BBK BBK921D User manual

SERVICE MANUAL
BBK921D

CONTENTS
1. SAFETY PRECAUTIONS
1.1 GENENRAL GUIDELINES
2. PREVENTION OF ELECTRO STATIC DISCHARGE(ESD)TO ELECTROSTATICALLY
SENSITIVE(ES) DEVICES
3. PRECAUTION OF LASTER DIODE
4. GENERAL DESCRIPTION
5. PREVENTION OF STATIC ELECTRICITY DISCHARGE
5.1 GROUNDING FOR ELECTROSTATIC BREAKDOWN PREVENTION
5.1.1 WORKTABLE GROUNDING
5.1.2 HUMAN BODY GROUNDING
5.1.3 HANDING OF OPTICAL PICKUP
5.2 HANDING PRECAUTIONS FOR TRAVERSE UNIT(OPTICAL PICKUP)
6. ASSENBLING AND DISASSEMBLING THE MECHANISM UNIT
6.1 DISASSEMBLY PROCEDURE
6.2 TERMINAL PCB
6.3 CLAMP PLATE UNIT
6.4 TRAY
6.5 TRAVERSE BLOCK
6.6 TRAVERSE GEAR
6.7 OPTICAL PICKUP UNIT
6.7.1 PRECAUTIONS IN OPTICAL PICKUP REPLACEMENT
6.8 DISASSEMBLING THE MIDDLE CHASSIS
6.9 DISASSENBLING THE TRAVERSE GRAR A
6.10 DISASSEMBLING THE SPINDLE MOTOR UNIT
7. ELECTRICAL CONFIRMATION
7.1 VIDEO OUTPUT(LUMINANCE SIGNAL)CONFIRMATION
7.2 VIDEO OUTPUT(CHROMINANCE SIGNAL)CONFIRMATION
8. MPEG CHECK WAVEFORM
9. IC BLOCK DIAGRAM & DESCRIPTION
10. SCHEMATIC & PCB WIRING DIAGRAM
11. SPARE PARTS LIST
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1

1.SAFETY PRICAUTIONS
1.1 GENERAL GUIDELINES
1.When servicing,observe the original lead dress.ifa short circuit is found,replace all parts which have
been overheated or damaged by the short circuit.
2.After servicing,see to it that all the protective devices such as insulation bamiers,insulation papers
shields are properly installed.
3.After servicing,make the following leakage current checks to prevent the customer from being exposed
to thock hazards.
2.PREVENTION OF ELECTRO STATIC DISCHARGE(ESD) TO ELECTROSTATECALLY
SENSITIVE(ES) DEVICES
Some semiconductor(solid state)devices can be damaged easily by static electricity.Such components
commonly are called Electrostatically Sensitive(ES)Devices.Examples of typical ES devices are integrated
circuits and some field-effect transistorsand semiconductor chip components.The following techniques
should be used to help reduce the incidence of component damage caused by electro static discharge(ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly,drain
off any ESDon your body by touching a known earth ground.Alteatively,obtain and wear a commercially
availabel discharging ESD wrist strap,which should be removed for potential shock reasons prior to
applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices,place the assembly on a conductive
surface such as alminum foil,to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device.Some solder removal devices not classified as anti-static
(ESD protected)can generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals.These can generate electrical charges sufficient to damage ES
devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are
ready to install if.(Most replacement ES devices are packaged with leads electrically shorted together by
conductive foam,alminum foil or comparable conductive material).
7.Immediately before removing the protective material from the leads of a aeplacement ES device,touch
the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices.(Otherwise hamless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity(ESD)
2
notice (1885x323x2 tiff)

