Yaesu Ft-847 Manual

"",,- YAESU

FT -847

HF & V/UHF Band Transceiver

Technical Supplement

VERTEX STANDARD CO., LTD.

4-8-8 Nakameguro, Meguro-Ku, Tokyo 153-8644, Japan

VERTEXSTANDARD

us Headquarters

17210 Edwards Rd., Cerritos, CA 90703, U.S.A.

International Division

8350 N.W. 52nd Terrace, Suite 201, Miami, FL 33166. U.S.A.

.-C) YAESU EUROPE B.V.

-,- P.o. Box 75525, 1118 ZN Schiphol, The Netherlands

YAESU UK LTD.

-0 Unit 12, Sun Valley Business Park, Win nail Close

-"~ Winchester, Hampshire. S023 OLB, U.K.

YAESU GERMANY GmbH

.'-'" Am Kronberger Hang 2, 0-65824 Schwalbach. Germany

VERTEX STANDARD HK LTD.

Unit 5. 20/F., Seaview Centre, 139-141 Hoi Bun Road,

Kwun Tong, Kowloon, Hong Kong

~~cc."" ---~~.._""~-, ,~~ "---

Contents

Introduction 1-1

Specifications 1-2

Chip Component Information 1-3

Mechanical Details (Exploded Views & Mechanical Parts) 2-1

Alignment 3-1

Block & Interconnection Diagrams 4-1

PCB Diagrams & Parts List

AF-CNTL Unit 5A-1

PLL Unit 5B-1

RF Unit 5C-1

V /U-P A Unit 5D-1

PA Unit 5E-1

DSP Unit 5F-1

Panel Unit 5G-1

SSB-Filter-l/ -2 Unit 5H-1

Phone-Jack Unit 5 I-I

Mic Unit 5 J-1

HPF Unit 5K-1

r~ ~ -

Cut out the labelattheright, and placei.tbehind the: FT -847

clearplastic window in the spineof abInder. I Technical Supplement

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Introd uction

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This manual provides technical information covered by warranty. For the major circuit

necessaryfor servicing the YaesuFT-847HF & boards, eachside of the board is identified byiV/UHF-Band

Transceiver.It doesnotinclude in- thetype of the majority of componentsinstalled

formation on installation and operation, which on thatside.In mostcasesonesidehasonly chip

are described in the FT-847Operating Manual components,and the other has either a mixture

provided with the transceiver,or onaccessories of both chip and lead components (trimmers,

which aredescribed in their manuals. coils,electrolytic capacitors,packagedICs,etc.),

The FT-847is carefully designedto allow the or lead componentsonly.

knowledgeable operator to make nearly all ad- While we believe the technicalinformation in

justmentsrequired forvarious stationconditions, this manual is correct,Yaesuassumesno liabili-

modesand operatorpreferencessimply from the ty for damagethat may occurasa result of typo-

controls onthe panels,without opening the case graphical or other errors that may be present.

of the transceiver.TheFT-847Operating Manu- Your cooperation in pointing out anyinconsis-

al describestheseadjustments, plus certain in- tencies in the technical information would be

ternal settings. appreciated. Yaesu Musen reservesthe right to

Servicingthis equipmentrequiresexpertisein make changesin this transceiver and the align-

handling surface mount chip components. At- mentprocedures,in the interestof technological

tempts by unqualified persons to service this improvement, without notification of owners.

equipment mayresultin permanentdamagenot

1-1

FT -847 Technical SupplementI

": c,cc",::~'f:~~;~

Specifications

General

Frequency Range: Receive 100kHz -30 MHz, 36MHz -76 MHz, 108MHz -174 MHz, 420MHz -512 MHz

Transmit 160 -6 Meters, 2 Meters, 70Centimeters (Amateur bands only)

5.1675 MHz (Alaska Emergency Channel)

Emission Modes: USB, LSB, CW, AM, FM Fl (9600bps Packet), F2 (1200 bps Packet) AFSK

Synthesizer Steps (Min.): 0.1 Hz (CW, SSB),10 Hz (AM, FM) ,

Antenna Impedance: 50-0., Unbalanced

Operating Temp. Range: -10 °C to +50 °C (14 of to 122 OF)

Frequency Stability: Better than:f:2 ppm (0 °C to +40 °C) SSB/CW / AM/ AFSK

Better than:f:5 ppm (-10 °C to +50 °C) SSB/CW / AM/ AFSK

Better than :f:11 kHz :f:5ppm} FM

Power Requirements: DC 13.8 V = :f:l0 %,Negative Ground

Current Consumption: Receive: 1.5 A (Squelched), 2.0 A (Max. Audio)

Transmit: 22 A (@ 100 W RF output)

Case Size: 260 (W) x 86 (H) x 270 (D) mm (10.24" x 3.39" x 10.63")

Weight: Approximately 7 kg (14.4lbs.)

