Yes YES-PB8-2HV User manual

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3
Yield Engineering Systems
610-14224-01 Revision 0
Operation, Software, and
Maintenance Manual
Hi-Vac Processing System
YES-PB8-2HV

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ECO 1659: Production Release
Written By
By: Craig McCoy Date: 7/6/12
Checked By
By: Date:
Software
By: Date:
Field Service/QA
By: Date:
Process Engineering
By: Date:
Marketing
By: Date:

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iii
The Answer is …
Scope
This manual explains in detail how to use the YES-PB8-
2HV. We hope you find it clear, concise, and capable of
answering any questions you may have regarding this
system.
If we can assist you further, please feel free to contact us
directly at [phone]. Our Field Service Department
will be happy to help you.

Table of Contents
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Table of Contents
Table of Contents...................................................................................iv
Table of Figures......................................................................................ix
Introduction.............................................................................................1
Process Description..............................................................................1
Applications ..........................................................................................1
Sub-Atmospheric Process .....................................................................1
Hi Vacuum Process...............................................................................2
Features ................................................................................................2
Specifications........................................................................................4
Process Exposed Parts......................................................................4
Additional Parts................................................................................4
System Power Requirements.............................................................4
Process Vacuum Pump Power Requirements...................................4
Turbo Pump Power Requirements....................................................4
Wafer Capacity.................................................................................4
Overall Dimensions ..........................................................................5
Standard Tool...................................................................... 5
With MFC Option/s ............................................................ 5
With Control Console Remote Location............................. 5
Control Console, No Light Tower...................................... 5
Control Console with Light Tower..................................... 5
Weight, Distribution, and Mass Centers TBD ..................................6
Energy Consumption.........................................................................7
Process Gas Consumption................................................................7
System Set Up and Test..........................................................................8
Safety.....................................................................................................8
Safety Signal Word Definitions.........................................................8
Unavoidable hazards........................................................................8
Type 3 Electrical Hazards................................................... 8
Type 4 Electrical Hazards................................................... 8
Type 5 Electrical Hazards................................................... 9
Cabinet Safety Grounding ................................................................9
Chamber Temperature....................................................................11
Vacuum Pump Temperature ...........................................................11
Hazard Warning Labels..................................................................12
EMO Circuit ...................................................................................15
Lockout Procedure..........................................................................16
Electrical........................................................................... 16
Pneumatic/Reactant Gasses .............................................. 16
Turn the System On.............................................................................17
Temperature Controller Factory Setup ..........................................18
Keypad Operation............................................................. 18
PID and Remaining Settings............................................. 20
Adjust the Pressure Gauge Set Points.................................................22
Upper Cycle Purge Limit................................................................22

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Lower Cycle Purge Limit................................................................22
Set the O2 Analyzer Set Points............................................................23
Process Pump......................................................................................24
Turbo Pump ........................................................................................24
Clean the Chamber .............................................................................24
Adjust Gas Flows................................................................................24
MFC Option....................................................................................24
Standard Gas Inlet Needle Valve....................................................24
Adjust the Process Vacuum Throttle Valve.........................................25
System Operation..................................................................................26
Operation Panel..................................................................................26
Recipes #1-8........................................................................................26
Dehydration....................................................................................26
Pump Down to Process Pressure....................................................26
Temperature Ramp .........................................................................26
Process Chamber Vent....................................................................27
Operator Panel Recipe # 9:............................................................27
Chamber Vent.................................................................................27
Operator Panel Recipe # 0:............................................................27
Vacuum Test....................................................................................27
Hi-Vac Step(Turbo Pump) ..................................................................28
Temperature Controller......................................................................28
Control Mode..................................................................................28
Programming..................................................................................29
Program Mode................................................................................29
Temperature Controller Profile Program ......................................29
Safety Interlocks..................................................................................33
Door Lock.......................................................................................33
Chamber/Gas Heaters Over Temperature Monitors......................33
Door Seal Vacuum Interlock...........................................................34
System Controller................................................................................35
General Operation..........................................................................35
Touch screen Operator Interface....................................................35
Touch Screen Panels...........................................................................37
Operator's Panel (No MFC Option)...............................................37
Operator's Panel Button Description .............................................37
Operator Panel (MFC Option Only) ..............................................38
Operator Panel Button Description (MFC Option Activated)........38
Alarm Panel....................................................................................39
Alarm Window ................................................................................39
Alarm Panel Button Descriptions...................................................40
Operator Maintenance Panel .........................................................41
Operator Maintenance Panel Button Descriptions ........................41
Engineer Maintenance Panel..........................................................42
Recipe Set Up Panel .......................................................................44
Recipe Set Up Panel Descriptions..................................................44
Recipe 1 to 8 Set Up Panel .............................................................45
Recipe 1 to 8 Set Up Panel Button Descriptions ............................45
Hi-Vac Parameter Panel Button Descriptions................................47
Com Device Display Panel Button Descriptions............................48

