XIMEA xiC User manual

xiC
[ksi-see: or sai-see:]
•USB 3.1 camera series
Technical Manual
Version 1.16, August, 2018

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1. Introduction
1.1. About This Manual
Dear customer,
Thank you for purchasing a product from XIMEA.
We hope that this manual can answer your questions, but should you have any further questions or if you wish to claim a
service or warranty case, please contact your local dealer or refer to the XIMEA Support on our website:
www.ximea.com/support
The purpose of this document is to provide a description of the XIMEA xiC-Series cameras and to describe the correct way to
install related software and drivers and run it successfully. Please read this manual thoroughly before operating your new
camera for the first time. Please follow all instructions and observe the warnings.
This document is subject to change without notice.
1.2. About XIMEA
XIMEA is one of the worldwide leaders for innovative camera solutions with more than 20-year history of research,
development and production of digital image acquisition systems. Based in Slovakia, Germany and the US and with a global
distributor network, XIMEA offers their cameras worldwide. In close collaboration with customers XIMEA has developed a
broad spectrum of technologies and cutting-edge, highly competitive products.
XIMEA's camera centric technology portfolio comprises a broad spectrum of digital technologies, from data interfaces such as
FireWire, USB 2.0, 3.0 and USB 3.1, to cooled digital cameras with CCD and CMOS sensors, as well as smart cameras with
embedded PCs, and X-ray cameras. XIMEA has three divisions –generic machine vision and integrated vision systems,
scientific imaging and OEM/custom.
XIMEA cameras find use in many industrial applications, such as motion control, robotics, or quality control in manufacturing.
The broad spectrum of cameras also includes thermally stabilized X-ray cameras, and specialty cameras for medical
applications, research, surveillance and defense.
1.2.1. Contact XIMEA
XIMEA is a worldwide operating Company
Headquarters
Sales worldwide
XIMEA GmbH
Am Mittelhafen 16
48155 Münster
Germany
Tel: [phone]
Fax: [phone]
Sales America
XIMEA Corp.
8725 W 14th Ave, Ste 110
Lakewood, CO 80215
USA
Tel: [phone]
Fax: [phone]
R&D, Production
XIMEA s.r.o.
Lesna 52
900 33 Marianka
Slovakia
Internet www.ximea.com
General inquiries [email protected]om
Sales [email protected]om
Support [e-mail]

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Standard Conformity
The xiC cameras have been tested using the following equipment:
Model option –UB (microB USB 3.1 conector)
•A shielded USB 3.0 cable ref. CBL-U3-3M0 (3m)
•A shielded I/O Sync cable ref. CBL-702-8P-SYNC-5M0 (5m)
Model option –TC (Type C connector in USB 3.1 Gen 1 mode)
•A shielded USB 3.1 Type-C to A cable (1m)
•A shielded I/O Sync cable ref. CBL-702-8P-SYNC-5M0 (5m)
Model option –FV and –FL
•Camera is connected to Tegra TX1 processor board via TX1CB-PHOXI-BRD and CBL-MQ-FL-0M1. Whole setup is housed
in AW16918ESS enclosure, with modified end panels to hold camera and provide access to power connector and Ethernet
connector. System is Linux operating system controlled over Ethernet from remote computer. For more information please
contact our support: https://www.ximea.com/support/wiki/allprod/Contact_Support
Warning: Changes or modifications to the product or the environment may render it ineligible for operation under CE, FCC or
other jurisdictions. XIMEA recommends using the above configuration to ensure compliance with the following standards.
Please refer also to chapter 1.2.9.
1.2.2. CE Conformity
The xiC cameras described in this manual comply with following requirements. Please refer also to chapter 1.2.9.
•EC EMC Directive 2004/108/EEC
electromagnetic compatibility of equipment
Used harmonized European standards and technical specifications:
•EN 55022:2006 + A2:2010
Information technology equipment –Radio disturbance characteristics –Limits and methods of measurement
•EN 55024:2010
Information technology equipment - Immunity characteristics - Limits and methods of measurement
•EN 61000-6-2:2005 Electromagnetic compatibility (EMC). Generic standards. Immunity for industrial environments
•EN 61000-6-3:2007 + A1:2011
Generic standards –Emission standard for residential, commercial and light-industrial environments
•EN 61000-4-2:2009 Electrostatic discharge immunity test
•EN 61000-4-3:2006 + A2:2010
Radiated, radio-frequency electromagnetic field immunity test
•EN 61000-4-4:2012 Electrical fast transient/burst immunity test
•EN 61000-4-6:2009 Immunity to conducted disturbances, induced by radio frequency fields
•EN 61000-6-1:2007 Generic standards –Immunity for residential, commercial and light-industrial environments
•EN 61326-1:2013
Electrical equipment for measurement, control and laboratory use. EMC requirements. General requirements
•EN 61000-4-8:2010
Electromagnetic compatibility (EMC). Testing and measurement techniques. Power frequency magnetic field immunity test
•EN 55016-2-3:2010
Specification for radio disturbance and immunity measuring apparatus and methods. Methods of measurement of
disturbances and immunity. Radiated disturbance measurements

