Corvalent H61SB User manual

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H61SB USER MANUAL
Part Number: H61SB

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Table of Contents
REVISION HISTORY ................................................................................................................. 4
PREFACE 5
SAFETY PRECAUTIONS WARNING!....................................................................................... 6
Static Electricity Warning! ..................................................................................................................... 6
FCC Notice ........................................................................................................................................... 6
CE Notice ............................................................................................................................................. 6
Conventions Used in this Manual ......................................................................................................... 6
CHAPTER 1 TECHNICAL SPECIFICATIONS ..................................................................... 7
Embedded Processors (1155 LGA package) ....................................................................................... 7
Non-Embedded Processors ................................................................................................................. 7
Chipset ................................................................................................................................................. 7
Peripheral Chips ................................................................................................................................... 8
System Memory .................................................................................................................................... 8
BIOS ..................................................................................................................................................... 8
Embedded I/0 ....................................................................................................................................... 8
Miscellaneous ....................................................................................................................................... 9
Power connectors ................................................................................................................................. 9
Fan Headers ......................................................................................................................................... 9
Form Factor and Dimensions ............................................................................................................... 9
Environmental Requirements ............................................................................................................... 9
CHAPTER 2 HARDWARE CONFIGURATION ...................................................................10
Handling Precautions ......................................................................................................................... 10
Connector Locations........................................................................................................................... 11
Header Locations ............................................................................................................................... 12
Jumper Locations ............................................................................................................................... 13
Setting the Jumpers............................................................................................................................ 15
Jumpers .............................................................................................................................................. 16
Headers .............................................................................................................................................. 18
Connectors ......................................................................................................................................... 28
Installing Memory ............................................................................................................................... 34
Installing CPU ..................................................................................................................................... 35
Installing HEAT SINK/FAN ................................................................................................................. 36
Installing FAN(s) ................................................................................................................................. 36
Installing Power Cables ...................................................................................................................... 36
CHAPTER 3 AMIBIOS SETUP ...........................................................................................37
BIOS Boot Sequence ......................................................................................................................... 37
Starting BIOS Setup ........................................................................................................................... 37
BIOS Setup Main Menu ...................................................................................................................... 38
Main Setup ......................................................................................................................................... 41
Advanced BIOS Setup ....................................................................................................................... 42
Chipset Setup ..................................................................................................................................... 47
Boot Setup .......................................................................................................................................... 52
Security Setup .................................................................................................................................... 54
Save & Exit Menu ............................................................................................................................... 55
APPENDIX A TECHNICAL SUMMARY ...............................................................................56

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System Memory Map.......................................................................................................................... 56
Interrupt Map ...................................................................................................................................... 57
Graphics Features .............................................................................................................................. 58
APPENDIX B FLASH BIOS PROGRAMMING .....................................................................59
How to Reflash the BIOS ................................................................................................................... 59
APPENDIX C EFI BIOS AND POST CODES .......................................................................60
Checkpoint Ranges ............................................................................................................................ 60
Standard Checkpoints ........................................................................................................................ 61
APPENDIX D TERMINOLOGY ............................................................................................69

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Revision History
Revision Revision History Date
02 Updated Audio module Connector 08/16/17
01 First Release 06/16/16
Notice
The company reserves the right to revise this publication or to change its contents without notice.
Information contained herein is for reference only and does not constitute a commitment on the part
of the manufacturer or any subsequent vendor. They are in no way responsible for any loss or
damage resulting from the use (or misuse) of this publication.
This publication and any accompanying software may not, in whole or in part, be copied,
photocopied, translated or reduced to any machine readable form without prior consent from the
vendor, manufacturer or creators of this publication, except for copies kept by the user for backup
purposes.
Brand and product names mentioned in this publication may or may not be copyrights and/or
registered trademarks of their respective companies. They are mentioned for identification purposes
only and are not intended as an endorsement of that product or its manufacturer.
June 2016

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Preface
Thank you for your purchase of the H61SB industrial embedded motherboard. This design was
based on the Intel® H61 (Ibex Peak) chipset and the 2nd and 3rd generation Intel core processor
family providing the ideal platform to industrial applications that require low power and high
performance. With proper installation and maintenance, your board will provide years of high
performance and trouble free operation.
This manual provides a detailed explanation into the installation and use of the H61SB industrial
embedded motherboard. It is written for the novice PC user/installer. However, as with any major
computer component installation, previous experience is helpful and should you not have prior
experience, it would be prudent to have someone assist you in the installation.

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Safety Precautions Warning!
Static Electricity Warning!
The H61SB motherboard has been designed as rugged as possible but can still be damaged if jarred
sharply or struck. Handle the motherboard with care.
It contains delicate electronic circuits that can be damaged or weakened by static electricity. Before
removing the board from its protective packaging, it is strongly recommended that you use a
grounding wrist strap. The grounding strap will safely discharge any static electricity build up in your
body and will avoid damaging the motherboard. Do not walk across a carpet or linoleum floor with
the bare board in hand.
FCC Notice
This equipment has been designed to comply with the limits for a Class A digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance
with the instruction manual, may cause harmful interference to radio communications. Operation of
this equipment in a residential area is likely to cause harmful interference in which case the user will
be required to correct the interference.
You are cautioned that any change or modifications to the equipment not expressly approved by the
party responsible for compliance could void your authority to operate such equipment.
CE Notice
This equipment has been designed to comply with CE. In a domestic environment this product may
cause radio interference in which case the user may be required to take adequate measures.
Conventions Used in this Manual



Notes - Such as a brief discussion of memory types.
Important Information - such as static warnings, or
very important instructions.
When instructed to enter keyboard keystrokes, the
text will be noted by this graphic.

