ADLINK Technology IMB-M47 User manual

IMB-M47
User’s Manual
ATX Motherboard with 12/13th Gen Intel®Core™ i9/i7/i5/i3 Processors
and Intel®Q670 Chipset
Manual Rev.: 1.0
Revision Date: Sep.20, 2023
Part Number: 50M-13016-1000

ii Preface
Preface
Copyright
Copyright 2022 ADLINK Technology, Inc. This document contains proprietary information protected by copyright.
All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in
any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation
through compliance with the European Union's Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental
protection is a top priority for ADLINK. We have enforced measures to ensure that our products,
manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged
to dispose of them in accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Battery Labels (for products with battery)
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arsenic, benzene,
cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP,
styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause
cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP,
DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
廢電池請回收

IMB-M47
Preface iii
Revision History
Revision Description Date By
1.0 Initial release 2023-09-20 CC

iv Preface
Table of Contents
Preface ................................................................................................................................ii
Table of Contents..............................................................................................................iv
List of Figures ...................................................................................................................vi
List of Tables....................................................................................................................vii
1Introduction................................................................................................................1
1.1 Packing List ................................................................................................................1
1.2 Optional Accessories ..................................................................................................1
2Specifications ............................................................................................................3
2.1 Core System ...............................................................................................................3
2.2 I/O Interface ................................................................................................................4
2.3 Video...........................................................................................................................4
2.4 Audio...........................................................................................................................4
2.5 LAN.............................................................................................................................4
2.6 Temperatures .............................................................................................................5
2.7 Humidity......................................................................................................................5
2.8 Certificate (EMC) ........................................................................................................5
2.9 Form Factor ................................................................................................................5
2.10 Operating Systems .....................................................................................................5
2.11 Functional Block Diagram...........................................................................................6
3Mechanical Layout ....................................................................................................7
3.1 Connector Locations...................................................................................................7
3.2 Mechanical Dimensions............................................................................................11
4Connector Pinouts ..................................................................................................13
4.1 Rear IO Connectors..................................................................................................13
4.2 Onboard Headers / Connectors................................................................................16
4.3 Jumper and Swtich Settings .....................................................................................22
4.4 Expansion Slots ........................................................................................................23
5Driver Installation ....................................................................................................27
6UEFI Setup ...............................................................................................................29
6.1 Menu Structure .........................................................................................................29
6.2 Main Menu ................................................................................................................30
6.3 Advanced Menu........................................................................................................31
6.4 Thunderbolt (TM) Configuration...............................................................................48
6.5 Hardware Health Event Monitoring Screen ..............................................................49

IMB-M47
Preface v
6.6 Security Screen ........................................................................................................50
6.7 Boot Screen ..............................................................................................................54
6.8 Exit Screen ...............................................................................................................55
Safety Instructions...........................................................................................................57
Getting Service.................................................................................................................58

vi Preface
List of Figures
Figure 1: Functional Block Diagram .........................................................................................................6
Figure 2: IO Panel Connector Locations ..................................................................................................7
Figure 3: Onboard Connector Locations ..................................................................................................8
Figure 4: Mechanical Dimensions ..........................................................................................................11
Figure 5: Mechanical Dimensions - IO Panel.........................................................................................12

IMB-M47
Preface vii
List of Tables
Table 1: IO Panel Connector Definitions ..................................................................................................7
Table 2: Onboard Connector Definitions ..................................................................................................9

viii Preface
This page intentionally left blank.

IMB-M47
Introduction 1
1 Introduction
ADLINK IMB-M47 ATX is an industrial motherboard supporting 12/13th Generation Intel® Core™ i9/i7/i5/i3 desktop
processors, an Intel® Q670 Chipset, and 7 PCIe expansion slots to provide a cost-competitive embedded
computing solution. It includes high-speed data transfer interfaces such as PCIe 5.0, USB 3.2 Gen2, and SATA 6
Gb/s (SATA III), and dual-channel DDR5 3600/4000/4800 MHz RAM for industrial automation applications. With
industrial-grade I/O port design, the IMB-M47 offers a significant competitive advantage for embedded computing
applications in terms of device compatibility, durable connectivity, and extreme environment readiness.
1.1 Packing List
•IMB-M47 ATX motherboard
•Rear I/O shield
•M.2 screw kit
1.2 Optional Accessories
•CPU cooler for 65W CPU (Part Number: 32-20976-0000-A0)
•CPU cooler for 125W CPU (available by request only)
•2-port USB 2.0 cable with bracket (Part Number: 30-25010-3010)
•2-port USB 3.0 cable with bracket (Part Number: 30-25046-0100)
•1-port LPT cable with bracket (Part Number: 30-25019-2000)
•2-port COM cable with bracket (Part Number: 30-25116-0000-A0)

