Beckhoff CB3263 Series User manual

Beckhoff Automation GmbH & Co. KG phone: [phone]
Eiserstr. 5 fax: [phone]
33415 Verl email: [email protected]
Germany web: www.beckhoff.de
CB3263-xxxx
Manual
rev. 0.4

Contents
Beckhoff New Automation Technology CB3263-xxxx page 3
Contents
0Document History................................................................................................................................. 6
1Introduction .......................................................................................................................................... 7
1.1 Notes on the Documentation........................................................................................................ 7
1.1.1 Disclaimer............................................................................................................................. 7
1.1.2 Copyright............................................................................................................................... 7
1.2 Safety Instructions ........................................................................................................................ 8
1.2.1 Disclaimer............................................................................................................................. 8
1.2.2 Description of Safety Symbols.............................................................................................. 9
1.3 FCC Approvals for the United States of America......................................................................... 9
1.4 FCC Approval for Canada ............................................................................................................ 9
1.5 Essential Safety Measures ......................................................................................................... 10
1.5.1 Operator's Obligation to Exercise Diligence ....................................................................... 10
1.5.2 National Regulations Depending on the Machine Type ..................................................... 10
1.5.3 Operator Requirements...................................................................................................... 10
1.6 Functional Range........................................................................................................................ 11
2Overview............................................................................................................................................ 12
2.1 Features...................................................................................................................................... 12
2.2 Feature List................................................................................................................................. 13
2.3 Specifications and Documents ................................................................................................... 14
3Detailed Description........................................................................................................................... 15
3.1 Power Supply / UPS ................................................................................................................... 15
3.2 SUPS.......................................................................................................................................... 15
3.3 CPU ............................................................................................................................................ 15
3.4 Memory....................................................................................................................................... 15
3.5 M.2.............................................................................................................................................. 15
4Connectors......................................................................................................................................... 17
4.1 Connector Map ........................................................................................................................... 18
4.2 Power Supply.............................................................................................................................. 19
4.2.1 Mainboard Power Supply.................................................................................................... 19
4.2.2 Power Supply for Peripherals (I-PEX) ................................................................................ 20
4.2.3 Power Supply for Peripherals (SATA) ................................................................................ 21
4.2.4 S-UPS................................................................................................................................. 22
4.2.5 External CMOS Battery ...................................................................................................... 23
4.3 Front Panel Connectors.............................................................................................................. 24
4.3.1 DVI / HDMI / VGA............................................................................................................... 24
4.3.2 USB..................................................................................................................................... 26
4.3.3 LAN..................................................................................................................................... 27
4.4 Internal Connectors .................................................................................................................... 28
4.4.1 Memory............................................................................................................................... 28
4.4.2 M.2 2280 (Keying B)........................................................................................................... 31
4.4.3 M.2 2242 (Keying B)........................................................................................................... 33
4.4.4 DVI/HDMI/DisplayPort and USB3.0.................................................................................... 35
4.4.5 SATA Interface.................................................................................................................... 37
5BIOS Settings..................................................................................................................................... 38
5.1 General Remarks........................................................................................................................ 38
5.2 Main............................................................................................................................................ 39