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Output Panel 1................................................................................49
Output Panel 1 Button Descriptions...............................................49
Output Panel 2................................................................................50
Output Panel 2 Button Descriptions...............................................50
Date/Time Panel.............................................................................51
Date/Time Panel Button Descriptions ............................................51
Parameter Setup Panel...................................................................52
Parameter Setup Panel Button Descriptions..................................52
PID Panel .......................................................................................54
PID Panel Button Descriptions ......................................................54
SCR Panel.......................................................................................55
SCR Panel Button Descriptions......................................................55
Temperature Offset Panel...............................................................57
Temperature Offset Panel Button Descriptions..............................57
Fan Power Panel............................................................................58
Fan Power Panel Button Descriptions...........................................58
Exhaust Damper Set Up Panel .......................................................59
Exhaust Damper Set Up Panel Button Descriptions ......................59
Flow Panel......................................................................................60
Flow Panel Button Descriptions.....................................................60
Signal Tower Set Up Panel.............................................................61
Signal Tower Set Up Panel Button Descriptions............................61
Additional Light States Panel .........................................................62
Additional Light States Panel Button Descriptions ........................62
O2 Panel.........................................................................................63
O2 Panel Button Descriptions........................................................63
Vacuum Set Up Panel.....................................................................64
Vacuum Set Up Panel Button Descriptions ....................................64
Options Panel .................................................................................66
Options Panel Button Description..................................................66
InTouch Set Up Panel.....................................................................68
InTouch Set Up Panel Button Descriptions....................................68
Program Theory of Operation ............................................................69
Functional Explanation ..................................................................69
Programming..................................................................................69
Input / Output List...........................................................................69
System Operation................................................................................71
Process Operation ..........................................................................71
Theory of Operation Electrical...........................................................72
Theory of Operation Plumbing...........................................................74
Process Gas Input Line...................................................................74
Vacuum Output Lines......................................................................74
Door Seal Vacuum..........................................................................74
Maintenance and Troubleshooting......................................................75
Intervals and procedures ....................................................................75
Daily ...............................................................................................75
Weekly.............................................................................................75
Monthly...........................................................................................75
De-Commissioning Tool/ Recycling ...............................................75
Software Download Procedures .........................................................76

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PLC Software..................................................................................76
Touchscreen Software.....................................................................79
Troubleshooting Process Problems ....................................................81
Improper Curing.............................................................................81
Troubleshooting Equipment Problems................................................81
Insufficient Facilities for Required Process ...................................81
Software..........................................................................................82
Faulty Wiring or Instrumentation Malfunction ..............................82
Sizeable Vacuum Leak ....................................................................82
High Oxygen Concentration...........................................................84
Troubleshooting Equipment Malfunctions.........................................85
Reference Table Procedures...............................................................87
REF 1 - Door Seal Leaks................................................................87
REF 2 - Valve Repair......................................................................87
REF 3 - Power On Switch...............................................................87
REF 4 - Circuit Breakers................................................................88
REF 5 - Light Tower.......................................................................88
REF 6 - System Controller..............................................................88
REF 7 - System Vacuum Gauges ....................................................88
REF 8 - Temperature Controller ....................................................88
REF 9 – Chamber Main Heaters....................................................89
REF 10 - Cooling Blower ...............................................................89
REF 11 – Process Gas Heater........................................................89
REF 12 – Process Vacuum Pump...................................................90
REF 13 - Solid State Relays............................................................90
REF 14 - Software (Program).........................................................90
REF 15 – Chamber Rear Trim Heater............................................90
Ref 16 - Turbo Pump.......................................................................91
Alarm List............................................................................................92
Atm to tp1 ab...................................................................................92
Tp1 to tp2 ab...................................................................................92
Tp2 to tp1 ab...................................................................................92
Tp1 to Atm ab..................................................................................92
High temp ab...................................................................................92
Door temp high...............................................................................92
Pres lo alm ramp.............................................................................92
Pres lo alm dwell ............................................................................93
Pres lo alm cool..............................................................................93
Pressure hi ab.................................................................................93
Operator reset.................................................................................93
Cabinet overtemp............................................................................93
Pro Gas overtemp...........................................................................93
Failed to reach temp.......................................................................93
Hi Vac Starting Pres Abort.............................................................93
Door Switch Not Made ...................................................................93
Foreline Pressure Boot...................................................................93
Gate Valve Failed to Close Boot ....................................................93
Gate Valve Failed to Close Process ...............................................93
Gate Valve Failed to Open Process................................................93
Hi-Vac Hi Pressure Abort...............................................................93
Hi-Vac Segment Read Failure........................................................93