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1.2.3. For customers in the US: FCC Conformity
The xiC cameras described in this manual have been tested and found to comply with Part 15 of the FCC rules, which states
that:
Operation is subject to the following two conditions:
•This device may not cause harmful interference, and
•This device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for Class A digital device, pursuant to part 15 of the FCC
rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated
in a commercial environment. This equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this
equipment in a residential area is likely to cause harmful interference in which case the users will be required to correct the
interference at their own expense.
You are cautioned that any changes or modifications not expressly approved in this manual could void your authority to operate
this equipment under above jurisdictions. The shielded interface cable recommended in this manual must be used with this
equipment in order to comply with the limits for a computing device pursuant to Subpart J of Part 15 of FCC Rules.
Please refer also to chapter 1.2.9
1.2.4. For customers in Canada
The xiC cameras comply with the Class A limits for radio noise emissions set out in Radio Interference Regulations.
Please refer also to chapter 1.2.9
1.2.5. RoHS Conformity
The xiC cameras comply with the requirements of the RoHS (Restriction of Hazardous Substances) Directive
2011/65/EU.
1.2.6. WEEE Conformity
The xiC cameras comply with the requirements of the WEEE (waste electrical and electronic equipment) Directive
2003/108/EC.
1.2.7. AIA standard USB3 Vision
The xiC cameras are compliant with the USB 3.0 SuperSpeed specification and are designed to be
compliant with the AIA USB3 Vision standard.
1.2.8. GenICam GenTL API
GenICam standard transport layer interface, grabbing images. GenICam/GenTL provides an agnostic transport layer interface
to acquire images or other data and to communicate with a device. Each XIMEA camera can be GenTL Producer.
1.2.9. Camera Sub-Assemblies
The FL and FV camera models are "semi" housed with flex ribbon cable interfaces. As such, these devices do not comply with
CE/FCC/Class A limits (Canada) regulations. The system integrator (customer) is liable for compliance with CE/FCC/ Class A
limits (Canada) regulations.

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1.3. Helpful Links
•XIMEA Homepage http://www.ximea.com/
•xiC USB3 Vision Camera Zone http://www.ximea.com/usb3zone
•USB3 Hardware Compatibility http://www.ximea.com/support/wiki/usb3/Compatible_hardware
•USB3.1 Updates https://www.ximea.com/support/wiki/usb3/USB_31_updates
•xiAPI stable versions download https://www.ximea.com/support/documents/4
•xiAPI beta versions download https://www.ximea.com/support/documents/14
•Frequently Asked Questions http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions
•Knowledge Base http://www.ximea.com/support/wiki/allprod/Knowledge_Base
•Vision Libraries http://www.ximea.com/support/projects/vision-libraries/wiki
•XIMEA Registration http://www.ximea.com/en/products/register
•XIMEA Live Support http://www.ximea.com/support/wiki/allprod/XIMEA_Live_Support
•XIMEA General Terms & Conditions http://www.ximea.com/en/corporate/generaltc