Contents
page 4 Beckhoff New Automation Technology CB3263-xxxx
5.3 Advanced.................................................................................................................................... 40
5.3.1 ACPI Settings...................................................................................................................... 42
5.3.2 H/W Monitor........................................................................................................................ 43
5.3.3 CPU Configuration.............................................................................................................. 44
5.3.4 PPM Configuration.............................................................................................................. 47
5.3.5 SATA Configuration............................................................................................................ 48
5.3.6 Miscellaneous Configuration............................................................................................... 49
5.3.7 Network Stack..................................................................................................................... 50
5.3.8 Power Controller Options.................................................................................................... 51
5.3.9 CSM Configuration ............................................................................................................. 52
5.3.10 Advanced-Menü-NVMe Configuration................................................................................ 53
5.3.11 SDIO Configuration............................................................................................................. 54
5.3.12 USB Configuration.............................................................................................................. 55
5.3.13 Security Configuration ........................................................................................................ 56
5.3.14 Intel(R) I210 Gigabit Network Connection.......................................................................... 57
5.3.15 Driver Health....................................................................................................................... 59
5.4 Chipset........................................................................................................................................ 61
5.4.1 North Bridge........................................................................................................................ 62
5.4.2 South Bridge....................................................................................................................... 66
5.5 Security....................................................................................................................................... 70
5.5.1 Secure Boot menu.............................................................................................................. 71
5.6 Boot............................................................................................................................................. 73
5.6.1 Advanced Fixed Boot Order Parameters............................................................................ 74
5.7 Save & Exit ................................................................................................................................. 75
5.8 BIOS-Update .............................................................................................................................. 76
6Mechanical Drawings......................................................................................................................... 77
6.1 PCB: Mounting Holes ................................................................................................................. 77
6.2 PCB: Die Center ......................................................................................................................... 78
6.3 PCB: Pin 1 Dimensions .............................................................................................................. 79
6.4 PCB: Outlines ............................................................................................................................. 80
7Technical Data................................................................................................................................... 81
7.1 Electrical Data............................................................................................................................. 81
7.2 Environmental Conditions........................................................................................................... 81
7.3 Thermal Specifications ............................................................................................................... 82
8Support and Service .......................................................................................................................... 83
8.1 Beckhoff's Branch Offices and Representatives ........................................................................ 83
8.2 Beckhoff Support ........................................................................................................................ 83
8.3 Beckhoff Service......................................................................................................................... 83
8.4 Beckhoff Headquarters............................................................................................................... 83
IAnnex: Post-Codes............................................................................................................................ 85
II Annex: Resources.............................................................................................................................. 86
IO Range................................................................................................................................................ 86
Memory................................................................................................................................................... 86
Interrupt.................................................................................................................................................. 86
PCI Devices............................................................................................................................................ 87
SMB Devices.......................................................................................................................................... 87

Notes on the Documentation Chapter: Document History
Beckhoff New Automation Technology CB3263-xxxx page 5

Chapter: Document History Notes on the Documentation
page 6 Beckhoff New Automation Technology CB3263-xxxx
0 Document History
Version
Changes
0.1
first pre-release
0.2
updated BIOS chapter
0.3
added chapter LEDs
corrected I-PEX connector pinout
0.4
changed M.2 description
corrected power supply connector pinout
updated M.2 pinouts for M.2 2280 and M.2 2242
All company names, brand names, and product names referred to in this manual are registered or
unregistered trademarks of their respective holders and are, as such, protected by national and
international law.

Notes on the Documentation Chapter: Introduction
Beckhoff New Automation Technology CB3263-xxxx page 7
1 Introduction
1.1 Notes on the Documentation
This description is only intended for the use of trained specialists in control and automation engineering
who are familiar with the applicable national standards. It is essential that the following notes and
explanations are followed when installing and commissioning these components.
The responsible staff must ensure that the application or use of the products described satisfy all the
requirements for safety, including all the relevant laws, regulations, guidelines and standards.
1.1.1 Disclaimer
The documentation has been prepared with care. The products described are, however, constantly under
development.
For that reason the documentation is not in every case checked for consistency with performance data,
standards or other characteristics.
None of the statements of this manual represents a guarantee (Garantie) in the meaning of § 443 BGB of
the German Civil Code or a statement about the contractually expected fitness for a particular purpose in
the meaning of § 434 par. 1 sentence 1 BGB.
In the event that it contains technical or editorial errors, we retain the right to make alterations at any time
and without warning.
No claims for the modification of products that have already been supplied may be made on the basis of
the data, diagrams and descriptions in this documentation.
1.1.2 Copyright
© This documentation is copyrighted. Any reproduction or third party use of this publication, whether in
whole or in part, without the written permission of Beckhoff Automation GmbH & Co. KG, is forbidden.

Chapter: Introduction Safety Instructions
page 8 Beckhoff New Automation Technology CB3263-xxxx
1.2 Safety Instructions
Consider the following safety instructions and descriptions!
Product specific safety instructions are to be found on the following pages or in the areas mounting,
wiring, commissioning etc.
1.2.1 Disclaimer
All the components are supplied in particular hardware and software configurations appropriate for the
application. Modifications to hardware or software configurations other than those described in the
documentation are not permitted, and nullify the liability of Beckhoff Automation GmbH & Co. KG.

FCC Approvals for the United States of America Chapter: Introduction
Beckhoff New Automation Technology CB3263-xxxx page 9
1.2.2 Description of Safety Symbols
The following safety symbols are used in this documentation. You have to read the safety symbols
carefully and adhere them strictly!
DANGER
Acute risk of injury!
If you do not adhere the safety advise adjoining this symbol, there is immediate
danger to life and health of individuals!
WARNING
Risk of injury!
If you do not adhere the safety advise adjoining this symbol, there is danger to life
and health of individuals!
CAUTION
Hazard to devices and environment
If you do not adhere the safety advise adjoining this symbol, there is obvious
hazard to individuals!
Attention
Hazard to devices and environment
If you do not adhere the notice adjoining this symbol, there is obvious hazard to
materials and environment.
Notice
Note or pointer
This symbol indicates information that contributes to better understanding.
1.3 FCC Approvals for the United States of America
FCC: Federal Communications Commission Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
1.4 FCC Approval for Canada
FCC: Canadian Notice
This equipment does not exceed the Class A limits for radiated emissions as described in the Radio
Interference Regulations of the Canadian Department of Communications.