3. Precaution of L aster Diode
3

4

5

5.PREVERTION OF STATIC ELECTRICITY DISCHARGE
The laser diode in the traverse unit (optical pickup)may brake down due to static electricity of clothes or human
body.Use due caution to electrostatic breakdown when servicing and handling the laser diode.
5.1.Grounding for electrostatic breakdown prevention
Some devices such as the DVD player use the optical pickup(laser diode)and the optical pickup will be damaged
by static electricity in the working environment.Proceed servicing works under the working environment where
grounding works is completed.
5.1.1. Worktable grounding
1.Put a conductive material(sheet)or iron sheet on the area where the optical pickup is placed,and ground thesheet.
5.1.2.Human body grounding
1 Use the anti-static wrist strap to discharge the static electricity form your body.
5.1.3.Handing of optical pickup
1.To keep the good quality of the optical pickup maintenance parts during transportation and before
installation,the both ends of the laser diode are short-circuited.After replacing the parts with new ones,
remove the short circuit according to the correct procedure.(See this Technical Guide).
2.Do not use a tester to check the laser diode for the optical pickup .Failure to do so willdamage the laser
diode due to the power supply in the tester.
5.2.Handing precautions for Traverse Unit (Optical Pickup)
1.Do not give a considerable shock to the traverse unit(optical pickup)as it has an extremely high-precise
structure.
2.When replacing the optical pickup,install the flexible cable and cut is short land with a nipper.See the
optical pickup replacement procedure in this Technical Guide.Before replacing the traverse unit,remove
the short pin for preventingstatic electricity and install a new unit.Connect the connector as short times as
possible.
3.The flexible cable may be cut off if an excessive force is applied to it.Use caution when handling the cable.
4.The half-fixed resistor for laser power adjustment cannot be adjusted.Do not turn the resistor.
safety_3 (1577x409x2 tiff)
6

6.ASSEMBLING AND DISASSENBLING THE MECHANISM UNIT
6.1Disassembly Procedure
6.2 Terminal P.C.B.
1.Unscrew the screws.
2.Remove the solders.
3.Remove the connectors
５
7

6.3 Clamp Plate Unit
1.Spread the stopper with hand to silde the tabs and remove the clamp plate unit.
6.4 Tray
1.Lift the tray.
６
8

6.5 Traverse Block
1.Lift the traverse block while spreading the hook of the mechanical chassis chassis unit.
2.Disengage the tabs from the holes of the mechanical chassis unit.
6.6. Traverse Gear
1.Disengage the tabs from the traverse gear
2.Remove the traverse gears B and C.
７
9

5.6 Mechanism Unit
1.Unscrew the screws.
2.Remove the connectors.
5.7 Terninal P.C.B.
1.Unscrew the screws
2.Remove the solders.
3.Remove the connectors.
6.7 Optical Pickup Unit
1. Unscrew the screws.
2.Remove the spring holders and the springs.
3.Pull out of the drive shaft and guide shaft.
10

The optical pickup can be damaged by static electricity from you body.Be sure to take static electricity countermeasures
when working around the optical pickup.(Refer to the related page in this Manual about the countermeasures.
1.Do not touch laser diode,actuator and their peripheries.
2.Do not use tester to check laser diode.(Laser diode can be damaged easily.)
3.The use of soldering iron with anti-static feature is recommended when providing short-circuit to laser diode or when
-When using the soldering iron without anti-static feature,short-circuit the flexible cable terminal with a clip before
removing it.
4.Solder the land on flexible cable of optical pickup unit.
6.7.1. Precautions in optical pickup replacement
11

6.8. Disassenbling the Middle Chassis
1.Remove the holders pins.
2.Remove the tab.
3.It lifts while pulling it in the direction of the arrow.
6.9. Disassenbling the Traverse Gear A
1.Remove the traverse gear A.
12

7. Electrical Confirmation
7.1. Video Output (Luminance Signal) Confirmation
DO this confirmation after replacing a P.C.B.
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohms.
2.Confirm that luminance signal(Y+S)level is 1000mVp-p±30mV
Measurement point
Video output terminal
Color bar 75%
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
DVDT-S15
or
DVDT-S01
Mode Disc
Measuring equipment,tools
200mV/dir,10 sec/dir 1000mVp-p±30mV
Confirmation value
13

