Yes YES-PB8-2HV User manual

610-14224-01, Revision 0
YES-PB8-2HV i
3
Yield Engineering Systems
610-14224-01 Revision 0
Operation, Software, and
Maintenance Manual
Hi-Vac Processing System
YES-PB8-2HV

610-14224-01, Revision 0
YES-PB8-2HV ii
ECO 1659: Production Release
Written By
By: Craig McCoy Date: 7/6/12
Checked By
By: Date:
Software
By: Date:
Field Service/QA
By: Date:
Process Engineering
By: Date:
Marketing
By: Date:

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YES-PB8-2HV
iii
The Answer is …
Scope
This manual explains in detail how to use the YES-PB8-
2HV. We hope you find it clear, concise, and capable of
answering any questions you may have regarding this
system.
If we can assist you further, please feel free to contact us
directly at [phone]. Our Field Service Department
will be happy to help you.

Table of Contents
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Table of Contents
Table of Contents...................................................................................iv
Table of Figures......................................................................................ix
Introduction.............................................................................................1
Process Description..............................................................................1
Applications ..........................................................................................1
Sub-Atmospheric Process .....................................................................1
Hi Vacuum Process...............................................................................2
Features ................................................................................................2
Specifications........................................................................................4
Process Exposed Parts......................................................................4
Additional Parts................................................................................4
System Power Requirements.............................................................4
Process Vacuum Pump Power Requirements...................................4
Turbo Pump Power Requirements....................................................4
Wafer Capacity.................................................................................4
Overall Dimensions ..........................................................................5
Standard Tool...................................................................... 5
With MFC Option/s ............................................................ 5
With Control Console Remote Location............................. 5
Control Console, No Light Tower...................................... 5
Control Console with Light Tower..................................... 5
Weight, Distribution, and Mass Centers TBD ..................................6
Energy Consumption.........................................................................7
Process Gas Consumption................................................................7
System Set Up and Test..........................................................................8
Safety.....................................................................................................8
Safety Signal Word Definitions.........................................................8
Unavoidable hazards........................................................................8
Type 3 Electrical Hazards................................................... 8
Type 4 Electrical Hazards................................................... 8
Type 5 Electrical Hazards................................................... 9
Cabinet Safety Grounding ................................................................9
Chamber Temperature....................................................................11
Vacuum Pump Temperature ...........................................................11
Hazard Warning Labels..................................................................12
EMO Circuit ...................................................................................15
Lockout Procedure..........................................................................16
Electrical........................................................................... 16
Pneumatic/Reactant Gasses .............................................. 16
Turn the System On.............................................................................17
Temperature Controller Factory Setup ..........................................18
Keypad Operation............................................................. 18
PID and Remaining Settings............................................. 20
Adjust the Pressure Gauge Set Points.................................................22
Upper Cycle Purge Limit................................................................22

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Lower Cycle Purge Limit................................................................22
Set the O2 Analyzer Set Points............................................................23
Process Pump......................................................................................24
Turbo Pump ........................................................................................24
Clean the Chamber .............................................................................24
Adjust Gas Flows................................................................................24
MFC Option....................................................................................24
Standard Gas Inlet Needle Valve....................................................24
Adjust the Process Vacuum Throttle Valve.........................................25
System Operation..................................................................................26
Operation Panel..................................................................................26
Recipes #1-8........................................................................................26
Dehydration....................................................................................26
Pump Down to Process Pressure....................................................26
Temperature Ramp .........................................................................26
Process Chamber Vent....................................................................27
Operator Panel Recipe # 9:............................................................27
Chamber Vent.................................................................................27
Operator Panel Recipe # 0:............................................................27
Vacuum Test....................................................................................27
Hi-Vac Step(Turbo Pump) ..................................................................28
Temperature Controller......................................................................28
Control Mode..................................................................................28
Programming..................................................................................29
Program Mode................................................................................29
Temperature Controller Profile Program ......................................29
Safety Interlocks..................................................................................33
Door Lock.......................................................................................33
Chamber/Gas Heaters Over Temperature Monitors......................33
Door Seal Vacuum Interlock...........................................................34
System Controller................................................................................35
General Operation..........................................................................35
Touch screen Operator Interface....................................................35
Touch Screen Panels...........................................................................37
Operator's Panel (No MFC Option)...............................................37
Operator's Panel Button Description .............................................37
Operator Panel (MFC Option Only) ..............................................38
Operator Panel Button Description (MFC Option Activated)........38
Alarm Panel....................................................................................39
Alarm Window ................................................................................39
Alarm Panel Button Descriptions...................................................40
Operator Maintenance Panel .........................................................41
Operator Maintenance Panel Button Descriptions ........................41
Engineer Maintenance Panel..........................................................42
Recipe Set Up Panel .......................................................................44
Recipe Set Up Panel Descriptions..................................................44
Recipe 1 to 8 Set Up Panel .............................................................45
Recipe 1 to 8 Set Up Panel Button Descriptions ............................45
Hi-Vac Parameter Panel Button Descriptions................................47
Com Device Display Panel Button Descriptions............................48

