Canon Die Bonder BESTEM-D01 User manual

Die Bonder
Die Bonder
R
Re ec co og gn ni it ti io on n S Se et tt ti in ng g
Recognition Setting
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Foreword Foreword
Foreword Foreword
Foreword
Foremost, we would like to thank you for purchasing our [Die Bonder system
BESTEM-D01 ].
This machine features automated operation from the bonding of dies on top of supplied
lead frame islands until lead frames storage operation.
For a long lasting machine, we would appreciate it very much if this operation manual is
carefully read through before operating the machine.
We hope that by having complete understanding on the operation method and
machine’s safety, you will be able to utilize the machine efficiently.
ON0001 OM0001
i
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Foreword Foreword
Foreword Foreword
Before Using
This manual has been prepared for persons who had undergone special training on the
machine. Kindly place this manual at a place easy to retrieve for referencing purposes.
Please take note of the following cautions before using the machine.
■ Please do not modify the machine. Warrantee will be void once the
machine is modified.
■ If the machine is used for purposes other than stated or that actions
differing to that written in the manual are done, it may lead to
unforeseen accidents. Please take note that our company will not bear
any responsibility to the results affected by these actions.
■ Contents of warrantee specified in the Sale and Purchase Agreement
are the sole responsibility of the company. Contents in this manual or
other documentations may be one part of the Agreement and which
may not be amended or changed.
■ This manual or part of this manual must not be reproduced or copied.
■ When taking this machine out to an overseas country, the export and
import laws and regulations must be complied with. Please handle the
export clearance application. Our company will not take any
responsibility for machines taken out of the country without going
through the proper procedures.
■ Contents in this manual may be changed without prior notice during
any machine improvement activities.
Please contact any of our offices, as stated at the back cover, if this manual contains
jumbled pages or missing pages.
ON0001 OM0001
ii
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Contents
OM0001 OM0001
Contents
Contents
Contents
Foreword i
Before Using ii
Contents iii
Recognition Setting
1 Recognition Screen Start-up 1
2 Chip Recognition 2
3 Island Recognition 10
4 Pf Recognition 18
5 DBI/Pf Inspection 20
6 DBI/Chip Inspection 26
7 Confirmation function at island recognition NG 34
iii
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1. Recognition Main Screen
MMI main screen will be displayed once the machine is started-up.
Click on REC Edit button to display recognition main screen.
Please select the item that wish to be inspected from the “Inspection menu” buttons.
Chip REC button --- It will change to “chip recognition setting” screen.
DBI/chip Inspection button --- It will change to “DBI/chip inspection setting” screen.
Island REC button --- It will change to “Mt island recognition setting” screen.
DBI/Pf Inspection button --- It will change to “DBI/Pf inspection setting” screen.
Pf REC button --- It will change to “Pf recognition setting” screen.
P．1
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BESTEM – D01R
2. Chip Recognition
Clicking on Chip REC button in recognition main screen will display the following screen whereby chip
recognition teaching can be done. Set according to ①～⑤ sequence. ⑥、⑦ is other inspection execution button.
①②
③
④
⑤
※⑥⑦
※Click on Super User button to enter the super user mode screen. Here, the button display will change to
Normal User and super user items will be displayed at tab items. Clicking Normal User button will end super user
setting and the screen will change to the normal screen. Change accordingly if super user parameter is necessary.
① Digital Zoom
Set the image display magnification (100%, 200%～5000%) with the indicator bar.
② Image angle align
Carry outθalignment for camera live image for specified angle rotation with「＋」「－」button.
③ Tab items
Set each items in “chip base, template, NG mark detect and chipping detect”. Each items setting
procedure is as explained below.
④ Apply button
Saves chip recognition parameters. If Apply button is not clicked and Return button is clicked, the
setting will return to the previous saved setting.
P．2
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BESTEM – D01R
⑤ REC exe button
Carry out chip recognition trace position. Check if the parameters are correct.
Others Command
⑥OriFlat exe button
Execute orientation flat checking. Check if the parameters are correct.
※Wafer table has to move to orientation flat position.
⑦Angle exe button
Check the slanting angle for wafer. Does not has any parameter needs to be set.
Additional Function --- When press Super User button, the following display will appear.
※Other recognition edit screen have the same function.
※Password is the same as main operation super mode。
①Numeral key …Input password.
②BS key …Clear last digit.
③Cancel key …Quit super user mode, return to normal user recognition edit.
④Enter key …If password is correct, enter into super user recognition edit display.
P．3
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BESTEM – D01R
Tab items are explained as follow. Set according to the procedure below.
【Chip base】--- Normal User
If「Chip Base」tab is clicked, the right screen will be
displayed.
1. “REC result display”--- Sets recognition results
display.
2. “Chip base parameter setting”
①“Coaxial illumination” --- Sets coaxial
illumination during chip recognition.
※Checks image display and if adjustment is
required, click on Super User button and
change 「Chip base」tab →「②Exposure
time」in super user mode.
