Avalue Technology OFT-15W03 User manual

Part No. E2017T153A0R
OFT-15W03
15.6" Open Frame Tablet
Quick Reference Guide
1st Ed –08 June, 2020
Copyright Notice
Copyright 2020 Avalue Technology Inc., ALL RIGHTS RESERVED.

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Federal Communication Commission Interference Statement
THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES. OPERATION IS SUBJECT TO THE
FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE AND
(2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING INTERFERENCE THAT
MAY CAUSE UNDESIRED OPERATION.
Note: This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instruction, may cause
harmful interference to radio communications. However, there is no guarantee that interference will
not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
Notice:
(1) A Unshielded-type power cord is required in order to meet FCC emission limits and also to prevent
interference to the nearby radio and television reception. It is essential that only the supplied
power cord by used.
(2) Use only shielded cables to connect I/O devices to this equipment.
(3) Changes or modifications not expressly approved by the party responsible for compliance could
void the user’s authority to operate the equipment.

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FCC RF Radiation Exposure Statement
This Wireless LAN radio device has been evaluated under FCC Bulletin OET 65 and found compliant
to the requirements as set forth in CFR 47 Sections 2.1091, 2.1093, and 15.247 (b) (4) addressing RF
Exposure from radio frequency devices. The radiated output power of this Wireless LAN device is far
below the FCC radio frequency exposure limits. Nevertheless, this device shall be used in such a
manner that the potential for human contact during normal operation is minimized. When nearby
persons has to be kept to ensure RF exposure compliance, in order to comply with RF exposure limits
established in the ANSI C95.1 standards, the distance between the antennas and the user should not
be less than 20 cm.

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WARNING
“CAUTION – Use suitable mounting apparatus to avoid risk of injury.”
“CAUTION – This is a Class A product. In a domestic environment this product may cause radio
interference in which case the user may be required to take adequate measures”
“CAUTION –Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries
according to the instructions.”
“CAUTION - Use a power cord that matches the voltage of the power outlet, which has been approved
and complies with the safety standard of your particular country.”
“WARNING – To avoid risk of electric shock, this equipment must only be connected to a supply
mains with protective earth.”

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Content
1. Getting Started............................................................................................................7
1.1 Safety Precautions ................................................................................................7
1.2 Packing List...........................................................................................................7
1.3 System Specifications ...........................................................................................8
1.4 System Overview.................................................................................................11
1.4.1 Top View.................................................................................................................................... 11
1.4.2 Bottom View............................................................................................................................... 11
1.5 System Dimensions.............................................................................................12
1.5.1 Front and Rear side ................................................................................................................... 12
1.6 Flush Mounting Concept......................................................................................13
1.7 Panel Mounting....................................................................................................14
1.8 Wall Mounting Concept........................................................................................22
1.9 Wall Mounting......................................................................................................23
2. Hardware Configuration...........................................................................................31
2.2 Motherboard Overviews ...........................................................................................32
2.3 Motherboard Connector list......................................................................................33
2.4 Motherboard Jumpers & Connectors settings ..........................................................35
2.4.1 Clear CMOS (JCMOS1).............................................................................................................. 35
2.4.2 Backlight power select (JBLP1) .................................................................................................. 35
2.4.3 AT/ATX Input power select (JAT1).............................................................................................. 36
2.4.4 DC Power-in connector (JPWR2) ............................................................................................... 36
2.4.5 Touch Key Button (JTK1)............................................................................................................ 37
2.4.6 MCU connector (JMCU1)............................................................................................................ 37
2.4.7 Power button (JPB1)................................................................................................................... 38
2.4.8 Speaker interface (JSPK1).......................................................................................................... 38
2.4.9 A-MIC connector (JAMIC1)......................................................................................................... 39
2.4.10 General purpose I/O connector (JGPIO1)................................................................................. 39
2.4.11 I2C Touch Panel connector (JTP1)........................................................................................... 40
2.4.12 USB Touch connector (JTP2) ................................................................................................... 40
2.4.13 I2C Sensor (JSEN1).................................................................................................................. 41
2.4.14 Console Debug connector (JCOM1)......................................................................................... 41
2.4.15 RS-232 connector (JCOM2)...................................................................................................... 42
2.4.16 RS-232 & RS-485 connector (JCOM3)..................................................................................... 42
2.4.17 USB Camera & DMIC connector (JCAM1) ............................................................................... 43
2.4.18 RTD connector (JRTD1)............................................................................................................ 43