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Output Panel 1................................................................................49
Output Panel 1 Button Descriptions...............................................49
Output Panel 2................................................................................50
Output Panel 2 Button Descriptions...............................................50
Date/Time Panel.............................................................................51
Date/Time Panel Button Descriptions ............................................51
Parameter Setup Panel...................................................................52
Parameter Setup Panel Button Descriptions..................................52
PID Panel .......................................................................................54
PID Panel Button Descriptions ......................................................54
SCR Panel.......................................................................................55
SCR Panel Button Descriptions......................................................55
Temperature Offset Panel...............................................................57
Temperature Offset Panel Button Descriptions..............................57
Fan Power Panel............................................................................58
Fan Power Panel Button Descriptions...........................................58
Exhaust Damper Set Up Panel .......................................................59
Exhaust Damper Set Up Panel Button Descriptions ......................59
Flow Panel......................................................................................60
Flow Panel Button Descriptions.....................................................60
Signal Tower Set Up Panel.............................................................61
Signal Tower Set Up Panel Button Descriptions............................61
Additional Light States Panel .........................................................62
Additional Light States Panel Button Descriptions ........................62
O2 Panel.........................................................................................63
O2 Panel Button Descriptions........................................................63
Vacuum Set Up Panel.....................................................................64
Vacuum Set Up Panel Button Descriptions ....................................64
Options Panel .................................................................................66
Options Panel Button Description..................................................66
InTouch Set Up Panel.....................................................................68
InTouch Set Up Panel Button Descriptions....................................68
Program Theory of Operation ............................................................69
Functional Explanation ..................................................................69
Programming..................................................................................69
Input / Output List...........................................................................69
System Operation................................................................................71
Process Operation ..........................................................................71
Theory of Operation Electrical...........................................................72
Theory of Operation Plumbing...........................................................74
Process Gas Input Line...................................................................74
Vacuum Output Lines......................................................................74
Door Seal Vacuum..........................................................................74
Maintenance and Troubleshooting......................................................75
Intervals and procedures ....................................................................75
Daily ...............................................................................................75
Weekly.............................................................................................75
Monthly...........................................................................................75
De-Commissioning Tool/ Recycling ...............................................75
Software Download Procedures .........................................................76

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PLC Software..................................................................................76
Touchscreen Software.....................................................................79
Troubleshooting Process Problems ....................................................81
Improper Curing.............................................................................81
Troubleshooting Equipment Problems................................................81
Insufficient Facilities for Required Process ...................................81
Software..........................................................................................82
Faulty Wiring or Instrumentation Malfunction ..............................82
Sizeable Vacuum Leak ....................................................................82
High Oxygen Concentration...........................................................84
Troubleshooting Equipment Malfunctions.........................................85
Reference Table Procedures...............................................................87
REF 1 - Door Seal Leaks................................................................87
REF 2 - Valve Repair......................................................................87
REF 3 - Power On Switch...............................................................87
REF 4 - Circuit Breakers................................................................88
REF 5 - Light Tower.......................................................................88
REF 6 - System Controller..............................................................88
REF 7 - System Vacuum Gauges ....................................................88
REF 8 - Temperature Controller ....................................................88
REF 9 – Chamber Main Heaters....................................................89
REF 10 - Cooling Blower ...............................................................89
REF 11 – Process Gas Heater........................................................89
REF 12 – Process Vacuum Pump...................................................90
REF 13 - Solid State Relays............................................................90
REF 14 - Software (Program).........................................................90
REF 15 – Chamber Rear Trim Heater............................................90
Ref 16 - Turbo Pump.......................................................................91
Alarm List............................................................................................92
Atm to tp1 ab...................................................................................92
Tp1 to tp2 ab...................................................................................92
Tp2 to tp1 ab...................................................................................92
Tp1 to Atm ab..................................................................................92
High temp ab...................................................................................92
Door temp high...............................................................................92
Pres lo alm ramp.............................................................................92
Pres lo alm dwell ............................................................................93
Pres lo alm cool..............................................................................93
Pressure hi ab.................................................................................93
Operator reset.................................................................................93
Cabinet overtemp............................................................................93
Pro Gas overtemp...........................................................................93
Failed to reach temp.......................................................................93
Hi Vac Starting Pres Abort.............................................................93
Door Switch Not Made ...................................................................93
Foreline Pressure Boot...................................................................93
Gate Valve Failed to Close Boot ....................................................93
Gate Valve Failed to Close Process ...............................................93
Gate Valve Failed to Open Process................................................93
Hi-Vac Hi Pressure Abort...............................................................93
Hi-Vac Segment Read Failure........................................................93

