
L2 Repair Document TCLCommunication Ltd.
5015D/X/A/E_5016A/J Level 2 Repair Document
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Content
1Level 2 repair process ..............................................................................................4
2Warranty Check and Visual Inspection ...................................................................5
2.1 Warranty confirmation of L1.....................................................................................5
2.2 Visual mechanical check..........................................................................................6
2.3 Pretest........................................................................................................................7
3Software download .................................................................................................14
3.1 Equipments requested when download:............................................................14
3.2 Install driver.............................................................................................................14
3.3 SW download process............................................................................................16
5Disassembly and assembly 5015...........................................................................20
5.1 ESD Safety...............................................................................................................20
5.2 Disassembly tool.....................................................................................................20
5.3 Disassembly process .............................................................................................21
5.4 Reassembly Process ..............................................................................................30
5.5 Disassembly process evaluation...........................................................................31
6Disassembly Complete...........................................................................................32
7Level 2 repair...........................................................................................................34
8PCBA exchange.......................................................................................................36
9Other component exchange...................................................................................36
10 Final test ..................................................................................................................37
APPENDIX 1 Packaging Requirements ........................................................................38