ZTEWelink Z-Wave ZM5202 User manual
Hardware Development Guide of Module Product
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Hardware Development Guide of
Module Product
Product Model No:ZM5202
Document Version: 2.0
Release Date: 2013-05-31
Hardware Development Guide of Module Product
II All Rights reserved, No Spreading abroad without Permission of ZTEWelink
Legal Information
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Hardware Development Guide of Module Product
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Revision History
Version Date Description
1.0 2010-04-15 1st version
2.0
2013-03-20
1. Delete the part of 3.13 and 3.14 in former version
2. Change Logo of the header, footer and front cover
3. Modify the legal information
2013-05-13
4. Modify the Reference document list in chapter 1.3
5. Add the module dimensions of top plane and thickness
6. Modify the chapter 7.7 of Recommended Product
Upgrading Plan
7. Modify the Standby current from 3.5mA to 5mA in Table
2-1
8. Modify the peak current from ≤470mA to ≤2A and
modify the Working temperature from 70 to 75°C in
Table 2-1
9. Modify the Pin 32-35,64,65,67,68 and description in
chapter 3.1.3
10. Modify chapter 3.8.3 to support of 8 wire UART
11. Modify the MODULE_WAKEUP_AP interface
application
12. Modify the product test environment in Table 6-2 and
6-4
13. Modify the product test result in Table 6-6
14. Update the Figure 3-1 of PIN Configuration Diagram
Modify the Figure 7-2 of Main and AGPS Antenna
Welding Pad Interface
15. Modify the Figure 7-1 of Main Antenna RF Connector
Interface
16. Modify Figure 2-1 of Product Illustration
2013-05-31 17. Release as Version 2.0
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TABLE OF CONTENTS
1About This Document.....................................................................................1
1.1 Application Range ............................................................................................................ 1
1.2 Purpose ............................................................................................................................ 1
1.3 Supported & Reference Document List ........................................................................... 1
1.4 Abbreviations ................................................................................................................... 2
2Product Overview............................................................................................3
2.1 Mechanic Features .......................................................................................................... 3
2.2 Technical Parameters ...................................................................................................... 5
2.3Function Overview ........................................................................................................... 8
2.3.1 Baseband Function .......................................................................................................... 8
2.3.2 Radio Frequency Function ............................................................................................... 8
3Interfaces.......................................................................................................10
3.1 Definition of PINs ........................................................................................................... 10
3.1.1 Definition of PIN I/O Parameters .................................................................................... 10
3.1.2 PIN Configuration Diagram ............................................................................................ 10
3.1.3 PIN Description .............................................................................................................. 11
3.2 Working Condition .......................................................................................................... 15
3.3 Feature of Interface Power Level ................................................................................... 16
3.3.1 Feature of Digital Power Level Signal ............................................................................ 16
3.4 Power Interface .............................................................................................................. 16
3.4.1 Description of Power PINs ............................................................................................. 16
3.4.2 Requirement of Power Supply ....................................................................................... 16
3.5 (U)SIM Card Interface .................................................................................................... 17
3.5.1 Description of PINs ........................................................................................................ 17
3.5.2 Electric Feature .............................................................................................................. 17
3.5.3 Application of (U)SIM Card Interface ............................................................................. 18
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3.6 SD Card Interface .......................................................................................................... 18
3.6.1 Description of PINs ........................................................................................................ 18
3.6.2 Electric Feature .............................................................................................................. 19
3.6.3 Application of SD Card Interface .................................................................................... 19
3.7 USB2.0 Interface ............................................................................................................ 20
3.7.1 Description of PINs ........................................................................................................ 20
3.7.2 Electric Feature .............................................................................................................. 20
3.7.3 Application of USB Interface .......................................................................................... 20
3.8 Serial Interface ............................................................................................................... 21
3.8.1 SPI (Serial Peripheral Interface) Bus Interface .............................................................. 21
3.8.2 I2C Bus .......................................................................................................................... 22
3.8.3 UART Interface .............................................................................................................. 24
3.9 JTAG (Joint Test Action Group) Interface ...................................................................... 26
