Cree Xlamp ml series User manual

11

soldering & handling

XLamp®are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do





contact Cree Sales at [email protected].

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300



CLD-AP50 REV 8B

Cree®XLamp®ML Family LEDs

INTRODUCTION

This application note applies to XLamp®ML family LEDs, which

have order codes in the following fomat:

MLxxxx-xx-xxxx-xxxxxx

This application note explains how XLamp ML family LEDs and

assemblies containing these LEDs should be handled during

manufacturing. Please read the entire document to understand

how to properly handle XLamp ML family LEDs.

TABLE OF CONTENTS

Handling XLamp®ML Family LEDs............................................. 2

Circuit Board Preparation & Layouts........................................... 3

Case Temperature (Ts) Measurement Point............................... 4

Notes on Soldering XLamp®ML family LEDs............................. 4

Low Temperature Operation........................................................ 7

XLamp® ML Family LED Reow Soldering Characteristics ....... 8

Chemicals & Conformal Coatings............................................... 9

Assembly Storage & Handling................................................... 10

Tape and Reel............................................................................. 11

Packaging & Labels ................................................................... 12

HANDLING XLAMP®ML FAMILY LEDS

Manual Handling

Use tweezers to grasp XLamp ML family LEDs at the base. Do not touch the top surface of the LED with tweezers.

Cree recommends the following at all times when handling XLamp ML Family LEDs or assemblies containing these LEDs:

• Never touch the optical surface with ngers or sharp objects. The LED lens surface could be soiled or damaged, which would affect

the optical performance of the LED.

• Cree recommends always handling ML family LEDs with appropriate ESD grounding.

• Cree recommends handling ML family LEDs wearing clean, lint-free gloves.

In luminaire design Cree recommends the same principle. Cover exposed LEDs to protect them during luminaire instalation and routine

maintenance. A transparent cover over the optical cavity of a luminaire is an example of this kind of protection.

In production environments, whenever possible, Cree recommends the use of a pick & place tool to remove the XLamp ML family LEDs

from the factory tape & reel packaging.

Pick & Place Nozzle

For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be constructed of non-

metallic materials. Cree and several of Cree’s customers have had good success using nozzles fabricated from 90d urethane.

Cree recommends the pick & place tool shown below for XLamp ML Family LEDs.

X

WRONG

P

CORRECT

22

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 2

XLamp®mL FamiLy LED SoLDEring & HanDLing

CIRCUIT BOARD PREPARATION & LAYOUTS

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specications before placing or

soldering XLamp ML family LEDs onto the PCB. The diagram below shows the recommended PCB solder pad layout for XLamp ML family

LEDs.

All dimensions in mm.

For additional information about FR4 thermal vias, illustrated above, consult Cree’s Optimizing PCB Thermal Performance application

note.

Recommended FR4 Solder Pad Recommended MCPCB Solder Pad

MX3535 Pad Layout

Recommended Stencil Pattern

(Hatched Area Is Opening)

MX3535 Pad Layout

Alternative Solder Pad

MX3535 Pad Layout

33

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 3

XLamp®mL FamiLy LED SoLDEring & HanDLing

CASE TEMPERATURE (TS) MEASUREMENT POINT

XLamp ML family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This

measurement point is shown in the picture below.

It is not required to use a solder footprint for the thermal pad that is larger than the XLamp ML LED itself. In testing, Cree has found such

a solder pad to have insignicant impact on the resulting Tsmeasurement.

NOTES ON SOLDERING XLAMP®ML FAMILY LEDS

XLamp ML family LEDs are designed to be reow soldered to a PCB. Reow soldering may be done by a reow oven or by placing the

PCB on a hotplate and following the reow soldering prole listed in the XLamp ML Family LED Reow Soldering Characteristics section

(page 7).

Do not wave-solder XLamp ML family LEDs. Do not hand-solder XLamp ML family LEDs. N2 reow is recommended.

X

WRONG

P

CORRECT

P

CORRECT

44

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 4

XLamp®mL FamiLy LED SoLDEring & HanDLing

Solder Paste Type

Cree strongly recommends using “no clean” solder paste with XLamp ML LEDs so that cleaning the PCB after soldering is not required.

Cree uses Kester®R276 solder paste internally.

Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).

Solder Paste Thickness

The choice of solder and the application method will dictate the specic amount of solder. For the most consistent results, an automated

dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil

(102-μm) bond line, i.e., the solder joint thickness after reow soldering.

After Soldering

After soldering, allow XLamp ML family LEDs to return to room temperature before subsequent handling. Premature handling of the

device could result in damage to the LED.

Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reow. After

shearing selected devices from the circuit board the solder should appear completely re-owed (no solder grains evident). The solder

areas should show minimum evidence of voids on the backside of the package and the PCB.

Cleaning PCBs After Soldering

Cree recommends using “no clean” solder paste so that ux cleaning is not necessary after reow soldering. If PCB cleaning is necessary,

Cree recommends the use of isopropyl alcohol (IPA).

Do not use ultrasonic cleaning.