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Chapter 1 Technical Specifications
The H61SB is a long-life industrial motherboard with multi-core processor technology and PCI
Express 2.0 and 3.0 support. Powered by the Intel® H61 chipset (Ibex Point), the H61SB
motherboard was designed specifically for embedded applications such as Medical, Security,
Imaging, Industrial Automation, Manufacturing and any application that could benefit from a PICMG
1.0 back-plane solution.
Embedded Processors (1155 LGA package)
Intel® Core™ i7-3770 3.40GHz, 4 core/ 8 threads, 8M cache, 77W
Intel® Core™ i7-2600 3.40GHz, 4 core/ 8 threads, 8M cache, 95W
Intel® Core™ i5-3550S 3.00GHz, 4 core/ 4 threads, 6M cache, 65W
Intel® Core™ i5-2400 3.10GHz, 4 core/ 4 threads, 6M cache, 95W
Intel® Core™ i3-3220 3.30GHz, 2 core/ 4 threads, 3M cache, 55W
Intel® Core™ i3-2120 3.30GHz, 2 core/ 4 threads, 3M cache, 65W
Intel® Pentium™ G2120 3.10GHz, 2 core/ 2 threads, 3M cache, 55W
Intel® Pentium™ G850 2.90GHz, 2 core/ 2 threads, 3M cache, 65W
Intel® Celeron™ G540 2.50GHz, 2 core/ 2 threads, 2M cache, 65W
Non-Embedded Processors
For additional supported processors, please contact your Sales Representative.
Chipset
BD82H61 PCH Two DDR3 1666,1333 or 1067MHz DIMM sockets
Up to 16GB of non-ECC memory
Intel® Integrated Graphics.
One VGA port at 2048x1536@75Hz (QXGA)
Four SATAII 3Gb/s ports

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Peripheral Chips
Fintek F71869ED SIO chip) Two full handshake COM ports, COM2
configurable to RS-232C, RS-422 or RS-485
One Parallel Port header
PS/2 keyboard and mouse header
Hardware voltage monitor /CPU temp. monitor
Watchdog timer
PWM fan control outputs / tachometer inputs
CPU thermal diode monitoring
System Memory
Two DIMM sockets, supporting up to 16GB of unbuffered non-ECC DDR3 memory.
BIOS
AMI UEFI BIOS 64Mb SPI
Embedded I/0
Serial Ports (2) 2 full handshake RS232 serial ports
COM2 configurable to RS-232C, RS-422 or RS485
USB Interfaces (10) 8 USB2.0 ports on 2x10 20-pin headers
2 USB2.0 ports on back I/O
Keyboard/Mouse Header Combined PS/2 Keyboard and mouse on header
Video Support DB-15 VGA connector on back-I/O
(Maximum resolution 2048x1536 @75Hz)
Audio 9 pin header, supporting HD Audio module
ISA bridge 16 bit ISA support (non-DMA)
GPIO 8-bit programmable, 4 in/4 out
Realtek RTL8111 Gigabit Ethernet Two PCI-E Gigabit Ethernet controller
10/100/1000 Mbps full and half duplex operation
TPM1.2 2x20 pin header

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Miscellaneous
CMOS/Battery RTC integrated in PCH
CR2032 lithium battery or equivalent
Watchdog Timer Reset: 1~65535 sec./min and 1 min./step
Expansion 1x PICMG 1.0, ISA/PCI
Power connectors
Main power through PICMG backplane
4 pin 12V power connector
Fan Headers
CFAN1 – 4 pin header (PWM)
CFAN2 – 4 pin header (PWM)
Form Factor and Dimensions
13.3" x 4.8" (338mm x 122mm)
Environmental Requirements
RoHS compliant assembly
CATEGORY OPERATING NON-OPERATING
TEMPERATURE 0C to 60C -40C to 70C
HUMIDITY 10 to 95% non-condensing 5 to 95% @ 40C non-
condensing

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Special Warranty Note:
Products returned for warranty repair will be inspected for damage caused by
improper installation and misuse as described in the previous section and the static
warning below. Should the board show signs of abuse, the warranty will become void
and the customer will be billed for all repairs and shipping and handling costs.
Chapter 2 Hardware Configuration
This chapter provides all the necessary information for getting the H61SB ready to use. Topics
discussed include installing the DRAM and jumper settings.
Handling Precautions
The H61SB has been designed to be as rugged as possible but it can be damaged if dropped, jarred
sharply or struck. Damage may also occur by using excessive force in performing certain installation
procedures such as forcing the system board into the chassis or placing too much torque on a
mounting screw.
Take special care when installing or removing the system memory DIMMs. Never force a memory
into a socket. Screwdrivers slipping off a screw and scraping the board can break a trace or
component leads, rendering the board unusable. Always handle the H61SB with care.

Static Warning
The H61SB contains delicate electronic semiconductors that are highly sensitive to static electricity.
These components, if subjected to a static electricity discharge, can be weakened thereby reducing
the serviceable life of the system board. BEFORE THE BOARD IS REMOVED FROM ITS
PROTECTIVE ANTISTATIC PACKAGING, TAKE PROPER PRECAUTIONS! Work on a conductive
surface that is connected to the ground. Before touching any electronic device, ground yourself by
touching an unpainted metal object or, and highly recommended, use a grounding strap.