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1.4. Table of Contents
1. Introduction................................................................................................................................................................2
1.1. About This Manual.............................................................................................................................................2
1.2. About XIMEA .....................................................................................................................................................2
1.2.1. Contact XIMEA..........................................................................................................................................2
1.2.2. CE Conformity...........................................................................................................................................3
1.2.3. For customers in the US: FCC Conformity ...................................................................................................4
1.2.4. For customers in Canada...........................................................................................................................4
1.2.5. RoHS Conformity.......................................................................................................................................4
1.2.6. WEEE Conformity ......................................................................................................................................4
1.2.7. AIA standard USB3 Vision..........................................................................................................................4
1.2.8. GenICam GenTL API..................................................................................................................................4
1.2.9. Camera Sub-Assemblies ...........................................................................................................................4
1.3. Helpful Links .....................................................................................................................................................5
1.4. Table of Contents...............................................................................................................................................6
2. xiC Camera Series ....................................................................................................................................................11
2.1. What is xiC......................................................................................................................................................11
2.2. Advantages .....................................................................................................................................................11
2.3. USB3 Vision Camera Applications .....................................................................................................................12
2.4. Common features ............................................................................................................................................12
2.5. Model Nomenclature........................................................................................................................................13
2.6. Models Overview, sensor and models ...............................................................................................................14
2.7. Accessories.....................................................................................................................................................14
3. Hardware Specification .............................................................................................................................................15
3.1. Power Supply ..................................................................................................................................................15
3.2. General Specification .......................................................................................................................................15
3.2.1. Environment ...........................................................................................................................................15
3.2.2. Firmware / Host driver / API features........................................................................................................15
3.3. Lens Mount.....................................................................................................................................................16
3.3.1. Screws...................................................................................................................................................16
3.4. Optical path.....................................................................................................................................................17
3.4.1. Filter glasses ..........................................................................................................................................17
3.4.2. Monochrome and near infrared extended camera models..........................................................................17
3.4.3. Color camera models ..............................................................................................................................18
3.5. Model Specific Characteristics..........................................................................................................................19
3.5.1. MC023xG-SY .........................................................................................................................................19
3.5.1.1. Sensor and camera parameters ......................................................................................................19
3.5.1.2. Quantum efficiency curves [%]........................................................................................................20
3.5.1.3. Dimensional drawings MC023xG-SY-TC (C-mount [with C/CS mount module B]) ...............................20
3.5.1.4. Dimensional drawings MC023xG-SY-UB (C-mount [with C/CS mount module B]) ...............................21
3.5.1.5. Dimensional drawings MC023xG-SY-FL (C-mount [with C/CS mount module B])................................22
3.5.1.6. Dimensional drawings MC023xG-SY-FV (C-mount [with C/CS mount module B])................................23
3.5.1.7. Referenced documents...................................................................................................................23
3.5.1.8. Sensor features..............................................................................................................................23
3.5.2. MC031xG-SY .........................................................................................................................................24
3.5.2.1. Sensor and camera parameters ......................................................................................................24

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3.5.2.2. Quantum efficiency curves [%]........................................................................................................25
3.5.2.3. Dimensional drawings MC031xG-SY-TC (C-mount [with C/CS mount module B]) ...............................26
3.5.2.4. Dimensional drawings MC031xG-SY-UB (C-mount [with C/CS mount module B]) ...............................26
3.5.2.5. Dimensional drawings MC031xG-SY-FL (C-mount [with C/CS mount module B])................................27
3.5.2.6. Dimensional drawings MC031xG-SY-FV (C-mount [with C/CS mount module B])................................28
3.5.2.7. Referenced documents...................................................................................................................28
3.5.2.8. Sensor features..............................................................................................................................28
3.5.3. MC050xG-SY .........................................................................................................................................29
3.5.3.1. Sensor and camera parameters ......................................................................................................29
3.5.3.2. Quantum efficiency curves [%]........................................................................................................30
3.5.3.3. Dimensional drawings MC050xG-SY-TC (C-mount [with C/CS mount module B]) ...............................31
3.5.3.4. Dimensional drawings MC050xG-SY-UB (C-mount [with C/CS mount module B]) ...............................31
3.5.3.5. Dimensional drawings MC050xG-SY-FL (C-mount [with C/CS mount module B])................................32
3.5.3.6. Dimensional drawings MC050xG-SY-FV (C-mount [with C/CS mount module B])................................33
3.5.3.7. Referenced documents...................................................................................................................33
3.5.3.8. Sensor features..............................................................................................................................33
3.5.4. MC089xG-SY .........................................................................................................................................34
3.5.4.1. Sensor and camera parameters ......................................................................................................34
3.5.4.2. Quantum efficiency curves [%]........................................................................................................35
3.5.4.3. Dimensional drawings MC089xG-SY-TC (C-mount [with C/CS mount module B]) ...............................36
3.5.4.4. Dimensional drawings MC089xG-SY-UB (C-mount [with C/CS mount module B]) ...............................36
3.5.4.5. Dimensional drawings MC089xG-SY-FL (C-mount [with C/CS mount module B])................................37
3.5.4.6. Dimensional drawings MC089xG-SY-FV (C-mount [with C/CS mount module B])................................38
3.5.4.7. Referenced documents...................................................................................................................38
3.5.4.8. Sensor features..............................................................................................................................38
3.5.5. MC124xG-SY .........................................................................................................................................39
3.5.5.1. Sensor and camera parameters ......................................................................................................39
3.5.5.2. Quantum efficiency curves [%]........................................................................................................40
3.5.5.3. Dimensional drawings MC124xG-SY-TC (C-mount [with C mount module B]).....................................41
3.5.5.4. Dimensional drawings MC124xG-SY-UB (C-mount [with C mount module B]) ....................................41
3.5.5.5. Dimensional drawings MC124xG-SY-FL (C-mount [with C/CS mount module B])................................42
3.5.5.6. Dimensional drawings MC124xG-SY-FV (C-mount [with C mount module B]).....................................43
3.5.5.7. Referenced documents...................................................................................................................43
3.5.5.8. Sensor features..............................................................................................................................43
3.6. User interface –LEDs ......................................................................................................................................44
3.7. xiC USB 3.1 Gen1 Type-C Interface ..................................................................................................................45
3.7.1. Type-C connector location.......................................................................................................................45
3.7.2. Pinning...................................................................................................................................................45
3.8. xiC USB 3.1 Gen1 micro B Interface..................................................................................................................46
3.8.1. USB 3.1 micro B Location........................................................................................................................46
3.8.2. Pinning...................................................................................................................................................46
3.9. xiC Flex cable interface ....................................................................................................................................47
3.9.1. Flex Connection Location.........................................................................................................................47
3.9.2. Pinning...................................................................................................................................................47
3.9.3. Inserting / detaching FPC cable................................................................................................................48
3.10. xiC Digital Input / Output (GPIO) Interface ..........................................................................................................51

