Corvalent H61SB User manual

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H61SB USER MANUAL
Part Number: H61SB

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Table of Contents
REVISION HISTORY ................................................................................................................. 4
PREFACE 5
SAFETY PRECAUTIONS WARNING!....................................................................................... 6
Static Electricity Warning! ..................................................................................................................... 6
FCC Notice ........................................................................................................................................... 6
CE Notice ............................................................................................................................................. 6
Conventions Used in this Manual ......................................................................................................... 6
CHAPTER 1 TECHNICAL SPECIFICATIONS ..................................................................... 7
Embedded Processors (1155 LGA package) ....................................................................................... 7
Non-Embedded Processors ................................................................................................................. 7
Chipset ................................................................................................................................................. 7
Peripheral Chips ................................................................................................................................... 8
System Memory .................................................................................................................................... 8
BIOS ..................................................................................................................................................... 8
Embedded I/0 ....................................................................................................................................... 8
Miscellaneous ....................................................................................................................................... 9
Power connectors ................................................................................................................................. 9
Fan Headers ......................................................................................................................................... 9
Form Factor and Dimensions ............................................................................................................... 9
Environmental Requirements ............................................................................................................... 9
CHAPTER 2 HARDWARE CONFIGURATION ...................................................................10
Handling Precautions ......................................................................................................................... 10
Connector Locations........................................................................................................................... 11
Header Locations ............................................................................................................................... 12
Jumper Locations ............................................................................................................................... 13
Setting the Jumpers............................................................................................................................ 15
Jumpers .............................................................................................................................................. 16
Headers .............................................................................................................................................. 18
Connectors ......................................................................................................................................... 28
Installing Memory ............................................................................................................................... 34
Installing CPU ..................................................................................................................................... 35
Installing HEAT SINK/FAN ................................................................................................................. 36
Installing FAN(s) ................................................................................................................................. 36
Installing Power Cables ...................................................................................................................... 36
CHAPTER 3 AMIBIOS SETUP ...........................................................................................37
BIOS Boot Sequence ......................................................................................................................... 37
Starting BIOS Setup ........................................................................................................................... 37
BIOS Setup Main Menu ...................................................................................................................... 38
Main Setup ......................................................................................................................................... 41
Advanced BIOS Setup ....................................................................................................................... 42
Chipset Setup ..................................................................................................................................... 47
Boot Setup .......................................................................................................................................... 52
Security Setup .................................................................................................................................... 54
Save & Exit Menu ............................................................................................................................... 55
APPENDIX A TECHNICAL SUMMARY ...............................................................................56

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System Memory Map.......................................................................................................................... 56
Interrupt Map ...................................................................................................................................... 57
Graphics Features .............................................................................................................................. 58
APPENDIX B FLASH BIOS PROGRAMMING .....................................................................59
How to Reflash the BIOS ................................................................................................................... 59
APPENDIX C EFI BIOS AND POST CODES .......................................................................60
Checkpoint Ranges ............................................................................................................................ 60
Standard Checkpoints ........................................................................................................................ 61
APPENDIX D TERMINOLOGY ............................................................................................69

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Revision History
Revision Revision History Date
02 Updated Audio module Connector 08/16/17
01 First Release 06/16/16
Notice
The company reserves the right to revise this publication or to change its contents without notice.
Information contained herein is for reference only and does not constitute a commitment on the part
of the manufacturer or any subsequent vendor. They are in no way responsible for any loss or
damage resulting from the use (or misuse) of this publication.
This publication and any accompanying software may not, in whole or in part, be copied,
photocopied, translated or reduced to any machine readable form without prior consent from the
vendor, manufacturer or creators of this publication, except for copies kept by the user for backup
purposes.
Brand and product names mentioned in this publication may or may not be copyrights and/or
registered trademarks of their respective companies. They are mentioned for identification purposes
only and are not intended as an endorsement of that product or its manufacturer.
June 2016

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Preface
Thank you for your purchase of the H61SB industrial embedded motherboard. This design was
based on the Intel® H61 (Ibex Peak) chipset and the 2nd and 3rd generation Intel core processor
family providing the ideal platform to industrial applications that require low power and high
performance. With proper installation and maintenance, your board will provide years of high
performance and trouble free operation.
This manual provides a detailed explanation into the installation and use of the H61SB industrial
embedded motherboard. It is written for the novice PC user/installer. However, as with any major
computer component installation, previous experience is helpful and should you not have prior
experience, it would be prudent to have someone assist you in the installation.

