Cree Xlamp xr series User manual

soldering & handling

registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or

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or vendor endorsement, sponsorship or association.

Cree, Inc.

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CLD-AP16 REV 10A

Cree®XLamp®XR Family LEDs

TABLE OF CONTENTS

Handling XLamp®XR Family LEDs...........................................2

Circuit Board Preparation & Layouts........................................3

Case Temperature (Ts) Measurement Point............................3

Notes on Soldering XLamp®XR Family LEDs .........................4

XLamp® XR Family LED Reow Soldering Characteristics.....6

Moisture Sensitivity ..................................................................7

Low Temperature Operation.....................................................8

Chemicals & Conformal Coatings............................................8

Assembly Storage & Handling..................................................9

Tape and Reel......................................................................... 10

Packaging and Labels............................................................ 11

INTRODUCTION

This application note applies to XLamp® XR family LEDs, which

have order codes in the following format.

XRxxxx-xx-xxxx-xxxxxx

This application note explains how XLamp XR family LEDs and

assemblies containing these LEDs should be handled during

manufacturing. Please read the entire document to understand

how to properly handle XLamp XR family LEDs.

Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor

endorsement, sponsorship or association. 2

XLamp®XR FamiLy LED SoLDERing & HanDLing

HANDLING XLAMP®XR FAMILY LEDS

Cree recommends the following at all times when handling XLamp XR family LEDs or assemblies containing these LEDs:

• Avoid putting mechanical stress on the LED lens.

• Never touch the optical surface with ngers or sharp objects. The LED lens surface could be soiled or damaged, which would affect

the optical performance of the LED.

• Cree recommends always handling XR family LEDs with appropriate ESD grounding.

• Cree recommends handling XR family LEDs wearing clean, lint‑free gloves.

Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp XR family LEDs from the factory tape & reel

packaging.

Pick & Place Nozzle

For pick and place nozzles coming into contact with silicone‑covered LED components, Cree recommends nozzles be constructed of

non‑metallic materials. Cree and several of Cree’s customers have had good success using nozzles fabricated from 90d urethane.

Cree recommends the pickup tool shown below for XLamp XR family LEDs.

Manual Handling

Use tweezers to grab XLamp XR family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with ngers. Do

not push on the lens.

Scale = none

All dimensions in mm

General tolerances = ± 0.1

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CORRECT

Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor

endorsement, sponsorship or association. 3

XLamp®XR FamiLy LED SoLDERing & HanDLing

CIRCUIT BOARD PREPARATION & LAYOUTS

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specications before placing or

soldering XLamp XR family LEDs onto the PCB.

The diagram below shows the recommended PCB solder pad layout for XLamp XR family LEDs.

CASE TEMPERATURE (TS) MEASUREMENT POINT

XLamp XR family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This

measurement point is shown in the pictures below.

It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XR family LED itself. In testing, Cree has found

such a solder pad to have insignicant impact on the resulting Ts measurement.

7.0 mm

5.6 mm 0.70 mm

8.4 mm

6.46 mm

Recommended PC Board Solder Pad

Recommended solder pad

for XLamp XR family LEDs

6.36

8.30

0.60 0.80

0.80

0.60

5.50

7.10

RECOMMENDED STENCIL PATTERN 7090

(HATCHED AREA IS OPENING)

Recommended stencil pattern

for XLamp XR family LEDs

(hatched area is opening)

Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor

endorsement, sponsorship or association. 4

XLamp®XR FamiLy LED SoLDERing & HanDLing

NOTES ON SOLDERING XLAMP®XR FAMILY LEDS

XLamp XR family LEDs are designed to be reow soldered to a PCB. Reow soldering may be done by a reow oven or by placing the PCB

on a hotplate and following the reow soldering prole listed on the previous page.

Do not wave solder XLamp XR family LEDs. Do not hand solder XLamp XR family LEDs.

Solder Paste Type

Cree strongly recommends using “no clean” solder paste with XLamp XR family LEDs so that cleaning the PCB after soldering is not

required. Cree uses Kester®R276 solder paste internally.

Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).

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Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor

endorsement, sponsorship or association. 5

XLamp®XR FamiLy LED SoLDERing & HanDLing

Solder Paste Thickness

The choice of solder and the application method will dictate the specic amount of solder. For the most consistent results, an automated

dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4‑mil

(102‑μm) bond line, i.e., the solder joint thickness after reow soldering.

After Soldering

After soldering, allow XLamp XR family LEDs to return to room temperature before subsequent handling. Premature handling of the

device, especially around the lens, could result in damage to the LED.

Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reow. After

shearing selected devices from the circuit board the solder should appear completely re‑owed (no solder grains evident). The solder

areas should show minimum evidence of voids on the backside of the package and the PCB.