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3.10.1. Location .................................................................................................................................................51
3.10.2. IO Connector Pinning ..............................................................................................................................51
3.10.3. Optically isolated Digital Input ..................................................................................................................52
3.10.3.1. Optically isolated Digital Input - General info ....................................................................................52
3.10.3.2. Digital Input –signal levels .............................................................................................................52
3.10.3.3. Digital Input –Internal Schematic....................................................................................................53
3.10.3.4. Digital Input –Wiring......................................................................................................................53
3.10.3.5. Digital Input –Timing .....................................................................................................................54
3.10.4. Optically isolated Digital Output................................................................................................................54
3.10.4.1. Optically isolated Digital Output - General info..................................................................................54
3.10.4.2. Optically isolated Digital Output Delay..............................................................................................54
3.10.4.3. Optically isolated Digital Output –Internal schematic........................................................................55
3.10.4.4. Digital Output –Wiring ...................................................................................................................55
3.10.4.5. Digital Output –Timing...................................................................................................................60
3.10.5. Non-isolated Digital Lines (-UB and -TC only)............................................................................................61
3.10.5.1. Non-isolated Digital Input/Output (INOUT) General info......................................................................61
3.11. External power supply input (AUX).....................................................................................................................61
3.12. Heat Dissipation...............................................................................................................................................62
3.13. CBL-U3-1M0 / CBL-U3-3M0 / CBL-U3-5M0.....................................................................................................63
3.14. CBL-U3-3M0-ANG...........................................................................................................................................64
3.15. CBL-MQ-FL-0M1.............................................................................................................................................65
3.16. BOB-MQ-FL ....................................................................................................................................................65
3.17. CBL-702-8P-SYNC-5M0..................................................................................................................................66
3.18. Tripod Adapter –MECH-MC-BRACKET-KIT........................................................................................................67
3.18.1. Dimensional drawings .............................................................................................................................67
3.19. USB 3 host adapters ........................................................................................................................................68
4. Operation.................................................................................................................................................................69
4.1. System Requirements ......................................................................................................................................69
4.1.1. Software Requirements ...........................................................................................................................69
4.1.2. Hardware Requirements ..........................................................................................................................69
4.1.2.1. System Configuration .....................................................................................................................69
4.1.2.2. USB 3.1 Host Adapter ....................................................................................................................70
4.1.2.3. Cables...........................................................................................................................................70
4.2. Video Formats .................................................................................................................................................71
4.2.1. Full Resolution ........................................................................................................................................71
4.2.2. ROIs –Region Of Interest ........................................................................................................................71
4.2.3. Downsampling Modes.............................................................................................................................71
4.2.3.1. Binning..........................................................................................................................................71
4.2.3.2. Skipping ........................................................................................................................................71
4.2.4. Image Data Output Formats.....................................................................................................................72
4.2.5. Digitization bit depth................................................................................................................................73
4.3. Acquisition modes ...........................................................................................................................................74
4.3.1. Free-Run................................................................................................................................................74
4.3.2. Trigger controlled Acquisition/Exposure ....................................................................................................74
4.3.2.1. Triggered acquisition - single frame ................................................................................................75
4.3.2.2. Triggered acquisition - burst of frames ............................................................................................76