2 Introduction
This page intentionally left blank.

IMB-M47
Specifications 3
2 Specifications
2.1 Core System
CPU:
•Intel® Core™ i9-12900E, 5.00GHz, 16 Core, DDR5 4800MHz supported, 30M Cache, 65W TDP
•Intel® Core™ i9-12900TE, 4.80GHz, 16 Core, DDR5 4800MHz supported, 30M Cache, 35W TDP
•Intel® Core™ i7-12700E, 4.80GHz, 12 Core, DDR5 4800MHz supported, 25M Cache, 65W TDP
•Intel® Core™ i7-12700TE, 4.60GHz, 12 Core, DDR5 4800MHz supported, 25M Cache, 35W TDP
•Intel® Core™ i5-12500E, 4.50GHz, 6 Core, DDR5 4800MHz supported, 18M Cache, 65W TDP
•Intel® Core™ i5-12500TE, 4.30GHz, 6 Core, DDR5 4800MHz supported, 18M Cache, 35W TDP
•Intel® Core™ i3-12100E, 4.20GHz, 4 Core, DDR5 4800MHz supported, 12M Cache, 65W TDP
•Intel® Core™ i3-12100TE, 4.00GHz, 4 Core, DDR5 4800MHz supported, 12M Cache, 35W TDP
•Intel® Pentium® G7400E, 3.60GHz, 2 Core, DDR5 4800MHz supported, 6M Cache, 46W TDP
•Intel® Pentium® G7400TE, 3.00GHz, 2 Core, DDR5 4800MHz supported, 6M Cache, 35W TDP
•Intel® Celeron® G6900E, 3.00GHz, 2 Core, 4M Cache, DDR5 4800MHz supported, 46W TDP
•Intel® Celeron® G6900TE, 2.40GHz, 2 Core, 4M Cache, DDR5 4800MHz supported, 35W TDP
•Intel® Core™ i9-13900E, 5.20GHz, 24 Core, 36M Cache, DDR5 5600MHz supported, 65W TDP
•Intel® Core™ i9-13900TE, 5.00GHz, 24 Core, 36M Cache, DDR5 5600MHz supported, 35W TDP
•Intel® Core™ i7-13700E, 5.10GHz, 16 Core, 30M Cache, DDR5 5600MHz supported, 65W TDP
•Intel® Core™ i7-13700TE, 4.80GHz, 16 Core, 30M Cache, DDR5 5600MHz supported, 35W TDP
•Intel® Core™ i5-13500E, 4.60GHz, 14 Core, 24M Cache, DDR5 4800MHz supported, 65W TDP
•Intel® Core™ i5-13500TE, 4.50GHz, 14 Core, 24M Cache, DDR5 4800MHz supported, 35W TDP
•Intel® Core™ i3-13100E, 4.40GHz, 4 Core, 12M Cache, DDR5 4800MHz supported, 65W TDP
•Intel® Core™ i3-13100TE, 4.10GHz, 4 Core, 12M Cache, DDR5 4800MHz supported, 35W TDP
Chipset: Intel® Q670 Express Chipset
Memory: 4x 288-pin DDR5 NON ECC socket, dual-channel DDR5 3600/4000/4800 MHz, up to 128 GB (based
on CPU)
BIOS: AMI® UEFI BIOS, 256 Mb SPI Flash Memory
Hardware Monitor: CPU voltage
•+3.3V voltage
•+5V voltage
•+12V voltage
•CPU temperature
•System temperature
•CPU fan speed
•System fan speed

4 Specifications
2.2 I/O Interface
Expansion slots:
•1x PCIe x16 Gen5
•1x PCIe x8 Gen5
•2x PCIe x4 Gen4
•3x PCIe x1 Gen3
SATA: 8x SATA 6.0 Gb/s connectors, Intel® software RAID 0/1/5/10 support
USB:
•1x USB 3.2 Gen2 type C connector (rear)
•5x USB 3.2 Gen2 connectors (rear)
•2x USB 3.1 via pin headers
•2x USB 2.0 via pin headers
•2x USB 2.0 vertical connectors
COM: 2x RS-232/422/485 (rear), 4x RS-232 pin headers
Parallel Port: 1x LPT pin header
PS/2 Combo Port: 1x PS/2 keyboard/mouse pin header
DIO: 8-bit GPIO (shared with LPT header)
TPM: TPM 2.0
M.2 connectors:
•1x M.2 (Key E, 2230) with PCIe x1, USB 2.0 and CNVi for Wireless
•1x M.2 (Key B, 3042/3052) with PCIe x1 / USB 3.2 Gen1 / USB 2.0 and SIM socket for 4G/5G
•1x M.2 (Key M, 2242/2260/2280/25110) with PCIe x4 Gen4
2.3 Video
Interfaces: 1x VGA connector (rear), resolution up to 1920 x 1200 at 60 Hz, 1x HDMI 2.0b connector (rear)
resolution up to 4096 x 2160 at 30 Hz, 1x DP 1.4++ connector (rear), resolution up to 4096 x 2160 at 60 Hz
2.4 Audio
Audio Codec: Realtek® ALC897
Interfaces: 1x Mic-in, 1x Line-in, and 1x Line-out connectors (rear)
2.5 LAN
LAN1: Intel® I226-V via RJ45 connector, with 10/100/1000/2500 Mbps
LAN2: Intel® I226-LM via RJ45 connector, with 10/100/1000/2500 Mbps, vPro support
LAN3:Intel® I226-V via RJ45 connector, with 10/100/1000/2500 Mbps

