ADLINK Technology IMB-M43H User manual

IMB-M43H
User’s Manual
ATX Motherboard with 6th /7th Gen Intel®Core™ i7/i5/i3 Processors
and Intel®H110 Chipset
Manual Rev.: 1.0
Revision Date: October 16, 2018
Part Number: 50-1Z241-1000

ii Preface
Preface
Copyright
Copyright 2018 ADLINK Technology, Inc. This document contains proprietary information protected by copyright.
All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in
any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation
through compliance with the European Union's Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental
protection is a top priority for ADLINK. We have enforced measures to ensure that our products,
manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged
to dispose of them in accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Battery Labels (for products with battery)
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arsenic, benzene,
cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP,
styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause
cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP,
DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
Revision History
Revision Description Date By
1.0 Initial release 2018-10-16 DA
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IMB-M43H
Preface iii
Table of Contents
Preface................................................................................................................................ii
List of Figures ....................................................................................................................v
List of Tables.....................................................................................................................vi
1. Introduction................................................................................................................1
1.1. Packing List ..............................................................................................................1
1.2. Optional Accessories ................................................................................................1
2. Specifications ............................................................................................................3
2.1. Core System.............................................................................................................3
2.2. I/O Interface..............................................................................................................3
2.3. Video ........................................................................................................................3
2.4. Audio ........................................................................................................................4
2.5. LAN...........................................................................................................................4
2.6. Temperatures ...........................................................................................................4
2.7. Humidity....................................................................................................................4
2.8. Certificate (EMC) ......................................................................................................4
2.9. Form Factor..............................................................................................................4
2.10. Operating Systems ...................................................................................................4
2.11. Functional Block Diagram .........................................................................................5
3. Mechanical Layout ....................................................................................................7
3.1. Connector Locations.................................................................................................7
3.2. Mechanical Dimensions..........................................................................................10
4. Connector Pinouts ..................................................................................................11
4.1. Rear IO Connectors................................................................................................11
4.2. Internal Connectors.................................................................................................13
4.3. Jumper and Switch Settings....................................................................................20
5. Driver Installation....................................................................................................25
6. System Resources ..................................................................................................27
6.1. System Memory Map..............................................................................................27
6.2. I/O Map...................................................................................................................27
6.3. Interrupt Request (IRQ) Lines.................................................................................29
6.4. PCI Features...........................................................................................................30
6.5. SMBus Slave Addresses.........................................................................................31

iv Preface
7. BIOS Setup...............................................................................................................33
7.1. Menu Structure .......................................................................................................33
7.2. Main Menu..............................................................................................................34
7.3. Advanced Menu......................................................................................................34
7.4. Chipset Menu..........................................................................................................43
7.5. Security Menu.........................................................................................................49
7.6. Boot Menu ..............................................................................................................50
7.7. Save & Exit Menu ...................................................................................................50
Safety Instructions...........................................................................................................52
Getting Service.................................................................................................................54

IMB-M43H
Preface v
List of Figures
Figure 1: Functional Block Diagram .........................................................................................................5
Figure 2: IO Panel Connector Locations ..................................................................................................7
Figure 3: Connector Locations .................................................................................................................8
Figure 4: Mechanical Dimensions ..........................................................................................................10
Figure 5: Mechanical Dimensions - IO Panel.........................................................................................10

vi Preface
List of Tables
Table 1: Connector Definitions.................................................................................................................8
Table 2: Jumper and Switch Definitions.................................................................................................20
Table 3: System Memory Map ...............................................................................................................27
Table 4: IO Map......................................................................................................................................27
Table 5: IRQ Lines PIC Mode ................................................................................................................29
Table 6 IRQ Lines APIC Mode...............................................................................................................29
Table 8 PCI Configuration Space Map...................................................................................................30
Table 8 PCI Interrupt Routing Map.........................................................................................................31
Table 9 SMBus Slave Addresses...........................................................................................................31

IMB-M43H
Introduction 1
1. Introduction
IMB-M43H is an ATX motherboard supporting the Desktop 6th and 7th Generation Intel® Core™ i7/i5/i3
Processors with Intel® H110 Chipset, providing the most cost-competitive solution anywhere in embedded
computing and fulfilling the specific needs of all users requiring 5 PCI add-on cards. With high-speed data transfer
interfaces such as PCIe 3.0/2.0, USB 3.0, and SATA 6 Gb/s (SATA III), dual-channel DDR4 memory up to 32 GB
in two DIMM slotsfor industrial automation applications, the ADLINK IMB-M43H carries significant competitive
advantage in the market. This leading, rugged I/O design enhances user experience with robust device
compatibility, durable connectivity, and extreme environment readiness.
1.1. Packing List
•IMB-M43H ATX motherboard
•Rear I/O shield
1.2. Optional Accessories
•2-port USB 2.0 port cable with bracket
•1-port LPT port cable with bracket
•2-port COM port cable with bracket
•LGA1156 2U Thermal Module