Chapter: Introduction Essential Safety Measures
page 10 Beckhoff New Automation Technology CB3263-xxxx
1.5 Essential Safety Measures
1.5.1 Operator's Obligation to Exercise Diligence
The operator must ensure that
othe product is only used for its intended purpose
othe product is only operated in sound condition and in working order
othe instruction manual is in good condition and complete, and always available for reference at the
location where the products are used
othe product is only used by suitably qualified and authorised personnel
othe personnel is instructed regularly about relevant occupational safety and environmental protection
aspects
othe operating personnel is familiar with the operating manual and in particular the safety notes
contained herein
1.5.2 National Regulations Depending on the Machine Type
Depending on the type of machine and plant in which the product is used, national regulations governing
the controllers of such machines will apply, and must be observed by the operator. These regulations
cover, amongst other things, the intervals between inspections of the controller. The operator must initiate
such inspections in good time.
1.5.3 Operator Requirements
oRead the operating instructions
All users of the product must have read the operating instructions for the system they work with.
oSystem know-how
All users must be familiar with all accessible functions of the product.

Functional Range Chapter: Introduction
Beckhoff New Automation Technology CB3263-xxxx page 11
1.6 Functional Range
The descriptions contained in the present documentation represent a detailed and extensive product
description. As far as the described motherboard was acquired as an integral component of an Industrial
PC from Beckhoff Automation GmbH & Co. KG, this product description shall be applied only in limited
scope. Only the contractually agreed specifications of the corresponding Industrial PC from Beckhoff
Automation GmbH & Co. KG shall be relevant. Due to several models of Industrial PCs, variations in the
component placement of the motherboards are possible. Support and service benefits for the built-in
motherboard will be rendered by Beckhoff Automation GmbH & Co. KG exclusively as specified in the
product description (inclusive operation system) of the particular Industrial PC.

Chapter: Overview Features
page 12 Beckhoff New Automation Technology CB3263-xxxx
2 Overview
2.1 Features
The CB3263 is a highly complex 3,5-inch board which incorporates complete motherboard functionality.
It's based on a System-On-Chip (SoC) of Intel®'s Atom E3800 product family. Modern low voltage
DDR3L technology provides top-notch memory performance, accomodating up to 16 GByte of RAM
(DDR3L-1333) via SO-DIMM204.
The frontpanel provides standard interfaces, such as a DVI/HDMI/DisplayPort connector, 3 Gigabit LAN
interfaces and 4 USB2.0 interfaces.
The CB3263 also provides internal interfaces, such as an 30pin I-PEX connector, which makes
DVI/HDMI/DP signals and a USB3.0 interface available, a SATA connector and two M.2(B) sockets,
which make PCI Express (1 x PCIe x1) and SATA signals available.
The power supply is realized via a 4pin connector. For connected peripherals, such as a display or a
SSD, the CB3263 provides two additional power supplies via internal FCI connectors.
Input voltage is 24V.
Intel® Atom™
E3840, E3823
1x
SoDIMM204
DDR3L-
1333
MEMORY
Power VCCCore;
DDRVTT; GFXVCC;
1.05V; 1.5V; 1.8V; 3.3V BIOS
SATA1-2
USB2-9
CRT
1.5GB/3.0GB
Intel®
i210
LAN1-3 10/100/
1000
SMBus
SPI
USB 2.0
NXP®
PCA9535
SMBus 8x GPIO
SMSC®
SCH3114
LPC
MS
KB
COM1
FAN 1-3
DVI/HDMI
DVI/HDMI/DP
(I-PEX)
1 x PCIe x1
USB 3.0
USB1
(I-PEX)