3.9.1 Description of PINs ........................................................................................................ 26
3.9.2 Application of JTAG Interface ........................................................................................ 26
3.10 Power-on/Power-off & Reset Signal .............................................................................. 26
3.10.1Description of PINs ........................................................................................................ 26
3.10.2Interface Application ...................................................................................................... 27
3.11 Interactive Application Interface ..................................................................................... 28
3.11.1Description of PINs ........................................................................................................ 28
3.11.2Interface Application ...................................................................................................... 28
3.12 LED Indicator Interface .................................................................................................. 29
3.12.1Description of PINs ........................................................................................................ 29
3.12.2Interface Application ...................................................................................................... 30
4Electric Feature.............................................................................................31
4.1 Power Feature................................................................................................................ 31
4.1.1 Power Supply ................................................................................................................. 31
4.1.2 Working Current ............................................................................................................. 31
4.2 Power-on/Power-off Flow ............................................................................................... 32
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4.3 Resetting Flow ............................................................................................................... 34
5Technical Index of Radio Frequency ...........................................................35
5.1 Technical Index of Radio Frequency under UMTS Mode .............................................. 35
5.1.1 UMTS (WCDMA)............................................................................................................ 35
5.2 Technical Index of Radio Frequency under GPRS/GSM/EDGE Mode ......................... 35
5.3 Technical Parameters of Antenna Testing Console ...................................................... 35
5.3.1 Sourceless Index............................................................................................................ 36
5.3.2 Sourced Index ................................................................................................................ 36
6Related Test & Testing Standard .................................................................37
6.1 Testing Reference .......................................................................................................... 37
6.2 Description of Testing Environment ............................................................................... 38
6.3 Reliability Testing Environment ...................................................................................... 39
6.4 Reliability Testing Result ................................................................................................ 40
7Design Guide.................................................................................................41
7.1 General Design Rule & Requirement ............................................................................ 41
7.2 Power Supply Circuit Design ......................................................................................... 41
7.3 RF Circuit Design ........................................................................................................... 42
7.3.1 RF Antenna Circuit Design ............................................................................................ 42
7.3.2 Precautions During the Initial Design of Antenna .......................................................... 45
7.4 Suggestions for EMC & ESD Design ............................................................................. 47
7.5 Suggestions for PCB Wielding Panel Design ................................................................ 48
7.6 Suggestions for Heat-dissipation Design ....................................................................... 48
7.7 Recommended Product Upgrading Plan ....................................................................... 49
8Manufacturing Guide ....................................................................................50
8.1 Design of Steel Mesh ..................................................................................................... 50
8.2 Furnace Temperature Curve .......................................................................................... 50
9FCC Regulations ...........................................................................................51
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Figures
Figure 2-1 Product Illustration ....................................................................................... 3
Figure 2-2 Module Dimensions ..................................................................................... 4
Figure 2-3 System Connection Structure ...................................................................... 8
Figure 3-1 PIN Configuration Diagram ........................................................................ 11
Figure 3-2 (U)SIM Card Signal Connection Circuit ...................................................... 18
Figure 3-3 SD Typical Application Circuit .................................................................... 19
Figure 3-4 USB Typical Circuit Application ................................................................. 21
Figure 3-5 SPI Bus Sequence Chart ........................................................................... 22
Figure 3-6 I2C Reference Circuit Diagram .................................................................. 23
Figure 3-7 Module Serial Port & AP Application Processor ......................................... 25
Figure 3-8 The connection of ZM5202 UART and Standard RS-232-C interface ........ 25
Figure 3-9 Module Power-on Plan .............................................................................. 27
Figure 3-10 Recommended Circuit for Power-on/Power-off & Reset........................... 27
Figure 3-11 The output of MODULE_WAKEUP_AP ................................................... 29