Moisture Sensitivity

XLamp ML Family LEDs are shipped in sealed, moisture-barrier bags

(MBB) designed for long shelf life. If XLamp ML Family LEDs are

exposed to moist environments after opening the MBB packaging but

before soldering, damage to the LED may occur during the soldering

operation. The derating table at right denes the maximum exposure

time (in days) for an XLamp ML Family LED in the listed humidity and

temperature conditions. LEDs with exposure time longer than the time

specied below must be baked according to the baking conditions listed below.

P

CORRECT

X

WRONG

Temp. Maximum Percent Relative Humidity

30% 40% 50% 60% 70% 80% 90%

35 ºC - - - 17 1 .5 .5

30 ºC - - - 28 1 1 1

25 ºC - - - - 2 1 1

20 ºC - - - - 2 1 1

55

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 5

XLamp®mL FamiLy LED SoLDEring & HanDLing

Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends

returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use.

Humidity inside the sealed moisture-barrier packaging can be checked immediately after opening the packaging by inspecting the

humidity indicator card. The pictures below provide a guide on how to read the humidity indicator card immediately after opening the

sealed moisture-barrier packaging.

The humidity indicator card shows that the humidity has not

reached 10%.

The humidity indicator card shows that the humidity level has

exceeded 30%.

Baking Conditions

It is not necessary to bake all XLamp ML Family LEDs. Only the LEDs that meet all of the following criteria must be baked:

• LEDs that have been removed from the original MBB packaging.

• LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.

• LEDs that have not been soldered.

LEDs should be baked at 70ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging before baking.

Do not bake parts at temperatures higher than 70ºC. This baking operation resets the exposure time as dened in the Moisture Sensitivity

section above.

Storage Conditions

XLamp ML Family LEDs that have been removed from the original MBB packaging but not soldered should be stored in one of the

following ways:

• Store the parts in a rigid metal container with a tight-tting lid. Verify that the storage temperature is <30°C, and place fresh desiccant

and an RH indicator in the container to verify that the RH is no greater than 60%.

• Store the parts in a dry, nitrogen-purged cabinet or container that actively maintains the temperature at <30° and the RH at no greater

than 60%.

• For short-term store only: LEDs can be resealed in the original MBB bag soon after opening. Fresh desiccant may be needed. Use the

included humidity indicator card to verify <60% RH.

If an environment of <60% RH is not available for storage, XLamp ML Family LEDs should be baked (described above) before reow

soldering.

66

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 6

XLamp®mL FamiLy LED SoLDEring & HanDLing

LOW TEMPERATURE OPERATION

The minimum operating temperature of these XLamp LED components is -40 °C. To maximize lifetime, Cree recommends avoiding

applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0°C.

77

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 7

XLamp®mL FamiLy LED SoLDEring & HanDLing

XLAMP®ML FAMILY LED REFLOW SOLDERING CHARACTERISTICS

In testing, Cree has found XLamp ML family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a

general guideline, Cree recommends that users follow the recommended soldering prole provided by the manufacturer of the solder

paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.

Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.

Profile Feature Lead-Free Solder

Average Ramp-Up Rate (Tsmax to Tp) 1.2°C/second

Preheat: Temperature Min (Tsmin) 120 °C

Preheat: Temperature Max (Tsmax)170 °C

Preheat: Time (tsmin to tsmax) 65-150 seconds

Time Maintained Above: Temperature (TL)217 °C

Time Maintained Above: Time (tL) 45-90 seconds

Peak/Classication Temperature (Tp) 235 - 245 °C

Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds

Ramp-Down Rate 1 - 6 °C/second

Time 25°C to Peak Temperature 4 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

Note: While the high reow temperatures (above) have been approved, Cree’s best practice guideline for reow is to use as low a

temperature as possible during the reow soldering process for these LEDs.

IPC/JEDEC J-STD-020C

TP

TL

Temperature

Time

t 25˚C to Peak

Preheat

ts

tS

tP

25

Ramp-down

Ramp-up

Critical Zone

TL to TP

Tsmax

Tsmin

88

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 8

XLamp®mL FamiLy LED SoLDEring & HanDLing

CHEMICALS & CONFORMAL COATINGS

Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and

current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application

Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of

chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.

Recommended Chemicals

In testing, Cree has found the following chemicals to be safe to use with XLamp ML family LEDs.

• Water

• Isopropyl alcohol (IPA)

Chemicals Tested as Harmful

In general, subject to the specics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to

XLamp ML family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp ML family LEDs. The

fumes from even small amounts of the chemicals may damage the LEDs.

• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)

• Methyl acetate or ethyl acetate (i.e., nail polish remover)

• Cyanoacrylates (i.e., “Superglue”)

• Glycol ethers (including Radio Shack®Precision Electronics Cleaner - dipropylene glycol monomethyl ether)

• Formaldehyde or butadiene (including Ashland®PLIOBOND®adhesive)

Hermetically Sealing Luminaires

For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment

that contains oxygen. Simply allowing the LEDs to ventilate to air is sufcient; no extraordinary measures are required. Hermetically

sealing LEDs in an enclosed space is not recommended.