Transmitter

Power Output: 160 -6 m: 100Watts (25 Watts AM carrier)

2m/70 cm: 50 Watts (12.5 Watts AM carrier)

Modulation Types: SSB:Balanced Modulator

FM: Variable Reactance

AM: Early Stage (Low Level)

FM Maximum Deviation: :f:5kHz (:f:2.5kHz on FM-N)

Spurious Radiation: Harmonics: At least 40 dB down (1.8 -29.7 MHz)

At least 60dB down (50/144/430 MHz)

Non-harmonic: At least 50 dB down (1.8 -29.7 MHz)

At least 60dB down (50/144/430 MHz)

Carrier Suppression: At least 40dB

Opp. Sideband Suppression: At least 40dB

3rd-Order IMD: At least 31 dB down (14 MHz, 100W PEP output)

SSBFrequency Response: 400 Hz -2600 Hz (-6 dB)

Microphone Impedance: 2000.- 10 ko. (Supplied microphone: 600 Q.)

Receiver

Sensitivity: SSB/CW AM-N FM

500 kHz -1.8 MHz: -20 JIV -

1.8-28MHz: 0.25JIV 2JIV -

28-30MHz: 0.25JIV 2JIV 0.5JIV

50 -54 MHz: 0.20 JIV 1 JIV 0.25 JIV

144/430 MHz: 0.125 JIV -0.2 JIV

(Abovespecificationsareworst-case.SSB/CW/AM-N figures arefor 10 dB SIN, 12 dB SINAD on FM)

Squelch Sensitivity: SSB/CW/AM FM

500 kHz -1.8 MHz: 20 JIV -

1.8-28MHz: 2pV -

28 -30 MHz: 2 JIV 0.25 JIV

50 -54 MHz: 1 JIV 0.20 JIV

144/430 MHz: 0.5 JIV 0.16 JIV

Image Rejection: Better than 60 dB

IF Rejection: Better than 60 dB

Selectivity (-6/-60dB): SSB/CW: 2.2 kHz/4.5 kHz

CW-N: 0.5 kHz/2.0 kHz (Optional YF-115C installed)

AM: 9kHz/20 kHz

AM-N: 2.2kHz/4.5kHz

FM: 15 kHz/30 kHz

FM-N: 9kHz/20 kHz

Audio Output: At least 1.5 0. into 8 W @10 % THO

Audio output impedance: 40. -160.

Specificationsare subjectto change,in the interestof improvement, without noticeor obligation.

Specifications areguaranteed only within Amateur bands.

1-2 FT -847 Technical Supplement

Chip Component Information

The diagrams below indicate someof the dis-

tinguishing features of common chip compo-

nents.

Capacitors (Unit: mm)

~ L Type L W H

2125 2.0 1.25 0.35 ~ 0.5

~ 1608 1.6 0.8 0.65 ~ 0.95

T 1005 1.0 0.5 0.45 ~ 0.55

Tantalum Capacitors

w L (Unit: mm)

-L Type L W H

H P 2.0 1.25 1.2

+ T A 3.2 1.6 1.6

B 3.4 2.8 1.9

-C 5.8 3.2 2.3

Resistors

~ L Marking* 100,222, 473...

-L 473

TTens Ones Multiplier

0 0 100

1 1 101

Indicated Letters 2 2 102

1 2 3 45 &, : , 0.:: ~~

5 5 105

(Unit: mm) 6 6 106

Type L W H 7 7 107

1/10 2.0 1.25 0.5 8 8 108

9 9 109

1/16 1.6 0.8 0.45

1/165 1 0 0 5 035 Examples: l00==10Q

...222==2.2kQ 473==47kQ

1-3

FT-847TechnicalSupplement

Chip Component Information

Replacfng Chip Components Precautions for Chip Replacement

Chip components areinstalled atthe factory 0 Do not disconnecta chip forcefully, or the

bya seriesof robots. The first oneplacesasmall foil pattern may peeloff the board.

spotof adhesiveresin atthe locationwhere each 0 Never re-usea chip component.Disposeof

part is to be installed, and later robots handle all removed chip components immediate-

and place parts using vacuum suction. ly to avoid mixing with new parts.