Figure 3-12 Reference Circuit of Status Indicator ....................................................... 30
Figure 4-1 Power-on Sequence Chart of ZM5202 Module .......................................... 33
Figure 4-2 Power-off Sequence Chart of ZM5202 Module .......................................... 33
Figure 4-3 Module Resetting Flow .............................................................................. 34
Figure 7-1 Main Antenna RF Connector Interface ....................................................... 42
Figure 7-2 Interface of Main Antenna and AGPS Antenna Welding Pad ..................... 44
Figure 7-3 RF Interface Testing Console (W.FL-R-SMT-1 from HRS) ......................... 44
Figure 7-4 T esting Cable ............................................................................................ 45
Figure 8-1 Recommended Pattern of Steel Mesh on Wielding panel .......................... 50
Figure 8-2 Furnace Temperature Curve Reference Diagram ...................................... 53
Figure 8-3 T esting Result............................................................................................ 53
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Tables
Table 1-1 Supported Document List ............................................................................. 1
Table 1-2 A bbreviation List ........................................................................................... 2
Table 2-1 M ajor Technical Parameters ......................................................................... 6
Table 2-2 Working Frequency Band ............................................................................. 9
Table 3-1 P IN Parameters .......................................................................................... 10
Table 3-2 PIN Interface Definition ............................................................................... 11
Table 3-3 Working Condition ...................................................................................... 15
Table 3-4 Power Level Range of Digital Signal ........................................................... 16
Table 3-5 Definition & Description of (U)SIM Card Signal Group ................................ 17
Table 3-6 Definition of SD Card Signal Interface ......................................................... 18
Table 3-7 Definition of SPI Signal ............................................................................... 21
Table 3-8 Definition of UART Signal ........................................................................... 24
Table 3-9 Definition of JTAG Signal ............................................................................ 26
Table 3-10 Interactive Application Interface ................................................................ 28
Table 3-11 Definition of LED PIN Signal ..................................................................... 29
Table 3-12 Definition of Indicator Status ..................................................................... 30
Table 4-1 Input Voltage .............................................................................................. 31
Table 4-2 Working Current .......................................................................................... 31
Table 4-3 P ower-on/Power-off Time ........................................................................... 33
Table 5-1 Sourceless Index of Main Antenna (Recommended) .................................. 36
Table 6-1 Testing Standard ........................................................................................ 37
Table 6-2 Testing Environment ................................................................................... 38
Table 6-3 Testing Instrument & Device ....................................................................... 38
Table 6-4 R eliability Features ..................................................................................... 39
Table 6-5 Temperature Testing Result Under Windless Environment ......................... 40
Table 6-6 H igh/Low-temperature Running & Storage Testing Result .......................... 40
Table 8-1 Curve Temperature Curve Parameter Setting ............................................. 52
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1 About This Document
1.1 Application Range
This document is applicable as the hardware development guide of ZM5202
WCDMA module products. The user can design ZM5202 according to the
requirement and guidance in this document. It is only applicable for the hardware
application and development of ZM5202 WCDMA module products.
1.2 Purpose
This document provides the design and development fundamentals for the users of
ZM5202. By reading this document, the user can have an overall knowledge of
ZM5202 and a clear understanding of the technical parameters. With this document,
the user can successfully fulfill the application and development of wireless 3G
Internet product or equipment.
Besides the product features and technical parameters, this document also
provides the product reliability tests and related testing standards, service function
implementation flow, RF performance indexes and a guide on the design of user
circuits, to provide the user with a complete design reference.
1.3 Supported & Reference Document List
Besides the hardware development document, ZTEWelink also provides the board
operation guide, software development guide and upgrading plan guide of ZM5202.
Table 1-1 is the list of supported documents.
Table 1-1 Supported Document List
NO. Document Name
1 ZTEWelink ZM5202 Module Specification.pdf
2 ZTEWelink LGA Type Ⅱ Module Dev Board User Guide.pdf
3 ZM5202 Software Development Guide of Module Product.pdf
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1.4 Abbreviations
Table 1-2 is a list of abbreviations involved in this document, as well as the English
full names.
Table 1-2 Abbreviation List
Abbreviations Full Name
ESD Electro-Static discharge
GPRS General Packet Radio Service
GSM Global Standard for Mobile
Communications
I/O Input/output
LED Light Emitting Diode
SPI Serial Peripheral Interface
WCDMA Wideband Code Division Multi Access
UMTS Universal Mobile Telecommunication
System
BER Bit Error Rate
DL Downlink
DPCH Dedicated Physical Channel
DPCH_Ec Average energy per PN chip for DPCH.
DPCH
SIM Subscriber Identification Module
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2 Product Overview
ZM5202 is one WCDMA wireless Internet module with LGA interface. It is widely
applied to but not limited to the various products and equipment such as laptops,
vehicle-mounted terminals, and e lectric devices, by providing data services. The
features of ZM5202 module are described as below.
1. It can support UMTS 850(900)/1900/2100MHz frequency band, and
GSM/GPRS/EDGE 850/900/1800/ 1900MHz frequency band.