Feature List Chapter: Overview
Beckhoff New Automation Technology CB3263-xxxx page 13
2.2 Feature List
CB3263
3,5"-Board
CPU
Atom™ E3845 (QC, 2M, 1.91 GHz), TDP 10W
Atom™ E3827 (DC, 1M, 1.75 GHz), TDP 8W
Atom™ E3826 (DC, 1M, 1.46 GHz), TDP 7W
Atom™ E3825 (DC, 1M, 1.33 GHz), TDP 6W
Atom™ E3815 (SC, 1M, 1.46 GHz), TDP 5W
Memory
Variants with Intel® Atom™ E3815 oder E3825: 1 socket with
DDR3L@1066/1333MHz à 8GB
Variants with Intel® Atom™ E3826, E3827 or E3845: 2 sockets,
each with 1x DDR3L @ 1066/1333MHz à 8GB (up to 16GB total
memory)
I/O
1 x SATA 2.0
1 x I-PEX
1 x M.2(B) Typ 2242 for SSD connection (SATA)
1 x M.2(B) Typ 2280 for PCIe connection
4 x USB 2.0
3 x GBit-LAN, Intel® i210
1 x DVI-I (DVI / HDMI / DP)
Graphics
HDMI / DVI: 1920 x 1200 (at 16:10), 1920 x 1600 (at 16:9)
DP / eDP: 2560 x 1600 (at 16:10), 2560 x 1440 (at 16:9)
RTC
changeable horizontal onboard battery
BIOS
AMI® Aptio V
Power Supply
16V - 36V input voltage range
Over- and undervoltage protection
S-UPS connection
Reverse voltage protection
not galvanically isolated
Format
102 mm x 147 mm

Chapter: Overview Specifications and Documents
page 14 Beckhoff New Automation Technology CB3263-xxxx
2.3 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
PCI specification
Version 2.3 bzw. 3.0
www.pcisig.com
PCI Express® Base specification
Version 2.0
www.pcisig.com
ACPI specification
Version 3.0
www.acpi.info
ATA/ATAPI specification
Version 7 Rev. 1
www.t13.org
USB specifications
www.usb.org
SM-Bus specification
Version 2.0
www.smbus.org
Intel® Chip Description
Intel® Atom™ Processor E3800 Product Family datasheet
www.intel.com
Intel® Chip Description
i210 Datasheet
www.intel.com
SMSC® Chip Description
SCH3114 Datasheet
www.smsc.com
(NDA required)
American Megatrends®
Aptio™ Text Setup Environment (TSE) User Manual
www.ami.com
American Megatrends®
Aptio™ 4.x Status Codes
www.ami.com

Power Supply / UPS Chapter: Detailed Description
Beckhoff New Automation Technology CB3263-xxxx page 15
3 Detailed Description
3.1 Power Supply / UPS
The CB3263 needs an external power supply of 24V (will tolerate 20V-30V). It is also used for charging
any UPS device that may be present. This UPS device is either capacitor-based or connected externally
as a Pb-battery pack. With a UPS installed and charged, the module can stay operational even when a
power failure occurs. A capacitor-based UPS can keep the board alive only for a few seconds while a
Pb-battery typically allows for several minutes of continued operation. The exact amount of time is hard to
predict as it also depends on factors such as the UPS' charge level at the time of the power failure,
CPU/chipset power consumption etc. Generally, a Pb-battery needs a much longer time to reach full
charge level compared to a capacitor-based UPS.
3.2 SUPS
Optionally the CB3263 can be equipped with a plug-in SUPS, which can keep the board alive over a short
period of time in case of power failure or voltage fluctuation. The exact amount of time is hard to predict
as it also depends on factors such as the SUPS' capacitors and the boards' power consumption etc. The
capacitors size is only limited by the required space.
3.3 CPU
The motherboard employs an Intel® Atom™ processor of the E3800 family, which is a system-on-chip
(SoC) being optimized for low power consumption, while at the same time providing state-of-the-art
computing performance.
The processors include a second level cache of 512 KByte. They also offer many features known from
the desktop range such as MMX2, serial number, loadable microcode etc.
The Atom™ CPU operates in an extended range of thermal conditions and therefore is capable for use in
industrial systems.
3.4 Memory
The CB3263 is equipped with two SO-DIMM204 sockets for DDR3L-1333-RAM. For technical and
mechanical reasons it is possible that particular memory modules cannot be employed. Please ask your
distributor for recommended memory modules.
With currently available SO-DIMM204 modules a memory extension up to 16 GByte is possible -
depending on the variants components. Product variants with Intel® Atom processors E3815 or E3825
provide only one memory socket. Therefore with those variants a memory extension is possible only up to
8 GByte.
If both memory sockets are in use, notice that you must use identical memory modules.
Please notice, that if only one memory socket shall be used, this one must be the memory socket U500
(which is the lower one).
3.5 M.2
Depending on the type of card, add-in cards, which comply with the M.2 specification, come in a very
small format and with flexible dimensions. Different key IDs support different interfaces, as there are up to
four PCI Express lanes, SATA and/or USB3.0 (see table below).
M.2 cards can be easily inserted: just plug them into the slot and fix it with a fixing screw.
Cards of different types have different keyings. Depending on the supported type, one port can receive
add-in cards of one ore various types.