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4.3.2.3. Exposure defined by trigger pulse length .........................................................................................76
4.3.2.4. Multiple exposures in one frame .....................................................................................................77
4.4. Camera Parameters and Features.....................................................................................................................78
4.4.1. Exposure Time........................................................................................................................................78
4.4.2. Gain.......................................................................................................................................................78
4.5. Host-Assisted Image Processing Parameters Available in xiAPI. ..........................................................................78
4.5.1. Auto Exposure –Auto Gain......................................................................................................................78
4.5.2. White Balance ........................................................................................................................................78
4.5.2.1. Assisted Manual White Balance ......................................................................................................78
4.5.2.2. Auto White Balance........................................................................................................................78
4.5.3. Gamma..................................................................................................................................................78
4.5.4. Sharpness ..............................................................................................................................................78
4.5.5. Color Correction Matrix............................................................................................................................79
4.5.6. Sensor Defect Correction.........................................................................................................................79
5. Software ..................................................................................................................................................................80
5.1. Accessing the Camera .....................................................................................................................................80
5.1.1. Proprietary API........................................................................................................................................80
5.1.2. Standard Interface ..................................................................................................................................80
5.1.2.1. GenICam .......................................................................................................................................80
5.1.2.2. USB3 Vision...................................................................................................................................80
5.1.3. Vision Library Integration .........................................................................................................................80
5.2. XIMEA CamTool...............................................................................................................................................81
5.3. Supported Vision Libraries................................................................................................................................83
5.3.1. Libraries maintained by XIMEA.................................................................................................................83
5.3.1.1. MathWorks MATLAB ......................................................................................................................83
5.3.1.2. MVTec HALCON.............................................................................................................................83
5.3.1.3. National Instruments LabVIEW Vision Library....................................................................................83
5.3.1.4. OpenCV.........................................................................................................................................83
5.4. XIMEA Windows Software Package...................................................................................................................84
5.4.1. Contents ................................................................................................................................................84
5.4.2. Installation..............................................................................................................................................84
5.5. XIMEA Linux Software Package.........................................................................................................................87
5.5.1. Contents ................................................................................................................................................87
5.5.2. Installation..............................................................................................................................................87
5.6. XIMEA macOS Software Package......................................................................................................................89
5.6.1. Contents ................................................................................................................................................89
5.6.2. Installation..............................................................................................................................................89
5.6.3. Start XIMEA CamTool ..............................................................................................................................90
5.7. Programming ..................................................................................................................................................91
5.7.1. XIMEA APIs.............................................................................................................................................91
5.7.2. xiAPI Overview ........................................................................................................................................91
5.7.3. xiAPI Functions Description......................................................................................................................91
5.7.4. xiAPI Parameters Description...................................................................................................................92
5.7.5. xiAPI Examples .......................................................................................................................................92
5.7.5.1. Connect Device..............................................................................................................................92
5.7.5.2. Parameterize Device.......................................................................................................................92