7.2. Video Output (Chrominance Signal) Confirmation
Do the confirmation after replacing P.C.B.
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohme.
2.Confirm that the chrominance signal(C)level is 621 mVp-p±30mV
Measurement point
Video output terminal
Color bar 75%
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
DVDT-S15
or
DVDT-S01
Mode Disc
Measuring equipment,tools Confirmation value
Screwdriver,Oscilloscope
200mV/dir,10 sec/dir 621mVp-p±30mV
141

8.MPEG BOARD CHECK WAVEFORM
2. IC5L0380R PIN.2 WAVEFORM DIAGRAM
1. 27MHz WAVEFORM DIAGRAM
15

SAM0400-100401 ESS Technology,Inc.
ES6008/18/28/38 DATA SHEET
ES60X8 PINOUT DIAGRAM
PRELIMINARY
ES60X8 PINOUT DIAGRAM
The identical device pinouts for the ES6008, ES6018, ES6028
and ES6038 are shown in Figure 2.
Figure 2 ES60x8 Pinout
1
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
LCS1#
LOE#
LD0
VSS
LCS3#
LCS2#
AUX[0]
LA21 LA20
RESET#
VEE
TSD3
HIOCS16#/CAMCLK/AUX3[4] HA1/AUX4[3] VSS HA0/AUX4[2] HWR#/DCI_CLK/AUX4[5] HRD#/DCI_ACK#/AUX4[6] HD4/DCI4/AUX1[4] HD5/DCI5/AUX1[5] HD6/DCI6/AUX1[6]/VFD_DOUT HD2/DCI2/AUX1[2] HD3/DCI3/AUX1[3] VEE
VCC
DB8
VCC
DB5
DB9
DCS0#
VCC
VSS
TSD0/SEL_PLL0 TSD1/SEL_PLL1
TDMFS
TDMCLK
TDMDR
TDMTSC#
TWS/SEL_PLL2
VEE
LA4 LA5 LA6 LA7 LA8 LA9
VSS
VCC
LA10
LA11
LA12 LA13 LA14 LA15 LA16
VSS VEE
LA17 LA18 LA19
TDMDX/RSEL
VSS
TSD2
SPDIF/PLL3
NC
VSS
MCLK
TBCK
VEE
VEE
VSS
VSS
DQM
RSD
RWS
RBCK
NC
XIN
XOUT
AVEE
DSCK
VSS
DB15
DB13
DB11
DB1
VSS
DMBS1
DRAS#
DOE#/DSCK_EN
VEE
DMA9
DMA7
VSS
DMA5
DMA3
VEE
DCS1#
DB14
DB12
DB10
DB0
VEE
DMBS0
DWE#
DCAS#
VSS
DMA8
DMA6
VEE
DMA4
DMA2
VSS
DB7
DB6
VSS
DB4
DB3
DB2
DMA11
DMA10
DMA1
DMA0
HCS3FX#/AUX3[6] HCS1FX#/AUX3[7] VSS HIORDY/AUX3[3] VSS HD13/AUX2[5]/SP HD12/AUX2[4]/C2PO HD11/AUX2[3]//IRQ HD10/AUX2[2]/SQSK HD9/AUX2[1]/SQSO HD8/DCI_FDS#/AUX2[0]/VFD_CLk VSS HIRQ/DCI_ERR#/AUX4[7] HRST#/AUX3[5] HRRQ#/AUX4[0] HWRQ#/DCI_REQ#/AUX4[1] HD15/AUX2[7]/IR HD14/AUX2[6]/SQSI VCC HD7/DCI7/AUX1[7]/VFD_DIN HD1/DCI1/AUX1[1] HD0/DCI0/AUX1[0] VCC VSS HSYNC#/CAMIN7/AUX3[0] PCLK2XSCN/CAMIN4 YUV7/CAMIN3 YUV6/VDAC PCLKQSCN/CAMIN5/AUX3[2] VSYNC#/CAMIN6/AUX3[1] YUV5/YDAC VSS ADVEE YUV4/RSET YUV3/COMP YUV2/CDAC YUV1/VREF YUV0/CAMIN2/UDAC DCLK VEE
AUX[7]
AUX[6]
VEE
LD1
LD2
LA3
LD12
VEE
HA2
/AUX4[4]
VEE
VEE
LD3
LD5
LD9
LD13
LWRHL#
CAMIN1
AUX[1]
AUX[3]/IOR#
LD4
LD6
LD10
LD14
VSS
LA0
AUX[2]/IOW#
AUX[4]
VEE
LD7
LD11
LD15
VEE
LA1
VSS
AUX[5]
VSS
LD8
VSS
LWRLL#
CAMIN0
LA2
VSS
VCC
LCS0#
VSS
208-Pin PQFP Package
ES6008/18/28/38
16

