Acer AR320 F2 User manual

Acer AR320F2
Service
Guide
PART NO.:
PRINTED IN TAIWAN

I
Preface
1. This Service Guide provides you with all technical information relating to the BASIC CONFIGURATION
decided for Acer's "global" product offering. To better fit local market requirements and enhance product
competitiveness, your regional office MAY have decided to extend the functionality of a machine (e.g.
add-on card, modem, or extra memory capability). These LOCALIZED FEATURES will NOT be covered
in this generic service guide. In such cases, please contact your regional offices or the responsible
personnel/channel to provide you with further technical details.
2. Please note WHEN ORDERING FRU PARTS, that you should check the most up-to-date information
available on your regional web or channel. If, for whatever reason, a part number change is made, it will not
be noted in the printed Service Guide. For ACER-AUTHORIZED SERVICE PROVIDERS, your Acer office
may have a DIFFERENT part number code to those given in the FRU list of this printed Service Guide. You
MUST use the list provided by your regional Acer office to order FRU parts for repair and service of
customer machines.
Revision History
Please refer to the table below for the updates made on Acer AR320 service guide.
Date Chapter Updates
Copyright
Copyright © 2009 by Acer Incorporated. All rights reserved. No part of this publication may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in
any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without
the prior written permission of Acer Incorporated.
Disclaimer
The information in this guide is subject to change without notice.
Acer Incorporated makes no representations or warranties, either expressed or implied, with respect to the
contents hereof and specifically disclaims any warranties of merchantability or fitness for any particular
purpose. Any Acer Incorporated software described in this manual is sold or licensed "as is". Should the
programs prove defective following their purchase, the buyer (and not Acer Incorporated, its distributor, or its
dealer) assumes the entire cost of all necessary servicing, repair, and any incidental or consequential
damages resulting from any defect in the software.
Acer is a registered trademark of Acer Corporation.
Intel is a registered trademark of Intel Corporation.
Pentium and Pentium II/III are trademarks of Intel Corporation.
Other brand and product names are trademarks and/or registered trademarks of their respective holders.

II
Conventions
The following conventions are used in this manual
:
Screen messages Denotes actual messages that appea
r
on screen.
NOTE Gives bi
t
s and pieces of additional
information related to the current
topic.
WARNING Ale
r
t
s you to an
y
damage that might
result from doing or not doing specific
actions.
CAUTION Gives precautionary measures to
avoid possible hardware or software
problems.
IMPORT
A
NT Reminds you to do specific actions
relevant to the accomplishment of
procedures.

III
Safety, Care and Regulatory Information
Before installing a server, be sure that you understand the following warnings and cautions.
WARNING: To reduce the risk of electric shock or damage to the equipment:
Do not disable the power cord grounding plug. The grounding plug is an important safety feature.
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times.
Unplug the power cord from the power supply to disconnect power to the equipment.
Do not route the power cord where it can be walked on or pinched by items placed against it. Pay particular
attention to the plug, electrical outlet, and the point where the cord extends from the server.
WARNING:To reduce the risk of personal injury from hot surfaces, allow the drives and the internal
system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal
damage.
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system
or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards
or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To
prevent electrostatic damage:
Avoid hand contact by transporting and storing products in static-safe containers.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
Place parts on a grounded surface before removing them from their containers.
Avoid touching pins, leads, or circuitry.
Always be properly grounded when touching a static-sensitive component or assembly.
Server warnings and cautions
Before installing a server, be sure that you understand the following warnings and cautions.
WARNING: To reduce the risk of electric shock or damage to the equipment:
1. Do not disable the power cord grounding plug. The grounding plug is an important safety feature.
2. Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times.
3. Unplug the power cord from the power supply to disconnect power to the equipment.
4. Do not route the power cord where it can be walked on or pinched by items placed against it. Pay
particular attention to the plug, electrical outlet, and the point where the cord extends from the server.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal
system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the
server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

1
Table of Contents
PREFACE I
REVISION HISTORY I
COPYRIGHT I
DISCLAIMER I
CONVENTIONS II
SAFETY, CARE AND REGULATORY INFORMATION III
PREVENTING ELECTROSTATIC DISCHARGE III
SERVER WARNINGS AND CAUTIONS III
TABLE OF CONTENTS 1
MECHANICAL COMPONENTS 5
SYSTEM COMPONENTS 11
SYSTEM SPECIFICATIONS 12
Hardware specification 12
Environmental specification 16
Mechanical specification 17
Power supply specification 18
APPEARANCE OF SYSTEM 20
Front view 20
Rear view 21
Internal Component 22
Switch and LED Indicators Introduction 23
Front Panel LED Description 23
Hard Disk Drive Sequence & LED Description 24