2 Introduction
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IMB-M43H
Specifications 3
2. Specifications
2.1. Core System
CPU: Desktop 6th/7th Generation Intel® Core™ i7/i5/i3 Processor, LGA1151 socket
•Intel® Core™ i7-6700, 3.4 GHz, 8M Cache, 14nm, 65W TDP, LGA1151 (4C/8T)
•Intel® Core™ i7-6700TE, 2.4 GHz 8M Cache, 14nm, 35W TDP, LGA1151 (4C/8T)
•Intel® Core™ i5-6500, 3.2 GHz, 6M Cache, 14nm, 65W TDP, LGA1151 (4C/4T)
•Intel® Core™ i5-6500TE, 2.3 GHz, 6M Cache, 14nm, 35W TDP, LGA1151 (4C/4T)
•Intel® Core™ i3-6100, 3.7 GHz, 3M Cache, 14nm,51W TDP, LGA1151 (2C/4T)
•Intel® Core™ i3-6100TE, 2.7 GHz, 4M Cache, 14nm, 35W TDP, LGA1151 (2C/4T)
•Intel® Pentium® G4400, 3.3GHz, 3M Cache, 14nm, 54W TDP, LGA1151 (2C/2T)
•Intel® Pentium® G4400TE, 2.4GHz, 3M Cache,14nm, 35W TDP, LGA1151 (2C/2T)
•Intel® Celeron® G3900, 2.8GHz, 2M Cache, 14nm, 51W TDP, LGA1151 (2C/2T)
•Intel® Celeron® G3900TE, 2.3GHz, 2M Cache,14nm, 35W TDP, LGA1151 (2C/2T)
•Intel® Core™ i7-7700, 3.6GHz, 8M Cache, 14nm, 65W TDP, LGA1151 (4C/8T)
•Intel® Core™ i7-7700T, 2.9GHz 8M Cache, 14nm, 35W TDP, LGA1151 (4C/8T)
•Intel® Core™ i5-7500, 3.4GHz, 6M Cache, 14nm, 65W TDP, LGA1151 (4C/4T)
•Intel® Core™ i5-7500T, 2.7GHz, 6M Cache, 14nm, 35W TDP, LGA1151 (4C/4T)
•Intel® Core™ i3-7101E, 3.9GHz, 3M Cache, 14nm, 54W TDP, LGA1151 (2C/4T)
•Intel® Core™ i3-7101TE, 3.4GHz, 3M Cache, 14nm, 35W TDP, LGA1151 (2C/4T)
Chipset:Intel® H110 Chipset
Memory: Two 288 PIN DDR4 Sockets (vertical type), Dual channel DDR4 2133MHz, up to 32 GB
BIOS: AMI® UEFI BIOS, 128 Mb SPI Flash Memory
2.2. I/O Interface
Expansion slots:1xPCIe x16 Gen3,1xPCIe x4 Gen2, 5x PCI 2.2
LAN: Dual GbE RJ-45 (rear)
SATA:4x SATA 6.0 Gb/s connectors
USB: 4x USB 3.0 connectors (rear), 2x USB 2.0 connectors (rear), 2x USB 2.0 pin headers, 2x USB 2.0
(vertical type A connector)
COM: 2x RS-232/422/485 with auto flow control connector (rear), 4x RS-232 pin headers
Parallel Port: 1x LPT pin header
PS2 Combo Port: 1x PS/2 keyboard & Mouse connector (rear)
DIO: 2x 20-pin/2.0mm GPIO pin header: 16 in and 16 out, one ground pin and one power pin
2.3. Video
Graphics Engine: Integrated Intel® HD Graphics series (based on CPU)
Interfaces: 1x VGA connector (rear), resolution up to 1920 x 1200 @ 60 Hz, 1x HDMI connector (rear)
resolution up to 4096 x 2160 @ 24 Hz

4 Specifications
2.4. Audio
Audio Codec: Realtek® ALC892-CG
Interfaces: 1x Mic-in, 1x Line-out and 1x Line-in connector (rear)
2.5. LAN
LAN1: Intel® I219-LM via RJ45 connector (rear)
LAN2:Intel® I211-AT via RJ45 connector (rear)
2.6. Temperatures
Operating Temperature:0°C to 60°C
Storage Temperature: -40°C to 85°C
2.7. Humidity
40° C @ 95% RH Non-condensing
2.8. Certificate (EMC)
CE/FCC Class B
2.9. Form Factor
ATX: 305 mm x 244 mm (W x L)
2.10. Operating Systems
Microsoft® Windows® 7 32/64-bit (only for 6th Gen Intel® Core™ processors)
Microsoft® Windows® 8.1 64-bit
Microsoft® Windows® 10 64-bit
OpenSUSE Leap 42.1 64-bit
Fedora 25 64-bit
Ubuntu 16.04 LTS 64 bit