ESS Technology,Inc.SAM0400-100401
ES6008/18/28/38 DATA SHEET
ES60X8 PIN DESCRIPTION PRELIMINARY
ES60X8 PIN DESCRIPTION
Table 1 lists the identical pin descriptions for the ES6008,
ES6018, ES6028 and ES6038.
Table 1 ES60x8 Pin Description
Name Number I/O Definition
VEE 1,18, 27, 59, 68,
75, 92, 99, 104,
130, 148, 157,
159, 164, 183,
193, 201
I I/O power supply.
VSS 8, 17, 26, 34, 43,
52, 60, 67, 76,
84, 91, 98, 103,
112, 120, 129,
138, 147, 156,
163, 171, 177,
184, 192, 200,
208
I Ground.
LA[21:0] 23:19, 16:10,
7:2, 207:204 O Device address output.
VCC 9, 35, 44, 83,
121, 139, 172 I Core power supply.
RESET# 24 I Reset input, active low.
TDMDX
25
O TDM transmit data.
RSEL I ROM Select.
TDMDR 28 I TDM receive data.
TDMCLK 29 I TDM clock input.
TDMFS 30 I TDM frame sync.
TDMTSC# 31 O TDM output enable.
TWS
32
O Audio transmit frame sync.
SEL_PLL2 I System and DSCK output clock frequency selection is made at the rising edge of
RESET#. The matrix below lists the available clock frequencies and their respective
PLL bit settings.
TSD0 33 O Audio transmit serial data port 0.
SEL_PLL0 I Refer to the description and matrix for SEL_PLL2 pin 32.
TSD1 36 O Audio transmit serial data port 1.
SEL_PLL1 I Refer to the description and matrix for SEL_PLL2 pin 32.
TSD[2] 37 O Audio transmit serial data output 2.
TSD[3] 38 O Audio transmit serial data output 3.
RSEL Selection
016-bitROM
1 8-bit ROM
SEL_PLL2 SEL_PLL1 SEL_PLL0 Clock Type
0 0 0 VCO off.
0 0 1 DCLK
0 1 0 Bypass mode
0 1 1 DCLK x 2
1 0 0 DCLK x 4.5
1 0 1 DCLK x 3
1 1 0 DCLK x 3.5z
1 1 1 DCLK x 4
17

