Z Microsystems Multi Processor Unit Z MPU User manual

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System Overview
1.0 System
1.1 Sealed
1.2 Independent
Z MPUZ MPU
Z MPUZ MPU
Z MPU
• Shared Chassis -- Shared
Peripherals
• Less space, less weight, less
power, less cost
The rugged Z MPU delivers
four independent computers.
Each computer is an Intel or
Sun COTS computer encased in
its own environmentally sealed
hot swappable module.
Each computer is a complete
stand alone system with its
own dedicated boot disk.
• Hot swappable Sealed
Computer Modules (SCM) and
Disk modules
• Mix & match platforms and
OS’s
The chassis can be quickly
populated with SCM’s and hard
drives, and can be mixed and
matched with Intel and Sun
motherboards using IDE and
SCSI hard drives.
Each hot pluggable computer
and its dedicated disk module
is environmentally sealed
against sand and dust,
effectively reducing
maintenance and increasing
reliability and system life.
• Independent Stand Alone
Systems
Four physically and logically
separate computers enable
different software applications
to run independently.
Each computer has its own
dedicated TranzPak 7 disk
module, its own external I/O
connectors, and shared access
to support peripherals.
Each computer has two
independent USB busses that
are matrix-switched to the
array of USB peripherals.
1.1 Sealed
1.2 Independent

Each docking slot has a transition board that mates with the removable SCM and its dedicated TranzPak 7 disk module. Inside each SCM
an interface board generates the required voltages and transitions the motherboard’s I/O signals to the outside world.
Hot swap SCM’s contain environmentally sealed COTS motherboards. Keep your
configurations current with the latest Intel/Sun motherboards.
Hot swap TranzPak 7 Modules contain
environmentally sealed IDE or SCSI hard drives.
Component Overview
Dedicated 28 VDC
Power and ATX
Interface Board
Heatsinks
conduct thermal
energy to module
cover for
dispersion
ATX Motherboard
(Intel or Sun)
Internal DC Power Input
and Switched USB
Transition
Board
Dedicated Disk
(SCSI or IDE)
PCI Card
Operator Front
External I/O
Connectors
2.2 Inside Look
2.1 SCM 2.0 TranzPak 7

Shared Peripherals & System Administration
• Shared Peripheral Clusters
The Peripheral Device Layer
organizes an array of the most
popular USB devices (CDW, floppy,
PCMCIA) and an external hub into
four switchable clusters that can
be individually and dynamically
switched to any SCM.
• Maximum Flexibility
Each SCM has two independent
internal USB busses that are
assignable to any of the four
peripheral clusters.
Peripheral assignments can be
made locally using the front panel
or remotely via the SysAdmin
network facility.
• Web Based SysAdmin
An embedded multiprocessor
monitors system health and
watch-dog activity.
An HTML web page provides
network capability for remote
monitoring and system
administration.
The ability to independently
control power, reboot, monitor
environmental performance,
execute failover strategies, and
administer system functions
across the network allows the
system to be located in “lights
out” inaccessible locations.
3.1 Peripheral Cluster
3.2 Remote SysAdmin
3.0 Peripheral Sharing

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Z Microsystems - Multi Processor Unit
Quad
modulated
fan array
provides
front to
back
cooling
Fan array
control
board
DC Power In
TranzPak 7
removable
disk module
(SCM)
Sealed
computer
module
stack
6.0 System Architecture
Peripheral
clusters
External
connector
transition
board
Switched
peripheral
and power
distribution
backplane

7.0 Schematics
7.1 Specifications
Z Microsystems 5945 Pacific Center Blvd., Suite 505 San Diego, CA 92121-4309 T: 858.657.1000 F: 858.657.1001 www.zmicro.com
Motherboards Intel and Sun ATX form
factor
Storage Options SCSI and/or IDE
Dimensions 10.5” H x 17.5" W x 22" D
Net Weight 110 lbs. (depending on
device)
Power
DC Voltage: 22 – 29 VDC
DC Current: 18A @ 28VDC Typ.
AC Voltage: 85 – 264 VAC @ 47-63 Hz
AC Current : 5.6A @ 120VAC Typ.
Environmental
Operating Temp. 5º to + 50º Celsius
Non Op. Temp. -40º to + 65º Celsius
Operating Humidity 5% to 95% Non condensing
Non Op. Humidity 5% to 95% Non condensing
Shipping Humidity 5% to 95% Non condensing
Non Op. Altitude -1,300 to 40,000 ft.
Operating Altitude -1,300 to 10,000 ft.
Operating Vibration Wheeled and tracked vehicles, fixed
and rotary wing aircraft.
Mil-Std-167 (in transit case)
Shock Operating Mil-Std-810E, Method 516, 30g’s
Fungus Non Nutrients / contaminants
Reliability
Operating Life 10 years
Maintainability <20 minutes
Regulatory
Safety UL 1950
EMI FCC Class A
Quality/Workmanship IPC / ISO 9002 and applicable section
of MIL-HDBK-454 Z MPU 4X
Z MPU 2X
7.2 Options