Chapter: Detailed Description M.2
page 16 Beckhoff New Automation Technology CB3263-xxxx
Key ID
Available Interfaces
A
PCIe x2, USB 2.0, I²C and DP
B*
PCIe x2, SATA, USB 2.0/3.0 Audio, UIM, HSIC,
SSIC, I²C, SMBus
C, D
Reserved
E
PCIe x2, USB2.0, I²C, SDIO, UART, PCM
F
Future Memory Interface (FMI)
G, H, J, K, L
Reserved
M
PCIe x4, SATA and SMBus
* With its M.2 socket the CB3263 supports keying B M.2 modules.
Notice
Driver Compatibility
For optimal driver compatibility we recommend the use of a Microsoft®
Windows® 8 operating system.
If you use an add-in card, which is not or not fully supported, the BIOS will display
an error message.

M.2 Chapter: Connectors
Beckhoff New Automation Technology CB3263-xxxx page 17
4 Connectors
This section describes all the connectors found on the CB3263.
Notice
Please consider the requirements on the cabling!
For most interfaces, the cables must meet certain requirements. For instance,
USB 2.0 requires twisted and shielded cables to reliably maintain full speed data
rates. Restrictions on maximum cable length are also in place for many high
speed interfaces and for power supply. Please refer to the respective
specifications and use suitable cables at all times.

Chapter: Connectors Connector Map
page 18 Beckhoff New Automation Technology CB3263-xxxx
4.1 Connector Map
Please use the connector map below for quick reference. Only connectors on the component side are
shown. For more information on each connector refer to the table below.
Ref.-No.
Function
Page
U500/501
"Memory"
p. 28
P1000
"M.2 2280 (Keying B)"
p. 31
P1001
"M.2 2242 (Keying B)"
p. 33
P1002
"Power Supply for Peripherals (I-PEX)"
p. 20
P1003
"Power Supply for Peripherals (SATA)"
p. 21
P1004
"DVI/HDMI/DisplayPort and USB3.0"
p. 35
P1005
"SATA Interface"
p. 37
P1006
"S-UPS"
p. 22
P1100/2/4
"LAN"
p. 27
P1101/3
"USB"
p. 26
P1105
"DVI / HDMI / VGA"
p. 24
P1106
"Mainboard Power Supply"
p. 19

Power Supply Chapter: Connectors
Beckhoff New Automation Technology CB3263-xxxx page 19
4.2 Power Supply
4.2.1 Mainboard Power Supply
The power supply of the CB3263 is realized via a 2x2pin connector (P20THR-1787014). The main 24V
power lines are assigned to pin 3.
If a UPS is present you need to have a possibility to shut down the board in a regular way without
activating the UPS, thereby preventing premature aging of UPS components. That's what pin 1
(PC_START) is for. When pulled high (24V) a regular shutdown without UPS activity is triggered. As a
part of this regular shutdown pin 2 (PC_AKTIV) is pulled from 24V to 0V.
Manufacturer
Description
Mating Connector
Phoenix
P20THR-1787014
DFMC 1,5/ 2-ST-3,5-LR- 1790292
Description
Name
Pin
Name
Description
PC Start
PC_START
1
2
PC_AKTIV
PC Status
Power Supply 24V
Vin
3
4
GND
Ground

Chapter: Connectors Power Supply
page 20 Beckhoff New Automation Technology CB3263-xxxx
4.2.2 Power Supply for Peripherals (I-PEX)
The CB3263 has a 2x6pin connector, which provides the power supply for displays, which are connected
via I-PEX.
Maximum current is 6 amperes for VCC combined (2A per contact), and also 6 amperes for 12V (2A per
contact).
Manufacturer
Description
Mating Connector
FCI
FCI 98424-G52-12LF
FCI 90311-012LF
Pinout power connector 2x6:
Description
Name
Pin
Name
Description
power supply 5V
VCC
1
7
VCC
power supply 5V
power supply 5V
VCC
2
8
GND
ground
ground
GND
3
9
GND
ground
ground
GND
4
10
GND
ground
power supply 12V
12V
5
11
GND
ground
power supply 12V
12V
6
12
12V
power supply 12V