XIMEA xiB64 Series User manual

xiB xiB64
[ksi-bee: or sai-bee:]
•PCI Express camera series
Technical Manual
Version 1.06, August 2018

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1. Introduction
1.1. About This Manual
Dear customer,
Thank you for purchasing a product from XIMEA.
We hope that this manual can answer your questions, but should you have any further questions or if you wish to claim a
service or warranty case, please contact your local dealer or refer to the XIMEA Support on our website:
www.ximea.com/support
The purpose of this document is to provide a description of the XIMEA xiB and xiB64-Series cameras and to describe the correct
way to install related software and drivers and run it successfully. Please read this manual thoroughly before operating your new
camera for the first time. Please follow all instructions and observe the warnings.
This document is subject to change without notice.
1.2. About XIMEA
XIMEA is one of the worldwide leaders for innovative camera solutions with a 20-year history of research, development and
production of digital image acquisition systems. Based in Slovakia, Germany and the US and with a global distributor network,
XIMEA offers their cameras worldwide. In close collaboration with customers XIMEA has developed a broad spectrum of
technologies and cutting-edge, highly competitive products.
XIMEA's camera centric technology portfolio comprises a broad spectrum of digital technologies, from data interfaces such as
FireWire, USB 2.0, 3.0 and USB 3.1, PCIe and PCIe based aggregation to cooled digital cameras with CCD and CMOS sensors,
as well as smart cameras with embedded PCs, and X-ray cameras. XIMEA has three divisions –generic machine vision and
integrated vision systems, scientific imaging and OEM/custom.
XIMEA cameras find use in many industrial applications, such as motion control, robotics, or quality control in manufacturing.
The broad spectrum of cameras also includes thermally stabilized X-ray cameras, and specialty cameras for medical
applications, research, surveillance and defense.
1.2.1. Contact XIMEA
XIMEA is a worldwide operating Company
Headquarters
Sales worldwide
XIMEA GmbH
Am Mittlehafen 16
48155 Münster
Germany
Tel: [phone]
Fax: [phone]
Sales America
XIMEA Corp.
8725 W 14th Ave, Ste 110
Lakewood, CO 80215
USA
Tel: [phone]
Fax: [phone]
R&D, Production
XIMEA s.r.o.
Lesna 52
900 33 Marianka
Slovakia
Internet www.ximea.com
General inquiries [email protected]om
Sales [email protected]om
Support [e-mail]

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1.3. Standard Conformity
The xiB cameras have been tested using the following equipment:
•Camera with lens Canon EF 50mm 1:1.8 and EF lens mount adapter
•IPASSTM PCIe x4 cable, 7m length, MOLEX type 74546-0407 (XIMEA P/N: CBL-PCI-COP-7M0)
•IPASSTM PCIe x4 cable, 3m length, MOLEX type 74546-0403, (XIMEA P/N: CBL-PCI-COP-3M0)
•10 meter PCIe Gen2 x4, fiber optics cable, Samtec type PCIE-4G2-010.0-11 (XIMEA P/N: CBL-PCI-FIB- 10M0)
•3 meter xiB series power/sync cable, 12 poles, type A65-3786 (revision 05) (XIMEA P/N: CBL-CBSYNC-3M0)
•Tripod adapter (XIMEA P/N: MECH-60MM-BRACKET-T)
•AC power adapter M+R Multitronik GmbH, Model BACS30M-24V-C8, 24V DC/1.25A (S/N:30240-0000198), (XIMEA P/N:
BACS30M-24-C8)
The xiB-64 models have not been certified, yet...
Warning: Changes or modifications to the product may render it ineligible for operation under CE, FCC or other jurisdictions.
