ADLINK Technology IMB-M47 User manual

IMB-M47
User’s Manual
ATX Motherboard with 12/13th Gen Intel®Core™ i9/i7/i5/i3 Processors
and Intel®Q670 Chipset
Manual Rev.: 1.0
Revision Date: Sep.20, 2023
Part Number: 50M-13016-1000

ii Preface
Preface
Copyright
Copyright 2022 ADLINK Technology, Inc. This document contains proprietary information protected by copyright.
All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in
any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation
through compliance with the European Union's Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental
protection is a top priority for ADLINK. We have enforced measures to ensure that our products,
manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged
to dispose of them in accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Battery Labels (for products with battery)
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arsenic, benzene,
cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP,
styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause
cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP,
DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
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IMB-M47
Preface iii
Revision History
Revision Description Date By
1.0 Initial release 2023-09-20 CC

iv Preface
Table of Contents
Preface ................................................................................................................................ii
Table of Contents..............................................................................................................iv
List of Figures ...................................................................................................................vi
List of Tables....................................................................................................................vii
1Introduction................................................................................................................1
1.1 Packing List ................................................................................................................1
1.2 Optional Accessories ..................................................................................................1
2Specifications ............................................................................................................3
2.1 Core System ...............................................................................................................3
2.2 I/O Interface ................................................................................................................4
2.3 Video...........................................................................................................................4
2.4 Audio...........................................................................................................................4
2.5 LAN.............................................................................................................................4
2.6 Temperatures .............................................................................................................5
2.7 Humidity......................................................................................................................5
2.8 Certificate (EMC) ........................................................................................................5
2.9 Form Factor ................................................................................................................5
2.10 Operating Systems .....................................................................................................5
2.11 Functional Block Diagram...........................................................................................6
3Mechanical Layout ....................................................................................................7
3.1 Connector Locations...................................................................................................7
3.2 Mechanical Dimensions............................................................................................11
4Connector Pinouts ..................................................................................................13
4.1 Rear IO Connectors..................................................................................................13
4.2 Onboard Headers / Connectors................................................................................16
4.3 Jumper and Swtich Settings .....................................................................................22
4.4 Expansion Slots ........................................................................................................23
5Driver Installation ....................................................................................................27
6UEFI Setup ...............................................................................................................29
6.1 Menu Structure .........................................................................................................29
6.2 Main Menu ................................................................................................................30
6.3 Advanced Menu........................................................................................................31
6.4 Thunderbolt (TM) Configuration...............................................................................48
6.5 Hardware Health Event Monitoring Screen ..............................................................49

IMB-M47
Preface v
6.6 Security Screen ........................................................................................................50
6.7 Boot Screen ..............................................................................................................54
6.8 Exit Screen ...............................................................................................................55
Safety Instructions...........................................................................................................57
Getting Service.................................................................................................................58

vi Preface
List of Figures
Figure 1: Functional Block Diagram .........................................................................................................6
Figure 2: IO Panel Connector Locations ..................................................................................................7
Figure 3: Onboard Connector Locations ..................................................................................................8
Figure 4: Mechanical Dimensions ..........................................................................................................11
Figure 5: Mechanical Dimensions - IO Panel.........................................................................................12

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Preface vii
List of Tables
Table 1: IO Panel Connector Definitions ..................................................................................................7
Table 2: Onboard Connector Definitions ..................................................................................................9

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IMB-M47
Introduction 1
1 Introduction
ADLINK IMB-M47 ATX is an industrial motherboard supporting 12/13th Generation Intel® Core™ i9/i7/i5/i3 desktop
processors, an Intel® Q670 Chipset, and 7 PCIe expansion slots to provide a cost-competitive embedded
computing solution. It includes high-speed data transfer interfaces such as PCIe 5.0, USB 3.2 Gen2, and SATA 6
Gb/s (SATA III), and dual-channel DDR5 3600/4000/4800 MHz RAM for industrial automation applications. With
industrial-grade I/O port design, the IMB-M47 offers a significant competitive advantage for embedded computing
applications in terms of device compatibility, durable connectivity, and extreme environment readiness.
1.1 Packing List
•IMB-M47 ATX motherboard
•Rear I/O shield
•M.2 screw kit
1.2 Optional Accessories
•CPU cooler for 65W CPU (Part Number: 32-20976-0000-A0)
•CPU cooler for 125W CPU (available by request only)
•2-port USB 2.0 cable with bracket (Part Number: 30-25010-3010)
•2-port USB 3.0 cable with bracket (Part Number: 30-25046-0100)
•1-port LPT cable with bracket (Part Number: 30-25019-2000)
•2-port COM cable with bracket (Part Number: 30-25116-0000-A0)

2 Introduction
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