Cambricon MLU-X1000 User manual

MLU-X1000 Accelerator
Product Manual
V0.9.3
2020.10.30

Cambricon ®
Copyright © 2020 Cambricon Corporation i
1. Preface........................................................................................................................................ 1
1.1. Copyright Declaration........................................................................................................ 1
1.2. Versioning............................................................................................................................2
1.3. Update history..................................................................................................................... 2
2. Overview......................................................................................................................................3
3. Product Specification Overview...............................................................................................4
3.1 Overview of Product Specification Parameters.............................................................. 4
3.2 Overview of structural specifications...............................................................................4
3.3 Overview of electrical specifications................................................................................5
3.4 Summary of heat dissipation specifications...................................................................6
4. Component Profile.....................................................................................................................7
4.1 MLUX-BB 1............................................................................................................................7
4.2 MLUX -PA4............................................................................................................................ 9
4.3 MLUX -PDB............................................................................................................................9
Directo

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4.4 MLUX -LINKB...................................................................................................................... 10
4.5 MLUX -IBB........................................................................................................................... 10
4.6 Front panel..........................................................................................................................11
4.7 Back panel.......................................................................................................................... 12
5. Electrical specifications..........................................................................................................13
5.1 PCIE topology description................................................................................................13
5.2 MLU-LINK interface description...................................................................................... 14
5.3 Power Interface Description............................................................................................ 16
6. BMC management system.....................................................................................................17
6.1 BMC function description.................................................................................................17
7. Heat dissipation specifications............................................................................................. 18
7.1 Description of the heat dissipation environment..........................................................18
7.2 Wind resistance curve of MLU-X1000............................................................................ 19
8. Optional components..............................................................................................................20
8.1 PCIE High Speed Cable.....................................................................................................20
8.2 MLU-LINK High Speed Cable........................................................................................... 20
8.3 Network...............................................................................................................................20
8.4 Hard disk.............................................................................................................................21
9. Cambricon NeuWare development environment................................................................22

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1. Preface
1.1. Copyright Declaration
Disclaimer
Cambricon Technologies Corporation Limited(hereinafter referred to as "Cambricon ") does not
represent, guarantee (express, implied or statutory) or guarantee the information contained in this
document and expressly waives any and all implied guarantees of saleability, ownership, non-aggression
of intellectual property or applicability for a specific purpose, and cambricon does not assume any liability
arising from the application or use of any product or service. cambricon shall not be liable for any breach
of contract, damages, costs or problems arising from :(1) any way of using cambricon products contrary
to this Guide; or (2) customer product design.
Limitation of liability
In no case shall Cambricon be liable for any damage caused by the use or inability to use this Guide
(including but not limited to damage such as loss of profits, business disruption and loss of information),
even if Cambricon has been advised that such damage may be suffered. Although the customer may
suffer any damage for any reason, according to the terms and conditions of sale of the products of the
Cambricon, the total and cumulative liability of Cambricon to the customer for the products described in
this Guide shall be limited.
Accuracy of information
The information provided in this document is owned by Cambricon and Cambricon reserves the right
to make any changes to this document information or to any products and services without notice. The
information contained in this guide and all other information of the Cambricon documents cited in this
guide are provided "as is ". Cambricon does not guarantee the accuracy or completeness of information,
texts, patterns, links or other items contained in this guide. Cambricon may make changes to this Guide or
to the products described in this Guide without notice, but does not undertake to update this Guide.
The performance tests and grades listed in this guide are to be measured using a specific chip or
computer system or component. After such tests, the results shown in this guide reflect the general
performance of Cambricon products. Any difference in system hardware or software design or
configuration will affect actual performance. As mentioned above, Cambricon does not represent, warrant
or guarantee that the products described in this Guide will apply for any particular purpose.Cambricon
does not represent or guarantee testing all parameters of each product.The customer is solely responsible
for ensuring that the product is suitable and applicable to the application of the customer plan and for