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Foreline Pressure Process..............................................................94
Failed To Reach Hi Vac SP............................................................94
1160 Gas Com Failure .....................Error! Bookmark not defined.
1160 Rear Trim Com Failure .........................................................94

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Table of Figures
Figure 1: Weight Distribution and Mass Centers................................6
Figure 2: Panel Grounding Fastener Locations – Main Machine....10
Figure 3: Panel Grounding Fastener Locations – Control Console .10
Figure 4: Front View Hazard Label Location....................................12
Figure 5: Left View Hazard Label Locations.....................................12
Figure 6: Right View Hazard Label Locations ..................................13
Figure 7: YES-PB8 –2HV Rear View Hazard Label Locations........13
Figure 8: YES-PB8 –2HV Console Hazard Label Locations............14
Figure 9: EMO Circuit.........................................................................15
Figure 10: Temperature Controller ....................................................17
Figure 11: Pressure Gauge...................................................................22
Figure 12: Plumbing layout - O2 Analyzer.........................................23
Figure 13: Temperature Display .........................................................28
Figure 14: Program #1 Temperature Plot..........................................32
Figure 15: Operator's Panel.................................................................37
Figure 16: Operator 2 Panel (MFC Active)........................................38
Figure 17: Alarm and Access Panel.....................................................39
Figure 18: Alarm Window ...................................................................39
Figure 19: Operator Maintenance Panel............................................41
Figure 20: Engineer Maintenance Panel.............................................42
Figure 21: Recipe Set Up Panel ...........................................................44
Figure 22: Recipe 1 to 8 Set Up Panel.................................................45
Figure 23: Hi-Vac Parameter Panel....................................................47
Figure 24: Com Device Display Panel.................................................48
Figure 25: Output Panel 1....................................................................49
Figure 26: Output Panel 2....................................................................50
Figure 27: Date/Time............................................................................51
Figure 28: Parameters Set Up Panel...................................................52
Figure 29: PID Panel ............................................................................54
Figure 30: SCR Panel ...........................................................................55
Figure 31: Temperature Offset Panel .................................................57
Figure 32: Fan Power Panel.................................................................58
Figure 33: Exhaust Damper Set Up Panel..........................................59
Figure 34: Flow Panel...........................................................................60
Figure 35: Signal Tower Set Up Panel................................................61
Figure 36: Additional Light States Panel............................................62
Figure 37: O2 Panel..............................................................................63
Figure 38: Vacuum Set Up Panel.........................................................64
Figure 39: Options Panel......................................................................66
Figure 40: InTouch Set Up Panel ........................................................68
Figure 41: CTC Monitor Utility Files Form.......................................76
Figure 42: Changing Communication Configuration........................77
Figure 43: Message for Established Communication........................77
Figure 44: Set Controller IP Address..................................................78
Figure 45: Downloading the PLC File.................................................78
Figure 46: Opening Proface Software.................................................79
Figure 47: Proface File Transfer Screen.............................................80

Introduction
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Introduction
Process Description
Typical applications that this tool can be used for (but are not limited to)
are: Applications
Copper Anneal - A type of heat treatment where the microstructure
of a material is altered, causing changes in its properties such as
strength and hardness.
Low-K dielectric cure - A thin film application that also involves
moisture removal and sealing.
Getter Activation - Getters are used to scavenge unwanted gases in
many applications. In MEMS devices, getters may be used to tie up
excess moisture or hydrogen which may interfere with the long term
operation of the device. Activating the getter material involves high
temperature and high vacuum processing to ensure the material starts
as moisture / hydrogen-free as possible.
Thin Film Thermal treatment - Thin film resistors can change
properties rapidly as they age unless they are properly thermally
treated. The process stabilizes the crystal grain and ensures long
term predictable behavior.
!!!Caution!!!
Regardless of process this tool is compatible for use with
non-toxic, non-flammable gasses only! Never allow
processing of substrates in the chamber that produce low
vapor pressure condensable vapors. They will be very
difficult to remove and will limit ultimate pump down
pressure specification of the chamber. Wear gloves when
handling cassettes or near chamber inner surfaces, to
prevent human organic contaminations.
Sub-Atmospheric Process
The oven comes equipped with a full chamber laminar flow system
through which preheated nitrogen is gently introduced during the
process. To help prevent particles on wafers and cassettes, the nitrogen
first passes through a stainless steel filter before entering the process
area. Vacuum introduced at the chamber floor creates the nitrogen
laminar flow and removes particles. Room temperature nitrogen flows
into the chamber at the end of the process to cool and continue cleaning
the wafers before removal.
A circulating air conduit cools the oven door and seal assemblies
allowing the product to be removed while leaving the oven walls at
idling (ambient-250°C) temperature to reduce ramp-up/ramp-down time

