Table of Contents
PART I
1
INTRODUCTION...............................................................................................1
1.1 General Features.......................................................................................................................................... 1
1.2 Configuration................................................................................................................................................ 1
2
HARDWARE LAYOUT .....................................................................................3
2.1 Terminal Connectors ................................................................................................................................... 4
2.2 Jumpers ........................................................................................................................................................ 7
2.3 SOM (System on Module)............................................................................................................................ 7
2.4 Micro USB OTG Port.................................................................................................................................... 8
2.5 MicroSD Card ............................................................................................................................................... 8
2.6 LEDs.............................................................................................................................................................. 8
2.7 Function Buttons.......................................................................................................................................... 9
2.8 Dip Switches................................................................................................................................................. 9
2.9 Memory Retention During Power Failure .................................................................................................. 9
2.10 Mounting..................................................................................................................................................... 10
3
SYSTEM WIRING & SETUP...........................................................................11
3.1 Power........................................................................................................................................................... 11
3.1.1
Primary Board Power (TB1)..................................................................................................................... 11
3.1.2
Powering Peripherals............................................................................................................................... 11
3.2 Grounding................................................................................................................................................... 12
3.3 Communications........................................................................................................................................ 12
3.3.1
Network (P2) ............................................................................................................................................ 12
3.3.2
Downstream RS-485 Serial Ports (TB3 & TB4)....................................................................................... 12
3.4 Unsupervised Cabinet Tamper & Power Fault (TB1).............................................................................. 14
3.5 Reader Ports (TB11 & TB12)..................................................................................................................... 15
3.5.1
TTL Readers ............................................................................................................................................ 15
3.5.2
RS-485 (OSDP) Readers......................................................................................................................... 16
3.6 Supervised Alarm Inputs (TB3 –TB8)...................................................................................................... 16
3.6.1
End of Line (EOL) Termination Resistors ................................................................................................ 17
3.7 Output Relays (TB9 & TB10)...................................................................................................................... 18
3.7.1
Strike Wiring............................................................................................................................................. 18
3.7.2
Auxiliary Output Relay.............................................................................................................................. 18
3.7.3
Voltage Spike Suppression...................................................................................................................... 18
3.8 Door / Access Point Setup ........................................................................................................................ 18
3.8.1
Reader...................................................................................................................................................... 19
3.8.2
Door Contact & Exit Pushbutton/REX Inputs........................................................................................... 19
3.8.3
Door Strike ............................................................................................................................................... 19
4
CONTROLLER CONFIGURATION ................................................................20
4.1 Host Communications............................................................................................................................... 20
4.2 Web Configuration Interface..................................................................................................................... 20
4.2.1
Date & Time ............................................................................................................................................. 23
4.2.2
Network.................................................................................................................................................... 23
4.2.3
Mail........................................................................................................................................................... 25
4.2.4
Services.................................................................................................................................................... 26
4.2.5
Maintenance............................................................................................................................................. 27
4.2.6
Firmware .................................................................................................................................................. 27
4.2.7
Profile....................................................................................................................................................... 30
4.3 Device Cluster ............................................................................................................................................ 30
5
TROUBLESHOOTING....................................................................................32
6
SPECIFICATIONS ..........................................................................................33
7
UL COMPLIANCE AS RECOGNIZED PRODUCT.........................................35
8
REVISION HISTORY ......................................................................................36