User interface – LEDs..................................................................................................... 23
2.10 Camera interface ......................................................................................................... 24
2.10.1 PCIe / FireFly interface........................................................................................... 24
2.11 Digital input / output (GPIO) interface...................................................................................... 27
2.11.1 Location ......................................................................................................... 27
2.11.2 Pinning .......................................................................................................... 28
2.11.3 Optically isolated digital input .................................................................................... 29
2.11.4 Optically isolated digital output................................................................................... 31
2.11.5 Non-isolated digital lines......................................................................................... 37
2.12 Accessories............................................................................................................... 38
2.12.1 CBL-PB4-PWR-0M15............................................................................................ 38
2.12.2 CBL-PB6-IO-xM ................................................................................................. 38
2.12.3 CBL-ECUE-X4G3-xM............................................................................................. 38
2.12.4 CBL-HQCD-xM .................................................................................................. 39
2.12.5 CB-X8G3-FAN-COOLER-KIT...................................................................................... 39
2.12.6 CB-X8G3-WAT-COOLER-KIT ..................................................................................... 40
2.12.7 MECH-60MM-BRACKET-T ....................................................................................... 41
2.12.8 MQ-BRACKET-T ................................................................................................. 42
2.12.9 ADPT-MX-X4G3-FF-X4G3-MTP .................................................................................. 43
2.12.10 ADPT-MX-X4G3-FF-X4G3-SFF................................................................................... 46
2.12.11 FireFly MTP adapters ............................................................................................ 49
2.12.12 PCIe host adapters............................................................................................... 51
3 General features ................................................................................................................ 53
3.1 Camera features .......................................................................................................... 53
3.1.1 ROIs – Region of interest ........................................................................................ 53
3.1.2 Downsampling modes ........................................................................................... 53
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3.1.3 Image data output formats....................................................................................... 54
3.2 Acquisition modes ........................................................................................................ 55
3.2.1 Free-Run ........................................................................................................ 55
3.2.2 Trigger controlled acquisition/exposure........................................................................... 55
3.3 Exposure time ............................................................................................................ 57
3.4 Gain ...................................................................................................................... 57
3.5 Dual ADC modes.......................................................................................................... 58
3.5.1 Non-combined mode ............................................................................................ 59
3.5.2 Combined mode ................................................................................................. 60
3.6 API Features .............................................................................................................. 61
3.6.1 Exposure – Auto gain ............................................................................................ 61
3.6.2 White balance ................................................................................................... 61
3.6.3 Gamma.......................................................................................................... 61
3.6.4 Sharpness....................................................................................................... 61
3.6.5 Color correction matrix........................................................................................... 61
3.6.6 Sensor defect correction ......................................................................................... 61
4 Operation ....................................................................................................................... 62
4.1 System requirements ..................................................................................................... 62
4.1.1 Software requirements........................................................................................... 62
4.1.2 Hardware requirements.......................................................................................... 62
4.1.3 Connection and cables........................................................................................... 62
4.2 XIMEA software packages................................................................................................. 63
4.2.1 XIMEA Windows software package............................................................................... 63
4.2.2 XIMEA Linux software package................................................................................... 66
4.2.3 XIMEA macOS software package................................................................................. 68
4.3 XIMEA CamTool........................................................................................................... 71
4.4 XIMEA control panel ...................................................................................................... 72
4.5 Supported vision libraries ................................................................................................. 73
4.5.1 MathWorks MATLAB............................................................................................. 73
4.5.2 MVTec HALCON ................................................................................................. 73
4.5.3 National Instruments LabVIEW vision library ...................................................................... 73
4.5.4 OpenCV ......................................................................................................... 73
4.6 Programming ............................................................................................................. 74
4.6.1 Standard interface ............................................................................................... 74
4.6.2 xiAPI............................................................................................................. 74