2. It can provide high-speed data access service under the mobile environment.
3. It provides the SPI interface, I2C interface, (U)SIM card interface (3.0V/1.8V),
USB2.0 interface, UART interface, SD2.0 interface, power-on/power-off, and
resetting.
Figure 2-1 Product Illustration
2.1 Mechanic Features
ZM5202 is a 108-pin LGA encapsulation module. Except for the signal PIN, there
are many dedicated heat-dissipation ground wielding panel to improve the
grounding performance, mechanical strength and heat-dissipation performance.
There are altogether 30 heat-dissipation ground wielding panels, evenly distributed
at the bottom of PCB. The dimensions of 108-pin LGA encapsulation are 26*36mm,
and the height is 2.5+/-0.2mm. The location of PIN 1 is identified by the ground
wielding panel with an inclination at the bottom, and its angle orientates to the top
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welding panel of the corresponding module. Figure 2-2 is a figure about the
dimensions of ZM5202 module.
Figure 2-2 Module Dimensions
(a)Dimensions on Top plane (b) Thickness
(c) Bottom
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2.2 Technical Parameters
The major features of ZM5202 can be described from the aspects of mechanic
feature, base band, radio frequency, technical standard and e nvironment feature.
Table 2-1 is a l ist of the major technical parameters and f eatures supported by
ZM5202.
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Table 2-1 Major Technical Parameters
Name Parameter
Item Specifications
Mechanical
Feature
Dimensions 36mm * 26mm * (2.5+/-0.2)mm
Weight About 5.2g
Encapsulation
type LGA package(108 Pin)
Baseband
Processor
architecture ARM 9 architecture
(U)SIM/SIM Standard 6 PIN SIM card interface
3V SIM card and 1.8V SIM card
Memory 32MByte/128MByte
USB interface USB 2.0 HIGH SPEED
Maximum
power
consumption 1
2.2W
Voltage DC 3. 4V-4.2V, typical: 3.8V
Working
current2
Peak current ≤2A (3.8V) note1
Average normal working current ≤150mA (3.8V) note2
Average normal working current
(without services) ≤75mA
Standby current ≤5mA (3.8V) note3
RF
GSM band EDGE/GPRS/GSM: 1900/1800/900/850MHz
UMTS band /WCDMA: 2100/1900/850(900)MHz;
RxDiv Band NAnote4
Max.
transmitter
power
UMTS2100/1900/850(900): Power Class 3 (+24dB +1/-3dBm)
GSM/GPRS 850MHz/900MHz: Power Class 4 (+33dBm
±2dBm)
GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30dBm
±2dBm)
EDGE 850MHz/900MHz: Power Class E2 (+27dBm ±3dBm)
EDGE 1800MHz/1900MHz: Power Class E2 (+26dBm
-4/+3dBm)
Receiving
sensitivity
WCDMA2100 : ≤-106.7dBm
WCDMA1900/850 : ≤-104.7dBm
WCDMA900 : ≤-103.7dBm
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Name Parameter
Item Specifications
GSM850/900/1800/1900 : ≤-102dBm
Equalization Support
Main antenna
interface Support
Receive
diversity
(GPS)
antenna
interface
Support the GPS wielding panel interface, support the diversity
antenna interface; but they are not supported simultaneously.
ZTEWelink does not provide the antenna, and the antenna is
provided by the third party.
Technical
Standard
Data rate
GSM CS: UL 9.6kbps/DL 9.6kbps
GPRS: Multi-slot Class 10
EDGE: Multi-slot Class 12
WCDMA CS: UL 64kbps/DL 64kbps
WCDMA PS: UL 384kbps/DL 384kbps
GPRS type Class B
3GPP
protocol R99/R5
Operating
system
Windows XP (SP2 and later)
Windows Vista
Windows 7
Linux
Android
Environment
Feature
Working
temperature -20 to 75° C
Storage
temperature -40 to 85° C
Humidity 5%~ 95%
Application
RAS dialup Support
SMS Support
Network
locking
Optionally support
SIM READER Not support
Upgrading Support
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Note: 1. Tes t condition: The value is measured in Max. transmit power.
Note 2: Testing condition: The value is measured in transmit power of 0dBm and band of WCDMA 2100MHz.
Note 3: Testing condition: The value is measured in cell power of -75dBm and DRX=640.
Note 4: NA means unrelated.