Introduction
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for the next wafer batch. A separate air circulation system works to
rapidly cool the oven down once the process is complete.
Hi Vacuum Process
The YES-PB8-2HV is also able to perform deep vacuum pulls and
allows more versatility to process requirements. Process temperature
uniformity is still controlled, even without the aid of gas conductance
that is present in the sub-atmospheric pressure range.
Features
Designed and built to be safe, reliable, durable, and operator friendly,
features of the YES-PB8-2HV Hi-Vac Oven include:
1. 24 Volt DC instrumentation
2. State Logic Controller
3. Color Touch Screen Operators Interface
4. Multiple program, ramp-able Temperature controller, 25-450°C
range with LED temperature and set point displays
5. Visual cycle complete
6. Audible and visual indication of incorrect process with light
tower and audible alarm
7. Double set point Vacuum Gauge
8. High and low vacuum checkpoint for system integrity
9. High and low nitrogen checkpoint
10. Over-temperature protection shutoff
11. Emergency Off button, front and rear
12. Electropolished 316L stainless steel chamber
13. Internal chamber welds
14. Preheated N2 (Process Gas)
15. 100 micron laminar flow inlet filter
16. Alternate vacuum valve for process vacuum
17. Dual door o-rings with a vacuum purge between the seals to
limit oxygen leakage through the door seal at high vacuum
ranges
18. Multiple PID control of temperature
19. RS-232 interface for State Logic Controller to download/monitor
programs
20. RS-232 port to upload/download panels
21. Forced air convection cooling with variable position damper
vane for faster ramp down and temperature uniformity stability
22. Ultra-high purity 0.5 micron N2 filter*

Introduction
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23. Second Gas*
24. Third Gas*
25. Cassette Placement Guides *
26. Oxygen Analyzer for O2 Detection*
27. Up to three Mass Flow Controllers for precise gas flow control*
28. Vacuum Line Gas Cooling
29. Hi-Vac Outlet Temperature control
30. SST Cart
31. Gate Valve
32. Turbo Vacuum Pump
33. Safety Pressure interlocks
* Indicates System Options

Introduction
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Specifications
The specifications of the YES-PB8-2HV are as follows: Process Exposed Parts
Chamber 316L SS electropolished cylinder with user
exposed dimensions of 14.41” [366 mm]ID
X 28.29"[719 mm]L
Tubing 316 SS
Isolated Vacuum Seals 316 SS Swagelok®
Door Plate 316L SS
Door Seals Cured Viton
Chamber Exposed Seals Copper Conflat & SST Swagelok®VCR
Additional Parts
Heaters 6 heaters, 12100 maximum total watts
Isolation Valves Bellows sealed with Kel-F tip seals
Instrumentation 24 Volts DC
Chamber Cooling Blower 1200 scfm
Flange Cooling Fan 27 scfm @ 0 IWC
System Power Requirements
208 VAC, 50/60 Hz, 40 amp service, 3 phase
Process Vacuum Pump
Power Requirements
200-230 VAC, 50/60 Hz, 7.0 amps minimum service, 1 phase
Turbo Pump Power
Requirements
100-240 VAC, 50/60 Hz, 2.5 amps minimum service, 1 phase, 350 watts
(Water Cooling)
Wafer Capacity
2 cassettes of 8" (200 mm) wafers, other cassette size quantities are
cassette type dependent.