② (“Spare illumination” --- Not used)
③ “Chip size/Chip pitch size” --- Click Setting
button and the window as on the right will
be displayed. Refer to the below diagram
and set each position and size accordingly
then double click Confirm button.
The color of display window before being confirmed is blue.
Pitch size X
Pitch size Y
Chip size X
Chip
Chip
※Chip size and pitch size setting is separately.
④ Forward recognition chip count --- Sets forward
recognition chip count during chip recognition
Refer to below diagram)
※Y direction forward recognition is fix at 0.
Chip size Y Chip
Picku
p
chi
p
Wafer
When the forward recognition chip
count is X=2, Y=1, pilot
recognition is done in this range
Picku
p
se
q
uence
P．4
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BESTEM – D01R
【Chip base】--- Super User
In Super User chip base tab is clicked, the right screen will be
displayed.
①Resolution --- Camera pixel resolution is set.
②Exposure time --- Camera exposure time is set.
③Focus monitor --- The focus of the camera is adjusted.
※There is a set part of the focus monitor also in a base tab of the
super user of the island recognition and the Pf recognition,
and do a necessary adjustment according to each camera,
please.
P．5
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BESTEM – D01R
【Template】
When「Template」tab is double clicked, a screen as on the right will be displayed.
1. Position set parameter setting method
①Position set method --- Selects positioning method
during chip recognition.
②Matching rate [％] --- Sets chip pattern matching
rate（％）.
③Search size (W,H [pixel]) --- When Setting button is
clicked, search window will be displayed.
X, Y position is fixed at center of screen. With
Bigger, Smaller button, set the search range
during positioning matching and then click
Confirm button.
The color of display window before being
confirmed is blue.
④ “Mask region”([pixel]) --- Selects “Use, Not Use”. When「Use」is selected then Setting button is
clicked, “mask area” will be set.
Once the above setting is completed, after select the template type (Rectangle(Standard),
Rectangle(Artificial(W)), Rectangle(Artificial(B)), Hexagon(H), Hexagon(V)), please click Template
setting button. A template will be created. In continuance, click Model optimization button to optimize
the template model.
※To adjust the clearance of the pattern, please adjust the 「Template」tab→「②Contrast」parameter
in super user mode. For “contrast”, when adjust to lower value, low contrast edge clearance will be
produced. when adjust to higher value, high contrast edge clearance will be produced.
2. “Position set tolerance” (X,Y) --- Sets positioning allowable range during chip recognition. [Unit:μm]
P．6
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BESTEM – D01R
【NG mark detect】
When「NG Mark」tab is clicked, the screen as on the right will
be displayed.
1. “NG mark parameter setting”
① “NG mark detect”--- Sets NG mark detection
“Execute/No execute”.
② “NG pickup” --- Sets NG mark chip pick up
“Execute/No execute” during chip recognition.
③ “Forward REC NG mark detect”--- During chip
detection, sets NG mark detection “ON/OFF” at pre
recognition.
④ “Detect position XY/size” ＷＨ[pixel] --- When
Setting button is clicked, NG mark detection
position and range size can be set.
⑤ “3 level scale setting” --- Sets the 3 threshold level
to obtain NG mark recognition pattern. When the
scroll bar is scrolled, the image will display the
detection in green color. The level is set when the NG
mark is already covered in green color
※During scroll bar is scrolled, the gray scale
scanning inside the inspection window will be
displayed in histogram form. The horizontal axis
represent the gray scale level and vertical axis
represent the area (in pixel).
2. “NG mark detect tolerance” --- Sets NG mark detection allowable range. If the detected pixel is over the
white pixel count or black pixel count, Ng mark is detected.
P．7
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BESTEM – D01R
【Chipping detect】
When「Chipping」tab is clicked, a screen as on the right will be displayed.
1. “Chipping detect parameter setting”
① “Chipping detect” --- Sets chipping detection
“Execute/No execute” during chip recognition.
② “Chipping detect XY position inside pixel” --- Sets
chipping detection position during chip recognition.
Y
X
Detection
window
Chip
③ “Chipping detect size”[pixel] --- When Setting
button is clicked, chipping detection range size is set.
Range size is the same at all chip 4 corners.
④ “3 level scale setting” --- Sets “3 level setting” to
obtain the chipping recognition pattern.
2. “Chipping detect tolerance”--- Sets chipping detection
allowable range at each 4 corners. If the detected pixel is
over the white pixel count or black pixel count, chipping is
detected.
P．8
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BESTEM – D01R
【Orient Flat check】
When「Orient Flat」tab is clicked, a screen as on the right will be displayed.
1. “Orient flat check parameter setting”
① “Orient flat check” --- Sets orient flat check
“Execute/No execute” when set the wafer.
② “3 level scale setting” --- Sets “3 level setting” to
extract the orientation flat. When the scroll bar is
scrolled, the image will display the detection in green
color. The level is set when the orientation flat is already
covered in green color
2. “Orient flat check tolerance” --- Set orientation flat
check allowable range. If the detected pixel is over the
white pixel count or black pixel count, orientation flat is
detected.