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5.7.5.3. Acquire Images..............................................................................................................................93
5.7.5.4. Control Digital Input / Output (GPIO) ................................................................................................93
5.7.6. xiAPI Auto Bandwidth Calculation.............................................................................................................94
5.7.7. USB3 Vision............................................................................................................................................94
5.7.8. GenICam ................................................................................................................................................94
5.8. XIMEA Control Panel ........................................................................................................................................95
6. Appendix..................................................................................................................................................................96
6.1. Troubleshooting and Support............................................................................................................................96
6.1.1. Worldwide Support..................................................................................................................................96
6.1.2. Before Contacting Technical Support........................................................................................................96
6.1.3. Frequently Asked Questions.....................................................................................................................96
6.1.3.1. What is USB 3.1 Gen 1 SuperSpeed?..............................................................................................96
6.1.3.2. What is the real transfer speed?......................................................................................................97
6.1.3.3. Why can I not achieve maximum transfer speed?.............................................................................97
6.1.3.4. What voltage should be applied to Digital Input of xiC to turn it on/off? ..............................................97
6.1.3.5. What is the implementation of Digital Output (VDO) of xiC? ...............................................................97
6.2. Product service request (PSR)...........................................................................................................................98
6.2.1. Step 1 - Contact Support.........................................................................................................................98
6.2.2. Step 2 - Create Product Service Request (PSR).........................................................................................98
6.2.3. Step 3 - Wait for PSR Approval ................................................................................................................98
6.2.4. Step 4 - Sending the camera to XIMEA.....................................................................................................98
6.2.5. Step 5 - Waiting for Service Conclusion....................................................................................................98
6.2.6. Step 6 - Waiting for return delivery...........................................................................................................98
6.3. Safety instructions and precautions...................................................................................................................99
6.3.1. Disassembling ........................................................................................................................................99
6.3.2. Mounting / Screwing ...............................................................................................................................99
6.3.3. Connections ...........................................................................................................................................99
6.3.4. Power supply..........................................................................................................................................99
6.3.5. Environment / protect against water.........................................................................................................99
6.3.6. Recommended light conditions. ...............................................................................................................99
6.3.7. Protect the optical components..............................................................................................................100
6.3.8. Mechanical loads..................................................................................................................................100
6.3.9. Camera / lens cleaning..........................................................................................................................100
6.3.10. Protect against static discharge (ESD) ....................................................................................................100
6.4. Warranty .......................................................................................................................................................100
6.5. Disclaimer of Warranty...................................................................................................................................101
6.6. List Of Trademarks ........................................................................................................................................101
6.7. Standard Terms & Conditions of XIMEA GmbH.................................................................................................101
6.8. Copyright ......................................................................................................................................................106
6.9. Revision History .............................................................................................................................................106
7. Glossary.................................................................................................................................................................107
8. list of figures ..........................................................................................................................................................108
9. list of tables ...........................................................................................................................................................111

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2. xiC Camera Series
2.1. What is xiC
xiC [ksi-see: or sai-see:] is an ultra-compact USB 3.1 (gen 1) Industrial camera family with outstanding features:
•Extremely small footprint, very light
•Low power consumption
•USB3 Vision Standard compatible
•sensors: 2.3 MP, 3.1 MP, 5.0 MP, 8.9 MP and 12.4 MP, b/w, color Sony sensors
•frame rates: 2.3 MP @ 165 fps to 12.4 MP @ 31 fps
The XiC camera line comes with several options for interface to the host computer; standard USB (type-C and micro-B) and
custom flex line connections. At the time of writing, the USB cameras utilize USB 3.1 gen1 definitions and yield a bandwidth of
about 450 Mbyte/s. The cameras are backward compatible with USB 3.0 and 2.0 (with concomitant reduction in pixel
throughput).
2.2. Advantages
Industry standard interface
USB 3.1 Gen1
AIA standard compatibility
USB3 Vision standard
Small
Fits into places where no other camera can fit
Low power consumption
2.2-3.5 W
Powerful
5Gb/s interface up to 450Mbyte/s data throughput for USB3.1 gen1
Fast
High speed, high frame rate: >650fps at VGA and 30fps at 12Mpix resolutions
Robust
Full metal housing, no sheet metal covers
Lightweight
Facilitates increased performance of robotic arms and gimbals
Connectivity
Programmable opto-isolated I/O, and non-isolated digital input and output. 4 status LEDs
Compatibility
Support for Windows, Linux and MacOS, ARM, various Image Processing Libraries
Software interfaces
GenICam / GenTL and highly optimized xiAPI SDK
Economical
Excellent value and price, low TCO and fast ROI
table 2-1, advantages