2
LAN Port LED Description 24
System Block Diagram 25
MOTHERBOARD PLACEMENT AND JUMPER SETTING 26
Motherboard Component 26
Connector Description and Jumper Setting 27
INSTALLING/REMOVING SYSTEM HARDWARE 29
Chassis Cover Removal and Installation 30
Removing the top cover 30
CPU Installation / Removal 31
Heat Sink Installation / Removal 32
Memory Installation / Removal 33
PCI Expansion Card Installation / Removal 34
Install the expansion card 34
Hard Disk Drive Installation / Removal 35
Power supply installation / Removal 36
Install a hot-swap power supply module 36
System Fan Installation / Removal 37
CABLE ROUTING 39
Cable Routing image 39
BIOS SETUP 40
Main Menu 42
Advanced Menu 43
Processor Configuration 44
Memory Configuration 46
Chipset Configuration 47
ACPI Settings 48
SATA/SAS Configuration 49
PCI Configuration 51
USB Configuration 52
Legacy Device Configuration 53
Power Configuration 54
Console Redirection 55
Security Menu 57
Setting a System Password 59
Changing a System Password 59
Removing a System Password 59

3
Server Management Menu 60
System Information 61
Event Log Configuration 62
Boot Options Menu 64
Boot Manager Menu 65
Exit Menu 66
RAID CONFIGURATION UTILITIES 67
Intel platform RAID configuration 67
Set RAID Controller in Legacy Mode 67
Enabling Intel Onboard SATA RAID 67
Entering Intel onboard SATA RAID BIOS Utility 67
Loading Factory Default Setting 67
Creating a RAID Volume 68
Initializing a RAID Volume 68
Assigning a Hot Spare Drive 68
LSI onboard SATA RAID configuration 68
Set RAID Controller in Legacy Mode 68
Set RAID Controller in Legacy Mode 68
Enabling LSI Onboard SATA RAID 68
Entering LSI onboard SATA RAID BIOS Utility 69
Loading Factory default setting 69
Creating a RAID Volume 69
Initializing a RAID Volume 69
Assigning a Hot Spare Drive 70
Saving and Exiting Onboard RAID Configuration Utility 70
MegaRAID SAS 9240-4I / 9260-8I RAID Configuration 70
Set RAID Controller in EFI Mode or Legacy Mode 70
Entering RAID BIOS Utility (Legacy Mode) 70
Entering RAID EFI Utility (EFI Mode) 71
Loading Factory Default Setting 71

4
Creating a RAID Volume 71
Initializing a RAID Volume 71
Assigning a Hot Spare Drive 72
3041E-R RAID configuration 72
Set RAID Controller in Legacy Mode 72
Entering RAID BIOS Utility 72
Loading Factory Default Setting 72
Creating a RAID Volume 72
Initializing a RAID Volume 73
Assigning a Hot Spare Drive 73
TROUBLESHOOTING 74
Error Symptoms List 74
BMC Event and iKVM Event Troubleshooting 77
BIOS BEEP CODES 79
BIOS Beep Codes Table 79
PEI Beep Codes 79
DXE Beep Codes 79
BIOS Recovery Instruction 80
BIOS POST ERROR MESSAGES LIST 82
BIOS POST error message list 82
PEI Phase 82
DXE Phase 83
UNDETERMINED PROBLEMS 85

5
Mechanical Components
Item Photo Part
number
Chassis HS.R8000.
001
(With
Fixed
Power)
HS.R8000.
002
(With
Redundant
Power)
Power
Supply
(Fixed)
PY.4000G.
002
Power
Supply
(Redund
ant)
PY.4000G.
003

6
Mylar 47.R80S2.
001
Fan
Duct 42.R6J0L. 001
Fan
Cage 42.R6J0L. 002
USB
Cable
700mm
(M/B to
front I/O
board)
50.R6J0L.
001
SAS/SA
TAsignal
mini
SAS to
mini
SAS
cable
(B/P to
M/B or
B/P to
SAS
CA.31400.
016

7
RAID
card)
SMBUS
signal
Cable
(B/P to
M/B)
CA.31400.
016
Cable
IDC 26P
490mm
front
LED/SW
signal
(M/B to
front I/O
board)
50.R6J0L.
002
Case
Open
Cable
50.R310L.
001
Cable
for slim
SATA
ODD
390mm
CA.R6J00.
001
Front I/O
board 55.R6J0L. 001

8
Main
Board MB.R800A
.001
Hot plug
hard
drive
back
plane
board
TA.35400.
012
Riser
Card TA.R6J00. 001
System
fan kit
(40*40*2
8)
HI.30900.0
20
System
fan kit
(40*40*5
6)
HI.30900.0
21
Hard
Drive
Carrier
TC.32900.
005 (FXN)

9
Hard
Drive
Dummy
TC.31300.
010 (FXN)
CPU
Heat
Sink
HI.30900.0
18
Slide
Rail Kit
TC.30800.
012
TC.30800.
015

10

11
System components
Item Description
1 Top cover
2 Hard drive blank
3 Main board
4 System fans
5 Power supply cage
6 Heat sink
7 System fan duct
8 PCIe Riser Cage