P．9
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BESTEM – D01R
3. Island Recognition
When island recognition button in recognition main screen is clicked, the below screen will be displayed and
island recognition teaching can be done. Set in ①～③ sequence. Set AgP recognition setting screen as
procedure in island recognition screen. (Explanation will be abbreviated here).
Basic screen and basic operation is as chip recognition.
①
※②
③
④
⑤⑥⑦
① Tab items
Set each Island base（「Pf base」for Pf recognition）, Template, NG mark detect item. Setting procedure for each
item is at the following page.
② Apply button
Saves set parameter. If Return is clicked without clicking Apply button first, setting will return to previously
saved setting.
③ REC exe button
Carry out trace position recognition. Check if the parameters are correct.
④Adjust exe button
Execute island positioning recognition. Island position will be compensated.
P．10
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BESTEM – D01R
⑤Digital zoom
This setting is use to zoom the image to obtain the image divided area which include the island size. (Setting range:
1 ~ 30 ) (Note 1)
⑥Island position move button (Note 2)
It can be moved to the setting island position as in auto run mode.
Please specified the island no. that wish to be moved by pressing the UP/DOWN button.
⑦Image move button (Unit: pixel) (Note 2)
Please teach to the first island center position.
(Note 1)
Eventhough the zoom setting can be done in REC EDIT screen, during island recognition and DBI chip inspection in
main screen, image zoom in 2 times or 3 times cannot be used.
For Pf recognition and DBI Pf inspection too, work size has the possibility cannot use image zoom in 2 times or 3 times.
(Note 2)
To change the image between odd and even column, please select “⑦Island selection”, then press Apply button. After
this, Odd, Even button is able to be selected for image changing.
P．11
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BESTEM – D01R
Tab items are explained as following. Set according to sequence below.
【Island base setting tab】
If「Island base」tab is clicked, the right screen will be
displayed.
1. “REC results display”--- Sets recognition results
display.
2. “Island base parameter setting”
① “Side illumination”--- Sets side illumination
during chip recognition.
※Checks image display and if adjustment is
required, click on Super User button in
command and change「Chip base」tab →
「②Exposure time」in super user mode.
② (”Spare illumination”--- Not used)
③ “Island size” W,H [um] --- Click Setting
button and island size. The island size display
window is blue before the “Confirm” is
clicked.
④ “Image region setting”[pixel] --- The function for this button is already moved to image main menu
bottom left “Digital zoom” and “Display position” portion. (Now, this function button cannot be used)
⑤ “Chip load selection” --- (odd column(standard), even column) Set the total bonding chip at one island
(1chip ～16chip). The maximum chip number that can be bonded in one island is 16 chips.
P．12
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BESTEM – D01R
⑥ “Frame front row inspect selection” --- The search area position for frame first row search is
automatically corrected. This corrected search area position will be kept until the next frame first row
inspection checking. If “No Execute” is selected, search area position will return to center of view area.
first island
Search area
⑦ “Island selection” --- When islands in the odd and even column are the same shape, select “1 island”.
When the shape for odd column island and even column island are different, select “2 island”. If “1
island” is selected, the template setting for odd and even column only set as Template No.1. If “2 island” is
selected, template for odd column is Template No.1 and template for even column is Template No.2. But
if different island pattern appeared on the same row, setting is impossible.
【Island that required 2 island selection】
Even row Odd row
Island
P．13
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BESTEM – D01R
【Template setting tab】
When「Template」tab is clicked, a screen as on the right will
be displayed.
1. “Alignment position detect parameter setting”
① “Position set method” --- Matching center only.
② “Position detect method” --- 1 point REC only.
③ “Island REC method” --- Set multi island
recognition or single island recognition.
④ Matching （％） --- Set island pattern matching
rate.
Template setting --- Set island image as a
template.
(Suggest: above 50%)
⑤ “Search position/size” X,Y,W,H [pixel] --- Set
search range position and size during positioning
matching.
⑥ “Template offset” X,Y [pixel] --- Teaching of the
offset value of the detected template position and
mount position is carried out with cursor with
setting button.
Template offset is set to shift the template origin
(mount reference point) when it is not at island
center.
Also can be use to correct mounted chip position in XY direction.
Template 1 is for odd row (standard) recognition template, 2 for even row recognition template.
When 1 island is selected, even and odd row both share template 1 data for recognition.
(setting unit is 1/100 pixel)
island
Template offset position
(Template origin)
cursor
⑦ “Mask region” --- Select template mask “Use/Not use”. When “Use”, click Setting button and set mask
area.
⑧ “1st chip position X, Y [pixel]” --- With Setting button, cursor is used to teach the offset X, Y from setting
island center position to first island center position. When 1st chip position is not at island center and template
center (mount reference position) need to be set as the island center, these setting is used.
P．14
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