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performing the necessary tests on the application, with a view to avoiding the default of the application or
product.
The fragility of customer product design can affect the quality and reliability of Cambricon products
and lead to additional or different circumstances and/or requirements beyond the scope of this guide.
Notice of Intellectual Property
The Cambricon and Cambricon symbols are trademarks and/or registered trademarks of Cambricon
Technologies Corporation Limited in the United States and other countries. Other companies and product
names shall be trademarks of the respective companies associated with them.
This guide is copyrighted and protected by the provisions of copyright laws and treaties
worldwide.This guide can not be reproduced, reworked, modified, published, uploaded, published,
transmitted or distributed in any way without the prior written permission of Cambricon. Except for the
customer's right to use this guide information and products, according to this guide, Cambricon does not
grant any other express or implied rights or permits. It is doubtful that the Cambricon does not grant any
(express or implied) rights or permits to the customer based on any patent, copyright, trademark, trade
secret or any other Cambricon intellectual property or ownership.
Copyright Declaration
© Cambricon Technologies Corporation Limited reserves all rights.
1.2. Versioning
Table 1.1 Version Record
Document
name
MLU-X1000 accelerator Product Manual
Version
number
V0.9.3
Author
Cambricon
Date created
2020.10.30
1.3. Update history
V0.2.0
Update time: 2020.07.10
Update:
- Initial version.
V0.93
Update time: 2020.10.30
Update:
- Modify the external interconnection name as MLU-Link, update the HBM rate, and add
warning of the button battery.

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2. Overview
MLU-X1000 accelerator is a construction unit of artificial intelligence supercomputing. The
extender inherits 4 MLU290-M5 intelligent accelerating cards, and provides up to 2 POPs of adaptive
precision computing power. The supercomputing system from 4 cards to 16 cards is constructed by
using the Cambrian MLU-LINK inter chip direct connection technology, which provides a highly agile,
highly reliable and high-performance computing foundation for the Artificial Intelligence Computing
Center.

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3. Product Specification Overview
3.1Overview of Product Specification Parameters
MLU-X1000 accelerator Specification Parameters are as follows :
Table 3.1 MLU-X1000 Specification Parameters
Specification indicators
Note
Model
MLU-X1000
Core architecture
Cambricon MLUv02
Core frequency
1GHz
Integer speed (INT8)
2048 TOPS (Dense)
Calculation accuracy support
INT16,INT8,INT4,FP32,FP16
Video decoding
Support
Memory capacity
128GB
Memory width
16384 bits
Memory bandwidth
4915.2 GB/s
ECC protection
Yes
System interface
2* PCI Express 4.0x16
MLU-LINK external interface
8Ports
MLU-LINK interface bandwidth
8*100 GB /S
TDP power consumption
2300W
Heat dissipation scheme
Air-cooled, compatible with liquid-cooled
3.2Overview of structural specifications
The structure specifications of the MLU-X1000 accelerator are as follows:

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Table 3.2 Structural Specification for MLU-X1000
Specification indicators
Note
Shape
437mm*87mm*735mm
Weight
29Kg
Package Shape
1000mm*635mm*230mm
Package Weight
39Kg
Bending radius of cable:
Table 3.3 Specification for cable bending
Wire diameter
Bending radius L1
(Base on the cabinet column)
Bending radius L2
(Base on the chassis)
30 AWG
97.45 mm
78.5 mm
26 AWG
121.64 mm
102.7 mm
Figure 3.1 Bending radius of cable
3.3Overview of electrical specifications
MLU-X1000 accelerator electrical specifications as follows:
Table 3.4 Electrical Specification for MLU-X1000
Specification indicators
Note
System interface
PCIE Gen 4X 16
Number of PCIE ports
2Ports

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PCIE bandwidth
128GB /s
Number of MLU-LINK ports
8Ports
MLU-LINK bandwidth
800GB /s
BMC management interface
IPMI V2.0
Host management interface
SMBUS
Input voltage
AC 115-127V,14,2A, 60/50Hz
AC 200-240V,14.9A, 60/50Hz
DC 240V, 16A(China mainland only)
3.4Summary of heat dissipation specifications
The heat dissipation specification of MLU-X1000 accelerator is as follows:
Table 3.4 Heat dissipation specifications of MLU-X1000
Specification indicators
Note
Working temperature
0℃-35℃, altitude of 900m below
Working humidity
20%RH-85%RH
Storage temperature
-40℃—75℃
Storage humidity
5%RH-95%RH
Noise
SDP @23℃, sound power ≤7.2 bels
Working altitude
≤3000 m (900-3000m, for each increase of 300 m
supported working temperature drop 1℃)