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Safety Precautions Warning!
Static Electricity Warning!
The H61SB motherboard has been designed as rugged as possible but can still be damaged if jarred
sharply or struck. Handle the motherboard with care.
It contains delicate electronic circuits that can be damaged or weakened by static electricity. Before
removing the board from its protective packaging, it is strongly recommended that you use a
grounding wrist strap. The grounding strap will safely discharge any static electricity build up in your
body and will avoid damaging the motherboard. Do not walk across a carpet or linoleum floor with
the bare board in hand.
FCC Notice
This equipment has been designed to comply with the limits for a Class A digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance
with the instruction manual, may cause harmful interference to radio communications. Operation of
this equipment in a residential area is likely to cause harmful interference in which case the user will
be required to correct the interference.
You are cautioned that any change or modifications to the equipment not expressly approved by the
party responsible for compliance could void your authority to operate such equipment.
CE Notice
This equipment has been designed to comply with CE. In a domestic environment this product may
cause radio interference in which case the user may be required to take adequate measures.
Conventions Used in this Manual



Notes - Such as a brief discussion of memory types.
Important Information - such as static warnings, or
very important instructions.
When instructed to enter keyboard keystrokes, the
text will be noted by this graphic.

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Chapter 1 Technical Specifications
The H61SB is a long-life industrial motherboard with multi-core processor technology and PCI
Express 2.0 and 3.0 support. Powered by the Intel® H61 chipset (Ibex Point), the H61SB
motherboard was designed specifically for embedded applications such as Medical, Security,
Imaging, Industrial Automation, Manufacturing and any application that could benefit from a PICMG
1.0 back-plane solution.
Embedded Processors (1155 LGA package)
Intel® Core™ i7-3770 3.40GHz, 4 core/ 8 threads, 8M cache, 77W
Intel® Core™ i7-2600 3.40GHz, 4 core/ 8 threads, 8M cache, 95W
Intel® Core™ i5-3550S 3.00GHz, 4 core/ 4 threads, 6M cache, 65W
Intel® Core™ i5-2400 3.10GHz, 4 core/ 4 threads, 6M cache, 95W
Intel® Core™ i3-3220 3.30GHz, 2 core/ 4 threads, 3M cache, 55W
Intel® Core™ i3-2120 3.30GHz, 2 core/ 4 threads, 3M cache, 65W
Intel® Pentium™ G2120 3.10GHz, 2 core/ 2 threads, 3M cache, 55W
Intel® Pentium™ G850 2.90GHz, 2 core/ 2 threads, 3M cache, 65W
Intel® Celeron™ G540 2.50GHz, 2 core/ 2 threads, 2M cache, 65W
Non-Embedded Processors
For additional supported processors, please contact your Sales Representative.
Chipset
BD82H61 PCH Two DDR3 1666,1333 or 1067MHz DIMM sockets
Up to 16GB of non-ECC memory
Intel® Integrated Graphics.
One VGA port at 2048x1536@75Hz (QXGA)
Four SATAII 3Gb/s ports