XIMEA recommends using the above configuration to ensure compliance with the following standards:
1.3.1. CE Conformity
The xiB cameras described in this manual comply with the requirements of the
•EC EMC Directive 2004/108/EEC
electromagnetic compatibility of equipment
Used harmonized European standards and technical specifications:
•EN 55022:2006 + A2:2010
Information technology equipment –Radio disturbance characteristics –Limits and methods of measurement
•EN 55024:2010
Information technology equipment - Immunity characteristics - Limits and methods of measurement
•EN 60950-1
Information technology equipment –Safety –Part 1: General requirements
•EN 61000-6-2:2005 Electromagnetic compatibility (EMC). Generic standards. Immunity for industrial environments
•EN 61000-6-3:2007 + A1:2011
Generic standards –Emission standard for residential, commercial and light-industrial environments
•EN 61000-6-4:2007 + A1:2011
Electromagnetic compatibility (EMC) - Part 6-4: Generic standards - Emission standard for industrial environments
•EN 61000-4-2:2009 Electrostatic discharge immunity test
•EN 61000-4-3:2006 + A2:2010
Radiated, radio-frequency electromagnetic field immunity test
•EN 61000-4-4:2012 Electrical fast transient/burst immunity test
•EN 61000-4-6:2009 Immunity to conducted disturbances, induced by radio frequency fields
•EN 61000-6-1:2007 Generic standards –Immunity for residential, commercial and light-industrial environments
1.3.2. For customers in the US: FCC Conformity
The xiB cameras described in this manual have been tested and found to comply with Part 15 of the FCC rules, which states
that:
Operation is subject to the following two conditions:
•This device may not cause harmful interference, and
•This device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for Class A digital device, pursuant to part 15 of the FCC
rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in
a commercial environment. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used
in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the users will be required to correct the interference at
their own expense.

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You are cautioned that any changes or modifications not expressly approved in this manual could void your authority to operate
this equipment under above jurisdictions. The shielded interface cable recommended in this manual must be used with this
equipment in order to comply with the limits for a computing device pursuant to Subpart J of Part 15 of FCC Rules.
The xiB-64 models have not been certified, yet.
1.3.3. For customers in Canada
The xiB cameras comply with the Class A limits for radio noise emissions set out in Radio Interference Regulations.
The xiB-64 models have not been certified, yet.
1.3.4. RoHS Conformity
The xiB & xiB-64 cameras comply with the requirements of the RoHS (Restriction of Hazardous Substances) Directive
2011/65/EU.
1.3.5. WEEE Conformity
The xiB and xiB-64 cameras comply with the requirements of the WEEE (waste electrical and electronic equipment) Directive
2003/108/EC.
1.3.6. GenICam GenTL API
GenICam standard transport layer interface, grabbing images. GenICam/GenTL provides an agnostic transport layer interface
to acquire images or other data and to communicate with a device. Each XIMEA camera can be GenTL Producer.
1.4. Helpful Links
•Ximea Homepage
http://www.ximea.com/
•xiB product page
https://www.ximea.com/en/pci-express-camera/pci-express-camera-
cmv12000-cmv20000
•PCI Express support page
https://www.ximea.com/support/wiki/xib/PCI_Express_camera_-_xiB
•Quick start guide
https://www.ximea.com/support/wiki/xib/Quick_Start_Guide
•xiAPI stable versions download
https://www.ximea.com/support/documents/4
•xiAPI beta versions download
https://www.ximea.com/support/documents/14
•Frequently Asked Questions
http://www.ximea.com/support/wiki/allprod/Frequently_Asked_Questions
•Knowledge Base
http://www.ximea.com/support/wiki/allprod/Knowledge_Base
•Vision Libraries
http://www.ximea.com/support/projects/vision-libraries/wiki
•XIMEA Registration
http://www.ximea.com/en/products/register
•XIMEA Live Support
http://www.ximea.com/support/wiki/allprod/XIMEA_Live_Support
•XIMEA General Terms &
Conditions
http://www.ximea.com/en/corporate/generaltc

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1.4.1. Table of Contents
1. Introduction................................................................................................................................................................2
1.1. About This Manual.............................................................................................................................................2
1.2. About XIMEA .....................................................................................................................................................2
1.2.1. Contact XIMEA..........................................................................................................................................2
1.3. Standard Conformity ..........................................................................................................................................3
1.3.1. CE Conformity...........................................................................................................................................3
1.3.2. For customers in the US: FCC Conformity ...................................................................................................3
1.3.3. For customers in Canada...........................................................................................................................4
1.3.4. RoHS Conformity.......................................................................................................................................4
1.3.5. WEEE Conformity ......................................................................................................................................4
1.3.6. GenICam GenTL API..................................................................................................................................4
1.4. Helpful Links .....................................................................................................................................................4
1.4.1. Table of Contents......................................................................................................................................5
2. xiB Camera Series ......................................................................................................................................................9
2.1. What is xiB........................................................................................................................................................9
2.2. Advantages .......................................................................................................................................................9
2.3. PCI Express Vision Camera Applications ............................................................................................................10
2.4. Common features ............................................................................................................................................10
2.5. Model Nomenclature........................................................................................................................................11
2.6. Models Overview, sensor and models ...............................................................................................................12
2.7. Options ...........................................................................................................................................................12
2.8. Accessories.....................................................................................................................................................13
3. Hardware Specification .............................................................................................................................................14
3.1. Power Supply ..................................................................................................................................................14
3.2. General Specification .......................................................................................................................................14
3.2.1. Environment ...........................................................................................................................................14
3.2.2. Firmware / Host driver / API features........................................................................................................14
3.3. Lens Mount.....................................................................................................................................................15