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2.4.19 LVDS/eDP connector (JLCD1).................................................................................................. 44
2.4.20 Backlight connector 1 (JBL1) .................................................................................................... 45
2.4.21 Backlight connector 2 (JBL2) .................................................................................................... 45
2.4.22 RTC battery connector (JBAT1)................................................................................................ 46

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1. Getting Started
1.1 Safety Precautions
Warning!
Always completely disconnect the power cord from your
chassis whenever you work with the hardware. Do not
make connections while the power is on. Sensitive
electronic components can be damaged by sudden power
surges. Only experienced electronics personnel should
open the PC chassis.
Caution!
Always ground yourself to remove any static charge before
touching the CPU card. Modern electronic devices are very
sensitive to static electric charges. As a safety precaution,
use a grounding wrist strap at all times. Place all electronic
components in a static-dissipative surface or static-shielded
bag when they are not in the chassis.
1.2 Packing List
1 x OFT-15W03
1 x Screw M3-4mm / ziplock bag No.00 40x60mm x1pc
1 x power cord, AC/DC adapter 12V/5A 90 Screw Type (Option)

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1.3 System Specifications
Board Specification
Mother Board
ACP-CHT3
CPU
Cherry Trail Z8350 Intel Atom 1.44GHz
CPU Cooler (Type)
N/A
Memory
2GB / 4GB DDR3L
Storage
32GB / 64GB eMMC
Power Supply
DC in 12V~24V
Adapter
60W, 12V
Microphone
1 x A-MIC interface, pitch 2.0mm
Speaker
1 x Speaker interface, pitch 2.0mm
Wireless LAN
1 x 802.11 b/g/n/ac Wireless LAN
Sensor
1 x I2C interface, 5 x2pin, pitch 2.0mm
Operating System
Android 8.1 / Win 10 / Ubuntu 19.04
Storage
eMMC
32GB / 64GB
Panel
LCD Panel
15.6”
1920 x 1080
Luminance
220nits
Touch Screen
PCAP, 10 points touch
Internal I/O
Micro USB (Client)
JUSBM1: Micro USB_90D
USB
JCAM1: 5 x 2P_2mm_90D
DMIC interface
USB Touch
JTP2: 5P_2mm_90D
M.2 Socket
JM2: M.2 B-Key x 1(3042)_90D
Touch Key Button
JTK1: 6 x 2P_2mm_90D
DC-IN(wafer)
JPWR2: 2 x 2P_2mm_90D
eDP
JLCD1: 20 x 2P_1.25mm_180D
Analog MIC
JAMIC1: 3P_2mm_90D
Speaker
JSPK1: 4P_2mm_90D
Sensor
JSEN1: 5 x 2P_2mm_90D
Touch Panel
JTP1: 6P_2mm_90D
Console Debug
JCOM1: 3P_2mm_90D
RS232
JCOM2: 5P_2mm_90D
RS232 & RS485
JCOM3: 5 x 2P_2mm_90D

