Cost Effective Equipment APOGEE 300 User manual

•
Owner’s Manual
Apogee™ 300 Bake Plate
www.costeffectiveequipment.com
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Cee® Apogee™ 300 Bake Plate Manual
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Contents
1. Apogee™ 300 Bake Plate Introduction................................................................................................................. 4
1.1. Confidentiality Statement ................................................................................................................................ 4
1.2. Warranty............................................................................................................................................................... 4
1.3. Returned Materials............................................................................................................................................. 4
1.4. Model and Revisions......................................................................................................................................... 5
1.5. Safety Hazards/Precautions............................................................................................................................ 5
1.6. Overview of Equipment-Specific Hazards................................................................................................... 5
1.7. Electrical............................................................................................................................................................... 5
1.8. Mechanical........................................................................................................................................................... 5
1.9. Chemical............................................................................................................................................................... 6
1.10. Lockout/Tagout Procedures and Information ........................................................................................ 6
1.11. Intended Use of Machine.............................................................................................................................. 6
2. Equipment Description............................................................................................................................................. 7
2.1. Dimensions.......................................................................................................................................................... 8
2.2. Programmability................................................................................................................................................. 8
2.3. Precision............................................................................................................................................................... 8
2.4. Reliability.............................................................................................................................................................. 8
2.5. Utilities.................................................................................................................................................................. 9
3. Installation ................................................................................................................................................................... 9
3.1. Floor Space Requirements.............................................................................................................................. 9
3.2. Facilities Requirements.................................................................................................................................. 10
3.3. Environment...................................................................................................................................................... 11
3.4. Unpacking/Inspection..................................................................................................................................... 11
3.5. System Installation and Setup...................................................................................................................... 11
3.6. Start Up............................................................................................................................................................... 13
4. Bake Plate Theory.................................................................................................................................................... 14
4.1. Bake Plates vs Conventional Ovens............................................................................................................... 14
4.2. The Skin Effect.................................................................................................................................................. 15
4.3. Hotplate Bake Variables and Methods ....................................................................................................... 15
4.4. Bake Temperature............................................................................................................................................ 15
4.5. Bake Methods.................................................................................................................................................... 16
4.6. Bake Time........................................................................................................................................................... 19
4.7. Exhaust Cover................................................................................................................................................... 19
4.8. Oven vs. Bake Plate Examples..................................................................................................................... 20

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4.9. Reflow Soldering.............................................................................................................................................. 20
4.10. Bake Plate Process Troubleshooting..................................................................................................... 21
5. Preventative Maintenance...................................................................................................................................... 22
5.1 Safety Checks................................................................................................................................................... 22
5.2 Mechanical Checklist...................................................................................................................................... 22
5.3 Utility Checks.................................................................................................................................................... 22
5.4 Cleaning.............................................................................................................................................................. 23

Cee® Apogee™ 300 Bake Plate Manual
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1. Apogee™ 300 Bake Plate Introduction
1.1.Confidentiality Statement
Information supplied is for the use in the operation and/or maintenance of Cee equipment.
Neither this document nor the information it contains shall be disclosed to others for manufacturing or any
other purpose without written authorization from, Cost Effective Equipment, LLC.
1.2.Warranty
Cost Effective Equipment, LLC warrants to the original purchaser (Buyer) that equipment is free from
defects in material and workmanship under normal use and service in accordance with Cee instructions
and specifications. Buyer Shall promptly notify Cee of any claim against this warranty, and any item to be
returned to Cee shall be sent with transportation charges prepaid by Buyer, clearly marked with a Return
Authorization (RMA) number obtained from Cee Customer Support. Cee’s obligation under this warranty is
limited to the repair or replacement, at Cee option, of any equipment, component or part which is
determined by Cee to be defective in material or workmanship. This obligation shall expire one (1) year
after the initial shipment of the equipment from Cee.
This warranty shall be void if:
(a) Any failure is due to the misuse, neglect, improper installation of, or accident to the equipment.
(b) Any major repairs or alterations are made to equipment by anyone other than a duly authorized
representative of Cee. Representatives of Buyer will be authorized to make repairs to the equipment
without voiding warranty, on completion of the Cee training program.
(c) Replacement parts are used other than those made or recommended by Cee.
CEE MAKES NO OTHER WARRANTIES, EXPRESSED OR IMPLIED, WITH RESPECT TO EQUIPMENT.
NO WARRANTY IS MADE AS TO THE MERCHANTABILITY OF THE EQUIPMENT NOR ITS FITNESS
FOR ANY PARTICULAR PURPOSE. In no event shall Cee be liable for consequential loss or damages,
however caused. No person or representative of Cee is authorized to assume for Cee any liability in
connection with Equipment nor to make any change to this warranty unless such change or modification is
put in writing and approved by an authorized representative of Cee in writing.
This warranty shall be governed by the laws of the state of Missouri U.S.A.
1.3.Returned Materials
Any materials, parts, or equipment returned Cost Effective Equipment, LLC must be clearly labeled with a
Return Material Authorization (RMA) number.
To obtain a RMA number, contact:
Cee Customer Support
Telephone: [phone]
E-Mail: [e-mail]
Web Address: http://www.costeffectiveequipment.com
Shipping information with RMA number:
Attn: Cee Customer Support
Cost Effective Equipment
3703 HyPoint Blvd
Rolla, Missouri 65401