3.4. Mounting points...............................................................................................................................................16
3.5. Optical path.....................................................................................................................................................16
3.6. Model Specific Characteristics..........................................................................................................................17
3.6.1. CB120xG-CM .........................................................................................................................................17
3.6.1.1. Sensor and camera parameters ......................................................................................................17
3.6.1.2. Quantum efficiency curves [%]........................................................................................................18
3.6.1.3. Dimensional drawings CB120xG-CM...............................................................................................19
3.6.1.4. Referenced documents...................................................................................................................20
3.6.1.5. Sensor features..............................................................................................................................20
3.6.2. CB200xG-CM .........................................................................................................................................21
3.6.2.1. Sensor and camera parameters ......................................................................................................21
3.6.2.2. Quantum efficiency curves [%]........................................................................................................22
3.6.2.3. Dimensional drawings CB200xG-CM...............................................................................................23
3.6.2.4. Referenced documents...................................................................................................................24
3.6.2.5. Sensor features..............................................................................................................................24
3.6.3. CB500xG-CM .........................................................................................................................................25
3.6.3.1. Sensor and camera parameters ......................................................................................................25
3.6.3.2. Quantum efficiency curves [%]........................................................................................................26
3.6.3.3. Dimensional drawings CB500xG-CM (with and without EF mount).....................................................27
3.6.3.4. Referenced documents...................................................................................................................28
3.6.3.5. Sensor features..............................................................................................................................28
3.6.4. CB013xG-LX-X8G3.................................................................................................................................29
3.6.4.1. Sensor and camera parameters ......................................................................................................29

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3.6.4.2. Quantum efficiency curves [%]........................................................................................................30
3.6.4.3. Dimensional drawings CB013xG-LX-X8G3.......................................................................................31
3.6.4.4. Referenced documents...................................................................................................................32
3.6.4.5. Sensor features..............................................................................................................................32
3.6.5. CB019xG-LX-X8G3.................................................................................................................................33
3.6.5.1. Sensor and camera parameters ......................................................................................................33
3.6.5.2. Quantum efficiency curves [%]........................................................................................................34
3.6.5.3. Dimensional drawings CB019xG-LX-X8G3.......................................................................................35
3.6.5.4. Referenced documents...................................................................................................................36
3.6.5.5. Sensor features..............................................................................................................................36
3.6.6. CB120xG-CM-X8G3................................................................................................................................37
3.6.6.1. Sensor and camera parameters ......................................................................................................37
3.6.6.2. Quantum efficiency curves [%]........................................................................................................38
3.6.6.3. Dimensional drawings CB120xG-CM-X8G3 .....................................................................................39
3.6.6.4. Referenced documents...................................................................................................................40
3.6.6.5. Sensor features..............................................................................................................................40
3.7. User interface –LEDs ......................................................................................................................................41
3.8. xiB, xiB-64 PCIe Interface.................................................................................................................................42
3.8.1. iPassTM Connector Location .....................................................................................................................42
3.9. Digital Input / Output (GPIO) Interface and Power ...............................................................................................43
3.9.1. Location .................................................................................................................................................43
3.9.2. IO Connector Pinning ..............................................................................................................................43
3.9.3. Power input ............................................................................................................................................45
3.9.4. Optically isolated Digital Input ..................................................................................................................46
3.9.4.1. Optically isolated Digital Input - General info ....................................................................................46
3.9.4.2. Digital Input –signal levels .............................................................................................................46
3.9.4.3. Digital Input –Internal Schematic....................................................................................................47
3.9.4.4. Digital Input –Wiring......................................................................................................................47
3.9.4.5. Digital Input –Timing .....................................................................................................................48
3.9.5. Optically isolated Digital Output................................................................................................................48
3.9.5.1. Optically isolated Digital Output - General info..................................................................................48
3.9.5.2. Optically isolated Digital Output Delay..............................................................................................48
3.9.5.3. Optically isolated Digital Output –Internal schematic........................................................................49
3.9.5.4. Digital Output –Wiring ...................................................................................................................49
3.9.5.5. Digital Output –Timing...................................................................................................................54
3.9.6. Non-isolated Digital Lines ........................................................................................................................55
3.9.6.1. Non-isolated Digital Input/Output (INOUT) General info......................................................................55