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Overall Dimensions
Standard Tool
28.82”[732 mm] W X 64.42”[1636 mm] H X 55.25”[1403 mm) D
(As configured in the facilities drawing with no MFC option, height with
light tower is 73.32”[1862 mm])
With MFC Option/s
28.82”[732 mm] W X 64.42”[1636 mm] H X 61.16”[1553 mm) D With Control Console
Remote Location
28.82”[732 mm] W X 55.11”[1400 mm] H X 55.25”[1403 mm) D
Control Console, No Light
Tower
24.25"[616 mm] W x 9.31"[236 mm] H x 44.41"[1128 mm] D
Control Console with Light
Tower
24.25"[616 mm] W x 18.22"[463 mm] H x 44.41"[1128 mm] D

Introduction
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Weight, Distribution, and
Mass Centers TBD
Figure 1: Weight Distribution and Mass Centers

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Energy Consumption
Idle
(Watts) Peak (Watts) Average (Watts)
PB8-HV 183 7200 3003
Idle is defined as tool running at 100C
Dwell is defined as tool running at 300C
Peak is defined as tool running ramping up.
Average is defined as Average of Peak, Dwell, and Cooling.
Process defined as Peak (40 min duration), Dwell (60 min.
duration), and Cool (40 min duration).
Note: AIC Rating for these tools is 10000A
Process Gas Consumption
Idle (LPM) Peak (LPM) Avg (LPM)
PB8-HV .200 57 28.6

System Set Up And Test
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System Set Up and
Test
This section describes the procedures used to test and prepare the YES-
PB8-2HV for process operations. Safety
Safety Signal Word
Definitions
Caution - Indicates a potentially hazardous situation, which, if not
avoided, may result in minor or moderate injury. It may also be used to
alert against unsafe practices (ANSI Z535.4)
Warning – Indicates a potentially hazardous situation, which if not
avoided, could result in death or serious injury (ANSI Z535.4).
Danger – Indicates an imminently hazardous situation, which, if not
avoided, will result in death or serious injury. This signal word is to be
limited to the most extreme situations (ANSI Z535.4). Unavoidable hazards
Type 3 Electrical Hazards
Type 3: Maintenance in areas exposed to live circuits
less than 30V RMS or 240VA with accidental contact
possible.
Control enclosure entrance with power on may be required for electrical
malfunction troubleshooting.
The control enclosure contains circuits with potentials up to 220VAC
and 24VDC. All electrical contacts and terminals in the control enclosure
are shielded from inadvertent contact.
Type 4 Electrical Hazards
Type 4: Maintenance in areas exposed to live circuits
greater than 30V RMS, 240VA, or RF with accidental
contact possible.
The following recommended set up and maintenance procedures require
entrance into the control enclosure while the power is on. Control
enclosure entrance with power on may also be required for electrical
malfunction troubleshooting.
The control enclosure contains circuits with potentials up to 220VAC
and 24VDC. All electrical contacts and terminals in the control enclosure
are shielded from inadvertent contact.
Verify supply voltages and frequencies (set up only)
System power up (set up only)

System Set Up And Test
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Type 5 Electrical Hazards
Type 5: Maintenance requiring physical entrance into
energized equipment.
There are no Type 5 electrical hazards on the YES-PB8-2HV as it is too
small for physical entrance.
Electrical Disconnect
The main power disconnect switch for the YES-PB8-2HV is located at
the right side of the rear panel on the Control Console. The main
disconnect switch removes all electrical power from the tool, including
the pump power.
Cabinet Safety Grounding
!!!Warning!!!
Engage the EMO button, turn off the main
disconnect and padlock, and remove plug
from facilities before servicing. There is no
visual device to indicate when the power has
been removed from the system, other than
the position of the main disconnect switch.

System Set Up And Test
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Indicators are placed on the tool with the above safety ground symbol, to
designate which fasteners ensure proper safety grounding of the cabinet
panels.
Figure 2: Panel Grounding Fastener Locations – Main Machine
Figure 3: Panel Grounding Fastener Locations – Control Console
!!!Warning!!!
Do not operate tool if
indicated fasteners are
missing or not fully engaged.

System Set Up And Test
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Chamber Temperature
Temperature increases in the chamber during normal operation. The tool
implements a maximum allowable temperature limit set point, primarily
to protect temperature runaway.
Vacuum Pump Temperature
Temperatures will increases on the outer vacuum pump housing surfaces
with continued operation.
!!!Caution!!!
Ensure vacuum pump housing
temperature is at a safe handling
temperate (51C) before touching.
The use of protective gloves is
recommended at elevated
temperatures.
!!!Caution!!!
When running process please note that the chamber flange is an
exposed area located just behind the door. Ensure flange
temperature is at a safe handling temperate (51C) before touching.
The use of protective gloves is recommended at elevated
temperatures. When the use of gloves is not enough for your
process YES has specially designed handlers for cassettes if
necessary.