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1.4.Model and Revisions
The model and serial number information for the Cee® Apogee™are located on the rear panel
near the power inlet. Software version information can be found on the About screen. See
DataStream™ Manual for screen shots and a detailed explanation of the system software.
1.5.Safety Hazards/Precautions
Read this manual in its entirety before operating the machine.
1.6.Overview of Equipment-Specific Hazards
The unit is very heavy and proper precautions should be taken when handling the machine to
minimize risk of injury. Labels are placed on the machine to identify areas where caution is
needed during operation.
1.7.Electrical
High voltage is present in the machine. Disconnect the power before servicing.
1.8.Mechanical
This machine uses compressed gasses, which can provide motive force for components and
can expand violently upon decompression. Disconnect N2 or CDA before removing any panels.
Ensure that all panels are on and in their correct locations before powering up or operating.
When opening the lid be aware of the pinch point at the hinge cover. Open the lid only by
using the handle on the lid.
The unit is very heavy and proper precautions should be taken when handling or moving the
machine to minimize risk of injury.

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1.9.Chemical
Ensure chemical compatibility of all chemicals and materials being used inside the machine.
This includes all wetted parts of the storage, supply, dispense, and waste systems.
Ensure chemical compatibility of all chemicals with each other. All dispensed materials are
held in one common waste storage tank. Check for reactions between chemicals before use.
Flammable Chemicals. No open flames/sparks.
Ensure proper ventilation/exhaust is used at all times.
Always wear the proper Personal Protective Equipment for the job. This includes safety
glasses, gloves and other equipment as needed to protect from mechanical and chemical
hazards.
1.10. Lockout/Tagout Procedures and Information
Before servicing, turn off the machine and remove the power inlet cord by disconnecting the plug
where it enters the machine.
1.11. Intended Use of Machine
The Cee® Apogee™300 Bake Plate is intended for use as a Semiconductor/Optical. It is primarily
intended for substrates up to the maximum size.
The Cee® Apogee™300 Bake Plate is not intended for use in food or medical applications or for
use in hazardous locations.
The Cee® Apogee™300 Bake Plate is intended for use only by properly trained personnel
wearing the proper personal protective equipment. Anyone not trained in the proper use of the
Model 200X and have not fully read this manual should not operate the equipment.
The Cee® Apogee™300 Bake Plate is intended for use in a cleanroom environment to provide
the proper processing conditions for the substrates. If it is used outside of a cleanroom
environment, the substrate cleanliness may be compromised.
The Cee® Apogee™300 Bake Plate is not intended for use in a hazardous or explosive
environment.

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2. Equipment Description
The Apogee™ 300 Bake Plate features a revolutionary intuitive interface, a space-saving design,
and track-quality thermal accuracy and uniformity.Fully programmable and user-friendly, the
Apogee™ 300 Bake Plate features the accuracy and repeatability needed to eliminate processing
variability from critical experiments. Recipes are easily entered, monitored, and stored with the
convenient full-color touch screen interface with DataStream™ Technology. Compact footprint,
intuitive design, and unequaled experience add up to years of high-performance bake step
processing, perfect for any low-volume or R&D laboratory processing environment.
1. Power Button –Used to turn on and off the tool
2. User Presence Button –Used for remote access (see DataStream™ Manual)
3. Bake Plate Lid –Cover for the bake plate working surface
4. Lid Handle –Used to open and close the lid
1
2
5
3