3.10. Power supply input (AUX PWR) .........................................................................................................................55
3.11. CBL-PCI-COP-xx/ CBL-PCI-FIB-xx.....................................................................................................................56
3.12. PCIe host adapter cards ...................................................................................................................................57
3.13. CBL-CB-PWR-SYNC-3M0 ................................................................................................................................58
3.14. CBL-MT-PWR-SYNC-3M0................................................................................................................................59
3.15. Tripod Adapter –MECH-60MM-BRACKET-T......................................................................................................60
3.16. xiB-64 cooling –CB-X8G3-FAN-COOLER-KIT....................................................................................................61
3.17. xiB cooling –MECH-60MM-HEATSINK-KIT........................................................................................................62
3.18. xiB Lens adapter –MECH-60MM-EF-ADAPTER.................................................................................................63
3.19. xiB Lens adapter –LA-C-MNT-60MM-xxx-KIT,..................................................................................................63
4. Operation.................................................................................................................................................................64
4.1. System Requirements ......................................................................................................................................64
4.1.1. Software Requirements ...........................................................................................................................64
4.1.2. Hardware Requirements ..........................................................................................................................64
4.1.2.1. System Configuration .....................................................................................................................64

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4.1.2.2. Cables...........................................................................................................................................65
4.2. Video Formats .................................................................................................................................................66
4.2.1. Full Resolution ........................................................................................................................................66
4.2.2. ROIs –Region Of Interest ........................................................................................................................66
4.2.3. Downsampling Modes.............................................................................................................................66
4.2.3.1. Binning..........................................................................................................................................66
4.2.3.2. Skipping ........................................................................................................................................66
4.2.4. Image Data Output Formats.....................................................................................................................67
4.3. Acquisition modes ...........................................................................................................................................68
4.3.1. Free-Run................................................................................................................................................68
4.3.2. Trigger controlled Acquisition/Exposure ....................................................................................................68
4.3.2.1. Triggered acquisition - single frame ................................................................................................69
4.3.2.2. Triggered acquisition - burst of frames ............................................................................................70
4.3.2.3. Exposure defined by trigger pulse length .........................................................................................70
4.4. Camera Parameters and Features.....................................................................................................................71
4.4.1. Exposure Time........................................................................................................................................71
4.4.2. Gain.......................................................................................................................................................71
4.5. Host-Assisted Image Processing Parameters Available in xiAPI. ..........................................................................71
4.5.1. Auto Exposure –Auto Gain......................................................................................................................71
4.5.2. White Balance ........................................................................................................................................71
4.5.2.1. Assisted Manual White Balance ......................................................................................................71
4.5.2.2. Auto White Balance........................................................................................................................71
4.5.3. Gamma..................................................................................................................................................71
4.5.4. Sharpness ..............................................................................................................................................71
4.5.5. Color Correction Matrix............................................................................................................................72
4.5.6. Sensor Defect Correction.........................................................................................................................72
4.5.7. HDR.......................................................................................................................................................73
5. Software ..................................................................................................................................................................76
5.1. Accessing the Camera .....................................................................................................................................76
5.1.1. Proprietary API........................................................................................................................................76
5.1.2. Standard Interface ..................................................................................................................................76
5.1.2.1. GenICam .......................................................................................................................................76
5.1.3. Vision Library Integration .........................................................................................................................76
5.2. XIMEA CamTool...............................................................................................................................................77
5.3. Supported Vision Libraries................................................................................................................................79
5.3.1. Libraries maintained by XIMEA.................................................................................................................79
5.3.1.1. MathWorks MATLAB ......................................................................................................................79
5.3.1.2. MVTec HALCON.............................................................................................................................79
5.3.1.3. National Instruments LabVIEW Vision Library....................................................................................79
5.3.1.4. OpenCV.........................................................................................................................................79
5.4. XIMEA Windows Software Package...................................................................................................................80
5.4.1. Contents ................................................................................................................................................80