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Peripheral Chips
Fintek F71869ED SIO chip) Two full handshake COM ports, COM2
configurable to RS-232C, RS-422 or RS-485
One Parallel Port header
PS/2 keyboard and mouse header
Hardware voltage monitor /CPU temp. monitor
Watchdog timer
PWM fan control outputs / tachometer inputs
CPU thermal diode monitoring
System Memory
Two DIMM sockets, supporting up to 16GB of unbuffered non-ECC DDR3 memory.
BIOS
AMI UEFI BIOS 64Mb SPI
Embedded I/0
Serial Ports (2) 2 full handshake RS232 serial ports
COM2 configurable to RS-232C, RS-422 or RS485
USB Interfaces (10) 8 USB2.0 ports on 2x10 20-pin headers
2 USB2.0 ports on back I/O
Keyboard/Mouse Header Combined PS/2 Keyboard and mouse on header
Video Support DB-15 VGA connector on back-I/O
(Maximum resolution 2048x1536 @75Hz)
Audio 9 pin header, supporting HD Audio module
ISA bridge 16 bit ISA support (non-DMA)
GPIO 8-bit programmable, 4 in/4 out
Realtek RTL8111 Gigabit Ethernet Two PCI-E Gigabit Ethernet controller
10/100/1000 Mbps full and half duplex operation
TPM1.2 2x20 pin header

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Miscellaneous
CMOS/Battery RTC integrated in PCH
CR2032 lithium battery or equivalent
Watchdog Timer Reset: 1~65535 sec./min and 1 min./step
Expansion 1x PICMG 1.0, ISA/PCI
Power connectors
Main power through PICMG backplane
4 pin 12V power connector
Fan Headers
CFAN1 – 4 pin header (PWM)
CFAN2 – 4 pin header (PWM)
Form Factor and Dimensions
13.3" x 4.8" (338mm x 122mm)
Environmental Requirements
RoHS compliant assembly
CATEGORY OPERATING NON-OPERATING
TEMPERATURE 0C to 60C -40C to 70C
HUMIDITY 10 to 95% non-condensing 5 to 95% @ 40C non-
condensing

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Special Warranty Note:
Products returned for warranty repair will be inspected for damage caused by
improper installation and misuse as described in the previous section and the static
warning below. Should the board show signs of abuse, the warranty will become void
and the customer will be billed for all repairs and shipping and handling costs.
Chapter 2 Hardware Configuration
This chapter provides all the necessary information for getting the H61SB ready to use. Topics
discussed include installing the DRAM and jumper settings.
Handling Precautions
The H61SB has been designed to be as rugged as possible but it can be damaged if dropped, jarred
sharply or struck. Damage may also occur by using excessive force in performing certain installation
procedures such as forcing the system board into the chassis or placing too much torque on a
mounting screw.
Take special care when installing or removing the system memory DIMMs. Never force a memory
into a socket. Screwdrivers slipping off a screw and scraping the board can break a trace or
component leads, rendering the board unusable. Always handle the H61SB with care.

Static Warning
The H61SB contains delicate electronic semiconductors that are highly sensitive to static electricity.
These components, if subjected to a static electricity discharge, can be weakened thereby reducing
the serviceable life of the system board. BEFORE THE BOARD IS REMOVED FROM ITS
PROTECTIVE ANTISTATIC PACKAGING, TAKE PROPER PRECAUTIONS! Work on a conductive
surface that is connected to the ground. Before touching any electronic device, ground yourself by
touching an unpainted metal object or, and highly recommended, use a grounding strap.

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Connector Locations
CN10
CN11
J7
CN1
CPU
(LGA1151)
CN4, 5, 9, 12
DIMMs
CN2
VGA1

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Header Locations
JFAN2
JFRT1
EATX1
COM2
COM1
J4
CN3
CN6, 7, 8, 13
TPM
KBMS1
JFAN1
DIO1

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Jumper Locations
JBAT1 JBAT2
JRS1
JAT1