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2.1.Dimensions
•13.25" W x 19" D x 12" H (33.65cm W x 48.26cm D x 30.48cm H)
•Machine weight: 65 lb (29.48 kg)
•Shipping weight: 148 lb (67.13 kg)
2.2.Programmability
•Touch screen interface and display
•unlimited bake process programs
•Virtually unlimited steps per program
•0.1-s resolution for step times with a range of
•0 to 9,999.9 s/step
•Three automated bake methods: contact, vacuum, proximity
•Bake plate auto sizing for 2-in, 3-in, 100-mm, 125-mm, 150-mm, and 200-mm substrates
•Temperature data recording
•Password protection available at no charge
•Ramping capability optional (8 specific set points within single bake recipe)
•Electronic lift pins (replace N2 proximity for loading/unloading substrates from bake module).
Program 10 specific proximity heights above the surface in any sequence or combination.
Height is programmed in 0.001" increments with an overall range of 0.000" to 0.750"
•Energy-saving capability (for predetermined temperature output control)
2.3.Precision
•Substrate sizes: < 1 cm to 200 mm round; 8" x 8" square)
•Temperature resolution: 0.1° C
•Temperature range: ambient to 300°C (400°C optional)
•Temperature uniformity: ± 0.3% across working surface
2.4.Reliability
•Exceptional reliability and up-time
•1-year full warranty parts and labor
•Free technical (live) phone support for the life of the product
•Application process assistance (live) for life of the product
•Exhaust bake hood design
•All stainless steel construction
•Exhausted hood for removal of process chemicals
•Optional nitrogen purge for inert bake environment

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2.5.Utilities
•Voltage ranges: 208-240 VAC
•Power requirements: 3100-4100 watts
•Exhaust port: 2" (50.8mm) OD
•Vacuum: 20 to 25 in Hg (67.7 - 84.7 Pa)
•Exhaust: 5 to 10 cfm (141.6 - 283.2 1/min)
•N2 (for bake plate proximity): 35 psi (241.3 Pa)
3. Installation
3.1.Floor Space Requirements
The Apogee™ 300 Bake Plate is a bench top unit and requires a table or bench top for location.
In most cases the supporting structure will be larger than the unit itself. The recommended
freestanding space requirements are: 1'0" back to front and 0’3" side to side.
Dimensions: 18.75”L x 26.25”D x 18”H
Weight: 146 lbs

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3.2.Facilities Requirements
The Apogee™ 300 Bake Plate requires the following utilities for operation. Locations for
connections are shown in the figure below.
1. USB Port –Used to update the software or download log files (see DataStream™
Manual).
2. Ethernet –Can be used for remote recipe writing and remote control (see
DataStream™ Manual).
3. AC Power In –Cord is Provided. Single Phase 100-120V AC at 10 Amps (208-240V
A/C option available, see back label shown in Figure 1 to verify).
4. Accessory Port –This is used to talked to external I/O device to support extra outputs
and inputs.
5. Light Tree (Optional) –Port for optional light tree.
6. Vacuum Accessory Supply –Can be used for items such as vacuum wands.
7. System Vacuum –System vacuum for the bake plate surface. Recommended vacuum
Supply is 20 in Hg at a flow of 5 l/min. Port is ¼” barb fitting
1
10
12
5
4
3
9
11
6
7
8
2

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8. System N2–System nitrogen for proximity bake on the bake plate surface. Supply
should be 35 psi.
9. Fuses –System protection fuses.
10.Hood Height Adjustment–4 bolts can be used to adjust gap under the hood. An
11.Exhaust Port –Exhaust port for bake plate vapors. Port is 1 inch OD and 50 CFM of
exhaust is recommended.
12.Exhaust Gate –Used to adjust flow rate of the exhaust on the bake plate by loosening
bolt and sliding gate. Sliding up closes exhaust and sliding down opens exhaust.
3.3.Environment
The Apogee™ 300 Bake Plate should be operated in a clean, low humidity environment.
3.4.Unpacking/Inspection
Thoroughly check machine for shipping damage. If physical damage is seen, DO NOT APPLY
POWER! Contact Cee™immediately.
The following items should be included with the shipment.
(1) Apogee™ 300 Bake Plate
(2) Stop Pins
(1) Temperature and Humidity Sensor
(1) Power Cord with female power connector
(1) User & Installation Manual –CD or USB
3.5.System Installation and Setup
1. Lift the unit out of the packing crate by grasping the bottom only. Do not lift the by any of
the top covers or protrusions. Do not roll or turn the unit on its side or ends.
2. Remove plastic wrap and packing foam.
3. Place Cee™ Apogee™ 300 Bake Plate on a table of proper height and strength so that the
controls and bake plate surface are at the proper ergonomic height.
4. Level the machine using the feet so that the bake plate surface is level front-to-back and
side-to-side.
5. Thoroughly clean the bake plate surface.
6. Connect utilities to the reference diagram in Section 3.7.2
(1) Connect the temperature/humidity sensor to the CAN terminal (#4).
(2) Connect the vacuum supply to the vacuum fitting (#7)
(3) Connect the nitrogen supply to the vacuum fitting (#8)
(4) Connect the exhaust lines to the exhaust port (#11)
7. Plug in the machine.
8. Once plugged in, only the cooling fan should be powered, not the display.