SAM0400-100401 ESS Technology,Inc.
ES6008/18/28/38 DATA SHEET
ES60X8 PIN DESCRIPTION
PRELIMINARY
Name Number I/O Definition
MCLK 39 I/O Audio master clock for audio DAC.
TBCK 40 O Audio transmit bit clock.
SPDIF
41
O S/PDIF output.
SEL_PLL3 I Clock source select.
NC 42, 48 No connect pins. Leave open.
RSD 45 I Audio receive serial data.
RWS 46 I Audio receive frame sync.
RBCK 47 I Audio receive bit clock.
XIN 49 I Crystal input.
XOUT 50 O Crystal output.
AVEE 51 I Analog power for PLL.
DMA[11:0] 66:61, 58:53 O DRAM address bus [11:0].
DCAS# 69 O DRAM column address strobe.
DOE# 70 O DRAM output enable.
DSCK_EN O DRAM clock enable.
DWE# 71 O DRAM write enable.
DRAS# 72 O DRAM row address strobe.
DMBS0 73 O SDRAM bank select 0.
DMBS1 74 O SDRAM bank select 1.
DB[15:0] 96:93, 90:85,
82:77 I/O DRAM data bus [15:0].
DCS[1:0]# 97,100 O SDRAM chip select [1:0].
DQM 101 O Data input/output mask.
DSCK 102 O Output clock to SDRAM.
DCLK 105 I 27 MHz clock input to PLL.
YUV0
106
O YUV0 pixel output data.
CAMIN2 I Camera input 2.
UDAC O Video DAC output.
Y: Luma component for YUV and Y/C processing.
C: Chrominance signal for Y/C processing.
U: Chrominance component signal for YUV mode.
V: Chrominance component signal for YUV mode.
Table 1 ES60x8 Pin Description (Continued)
SEL_PLL3 Clock Source
0 Crystal oscillator
1 DCLK input
Mode YDAC UDAC VDAC CDAC
A Y C Composite C
B Y Composite Composite C
C Y U Composite V
DYUCV
18

ESS Technology,Inc.SAM0400-100401
ES6008/18/28/38 DATA SHEET
ES60X8 PIN DESCRIPTION PRELIMINARY
Name Number I/O Definition
YUV1 107 O YUV1 pixel output data.
VREF I Internal voltage reference to video DAC. Bypass to ground with 0.1 µF capacitor.
YUV2 108 O YUV2 pixel output data.
CDAC O Video DAC output. Refer to description and matrix for UDAC pin 106.
YUV3 109 O YUV3 pixel output data.
COMP I Compensation input. Bypass to ADVEE with 0.1 µF capacitor.
YUV4 110 O YUV4 pixel output data.
RSET I DAC current adjustment resistor input.
ADVEE 111 I Analog power for video DAC.
YUV5 113 O YUV5 pixel output data.
YDAC O Video DAC output. Refer to description and matrix for UDAC pin 106.
YUV6 114 O YUV6 pixel output data.
VDAC O Video DAC output. Refer to description and matrix for UDAC pin 106.
YUV7 115 O YUV7 pixel output data.
CAMIN3 I Camera YUV 3.
PCLK2XSCN 116 I/O 27-MHz video output pixel clock.
CAMIN4 I Camera YUV 4.
PCLKQSCN 117 O 13.5-MHz video output pixel clock.
CAMIN5 I Camera YUV 5.
VSYNC# 118 I/O Vertical sync, active low.
CAMIN6 I Camera YUV 6.
HSYNC# 119 I/O Horizontal sync, active low.
CAMIN7 I Camera YUV 7.
HD[5:0] 127:122 I/O Host data I/O [5:0].
DCI[5:0] I/O DVD channel data I/O [5:0].
AUX1[5:0] I/O Aux1 data I/O [5:0].
HD[6]
128
I/O Host data I/O [6].
DCI[6] I/O DVD channel data I/O [6].
AUX1[6] I/O Aux1 data I/O [6].
VFD_DOUT I VFD data output.
HD[7]
131
I/O Host data I/O [7].
DCI[7] I/O DVD channel data I/O [7].
AUX1[7] I/O Aux1 data I/O [7:0].
VFD_DIN I VFD data input.
HD[8]
132
I/O Host data bus 8.
DCI_FDS# I/O DVD input sector start.
AUX2[0] I/O Aux2 data I/O 0.
VFD_CLK I VFD clock input.
HD[9] 133 I/O Host data bus line 9.
AUX2[1] I/O Aux2 data I/O [1] when selected.
SQSQ I Subcode-Q data.
HD[10] 134 I/O Host data bus line10.
AUX2[2] I/O Aux2 data I/O [2] when selected.
SQSK I Subcode-Q clock.
Table 1 ES60x8 Pin Description (Continued)
19