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GPIO
JGPIO1: 10 x 2P_1mm_90D_16bit
RTC Battery
JBAT1: 2P_1.25mm_180D
SIM Card socket
JUIM1: Micro SIM Card socket for LTE module
Expansion Slots
JSD1: Micro SD slot_90D
External I/O
DC in Power jack
JPWR1: Power Jack_90D
HDMI Port
JHDMI-1: HDMI Port_90D_Resolution: 1920 x 1080@60fps
USB Port
JUSB1: USB Type A Host (3.0)_90D
JUSB2: USB Type A Host (2.0)_90D
Lan Port
JLAN1: 10/100 Lan port_90D
Audio Port
JHP1: Headphone Jack_90D
Reset
SRST1: Reset button_90D
Mechanical
Power Type
12V~24V wide voltage DC input
Power Connector
Type
DC jack
Color
Metallic
Fanless
Yes
OS Support
Android 8.1 / Win 10 / Ubuntu 19.04
Reliability
EMI Test
CE
FCC Class A
Safety
2006/95/EC LVD EN-60950-1 Low Voltage Directive
Random Vibration
Operation
1. PSD: 0.00454G²/Hz, 1.5 Grms
2. Operation mode
3. Test Frequency : 5-500Hz
4. Test Axis : X,Y and Z axis
5. 30 minutes per each axis
6. IEC 60068-2-64 Test:Fh
7. Storage : CF or SSD
Sine Vibration Test
(Nonoperation)
1 Test Acceleration : 2G
2 Test frequency : 5~500 Hz
3 Sweep：1 Oct/ per one minute. (logarithmic)
4 Test Axis : X,Y and Z axis
5 Test time :30 min. each axis
6 System condition : Non-Operating mode
7. Reference IEC 60068-2-6 Testing procedures
Package vibration
test
1. PSD: 0.026G²/Hz , 2.16 Grms
2. Non-operation mode

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3. Test Frequency : 5-500Hz
4. Test Axis : X,Y and Z axis
5. 30 min. per each axis
6. IEC 60068-2-64 Test:Fh
Shock Test
1. Wave form：Half Sine wave
2. Acceleration Rate：10g for operation mode
3. Duration Time：11ms
4. No. of Shock：Z axis 300 times
5. Test Axis: Z axis
6. Operation mode
7. Reference IEC 60068-2-27 Testing procedures
Test Eb : Shock Test
Package Drop Test
One corner, three edges, six faces
ISTA 2A, IEC-60068-2-32 Test: Ed
Operating
Temperature
0°C ~ 40°C
Operating
Humidity
40°C @ 95% Relative Humidity, Non-condensing
Storage
Temperature
-20°C ~ 60°C
Note: Specifications are subject to change without notice.

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1.4 System Overview
1.4.1 Top View
1.4.2 Bottom View
Connectors
Label
Function
Note
HP
Audio line-out connector
HDMI
HDMI connector
USB3.0
USB 3.0 connector
USB2.0
USB 2.0 connector
LAN
RJ-45 Ethernet
Reset
Reset button
DCIN
DC power-in connector
SD
Micro SD card slot
Micro USB
Micro USB connector

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1.5 System Dimensions
1.5.1 Front and Rear side
(Unit: mm)

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1.6 Flush Mounting Concept

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1.7 Panel Mounting
(Installation
surface)
(Opening dimension)
(Opening dimension) (Opening dimension)
A
A
(Panel thickness)
(Unit: mm)

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Step1-1. Locate brackets on both sides, matching the holes on the monitor.
Step1-2. Insert and fasten 12 screws on each side of the monitor to secure Mounting brackets.
2
Hexagon Stud
12
1
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1
Item
Part Name
Quantity

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Step2. Insert and fasten 4 screws on each side of the monitor to secure Front bracket.
3
Front Bracket
1
4
Screw
4
Item
Part Name
Quantity

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Step3. Insert and fasten 16 screws to secure Bracket.
5
Panel Mount Bracket
4
4
Screw
8
Item
Part Name
Quantity

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(Outside of the wall)
Step4. Insert Motherboard 10”Open frame into the wall.
7
Wall
1
Item
Part Name
Quantity

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(Inside of the wall)
Step5. Fasten 8 screws to secure Panel mount brackets and insert it into Bracket.
5-1
8
Panel mount Screw
8
7
Panel Mount Kit Bracket
8
Item
Part Name
Quantity

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Step6. Insert and fasten 8 Panel mount screws to secure the module.