12
System Specifications
Hardware specification
System unit
Item Description
Processor socket Intel LGA1155
Processor Support
Intel Xeon E3-1200 series TDP 95W
Core logic chipsets Intel C204 PCH – north bridge, core logic controller
LAN controller Intel 82574L GbE controller
Intel 82579LM PHY
Realtek RTL8201EL (Dedicate LAN)
Memory controller
Integrated in CPU
Storage controller
SATA – Integrated in Intel C204 PCH
VGA controller
Integrated in ASPEED AST2150A2 32MB DDR2 memory
I/O subsystem
Two PCIe X8 slots from PCIe X16 riser card
Memory
Four DDR III slots 32 GB maximum system memory (8 GB in each of the four
DIMM slots)
Interleaving mode supported
Media storage
Four 3.5-inch bays for hot-plug SAS/SATA drives
I/O ports
Front panel – Two USB ports Rear panel – Video port, serial port, six USB ports, two
embedded NIC ports, one Management port, System ID LED
Internal – Two USB ports
Status LED indicators
Front panel – power, hard drive, system, ID and LAN1/2 activity
Rear panel – Activity and link status for the embedded NIC
ports
Thermal solution
N+1 redundant system fans

13
Memory
Item Description
Number of DIMM slots
Four
Maximum memory
capacity
32 GB (8 GB in each of the four DIMM slots)
Memory modes Single DIMM, non-interleaving (DIMM 1A)
Two DIMMs, interleaving (DIMM 1A and DIMM 2A)
Four DIMMs, full memory configuration
Memory controller Integrated in CPU
DIMM specifications
Size
Speed
Type
1 GB, 2 GB, 4GB, and 8GB
1066/1333/1600 MHz
DDR3-1066/1333/1600 unbuffered ECC DIMM
Processor
General processor specifications
Item Description
Manufacturing
technology 32nm
Thermal design power
95W
Socket type LGA1155

14
Dual-Core Intel Core™ i3
Specification Description
Processor
number Ci3-2130 Ci3-2100
CPU speed
3.4GHz 3.1 GHz
Bus speed
External Clock Frequency (BLK)
100MHz
External Clock Frequency
(BLK)
100 MHz
Bus/core ratio
Core Max Ratio Limit 34 Core Min Ratio Limit 9 Core Max Ratio Limit 31 Core Min Ratio Limit 16
Intel Smart cache size 3 MB 3 MB
Cores/Threads 2/4 2/4
Memory Controller
Frequency Up to 1333 MHz Up to 1333 MHz
Core stepping
D-2 Q-0
CPUID string
0x206A7 0x206A7
Thermal specification
65 W 65 W
Lithography 32 nm 32 nm

15
Quad-Core Intel Xeon
Specification Description
Processor
number XE3-1280 XE3-1270 XE3-1240 XE3-1230 XE3-1225 XE3-1220
CPU speed
3.5 GHz 3.4 GHz 3.3 GHz 3.2 GHz 3.1 GHz 3.1 GHz
Bus speed
External Clock Frequency
(BLK)
100 MHz
External Clock
Frequency
(BLK)
100 MHz
External Clock
Frequency
(BLK)
100 MHz
External Clock
Frequency
(BLK)
100 MHz
External Clock
Frequency
(BLK)
100 MHz
External Clock
Frequency
(BLK)
100 MHz
Bus/core ratio
Core Max Ratio Limit 35
Core Min
Ratio Limit 16
Core Max Ratio
Limit 34
Core Min Ratio
Limit 16
Core Max Ratio
Limit 33
Core Min Ratio
Limit 16
Core Max Ratio
Limit 32
Core Min Ratio
Limit 16
Core Max Ratio
Limit 31
Core Min Ratio
Limit 16
Core Max
Ratio Limit 31
Core Min
Ratio Limit 16
Intel Smart
cache size 8 MB 8 MB 8 MB 8 MB 6 MB 6 MB
Cores/Threads
4/8 4/8 4/8 4/8 4/8 4/8
Memory
Controller
Frequency
Up to 1333
MHz
Up to 1333
MHz
Up to 1333
MHz
Up to 1333
MHz
Up to 1333
MHz
Up to 1333
MHz
Core stepping
D-2 D-2 D-2 D-2 D-2 D-2
CPUID string
0x206A7 0x206A7 0x206A7 0x206A7 0x206A7 0x206A7
Thermal
specification 95 W 80W 80 W 80 W 95 W 80 W
Lithography 32 nm 32 nm 32 nm 32 nm 32 nm 32 nm

16
Environmental specification
Item Description
Temperature range
Operating
Non-operating
5–35°C (41–95°F)
-20–60C (-4–140°F)
Humidity (non-condensing)
Operating
Non-operating
8-90% RH
5-95% RH
Acoustic noise
SAS Mode (Idle)
SAS Mode (Operating)
SATA Mode (Idle)
SATA Mode (Operating)
43dBA / 5.6 BA
49dBA / 6.1 BA
40dBA / 5.1 BA
44dBA / 5.7 BA
* All temperature ratings shown are for sea level. An altitude derating of 1¢XC per 300 m (1.8¢XF per 1,000 ft)
to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
** Storage maximum humidity of 95% is based on a maximum temperature of 45¢XC (113¢XF). Altitude
maximum for storage corresponds to a pressure minimum of 70 KPa.