IMB-M47
Specifications 5
2.6 Temperatures
Operating Temperature: 0°C to 60°C
Storage Temperature: -40°C to 85°C
2.7 Humidity
60°C at 90% RH, non-condensing
2.8 Certificate (EMC)
CE/FCC Class B
2.9 Form Factor
ATX: 305 mm x 244 mm (W x L)
2.10 Operating Systems
Microsoft® Windows® 10, 64-bit
Microsoft® Windows® 11, 64-bit

6 Specifications
2.11 Functional Block Diagram
Figure 1: Functional Block Diagram

IMB-M47
Mechanical Layout 7
3 Mechanical Layout
3.1 Connector Locations
Figure 2: IO Panel Connector Locations
Table 1: IO Panel Connector Definitions
IO Panel Connectors
Item
Description
A USB 3.2 Gen2 Port
B USB 3.2 Gen2 Port
C RJ45 LAN Port (LAN3)
D COM Port (COM1) (RS232/422/485)
E COM Port (COM2) (RS232/422/485)
F RJ45 LAN Port (LAN2)
G RJ45 LAN Port (LAN1)
H Line in (light blue)
I Line out (lime)
J Mic in (pink)
K USB 3.2 Gen2 Port
L USB 3.2 Gen2 Port
M USB 3.2 Gen2 Port
N USB 3.2 Gen2x2 Type-C Port
O D-Sub Port (VGA1)
P DisplayPort (DP1)
Q HDMI Port (HDMI1)
A
B
H
I
C
D
E
F
G
J
K
L
M
N
O
P
Q

8 Mechanical Layout
Figure 3: Onboard Connector Locations
1
2
3
4
5
6
7
8
9
11
12
13
14
10
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
41
40
39
38
37
PCIE1
PCIE2
PCIE3
PCIE4
PCIE5
PCIE6
PCIE7
CMOS
Battery
DDR5_A1
DDR5_A2
DDR5_B1
DDR5_B2

IMB-M47
Mechanical Layout 9
Table 2: Onboard Connector Definitions
Onboard Connectors
Item Description Remarks
1 COM Port Pin9 PWR Setting Jumpers
PWR_COM1~2 (For COM Port1~2)
2 PS/2 Keyboard/Mouse Header
3 LAN LED Headers
I225_LED3 (For LAN3 Port)
4 ATX 12V Power Connector ATX12V1
5 Chassis Fan Connectors (+12V) CHA_FAN1
6 CPU Fan Connector (+12V)
7 USB 2.0 Port USB2_13
8 PSU_SMB1
9 24-pin ATX Power Input Connector ATXPWR1
10 Chassis Intrusion Header CI1
11 USB 2.0 Port USB2_12
12 PWR LOSS Jumper PWR_LOSS1
13 Chassis Intrusion Header CI2
14 Chassis Fan Connector (+12V) CHA_FAN3
15 USB 3.2 Gen1 Header USB3_5_6
16 M.2 Key-M Socket M2_M1
17 SATA3 Connectors SATA3_4~5
18 SATA3 Connectors SATA3_6~7
19 System Panel Header PANEL1
20 M.2 Key-B Socket M2_B1
21 M.2 Key-M Socket M2_M2
22 Chassis Fan Connector (+12V) CHA_FAN2
23 SATA3 Connectors SATA3_0~3
24 COM Port Headers (RS232) COM3~6
25 COM Port Pin9 PWR Setting Jumpers
PWR_COM3~6 (For COM Port3~6)
26 ATX/AT Mode Jumper SIO_AT1
27 ESPI Header ESPI1
28 Printer Port / GPIO Header LPT_GPIO1
29 Digital Input / Output Default Value
Setting
JGPIO_SET1
30 Digital Input / Output Power Select JGPIO_PWR1
31 USB 2.0 Header USB2_10_11
32 SPDIF Header SPDIF1
33 Front Panel Audio Header HD_AUDIO1

10 Mechanical Layout
Onboard Connectors
34 Buzzer BUZZ2
35 Clear CMOS Headers CLRMOS1~2
36 PWR_BAT1
37 LAN LED Headers (For LAN1~2 Port) I225_LED1
I225_LED2
38 DACC1
39 M.2 Key-E Socket M2_E1
40 5-pin Thunderbolt AIC Connector TB1
41 PCIe Power Connector PCIE_PWR1

IMB-M47
Mechanical Layout 11
3.2 Mechanical Dimensions
Top View
Dimensions: mm
Figure 4: Mechanical Dimensions

12 Mechanical Layout
Side View
Dimensions: mm
Figure 5: Mechanical Dimensions - IO Panel