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2.3. USB3 Vision Camera Applications
•Automation
•Ultra-fast 3D scanning
•Miniature and fast robotic arms
•Mobile devices
•In-situ optical inspection camera
•Material and life science microscopy
•Ophthalmology and retinal imaging
•Broadcasting
•Fast process capture, e.g. golf club swings
•Intelligent Transportations Systems (ITS) and traffic monitoring
2.4. Common features
Sensor Technology
CMOS, Global shutter
Acquisition Modes
Continuous, software and hardware trigger, fps limiting, triggered exposure and burst
Partial Image Readout
ROI, Skipping and Binning modes supported (model specific)
Image data formats
8, 10 or 12 bit RAW pixel data
Color image processing
Host based de-bayering, sharpening, Gamma, color matrix, true color CMS
Hot/blemish pixels correction
On camera storage of up to 5000 pixel coordinates, host assisted correction
Auto adjustments
Auto white balance, auto gain, auto exposure
Flat field corrections
Host assisted pixel level shading and lens corrections
Image Data and Control
Interface
USB 3.1 standard Micro B and standard Type-C with screw lock threads and flat ribbon
for embedded implementation compliant to USB3 Vision standard
General Purpose I/O
1x opto-isolated input, 1x opto-isolated output, and 2 non-isolated bidirectional I/O, 4X
user configurable LEDs
Signal conditioning
Programmable debouncing time (planned)
Synchronization
Hardware trigger input, software trigger, exposure strobe output, busy output
Housing and lens mount
Standard C-mount convertible to CS mount, and “semi-housed”
Power requirements
2.2-3.5W, supplied via USB 3.1 interface
Environment
Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 60°C storage
Ingress Protection: IP40
Operating systems
Windows 10 (x86 and x64), Windows 7 (x86 and x64), Linux Ubuntu, MacOS 10.8 and
newer
Software support
xiAPI SDK, adapters and drivers for various image processing packages
Firmware updates
Field firmware updatable
table 2-2, common features

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2.5. Model Nomenclature
Part number convention for the different models:
MCxxxyG-zz[-OPT]n
MC xiC family name
xxx: Resolution in 0.1 MPixel. E.g. 2.3 MPixel Resolution: xxx = 023
y: y=C: color model
y=M: black & white model
G: Global shutter (all XiC cameras are global shutter)
zz: Vendor of the sensor
zz = SY: Sony
[-OPT]: Options
OPT = TC: connector Type-C
OPT = UB: connector micro B
OPT = FL: flexline variant, connector parallel to board, semi-housed
OPT = FV: flexline variant, connector perpendicular to board, semi-housed

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2.6. Models Overview, sensor and models
Model1
Resolution
Pixel
size
ADC [bit]
DR
Optical
size
Sensor
diagonal
FPS2
MC023MG-SY
b/w
1936 x 1216
5.86 µm
10/12
71.7 dB
1/1.2”
13.4 mm
165
MC023CG-SY
Color
MC031MG-SY
b/w
2064 x 1544
3.45 µm
8/10/12
70.8 dB
1/1.8”
8.9 mm
122
MC031CG-SY
Color
MC050MG-SY
b/w
2464 x 2056
3.45 µm
8/10/12
70.8 dB
2/3”
11.1 mm
76
MC050CG-SY
Color
MC089MG-SY
b/w
4112 x 2176
3.45 µm
8/10/12
70.5 dB
1”
16.1 mm
43
MC089CG-SY
Color
MC124MG-SY
b/w
4112 x 3008
3.45 µm
8/10/12
70.5 dB
1.1”
17.6 mm
31
MC124CG-SY
Color
table 2-3, models overview
Note: 1) In the model name please add
-TC for USB 3.1 Gen1 Type C
-UB for USB 3.1 Gen1 Micro B
-FL for flat-flex cable connecting from the bottom of the camera
-FV for flat-flex cable connecting perpendicular to the sensor
2) Full resolution, 8-bit RAW
2.7. Accessories
The following accessories are available (short list):
Item P/N
Description
CBL-U3-1M0
1.0m USB 3.0 cable, micro B connector on camera side
CBL-U3-3M0
3.0m USB 3.0 cable, micro B connector on camera side
CBL-U3-3M0-ANG
3.0m USB 3.0 cable, angled micro B USB3 connector
CBL-U3-5M0
5.0m USB 3.0 cable, micro B connector on camera side
MECH-MC-BRACKET-KIT
xiC series tripod mounting bracket with Screws Kit
CBL-MQ-FL-0M1
Cable FPC MQ/MC Flex-Line, 0.1m
BOB-MQ-FL
Break Out Board, Flex-Line, Simple Board Level Micro-B USB3.0
U31PE1G3-V1-X21
PCI express adapter, 2x USB 3.1 ports asmedia ASM1142, xHCI
U3PE-FL1100-X41
PCI express adapter, 4x USB 3.0 ports, PCIe x4 slot
CBL-702-8P-SYNC-5M0
5.0m Trigger/Sync I/O cable
table 2-4, accessories
Note: 1)For more information please visit:
https://www.ximea.com/support/projects/usb3/wiki/USB_3_Host_Adapters