5.4.2. Installation..............................................................................................................................................80
5.5. XIMEA Linux Software Package.........................................................................................................................83
5.5.1. Contents ................................................................................................................................................83
5.5.2. Installation..............................................................................................................................................83
5.6. XIMEA macOS Software Package......................................................................................................................85
5.6.1. Contents ................................................................................................................................................85
5.6.2. Installation..............................................................................................................................................85
5.6.3. Start XIMEA CamTool ..............................................................................................................................86
5.7. Programming ..................................................................................................................................................87
5.7.1. XIMEA APIs.............................................................................................................................................87

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5.7.2. xiAPI Overview ........................................................................................................................................87
5.7.3. xiAPI Functions Description......................................................................................................................87
5.7.4. xiAPI Parameters Description...................................................................................................................88
5.7.5. xiAPI Examples .......................................................................................................................................88
5.7.5.1. Connect Device..............................................................................................................................88
5.7.5.2. Parameterize Device.......................................................................................................................88
5.7.5.3. Acquire Images..............................................................................................................................89
5.7.5.4. Control Digital Input / Output (GPIO) ................................................................................................89
5.7.6. xiAPI Auto Bandwidth Calculation.............................................................................................................89
5.7.7. GenICam ................................................................................................................................................90
5.8. XIMEA Control Panel ........................................................................................................................................91
6. Appendix..................................................................................................................................................................92
6.1. Troubleshooting and Support............................................................................................................................92
6.1.1. Worldwide Support..................................................................................................................................92
6.1.2. Before Contacting Technical Support........................................................................................................92
6.1.3. Frequently Asked Questions.....................................................................................................................92
6.1.3.1. What is the real transfer speed?......................................................................................................93
6.1.3.2. Why can I not achieve maximum transfer speed?.............................................................................93
6.2. Product service request (PSR)...........................................................................................................................93
6.2.1. Step 1 - Contact Support.........................................................................................................................93
6.2.2. Step 2 - Create Product Service Request (PSR).........................................................................................93
6.2.3. Step 3 - Wait for PSR Approval ................................................................................................................93
6.2.4. Step 4 - Sending the camera to XIMEA.....................................................................................................93
6.2.5. Step 5 - Waiting for Service Conclusion....................................................................................................94
6.2.6. STEP 6 - Waiting for return delivery .........................................................................................................94
6.3. Safety instructions and precautions...................................................................................................................94
6.3.1. Disassembling ........................................................................................................................................94
6.3.2. Mounting / Screwing ...............................................................................................................................94
6.3.3. Connections ...........................................................................................................................................95
6.3.4. Power supply..........................................................................................................................................95
6.3.5. Environment / protect against water.........................................................................................................95
6.3.6. Recommended light conditions. ...............................................................................................................95
6.3.7. Protect the optical components................................................................................................................95
6.3.8. Mechanical loads....................................................................................................................................95
6.3.9. Camera / lens cleaning............................................................................................................................95
6.3.10. Protect against static discharge (ESD) ......................................................................................................95
6.3.11. Safety instructions for board level cameras...............................................................................................96
6.4. Warranty .........................................................................................................................................................96
6.5. Disclaimer of Warranty.....................................................................................................................................96
6.6. List Of Trademarks ..........................................................................................................................................97
6.7. Standard Terms & Conditions of XIMEA GmbH...................................................................................................97
6.8. Copyright ......................................................................................................................................................101
6.9. Revision History .............................................................................................................................................102
7. Glossary.................................................................................................................................................................103
8. list of figures ..........................................................................................................................................................104
9. list of tables ...........................................................................................................................................................106

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2. xiB Camera Series
Figure 2-1 xiB and xiB-64 camera with heat sinks.