Forsinglesidedboards,solderpasteisapplied 0 Limit soldering time to 3secondsor lessto

and the board is then baked to hardenthe resin avoid damagingthe componentandboard.

and flow thesolder. Fordouble sidedboards,no

solder paste is applied, but the board is baked Removing Chip Components

(orexposedto ultra-violet light) to curetheresin 0 Removethe solder at eachjoint, onejoint ata

before dip soldering. time, using solder wick whetted with nona-

In our laboratories and service shops,small cidic fluxes asshown below. Avoid applying

quantities of chipcomponentsaremounted man- pressure,and do not attempt to remove tin-

ually byapplying aspotof resin,placingthecom- ning from thechip's electrode.

ponents with tweezers, and then soldering by

very small dual streamsof hotair (without phys- , -

, ical contactduring soldering). We removeparts ~-~j byfirst removing solderusing avacuum suction ~

iron, which applies a light steadyvacuum atthe

iron tip, and then breaking the adhesive with

tweezers. 0 Graspthe chip on both sides with tweezers,

Special vacuum/ desoldering equipment is and gently twist the tweezersbackand forth

recommended if you expectto do a lot of chip (to breakthe adhesive bond) while alternate-

replacements. Otherwise, it is usually possible ly heating eachelectrode. Becareful to avoid

to remove and replace chip components with peeling the foil tracesfrom the board.

only a tapered, temperature-controlled solder- .Dispose of the chip when removed.

ing iron, a setof tweezers and braided copper 0 After removing thechip, usethe copperbraid

solderwick. Soldering iron temperature should and soldering iron to wick away any excess

be below 280°C(536°F). solderand smooth the land for installation of

the replacementpart.

C'c 1-4 FT-847 Technical Supplement

-Chip Component Information

Installing a Replacement Chip

As the value of somechip componentsis not

indicated onthe body of the chip, becareful to

getthe right part for replacement.

0 Apply a small amount of solder to the land

on one sidewhere the chip is to be installed.

Avoid too much solder, which may cause

bridging (shorting to other parts).

0 Hold the chip with tweezers in the desired

position, and apply the soldering iron with a

motion line asindicated by the arrow in the

diagram below. Do not apply heat for more

than 3 seconds.

0 Removethetweezersand soldertheelectrode

onthe othersidein themannerjustdescribed.

1-5

FT -847 Technical Supplement

':,

T -Exploded View & Miscellaneous Parts

RAOO70000

S4000045 RAOO7000A (Lot 3-)

TOPCA E

REI::: ___=~De~cription -~:~- Y~~- 9!¥-:-

-~ PAN HEAD SCREW M2.6x6 U00200iXI1 4

<2> PAN HEAD SCREWM3xB UOO3OBOO1 14

<3> PAN HEAD SCREW M3x30 UOO330001 4

@ PAN HEAD SCREW M4x6B U00406007 2

<5> SEMS SCREW ASM3x6 UO3300001 8

@ BINDING HEAD SCREWM2x4B U20104007 1

(1) BINDINGHEADSCREWM3x6 U20306001 3 @ R4150130

@ TAPTITE SCREW M3x6 U24306001 83 HANDLE HOLDER (2pcs)

@ TAPTITE SCREWM3xB U243OBOO1 9

<8 OVAL HEAD SCREW M4x6B U31406007 2

@ OVALHEADSCREWM4x1OB U31410007 4

@ OVAL HEAD SCREW M4x16B U31416007 2

@ TAPTITE SCREW M3x6 U34306001 4

@ TAPTITE SCREWM3x6 U44306001 8

@ TOOTHED LOCK WASHER OW4NI U72004002 1

@ HEX HEAD BOLT HSM4x16NI U9900076 1

BINDING HEAD SCREW M3x1B U20318001@ BINDING HEAD SCREW M3x2ONI (Lot 8-) U20320002 4 t B-)

Non-designated parts are available

only as part of a designated assembly. @

V/U-PA Unil

)

RAOO63000

RAOO6300A (Lot 4-) (SP)

RUBBER KNOB (MODE)

RA00651 00

KNOB (POW)

RA0065200

KNOB (MOX)

RA0063300

RA006330A (Lot 4-)

RUBBER KNOB (TU) )

17-)

@ AF-GNTL Unit

"'"./ RA0070100

RA0063200 ./" RAOO7010A (Lot. 3-)

RA006320A (Lot 4-) IS\ BOTTOM CASE

RUBBER KNOB (ME) ~

RA00631 00

RA006310A (Lot 4-)