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3. Hardware Specification
3.1. Power Supply
The xiC cameras are powered via the USB Micro-B, type C or flexline connector. The input voltage is 5 V DC. The power
consumption is 2.2 -3.5W depending on the xiC model.
Power supply, via USB system connector:
•5 V (nominal)
•4.45 V to 5.5 V (at the camera connector)
Additionally, the models with Micro-B (-UB) and type-C (-TC) connector can use external power supply, with same requirements
as power supply defined above. For information about connection please see chapter: 3.9.3 Inserting / detaching FPC cable
•When inserting or detaching cables increased caution need to be taken, to prevent connector or cable damage. MC
cameras interface connectors are equipped with locking mechanism. When locked pulling the cable may lead to damage of
connector or camera. When manipulating with cable the power supply for the camera must be turned off.
Cable have marked ends. It is important to connect the end marked “CAM” to the camera and end marked “BOB” to host or
adapter. Swapped orientation can cause damage to camera. It is important that the power is turned off when
inserting/detaching the cable.
figure 3-38, MC FPC cable laser marking
Inserting FPC cable MC option -FL
Open connector lock
Insert cable

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Close connector lock
figure 3-39, MC FPC insert procedure option -FL

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Detaching FPC cable MX X2G2 option –FL
Open connector lock
Pull cable gently in marked direction.
figure 3-40, MC FPC detach procedure option -FL
Inserting FPC cables MC option -FV
Open connector lock
Insert cable
Close connector lock.
figure 3-41 MC FPC insert procedure option -FV

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Detaching FPC cable MX X2G2 option –FV
Open connector lock
Pull gently the cable out as marked.
figure 3-42, MC FPC detach procedure option -FV

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xiC Digital Input / Output (GPIO) Interface and 3.11 External power supply input (AUX).
Power supply, via Digital Input / Output (GPIO) Interface connector:
•5 V (nominal)
•4.45 V to 5.5 V (at the camera connector)
3.2. General Specification
3.2.1. Environment
Description
Symbol
Value
Optimal ambient temperature operation
Topt
+10 to +25 °C
Ambient temperature operation
Tmax
+0 to +50 °C
Ambient temperature for storage and transportation
Tstorage
-30 to +60 °C
Relative Humidity, non-condensing
RH
80 %
table 3-1, environment
Housing temperature must not exceed +65°C. It is recommended to mount the camera on heat conductive structure to
improve heat dissipation. The following parameters are not guaranteed if the camera is operated outside the optimum range:
•Dark current
•Dynamic Range
•Linearity
•Acquisition and readout noise
•S/N ratio, durability
Please refer to chapter 3.12 Heat Dissipation.
3.2.2. Firmware / Host driver / API features
Description
Value
Interpolation methods
Proprietary
White balance coefficients ranges
0.0 to 3.9
Sharpness filter
-400 to 400 %
Gamma
0.3 to 1.0
Full color correction matrix (3+1)x3 coefficients ranges
-3.9 to 3.9
table 3-2, firmware / API features
More details on API/SDK features are available at XIMEA support pages: https://www.ximea.com/support/wiki/apis/APIs

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3.3. Lens Mount
The xiC cameras are compatible with C-mount and CS-mount lenses.
figure 3-1, position C/CS-Mount module B
The cameras are delivered with C-mount back focal length. By removing the “C/CS-Mount module B” (see the figure above)
the camera can be rebuilt to CS-mount compatibility. Effectively reducing the back focal distance and overall length of camera
by 5mm. The required M2x8mm special screws are part of the camera delivery. The length of the lens thread is 6.5 mm.
Please read the chapter 3.4 Optical path carefully. Conversion between those two options is described:
https://www.ximea.com/support/projects/usb3/wiki/Convert_C_to_CS_Mount
Note: The distance between the threaded flange and the surface of the filter glass is 11.9 mm in case of C-Mount and 6.9
mm in case of CS-Mount. To avoid damaging of the filter glass, nothing may extend deeper into the housing.
Lens mount adapter configuration:
•C-Mount (with C/CS Mount module B)
•CS-Mount (without C/CS Mount module B)
3.3.1. Screws
All mounting screws are customized M2 screws with different lengths.
Technical details:
Material
Steel
Surface
Black zinc
Thread
M2
Driver
PH 00
Avail. Lengths
3mm –24 mm
table 3-3, custom screws, technical details
Drawings, e.g. with 10mm length:
figure 3-2, xiC mounting screws
Note: Never exceed a maximum torque of 0.3Nm when fastening the M2 mounting screws.
C/CS-Mount module B