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3.6.Start Up
*For detailed software information, please refer to the DataStream™ manual
1. Install the tool as shown earlier in Section 4.
2. Press the lighted power switch to turn the tool power on.
3. The display should momentarily show boot screen and then show main screen.
4. Enter the username and password.
(1) The default username and password are “admin” and “admin2” respectively.
5. The tool will login and display the Process page.
6. Navigate to Tools- Manual Control to run system checks to ensure the tool is working properly.
(1) Raise the lift pins down to 0 mm using the Set action.
(2) Inset the supplied stop pins into the desired holes on the back plate surface. These
stop pins keep the wafer centered on the bake plate surface. The holes closest to the
center are for 2-inch wafers. From the center, the stop pin locations are for 2 in, 3in,
100m, 125 mm, 150 mm, and 200 mm wafers respectfully.
(3) Set Bake Method to Vacuum. Place a substrate onto the center of the bake plate and
check that the vacuum holds the substrate.
(4) Set the Bake Method to Proximity. This will turn off the vacuum and purge N2to float
the substrate above the bake plate surface.
(5) Set the Bake Method to Contact. This will shut off N2 and the vacuum. Remove the
substrate.
(6) Ensure that the temperature/humidity sensor is reading on the parameter list.
(7) Enable the Plate Temperature by selecting the Enable value and Apply.
(8) Set the Plate Temperature to the desired temperature by changing the Action to Set.
(9) Check that the Plate Temperature reaches the desire setting.
7. If the tool passes these checks, the tool is ready to operate. Begin by creating a recipe.

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4. Bake Plate Theory
Hotplate bake processing has increased in popularity since the early 1980s. Previously the most
common technique for film drying and curing was the convection oven. Bake plates (also known
as hotplates) offer several advantages in the form of increased throughput, increased uniformity
and reproducibility, and decreased particle contamination. In a typical bake process the substrate
is placed into contact with a heated surface of known temperature. The substrate quickly rises to
temperature. Drying and curing steps generally take about 1 minute. This is in contrast to
traditional oven processes taking 30 minutes or more.
4.1.Bake Plates vs Conventional Ovens
Bake plates have several advantages over convection type ovens:
•decreased bake time
•increased reproducibility
•better film quality.
This section will describe these differences and set a few guidelines for
using bake plates.
Stratification, the formation of different temperature zones, is a
problem associated with convection ovens and can severely affect film
quality and reproducibility.
The heating rate of a substrate in an oven depends not only on the
heated air flow past a substrate but also on its proximity to other cold
substrates. Thus the heating rate for each substrate in a cassette of
substrates that are being baked, will be less than if each substrate is
baked alone.
In addition, substrates near the ends of a cassette heat faster than the substrates in the middle,
thus producing a non-uniform heating
Particle generation also occurs within a standard oven. In a forced-air, convection oven,
substrates are commonly exposed to a flow of particle laden air for at least 30 minutes.
During resin film cures, the substrates will be exposed to considerable particulate contamination.
The substrates are vulnerable since the film may still contain solvents and during this ‘soft’ state,
the film is very susceptible to having particles adhere to it.

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4.2.The Skin Effect
Another disadvantage in normal oven baking results from baking
substrates from the “outside in”. Since heat is applied to the outer
surface of the film first, a skin forms on the surface of the film thus
trapping solvents. Upon vaporizing, these solvents form blisters or
bubbles which results in adhesion loss or even bulk film failure. This
problem prevails in processes involving thick film resins, e.g. polyimides.
No skin effect occurs on a hotplate since hotplate baking heats the
substrate from the bottom up. This “inside out” approach offers
advantages for thick films since solvents in the film nearest the substrate
are baked off before the film surface seals over.
4.3.Hotplate Bake Variables and Methods
A typical bake process consists of preheating the surface to a known temperature, loading the
substrate onto the surface for a specific length of time and removing it promptly at the end of the
cycle. The selection of the temperature and time values used as well as the bake method
employed all affect the overall performance of the process.
4.4.Bake Temperature
The bake temperature used is dependent on several factors. The material and substrate being
baked as well as the results desired are key factors to be considered in developing a bake
process.
In general, hotplate baking will be performed at temperatures slightly higher than those used in
oven bake processes. The film being baked will reach a temperature somewhere between the
temperature of the hotplate and the ambient air above the film. As an example, with a hotplate
surface temperature of 115°C, a layer of photoresist on a silicon wafer will reach a final
temperature of about 105°C after a few seconds. Thicker substrates and/or substrates with lower
coefficients of thermal conductivity will require even higher temperatures to compensate for this
phenomenon.