RAOO72400 RUBBER KNOB (KEY)

COIL SPRING

RA0065500

ENCODER KNOB (2pcs) RAOO63400

RAOO65600 RAOO6340A (Lol. 4-)

VOLUME KNOB RUBBER KNOB (CL)

RA0065400

RAOO64800 RA0070300 KNOB (OUT) (4pcs)

KNOB MAIN ASS'Y SHEET (SAT) RAOO65300

RA006530A (Lol. 4-)

RAOO65900 KNOB (IN ) (4pcs)KNOB (SHUTTLE)

R3100700

R3100700A (1.01. 12-)

FOOT (2pcs)

FT-847 Technical Supplement 2-1

'::~:;';;:~iii!L

Exploded View & Miscellaneous Parts

REF. DESCRIPTION VALUE V/W TOL. MFR'S DESIG IYAESU PIN VERSo LOT.

""" MAIN ASS'Y """

C 0001 AL.ELECTRO.CAP. 100uF 16V RE3-16V101M 100UF K40129063 1-

FNOO01 FAN A0512 DC12V M2090017 1-

FNOO01 FAN F412R-12MB-32 DC12V M2090028 8-

FNOO02 FAN JF0625S1M-050 DC12V M2090023 1-

FNOO02 FAN JF0625S1M-050R1 DC12V M2090029 16-

J 0001 CONNECTOR FM-MDR-MI P1090352 1-

J 0002 CONNECTOR FM-MDR-MI P1090352 1-

J 0003 CONNECTOR FM-MDR-MI P1090352 1-

J 0004 CONNECTOR 020-0291 P1090547 1-

JPOO01 WIRE ASSY GRN 280 (2)1(2) T51528002 UNITED KINGDON 8-

POO01 WIREASSY A1179 T9206718 1-

P 0002 WIRE ASSY A1179 T9206702 1-

POO02 WIREASSY A1179 T9206702A 5-

P 0003 WIRE ASSY A1179 T9206703 1-

P 0003 WIRE ASSY A1179 T9206703A 5-

P 0004 WIREASSY A1179 T9206704 1-

P 0004 WIRE ASSY A1179 T9206704A 5-

POO05 WIREASSY A1179 T9206705 1-

POO05 WIREASSY A1179 T9206705A 2-

POO05 WIREASSY A1179 T9206705B 5-

P 0006 WIRE ASSY A1179 T9206706 1-

P 0006 WIRE ASSY A1179 T9206706A 2-

POO07 WIREASSY RED 280/400V5.5 T9318054 1-

P 0008 WIRE ASSY BLK 280/360 V5,5 T9318055 1-

P 0009 WIRE ASSY GRA 280 TMPITMP T9311201 1-

PO010 WIREASSY A1179 T9206707 1-

PO010 WIREASSY A1179 T9206707A 5-

PO011 WIREASSY A1179 T9206708 1-

PO011 WIREASSY A1179 T9206708A 5-

P 0012 WIRE ASSY A1179 T9206710A 1-

P 0012 WIRE ASSY A1179 T9206710B 5-

PO012 WIREASSY A1179 T9206710C 7-

PO013 WIREASSY A1179 T9206709A 1-

PO013 WIREASSY A1179 T9206709B 5-

P 0013 WIRE ASSY A1179 T9206709C 7-

PO014 WIREASSY A1179 T9206711 1-

PO014 WIREASSY A1179 T9206711A 5-

PO015 WIREASSY A1179 T9206712 1-

P 0015 WIRE ASSY A1179 T9206712A 5-

P 0016 WIRE ASSY BRN 330 TMPITMP T9318041 1-

P 0017 WIRE ASSY YEL 210 TMPITMP T9318042 1-

P 0018 WIRE ASSY BLK 340 TMPITMP T9318043 1-

P 0018 WIRE ASSY BLK 360 TMPITMP T9318056 2-

P 0019 WIRE ASSY ORG 200 TMPITMP T9318044 1-

PO020 WIREASSY A1179 T9206713 1-

PO020 WIREASSY A1179 T9206713A 5-

PO021 WIREASSY A1179 T9206714 1-

i PO022 WIREASSY BLK60TMPITMP T9318045 1-

J. P 0022 WIRE ASSY RED 60 TMPITMP T9318059 2-

i P 0023 WIRE ASSY ORG 120 TMPITMP T9318046 1-

I P 0023 WIREASSY GRN 110TMPITMP T9318060 2-

P 0024 WIRE ASSY BLK 140 TMPITMP T9318047 1-

P 0024 WIRE ASSY YEL 140 TMPITMP T9318061 2-

P 0025 WIRE ASSY ORG 150 TMPITMP T9318048 1-

P 0025 WIRE ASSY GRA 150 TMP/" T9318065 2-

PO026 WIREASSY A1179 T9206715 1-

P 0027 WIRE ASSY GRN 500 TMPITMP T9318049 1-

P 0028 WIRE ASSY RED 290 TMPITMP T9311404 1-

P 0028 WIRE ASSY RED 310 TMPITMP T9318058 2-

P 0028 WIRE ASSY RED 290 TMPITMP T9311404 7-

P 0029 WIRE ASSY A1179 T9206716 1-

PO029 WIREASSY A1179 T9206716A 5-

PO029 WIREASSY A1179 T9206716B 7-

P 0030 WIRE ASSY A1179 T9206717 1-

P 0032 WIRE ASSY A1179 T9206757 2-

S 0001 ROTARY ENCODER RSM20-250 09000631. 1-

S 0002 ROTARY SWITCH SRGPVJ-E N0190173 1-

SPOOO1SPEAKER 8-ohm VS-66Y 3W/8 OHM M4090066 1-

2-2 FT-847 Technical Supplement

i~_. --I'

_Alignment