2.1. What is xiB
xiB [ksi-bee: or sai-bee:] is a compact PCI express Industrial camera family with outstanding features:
•Small footprint
•High speed computer interface
•Sensors for xiB: 12, 20, and 50 Mpixel CMOSIS CMOS sensors
•Sensors for xiB-64: 1, 12 Mpixel CMOSIS and Luxima CMOS sensors
•frame rates: 50 MP @ 30 fps to 1 MP @ 3,500+ fps
The XiB camera line uses a PCI Express (PCIe) computer interface which eliminates the need for a framegrabber. Currently, PCIe
generations 2 and 3 are implemented for the xiB and xiB-64 camera lines. As a result, low latency communication between the
camera head and host computer is achieved. Direct Memory Access (DMA) engine is utilized for data transfer between
the camera and PC memory, reducing the CPU load to almost negligible values compared to other protocols.
Off the shelf hardware can be used for camera to computer interfaces, but testing was limited to the items discussed in this
manual. See section 3.10 - 3.12 for materials needed to interface your camera to the computer. Both copper (10m) and fiber
optic (>100m) cables are available for interfaces.
2.2. Advantages
Industry standard interface
Off the shelf components can be used –no ‘frame grabber’
Optional EF lens mount
Canon lenses controllable from software (focus and aperture)
Small
Fits into places where no other camera can fit
Powerful
Up to 64Gb/s (xiB-64)
Fast
High speed, high frame rate: up to 3500+fps (depending on the camera model)
Robust
Full metal housing, no sheet metal covers
Connectivity
Programmable opto-isolated I/O, and non-isolated digital input and output. 4 status LEDs
Compatibility
Support for Windows, Linux and MacOS, various Image Processing Libraries
Software interfaces
GenICam / GenTL and highly optimized xiAPI SDK
Economical
Excellent value and price, low TCO and fast ROI
Low latency
Computer CPU not involved in data transfer, latency from camera to memory is low
table 2-1, advantages

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2.3. PCI Express Vision Camera Applications
•Automation
•High speed inspection
•Ultra-fast 3D scanning
•Material and Life science microscopy
•Ophthalmology and Retinal imaging
•Broadcasting
•Fast process capture, e.g. golf club swings
•Aerial Imaging
2.4. Common features
Sensor Technology
CMOS, Global shutter
Acquisition Modes
Continuous, software and hardware trigger, limited fps, triggered exposure and burst,
exposure controlled by trigger length
Partial Image Readout
ROI, Skipping and Binning modes supported (model specific)
Image data formats
8, 10 or 12 bit RAW pixel data
Color image processing
Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS
Hot/blemish pixels correction
On camera storage of more than 5000 pixel coordinates, host assisted correction
Auto adjustments
Auto white balance, auto gain, auto exposure
Flat field corrections
Host assisted pixel level shading and lens corrections
Image Data and Control Interface
iPass external PCIe connector (Gen2 x4 for xiB, and Gen3 x8 for xiB-64)
General Purpose I/O
2x opto-isolated input, 2x opto-isolated output, and 4 non-isolated I/O, 4X user
configurable LEDs
Signal conditioning
Programmable debouncing time
Synchronization
Hardware trigger input, software trigger, exposure strobe output, busy output, ..
Housing and lens mount
Optional Canon EF mount available
Power requirements 1
12-24V input, 9-29W
Environment
Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 60°C storage
Ingress Protection: IP40
Operating systems
Windows 10 (x86 and x64), Linux Ubuntu, MacOS 10.8
Software support
xiAPI SDK, adapters and drivers for various image processing packages
Firmware updates
Field firmware updatable
table 2-2, common features
Note: 1) Power consumption is model specific