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Foreline Pressure Process..............................................................94
Failed To Reach Hi Vac SP............................................................94
1160 Gas Com Failure .....................Error! Bookmark not defined.
1160 Rear Trim Com Failure .........................................................94

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Table of Figures
Figure 1: Weight Distribution and Mass Centers................................6
Figure 2: Panel Grounding Fastener Locations – Main Machine....10
Figure 3: Panel Grounding Fastener Locations – Control Console .10
Figure 4: Front View Hazard Label Location....................................12
Figure 5: Left View Hazard Label Locations.....................................12
Figure 6: Right View Hazard Label Locations ..................................13
Figure 7: YES-PB8 –2HV Rear View Hazard Label Locations........13
Figure 8: YES-PB8 –2HV Console Hazard Label Locations............14
Figure 9: EMO Circuit.........................................................................15
Figure 10: Temperature Controller ....................................................17
Figure 11: Pressure Gauge...................................................................22
Figure 12: Plumbing layout - O2 Analyzer.........................................23
Figure 13: Temperature Display .........................................................28
Figure 14: Program #1 Temperature Plot..........................................32
Figure 15: Operator's Panel.................................................................37
Figure 16: Operator 2 Panel (MFC Active)........................................38
Figure 17: Alarm and Access Panel.....................................................39
Figure 18: Alarm Window ...................................................................39
Figure 19: Operator Maintenance Panel............................................41
Figure 20: Engineer Maintenance Panel.............................................42
Figure 21: Recipe Set Up Panel ...........................................................44
Figure 22: Recipe 1 to 8 Set Up Panel.................................................45
Figure 23: Hi-Vac Parameter Panel....................................................47
Figure 24: Com Device Display Panel.................................................48
Figure 25: Output Panel 1....................................................................49
Figure 26: Output Panel 2....................................................................50
Figure 27: Date/Time............................................................................51
Figure 28: Parameters Set Up Panel...................................................52
Figure 29: PID Panel ............................................................................54
Figure 30: SCR Panel ...........................................................................55
Figure 31: Temperature Offset Panel .................................................57
Figure 32: Fan Power Panel.................................................................58
Figure 33: Exhaust Damper Set Up Panel..........................................59
Figure 34: Flow Panel...........................................................................60
Figure 35: Signal Tower Set Up Panel................................................61
Figure 36: Additional Light States Panel............................................62
Figure 37: O2 Panel..............................................................................63
Figure 38: Vacuum Set Up Panel.........................................................64
Figure 39: Options Panel......................................................................66
Figure 40: InTouch Set Up Panel ........................................................68
Figure 41: CTC Monitor Utility Files Form.......................................76
Figure 42: Changing Communication Configuration........................77
Figure 43: Message for Established Communication........................77
Figure 44: Set Controller IP Address..................................................78
Figure 45: Downloading the PLC File.................................................78
Figure 46: Opening Proface Software.................................................79
Figure 47: Proface File Transfer Screen.............................................80

Introduction
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Introduction
Process Description
Typical applications that this tool can be used for (but are not limited to)
are: Applications
Copper Anneal - A type of heat treatment where the microstructure
of a material is altered, causing changes in its properties such as
strength and hardness.
Low-K dielectric cure - A thin film application that also involves
moisture removal and sealing.
Getter Activation - Getters are used to scavenge unwanted gases in
many applications. In MEMS devices, getters may be used to tie up
excess moisture or hydrogen which may interfere with the long term
operation of the device. Activating the getter material involves high
temperature and high vacuum processing to ensure the material starts
as moisture / hydrogen-free as possible.
Thin Film Thermal treatment - Thin film resistors can change
properties rapidly as they age unless they are properly thermally
treated. The process stabilizes the crystal grain and ensures long
term predictable behavior.
!!!Caution!!!
Regardless of process this tool is compatible for use with
non-toxic, non-flammable gasses only! Never allow
processing of substrates in the chamber that produce low
vapor pressure condensable vapors. They will be very
difficult to remove and will limit ultimate pump down
pressure specification of the chamber. Wear gloves when
handling cassettes or near chamber inner surfaces, to
prevent human organic contaminations.
Sub-Atmospheric Process
The oven comes equipped with a full chamber laminar flow system
through which preheated nitrogen is gently introduced during the
process. To help prevent particles on wafers and cassettes, the nitrogen
first passes through a stainless steel filter before entering the process
area. Vacuum introduced at the chamber floor creates the nitrogen
laminar flow and removes particles. Room temperature nitrogen flows
into the chamber at the end of the process to cool and continue cleaning
the wafers before removal.
A circulating air conduit cools the oven door and seal assemblies
allowing the product to be removed while leaving the oven walls at
idling (ambient-250°C) temperature to reduce ramp-up/ramp-down time