Potential of Silver Tarnishing

XLamp ML Family LEDs contain silver-plated parts that may tarnish (turn black) over time when exposed to oxidizing substances such as

sulfur, chlorine, or other halides. Oxidation of the leads can reduce the ability to make a good solder connection and affect the light output

of the LED. Exposure to oxidizing substances can come from materials used near the LED during manufacturing or from the air around

the LEDs during storage.

To reduce the potential of tarnishing for XLamp ML Family LEDs, Cree recommends that customers minimize exposure of the LEDs

to oxidizing substances at all times, including storage, manufacturing and product testing. Potential sources of oxidizing substances

include paper, air lters, some cleaning chemicals, cardboard boxes and rubber anti-static mats.

99

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 9

XLamp®mL FamiLy LED SoLDEring & HanDLing

ASSEMBLY STORAGE & HANDLING

Do not stack PCBs or assemblies containing XLamp ML family LEDs. PCBs or assemblies containing XLamp ML family LEDs should be

stacked in a way to allow at least 1-cm clearance.

Do not use bubble wrap directly on top of XLamp ML family LEDs. Force from the bubble wrap can potentially damage the LED.

P

CORRECT

P

CORRECT

X

WRONG

1010

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 10

XLamp®mL FamiLy LED SoLDEring & HanDLing

TAPE AND REEL

All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.

Except as noted, all dimensions in mm.

Loaded Pockets

(1,000 Lamps)

Leader

400mm (min) of

empty pockets with

at least 100mm

sealed by tape

(50 empty pockets min.)

Trailer

160mm (min) of

empty pockets

sealed with tape

(20 pockets min.)

START

END

Cathode Side

Anode Side

(denoted by + and circle)

160.0

A

B

2.5

±.1

SECTION A-A

SCALE 2 : 1

1.5

±.1

8.0

±.1

4.0

±.1

1.75

±.10

12.0 .0

+

.3

DETAIL B

SCALE 2 : 1

13

mm

7"

Cover Tape

Pocket Tape

User Feed Direction

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

CHECK

FINAL PROTECTIVE FINISH

MATERIAL

APPROVED

DRAWN BY

THIRD ANGLE PROJECTION

SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300

Fax (919) 313-5558

4600 Silicon Drive

Durham, N.C 27703

UNAUTHORIZED PERSON WITHOUT

THE WRITTEN CONSENT

MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY

CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT

CONTAINED WITHIN ARE THE PROPRIETARY AND

CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION

OF CREE INC.

NOTICE

X° ±.5 °

.XXX ± .25

.XX ±.75

.X ±1.5

FOR SHEET METAL PARTS ONLY

.XX ±.25

.XXX ± .125

X° ±.5 °

UNLESS OTHERWISE SPECIFIED

DIMENSIONS ARE IN

MILLIMETERS AND AFTER FINISH.

TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH:

1.6

(8 )

(12 )

(1.75 )

(4 )

(Ø1.5)

(1.65)

Trailer Loaded Pockets Leader

2/14.000

B

2402-00005

Carrier Loading Specification-MX6

7/1/09D. Seibel

REVISONS

REV DESCRIPTION BY DATE APP'D

A Released J.L. 7/1/09

BADDED CATHODE AND ANODE NOTES DC 2/26/12

160 mm (min) of

empty pockets

sealed with tape

(20 pockets min.)

400 mm (min) of

empty pockets with

at least 100 mm

sealed by tape

(50 empty pockets min.)

(1,400 pcs /Reel

CATHODE SIDE

ANODE SIDE

Cathode Mark

1111

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 11

XLamp®mL FamiLy LED SoLDEring & HanDLing

PACKAGING & LABELS

The diagrams below show the packaging and labels Cree uses to ship XLamp ML family LEDs. XLamp ML family LEDs are shipped in tape

loaded on a reel. Each box contains only one reel in a moisture barrier bag.

Patent Label

(on bottom of box)

Label with Cree Bin Code,

Quantity, Reel ID

Label with Cree Bin

Code, Quantity, Reel ID

Label with Cree Order Code,

Quantity, Reel ID, PO #

Label with Cree Order Code,

Quantity, Reel ID, PO #

Label with Cree Bin Code,

Quantity, Reel ID

Unpackaged Reel

Packaged Reel

Boxed Reel

CREE Bin Code

& Barcode Label

Vacuum-Sealed

Moisture Barrier Bag

Label with Customer

P/N, Qty, Lot #, PO #

Label with Cree Bin

Code, Qty, Lot #

Label with Cree Bin

Code, Qty, Lot #

Vacuum-Sealed

Moisture Barrier Bag

Patent Label

Label with Customer Order

Code, Qty, Reel ID, PO #

Humidity Indicator Card

(inside bag)

Dessicant

(inside bag)

1212

trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is provided

for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree

Sales at [email protected]. 12

XLamp®mL FamiLy LED SoLDEring & HanDLing

Cree XLamp ML Series User manual

Popular Work Light manuals by other brands