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Jumpers, Connectors and Headers Quick Reference Table
Jumpers Name Description
JAT1 AT/ATX Power Selection 2x1 header, pitch 2.00mm
JBAT1 Protected CMOS 3x1 header, pitch 2.54mm
JBAT2 CMOS Reset 3x1 header, pitch 2.54mm
JRS1 COM2 Function Selection 3x2 header, pitch 2.00mm
Header Name Description
CN3 Audio module header 9x1 header, pitch 2.00mm
CN6, 7, 8 and 13 USB2.0 header 5x2 header, pitch 2.54mm
COM1 Serial Port header 5x2 header, pitch 2.54mm
COM2 Serial Port header 7x2 header, pitch 2.54mm
DIO1 GPIO header 5x2 header, pitch 2.54mm
EATX1 ATX feature header 3x1 header, pitch 2.54mm
JFAN1 Processor Fan header (PWM) 4x1 header, pitch 2.54mm
JFAN2 System Fan header (PWM) 4x1 header, pitch 2.54mm
JFRT1 Front Panel header 8x2 header, pitch 2.54mm
J4 Parallel Port 13x2 header, pitch 2.54mm
KBMS1 PS/2 Keyboard/Mouse header 6x1 header, pitch 2.00mm
TPM1 Trusted Platform header 10x2 header, pitch 2.54mm
Connector Name Description Type
CN1 NIC1 RJ-45
CN2 NIC2 RJ-45
CN10 USB2.0
CN11 USB2.0
CN4, 5, 9 and 12 Shrouded Serial ATAII Connectors
CPU Processor Socket 1155 pin LGA socket
DIMM DDR3 DIMM memory sockets 240 pin
J7 ATX 12V Connector 2x2 connector
VGA1 Analog Video connector DB-15F

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Setting the Jumpers
Jumper Types
Jumpers or headers are small pins attached to the system board. Covering two pins with a shunt
closes the connection between them. The H61SB examines these jumpers to determine specific
configuration information. There are two different categories of jumpers on the H61SB.
A. Two pin jumpers are used for binary selections such as enable, disable. Instructions for this type
of jumper are open, for no shunt over the pins or closed, when the shunt covers the pins.
B. Three or four pin jumpers are used for multiple selections. Instructions for these jumpers will
indicate which two pins to cover. For example: for JP1 2-3 the shunt will be covering pins 2 and 3
leaving pin 1 exposed.
How to identify pin number 1 on Figure: Looking to the solder side (The board side with fewer
components) of the PCB (Printed Circuit Board), pin number 1 will have a squared pad. Other pins
will have a circular pad. They are numbered sequentially.
Double row jumpers are numbered alternately, i.e. pin number 2 is in the other row, but in the same
column of pin number 1. Pin number 3 is in the same row of pin 1, but in the next column and so
forth.

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2-3: CMOS Reset 1-2: CMOS Normal
1 3
1 3
Jumpers
Use the diagram below and the tables on the following pages to locate and set the on-board
configuration jumpers.
JAT1: AT/ATX Power Selection
PINs ASSIGNMENT
1 2
Open ATX Mode (default)
Closed AT Mode
JBAT1: Protected CMOS

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2-3: CMOS Reset 1-2: CMOS Normal
1 3
1 3
JBAT2: CMOS Reset
JRS1: COM2 Function Selection
3-4: RS422
1
1-2: RS232
1
1
5-6: RS485

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Headers
Use the diagram below and the tables on the following pages to locate the headers.
CN3: Audio Module header
PIN ASSIGNMENT
1 +12V
2 +3.3V
3 AC_SYNC
4 AC_SDOUT
5 GND
6 AC_BCLK
7 GND
8 AC_RST#
9 AC_SDIN0

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CN6: USB2.0 header
PIN ASSIGNMENT PIN ASSIGNMENT
2 10
1 9
1 VCC 2 VCC
3 D- 4 D-
5 D+ 6 D+
7 GND 8 GND
9 KEY 10 NC
CN7: USB2.0 header
PIN ASSIGNMENT PIN ASSIGNMENT
2 10
1 9
1 VCC 2 VCC
3 D- 4 D-
5 D+ 6 D+
7 GND 8 GND
9 KEY 10 NC

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CN8: USB2.0 header
PIN ASSIGNMENT PIN ASSIGNMENT
2 10
1 9
1 VCC 2 VCC
3 D- 4 D-
5 D+ 6 D+
7 GND 8 GND
9 KEY 10 NC
CN13: USB2.0 header
PIN ASSIGNMENT PIN ASSIGNMENT
2 10
1 9
1 VCC 2 VCC
3 D- 4 D-
5 D+ 6 D+
7 GND 8 GND
9 KEY 10 NC