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4.5.Bake Methods
Another important factor is the method of bake. Cee® hotplates allow for three distinct bake
methods; proximity, soft contact, and hard contact.
In a hard contact bake the substrate is held onto the hotplate surface by the application of vacuum
to the underside of the substrate. Small holes are machined into the hotplate surface in a pattern
which optimizes vacuum distribution without the formation of cold spots or warping of the
substrate. This method is usually preferred for silicon and other flat substrates where back side
contact is not a problem.
Soft contact baking uses gravity alone to hold the substrate onto the hotplate. This method
generally offers less uniformity since the substrate-hotplate thermal interface is not as efficient.
Proximity baking is accomplished by forcing nitrogen through ports in the hotplate surface. This
forces the substrate to float at a distance

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of one to four mils
(25-100µm) above the hotplate surface. Proximity baking allows a slower warm-up than contact
bake methods and can be advantageous when baking thick films where blistering would otherwise
be a problem.
Another advantage of proximity baking in this manner is that in many cases cambered or warped
substrates can be baked with a high degree of uniformity. This is usually not possible with the
contact methods since it is not possible to achieve a vacuum under a substrate that is not flat to
start with. Processing cambered substrates with the soft contact method creates hot spots where
the substrate touches the hotplate and cold spots where it does not. It should be noted as well that
this type of proximity process is “self-leveling” in that the substrate will tend to form a uniform gap
to the hotplate surface.
Proximity baking also offers the unique advantage of allowing hotplate processing without
touching the bottom side of the substrate. An example of this application is photomask processing.
In processing these relatively thick glass plates it is important that the back side of the glass not
directly touch the hotplate since this causes micro-fractures in the glass itself from rapid heating.
By performing the entire bake process in the proximity mode the integrity of the substrate is not
endangered and the uniformity is excellent.

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4.6.Bake Time
The selection of the bake time parameter plays an
important role in the reproducibility of the bake process.
Substrate thermal properties and the choice of bake
method greatly affect the amount of time necessary for the
substrate and therefore film temperature to stabilize during
the bake. Thicker substrates and the use of proximity bake
methods will increase the time necessary for the film to
reach its final temperature. It is important that most of the
baking action in the film takes place after this temperature
is reached. A silicon wafer will reach a stable temperature
within a few seconds and so it is traditional to adjust a
photoresist bake processes to be completed in 60-90
seconds with an appropriate bake temperature.
For thicker substrates such as photomasks and ceramic
modules the increased time necessary to heat the larger
mass of the substrate results in bakes times approaching
five minutes. It should be noted that these substrates can be
processed with higher temperature and much shorter bake
times but reproducibility may suffer. If the bake time is too
short then a significant amount of the actual bake process
will take place during the loading and unloading steps as
well as while the substrate is cooling after removal from the
bake plate. This is an unstable condition since it is very
difficult to exactly reproduce conditions during these steps.
In general the temperature-time relationship in a bake process can be taken as a "dose" of the
(temperature) x (time) product. Increasing the bake temperature results in a need for decreasing
bake time. The limits for both parameters can be reached when the process is no longer
reproducible or when the physical temperature limitations of the resin or substrate have been
reached.
4.7.Exhaust Cover
The design of the Cee® exhaust cover
promotes the dissipation of vapors
removed from a substrate placed on the
chuck, without drawing air across the
chuck surface.

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4.8.Oven vs. Bake Plate Examples
The chart below presents process examples for a commonly used resins. These figures should
not be use as a rigid guideline, since the best method with a particular baking application can only
be achieved through experimentation.
▪APPLICATION: Positive Photo Resist
▪OVEN BAKE
▪90°C –30 minutes, Polyimide beta (partial imidization)
▪135°C –30 minutes, Polyimide alpha (solvent removal)
▪HOTPLATE BAKE
▪115°C –30 secs w/Hard Contact bake, Polyimide beta (partial imidization)
▪150°C –15 secs w/Proximity bake, 150°C –90 secs w/Hard Contact bake, Polyimide
alpha (solvent removal)
4.9.Reflow Soldering
Bake plate processing heats the substrate and
the solder without applying heat directly to the
devices on the board. Using a combination of
proximity and hard-contact bakes, the bake
profile can be adjusted to suit any process.