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4. Component Profile
4.1MLUX-BB 1
MLUX-BB 1 is the baseboard which carries MLU290-M5 Intelligent processing card. Each
MLUX-BB 1 can carry 4 MLU290-M5 intelligent accelerating cards. The details are shown in the
following figure:
Figure 4.1 MLUX -BB1 graphic

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Table 4.1 MLUX -BB1 Description
Serial
number
Note
Serial
number
Note
1
MLU-LINK-0A &0B
16
OAM MODULE 2
2
MLU-LINK-2A &2B
17
OAM MODULE 1
3
MLU-LINK-1A &1B
18
OAM MODULE 3
4
MLU-LINK-1A &1B
19
F AN 4
5
PCIE 0
20
F AN 3
6
PCIE 1
21
F AN 2
7
IPMI
22
F AN 1
8
UID
23
F AN 0
9
COM HUB0
24
PCIE SWITCH 0
10
COM HUB1
25
PCIE SWITCH 1
11
COM HUB2
26
54V POWER BUSBAR
12
AC INDICATOR
27
HANDLE 0
13
FRONT PANEL CONN.
28
HANDLE 1
14
PDB MGT.CONN.
29
FRONT PCIE CONN.
15
OAM MODULE 0

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4.2MLUX -PA4
MLUX -PA4 is a PCIE board, which is placed on the host server and provides Mini SAS HD
interface for connection with MLU-X1000.The details are shown in the following figure:
Figure 4.2 MLUX -PA4 graphic
Table 4.2 MLUX -PA4 Description
Serial
number
Note
Serial
number
Note
1
mini SAS HD CONN.
3
PCIE GOLDEN FINGER
2
PCIE RETIMER
4.3MLUX -PDB
MLUX -PDB is the power distribution board.The details are shown in the following figure:
Figure 4.3 MLUX -PDB graphic
Table 4.3 MLUX -PDB Description
Serial
number
Note
Serial
number
Note
1
54V POWER BUSBAR
5
SSD POWER CONN.0

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2
PSU CONN.0
6
SSD POWER CONN.1
3
PSU CONN.1
7
PDB MGT.CONN.
4
INTRUTION
8
12V POWER BUSBAR
4.4MLUX -LINKB
MLUX -LINKB is passive connection board.The details are shown in the following figure:
Figure 4.4 MLUX -LINK B graphic
Table 4.4 MLUX -PDB Description
Serial
number
Note
Serial
number
Note
1
SSD MGT.CONN.0
5
OCULINK 2
2
SSD MGT.CONN.1
6
OCULINK 3
3
OCULINK 0
7
IBB CONN.
4
OCULINK 1
8
FRONT PCIE CONN.
4.5MLUX -IBB
MLUX-IBB is the backplane of Infiniband card. Each MLUX-IBB can place two Infiniband
cards.The details are shown in the following figure:

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Figure 4.5 MLUX -IBB graphic
Table 4.5 MLUX-IBB Description
Serial
number
Note
Serial
number
Note
1
IBB CONN.
3
IB SLOT 1
2
IB SLOT 0
4.6Front panel
The front panel of the chassis is shown as follows:
Figure 4.6 Front panel of chassis
Table 4.6 Description of front panel of chassis
Serial
number
Note
Serial
number
Note
1
Switching keys
7
SSD 1
2
UID keys
8
SSD 2
3
Reset button
9
SSD 3
4
PSU 0
10
NIC 0
5
PSU 1
11
NIC 1
6
SSD 0