Introduction and Precautions steps do not require all of the equipment listed,

The following procedures cover adjustments the interaction of some adjustments may require

that are not normally required once the trans- that more complex adjustments be performed af-

ceiver has left the factory. However, if damage terwards. Do not attempt to perform only a sin-

occurs and some parts subsequently are replaced, gle step unless it is clearly isolated electrically from

realignment may be required. If a sudden prob- all other steps. Rather, have all test equipment

lem occurs during normal operation, it is likely ready before beginning, and follow all of the steps

due to component failure; realignment should in a section in the order they are presented.

not be done until after the faulty component has Required Test Equipment

been replaced. 0 Digital DC Voltmeter (high-Z,1 MQ/V)

We recommend that servicing be performed 0 DC Ammeter

by authorized Yaesu service technicians, who are 0 RF Millivoltmeter

experienced with the circuitry and fully 0 AC Voltmeter

equipped for repair and alignment. If a fault is 0 RF St d d S.1 G /l'b d0 0 an ar Igna enerator w ca 1 rate

suspected, contact the sellIng dealer for mstruc- t t d dB 1 0 dB 0 5 Vou pu an sca e, p = .p

tions regarding repair. Authorized Yaesu service 0 AF so1G .h l ob dIgna enerator wIt ca 1 rate output

technicians have the latest modification informa- 0FCrequency ounter

tion, and realign all circuits and make compete 0 T 50 QD L d (150wo -ummy oa s -250 watts)

performance checks to ensure compliance with 0 150-Q Dummy Load (150 watts)

the factory specifications after repairs. 0I L.W(150 2500 )n- me attmeter -watts, 5 -Q

Those who do undertake any of the following 0L. D tmear e ector

alignments are cautioned to proceed at their own 0RF Att (150 40 dB) 1.enuator watts, or samp mg

risk. Problems caused by unauthorized attempts 1coup er

at realignment are not covered by the warranty 0St A 1 d 1 Gpec rum na yzer goo to at east 1 Hz

policy. Also, Yaesu must reserve the right to

change circuits and alignment procedures in the Alignment Preparation & Precautions

: interest of improved performance, without noti- A 50-Q dummy load and in-line wattmeter

~ fying owners. Under no circumstances should must be connected to the antenna jack in all pro-

f' any alignment be attempted unless the normal cedures that call for transmission, except where

function and operation of the transceiver are specified otherwise. Correct alignment is not

clearly understood, the cause of the malfunction possible with an antenna. Except where speci-

has been clearly pinpointed and any faulty com- fied otherwise, the transceiver should be tuned

ponents replaced, and the need for realignment to 14.2000 MHz, USB mode, and these control~

determined to be absolutely necessary. set as indicated:

The following test equipment (and thorough 0 MaX, PROC/KEYER, MONt OFF

familiarity with its correct use) is necessary for 0 MIC & RF PWR fully CCW

complete realignment. Correction of problems 0 A TT, RF AMP, AGC-F, NB OFF

caused by misalignment resulting from unautho- 0 AF as required

rized adjustments made with improper test equip- 0 SQL fully CCW

ment is not covered by warranty. Although most 0 SHIFT 12-o'clock

3-1

FT -847 Technical Supplement

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