2.3 Function Overview
2.3.1 Baseband Function
The baseband part of ZM5202 mainly includes the following signal groups: USB
signal, (U)SIM card signal, wakeup signal, working status indicator signal, UART
signal, SD interface signal, I2C interface signal, module power-on/resetting signal,
SPI, main antenna interface, AGPS antenna interface and power-supply interface.
Figure 2-3 is a diagram of the system connection structure.
Figure 2-3 System Connection Structure
Main Antenna
LGA HSDPA
Wireless module
USB
SIM card
POWER
GND
I2C
UART
SD
Wakeup and
Status
Indication
AGPS Antenna
SPI
2.3.2 Radio Frequency Function
The radio frequency function of ZM5202 can be viewed from the aspect of
over-the-air wireless bearer network, frequency band, whether the receive diversity
feature is supported, and the GPS function.
1. Support WCDMA 850(900)/1900/2100MHz;
2. Support GSM/EDGE/GPRS 850/900/1800/1900 MHz;
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3. Support GPS/AGPS;
The working frequency band of ZM5202 transceiver transmitter is as shown in Table
2-2.
Table 2-2 Working Frequency Band
Working
Frequency
Band Uplink Frequency Band Downlink Frequency
Band
UMTS850 824 MHz — 849 MHz 869 MHz — 894 MHz
UMTS900 880 MHz — 915 MHz 925 MHz — 960 MHz
UMTS1900 1850 MHz — 1910 MHz 1930 MHz — 1990 MHz
UMTS2100 1920 MHz — 1980 MHz 2110 MHz — 2170 MHz
GSM850 824 MHz — 849MHz 869 MHz — 894 MHz
GSM900 890 MHz — 915MHz 935 MHz — 960MHz
GSM1800 1710 MHz — 1785MHz 1805 MHz — 1880MHz
GSM1900 1850 MHz — 1910MHz 1930 MHz — 1990MHz
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3 Interfaces
3.1 Definition of PINs
3.1.1 Definition of PIN I/O Parameters
The definition of ZM5202 I/O parameter is as shown in Table 3-1.
Table 3-1 PIN Parameters
PIN Attribute Description
I Input PIN
O Output PIN
B Two-way digital port, CMOS
input
Z High-resistance output
P1 PIN group 1, the power supply
voltage is VDD_P1
P2 PIN group 2, the power supply
voltage is VDD_P2
PU PIN internal pull-up
PD PIN internal pull-down
A, AI, AO, AIO Analog circuit
3.1.2 PIN Configuration Diagram
The PIN sequence of interfaces on ZM5202 is defined as shown in Figure 3-1.
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Figure 3-1 PIN Configuration Diagram
3.1.3 PIN Description
Table 3-2 PIN Interface Definition
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PIN Signal Definition Pin
Voltage I/O PIN Attribute PU/PD
Status Remark
1 ANT_MAIN -- AI,
AO
Main antenna
feedback point
-- Mandatory
2 GND -- -- Ground -- Mandatory
3 JTAG_RESOUT_N P1 DI JTAG reset LGA -- If it is not used, NC
4 PON_RST_N P1 DI Module reset -- If it is not used, NC
5 POWER_ON P1 DI Power-on/Power-off
PIN
PU Mandatory
6 AP_READY P1 DI
Module queries AP
sleep status
-- If it is not used, NC
7 I2C_SCL P1 B I2C clock -- If it is not used, NC
8 I2C_SDA P1 B I2C data -- If it is not used, NC
9 MODULE_READY P1 DO AP queries Module
sleep status
-- If it is not used, NC
10 AP_WAKEUP_MO
DULE
P1 DI AP wakes up Module -- Low-
power level
wakeup. To make the
module standby, the
primary server needs to
raise up this low signal.
If it is not used, NC
11 MODULE
_WAKEUP_AP
P1 DO Module wakes up AP -- If it is not used, NC
12 GND -- -- -- -- Mandatory
13 NC -- -- -- -- --
14 GND -- -- -- -- Mandatory
15 NC -- -- -- -- --
16 NC -- -- -- -- --
17 NC -- -- -- -- --
18 NC -- -- -- -- --
19 MODULE_POWER
ON
P1 DO MODULE power-on
status indicator
-- If it is not used, NC
20 LED_GREEN P1 AI
Signal indicator
interface
-- If it is not used, NC
21 LED_RED P1 AI
Signal indicator
interface
-- If it is not used, NC
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