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4.7Back panel
The rear panel of the chassis is shown as follows:
Figure 4.7 Rear panel of chassis
Table 4.7 Description of rear panel of chassis
Serial
number
Note
Serial
number
Note
1
PCIE 0
10
MLU-LINK-3B
2
PCIE 1
11
IPMI
3
MLU-LINK-0A
12
UID
4
MLU-LINK-0B
13
COM HUB 0
5
MLU-LINK-2A
14
COM HUB 1
6
MLU-LINK-2B
15
COM HUB 2
7
MLU-LINK-1A
16
AC INDICATOR
8
MLU-LINK-1B
17
POWER CORD 0
9
MLU-LINK-3A
18
POWER CORD 1

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5. Electrical specifications
5.1PCIE topology description
MLU-X1000 accelerator uses 2 miniSAS HD interfaces to connect with the host server, and there
are 2 PCIE switching chips to connect the PCIE devices inside.PCIE interconnection topology is
shown as follows:
Figure 5.1 PCIE Connection topology
PCIE signal rate is 16 Gbps, and the cable loss is controlled within 15 dB @8GHz. It is
recommended to use 1 meter cable with a diameter of 30 AWG.
The pins of the miniSAS HD connectors used by PCIE interfaces are defined as follows:
Table 5.1 PCIE Interface pin definition
miniSAS HD pin
Note
Pin internal processing

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RX [15:0]P/N
PCIE input signal
External AC coupling
capacitance
TX [15:0]P/N
PCIE output signal
External AC coupling
capacitance
SMCLK
SMBUS interface clock signal
4.7 KΩ pull-up to 3.3 V
SMDAT
SMBUS interface data signal
4.7 KΩ pull-up to 3.3 V
PERST#
Reset signal
REFCL K P/N
PCIE clock signal
PRESENT
Opposite side in position detection signal
4.7 KΩ pull-up to 3.3 V
5.2MLU-LINK interface description
MLU-X1000 accelerator is equipped with 4 MLU290-M5 intelligent accelerating cards, each card
has 6 MLU-LINK ports. Among them, 4 ports are used for internal interconnection and 2 ports are
used for external interconnection. The MLU-LINK interconnection topology between the internal
cards is as follows:

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Figure 5.2 MLU-LINK internal connection topology
MLU-LINK interconnection between extenders refer to the following figure:
Figure 5.3 External MLU-LINK connection reference
The signal rate of MLU-LINK is 50 Gbps, and the cable loss is controlled within 10 dB @12.5GHz.
It is recommended to use 1 meter cable with a diameter of 30 AWG or 2 meter cable with a diameter
of 28 AWG .
MLU-LINK interface uses QSFP DD connectors whose pins are defined as follows:
Table 5.2 MLU-LINK Interface pin definition
QSFP-DD pins
Note
Internal processing of
pins
RX [8:1]P/N
SERDES signal input with AC coupling
capacitance inside
External AC coupling
capacitance is not
required
TX [8:1]P/N
SERDES signal output with AC coupling
capacitance inside
External AC coupling
capacitance is not
required
SCL
I2C interface clock signal of optical module
4.7 KΩ pull-up to 3.3 V
SDA
I2C interface data signal of optical module
4.7 KΩ pull-up to 3.3 V
ModPrsL
Optical module in position signal output
4.7 KΩ pull-up to 3.3 V
ModSelL
Selection signal of optical module, default
pull- up inside
1KΩ pull-down to GND
ResetL
Reset signal, low level effective
4.7 KΩ pull-up to 3.3 V
IntL
Interrupt signal of optical module, OC gate,
low level indicates an interrupt signal
4.7 KΩ pull-up to 3.3 V
InitMode
Initialization mode
1KΩ pull-down to GND

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VccRx,VccRx1,Vcc1,Vcc2
VccTx ,VccTx1
Power signal
5.3Power Interface Description
MLU-X1000 accelerator Input Power Requirements:
Table 5.3 MLU-X1000 Input Power Supply Specifications
Input voltage
Max. Input Current
AC 115-127V,60/50Hz
14.2A
AC 200-240V,60/50Hz
14.9A
DC 240V (China mainland only)
16A
MLU-X1000 accelerator is able to reduce power consumption adjustment for instantaneous
power changes above the µs level. The power regulator can support power fluctuations within the ms
level (e.g .1.2 x TDP).
Table 5.4 EDPp specifications of MLU-X1000
EDP
Duration
TBD
TBD
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