Evaluation Kit for CMX901 EV9011
2017 CML Microsystems Plc 2 UM9011/1
CONTENTS
Section Page
1Brief Description....................................................................................................................................................... 1
1.1 History ...............................................................................................................................................................................3
2Block Diagram .......................................................................................................................................................... 3
3Preliminary Information ........................................................................................................................................... 4
3.1 Laboratory Equipment.......................................................................................................................................................4
3.1.1 Power Supply.....................................................................................................................................................................4
3.2 Handling Precautions ........................................................................................................................................................4
3.2.1 Static Protection................................................................................................................................................................4
3.2.2 Contents - Unpacking ........................................................................................................................................................4
3.3 Approvals...........................................................................................................................................................................4
4Quick Start ............................................................................................................................................................... 5
4.1 Setting-Up .........................................................................................................................................................................5
4.2 Operation ..........................................................................................................................................................................5
5Signal Lists................................................................................................................................................................ 6
6Circuit Schematics and Board Layouts....................................................................................................................... 7
7Detailed Description................................................................................................................................................. 8
7.1 Circuit Description .............................................................................................................................................................8
7.1.1 Input Circuit.......................................................................................................................................................................8
7.1.2 Inter-stage Matching .........................................................................................................................................................8
7.1.3 Output Circuit....................................................................................................................................................................8
7.1.4 Bias Circuits .......................................................................................................................................................................8
7.2 Vias for the Central Metal Pad ..........................................................................................................................................8
7.3 Routings of Input and Output............................................................................................................................................8
7.4 Placement of External Components..................................................................................................................................8
7.5 Heatsink.............................................................................................................................................................................8
7.6 Application Information ....................................................................................................................................................8
8Performance Specification...................................................................................................................................... 11
8.1 Electrical Performance ....................................................................................................................................................11
8.1.1 Absolute Maximum Ratings ............................................................................................................................................11
8.1.2 Operating Limits ..............................................................................................................................................................11
8.1.3 Operating Characteristics ................................................................................................................................................11
Table Page
Table 1 Signal List ................................................................................................................................................................................6
Table 2 Test Points...............................................................................................................................................................................6
Figure Page
Figure 1 Block Diagram ........................................................................................................................................................................3
Figure 2 Typical Evaluation Connections for EV9011...........................................................................................................................5
Figure 3 PCB Layout: Overlay...............................................................................................................................................................7
Figure 4 PCB Layout: Top Copper ........................................................................................................................................................7
Figure 5 Typical Swept Response of EV9011-160 ................................................................................................................................9
Figure 6 Typical Swept Response of EV9011-435MHz.........................................................................................................................9
Figure 7 Ramp Up and Down EV9011-435MHz, -40°C .......................................................................................................................10
Figure 8 Typical Swept Response of EV9011-915MHz.......................................................................................................................10
It is recommended that you check for the latest product datasheet version from the Datasheets page of the CML website:
[www.cmlmicro.com].