5 Appendix ....................................................................................................................... 78
5.1 Troubleshooting and support .............................................................................................. 78
5.1.1 Worldwide support............................................................................................... 78
5.1.2 Before contacting technical support.............................................................................. 78
5.2 Frequently Asked Questions............................................................................................... 78
5.3 Product service request (PSR)............................................................................................. 79
5.3.1 Step 1 – Contact support ........................................................................................ 79
5.3.2 Step 2 – Create product service request (PSR) ................................................................... 79
5.3.3 Step 3 – Wait for Product Service Request (PSR) approval .. .. . .. .. .. . .. .. .. . .. .. . .. .. .. . .. .. .. . .. .. .. . .. .. . . . .. .. 79
5.3.4 Step 4 – Sending the camera to XIMEA .......................................................................... 79
5.3.5 Step 5 – Waiting for service conclusion .......................................................................... 79
5.3.6 Step 6 – Waiting for return delivery .............................................................................. 79
5.4 Safety instructions and precautions ....................................................................................... 80
5.4.1 Disassembly..................................................................................................... 80
5.4.2 Mounting / Screws............................................................................................... 80
5.4.3 Connections ..................................................................................................... 80
5.4.4 Power supply .................................................................................................... 80
5.4.5 Environment / protection against water........................................................................... 80
5.4.6 Recommended light conditions................................................................................... 80
5.4.7 Protection of optical components................................................................................. 81
5.4.8 Mechanical loads ................................................................................................ 81
5.4.9 Camera / lens cleaning .......................................................................................... 81
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5.4.10 Protect against static discharge (Electrostatic discharge (ESD)) . . .. .. .. . .. .. .. . .. .. . . . .. .. . .. .. .. . .. .. .. . .. .. .. . .. 81
5.4.11 Safety instruction for board level cameras........................................................................ 81
5.5 Warranty.................................................................................................................. 82
5.5.1 Disclaimer of Warranty........................................................................................... 82
5.6 Standard Terms & Conditions of XIMEA GmbH............................................................................. 83
5.7 List of Trademarks ........................................................................................................ 89
5.8 Copyright ................................................................................................................. 89
Glossary ............................................................................................................................ 90
List of gures ....................................................................................................................... 91
List of tables ........................................................................................................................ 93
XIMEA Technical Manual, Version: v230927 vi

1xiX-Xtreme camera series
1.1 What is xiX-Xtreme
xiX-Xtreme [ksi-x-treme: or sai-ex:tri:m] is the high-speed PCI express camera family with detachable sensor heads:
•Sony Pregius S sensors with 16.1 Mpx, 20.3 Mpx, and 24.5 Mpx
•Super-fast 32 Gbit/s data throughput to ensure 105 fps 24.5 Mpx up to 159 fps 16.1 Mpx enabled by PCIe X4G3
•The detachable sensor heads measure only 26 × 26 × 33 mm
–Sensor module is separable from camera electronics over distances up to 1 m
•Special sensor features like Dual ADC (HDR mode), short shutter interval time, and others
The xiX-Xtreme cameras offer the opportunity to reach the full sensor specications while still keeping the smallest possible form factor.
Our innovative approach separates the sensor head from the readout electronics, facilitating integration into the most conned spaces.
This separation not only optimizes spatial utility but also drastically reduces heat accumulation at the sensor, lowering noise levels and
enhancing image quality. The pixel size of 2.74 µm helps to use C-mount lenses thus further improving the cost-effectivity and enabling
miniature size for mobile and multiple camera systems.
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1.2 Advantages
Lightweight facilitates increased performance of robotic arms and gimbals or UAV / UAS
Efcient low power consumption and heat dissipation
Robust sturdy full metal jacket, no sheet metal covers
Adaptable customization options via Board level or connectors allow easy integration into OEM solutions
Economical removes bulky constructions and accessories saving energy and space at better prices
Simplistic straightforward way for easy multiple camera system, no workarounds, no frame grabbers
1.3 Camera applications
•automation
•ultra-fast 3D scanning
•miniature and fast robotic arms
•mobile devices
•in-situ optical inspection camera
•material and life science microscopy
•ophthalmology and retinal imaging
•broadcasting
•fast process capture, e.g. golf club swings
•Intelligent Transportations Systems (ITS) and trafc monitoring
•VR and AR
•vinematography
•sports
•unmanned vehicles
•UAV / drones etc
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1.4 Common features
Acquisition modes global shutter
Image data formats 8 bit, 10 bit, 12 bit RAW pixel data
Sensor technology CMOS
Sensor versions backside illuminated (BSI)
Partial image readout ROI, Skipping and Binning modes supported (model specic)
Interface PCI Express standard cable connector compliant to PCI Express external cabling specications
Color image processing Host based de-bayering, sharpening, Gamma, color matrix, true color CMS
Hot/blemish pixels correction on camera storage of up to 5000 px coordinates, host assisted correction
Auto adjustments auto white balance, auto gain, auto exposure
Flat eld corrections host assisted pixel level shading and lens corrections - this feature is being developed and tested
General purpose I/O I/O 1x opto-isolated input, 1x opto-isolated output, and 4x non-isolated bidirectional I/O, 4x user
congurable LEDs
Synchronization hardware trigger input, software trigger, exposure strobe output, busy output
Housing and lens mount Standard C-mount convertible to CS mount
Environment operating 0 to 50 ◦C on housing, RH 80 % non-condensing, −25 to 60 ◦C storage
Operating systems Windows, Linux Ubuntu, macOS
Software support xiAPI SDK, adapters and drivers for various image processing libraries
Firmware updates eld rmware update through xiCOP tool
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