Cleaning PCBs After Soldering

Cree recommends using “no clean” solder paste so that ux cleaning is not necessary after reow soldering. If PCB cleaning is necessary,

Cree recommends the use of isopropyl alcohol (IPA).

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Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor

endorsement, sponsorship or association. 6

XLamp®XR FamiLy LED SoLDERing & HanDLing

XLAMP®XR FAMILY LED REFLOW SOLDERING CHARACTERISTICS

In testing, Cree has found XLamp XR family LEDs to be compatible with JEDEC J‑STD‑020C, using the parameters listed below. As a

general guideline, Cree recommends that users follow the recommended soldering prole provided by the manufacturer of the solder

paste used.

Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.

Profile Feature Lead-Free Solder

Average Ramp-Up Rate (Tsmax to Tp) 1.2°C/second

Preheat: Temperature Min (Tsmin) 120 °C

Preheat: Temperature Max (Tsmax)170 °C

Preheat: Time (tsmin to tsmax) 65-150 seconds

Time Maintained Above: Temperature (TL)217 °C

Time Maintained Above: Time (tL) 45-90 seconds

Peak/Classication Temperature (Tp) 235 ‑ 245 °C

Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds

Ramp‑Down Rate 1 ‑ 6 °C/second

Time 25°C to Peak Temperature 4 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

IPC/JEDEC J‑STD‑020C

TP

TL

Temperature

Time

t 25˚C to Peak

Preheat

ts

tS

tP

25

Ramp-down

Ramp-up

Critical Zone

TL to TP

Tsmax

Tsmin

Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor

endorsement, sponsorship or association. 7

XLamp®XR FamiLy LED SoLDERing & HanDLing

MOISTURE SENSITIVITY

Cree recommends keeping XLamp XR‑C LEDs in the provided, resealable moisture‑barrier packaging (MBP) until immediately prior to

soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.

Humidity inside the MBP can be checked immediately after opening the MBP by inspecting the humidity indicator card. The pictures

below provide a guide on how to read the humidity indicator card immediately after opening the MBP.

The humidity indicator card shows that the humidity has not

reached 10%.

The humidity indicator card shows that the humidity level has

exceeded 30%.

Once the MBP is opened, XLamp XR‑C LEDs should be handled and

stored as MSL 4 per JEDEC J‑STD‑033, meaning they have limited

exposure time before damage to the LED may occur during the

soldering operation. The table on the right species the maximum

exposure time in days depending on temperature and humidity

conditions. LEDs with exposure time longer than the specied

maximums must be baked according to the baking conditions listed below.

Baking Conditions

It is not necessary to bake all XLamp LEDs. Only the LEDs that meet all of the following criteria must be baked:

• LEDs that have been removed from the original MBP.

• LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.

• LEDs that have not been soldered.

LEDs should be baked at 70ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do

not bake parts at temperatures higher than 70ºC. This baking operation resets the exposure time as dened in the Moisture Sensitivity

section above.

Temp. Maximum Percent Relative Humidity

30% 40% 50% 60% 70% 80% 90%

30ºC 9543111

25ºC 12754211

20ºC 17976221

Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor

endorsement, sponsorship or association. 8

XLamp®XR FamiLy LED SoLDERing & HanDLing

Storage Conditions

XLamp LEDs that have been removed from the original MBP but not soldered yet should be stored in a room or cabinet that will maintain

an atmosphere of 25 ± 5ºC and no greater than 10% RH (relative humidity). For LEDs stored in these conditions, storage time does not

add to exposure time as dened in the Moisture Sensitivity section above.

LOW TEMPERATURE OPERATION

The minimum operating temperature of these XLamp LED components is ‑40 °C. To maximize lifetime, Cree recommends avoiding

applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0°C.

CHEMICALS & CONFORMAL COATINGS

Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and

current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application

Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of

chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.

Recommended Chemicals

In testing, Cree has found the following chemicals to be safe to use with XLamp XR family LEDS.

• Water

• Isopropyl alcohol (IPA)

Chemicals Tested as Harmful

In general, subject to the specics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to

XLamp XR family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XR family LEDs. The

fumes from even small amounts of the chemicals may damage the LEDs.

• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)

• Methyl acetate or ethyl acetate (i.e., nail polish remover)

• Cyanoacrylates (i.e., “Superglue”)

• Glycol ethers (including Radio Shack® Precision Electronics Cleaner ‑ dipropylene glycol monomethyl ether)

• Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)

Hermetically Sealing Luminaires

For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment

that contains oxygen. Simply allowing the LEDs to ventilate to air is sufcient; no extraordinary measures are required. Hermetically

sealing LEDs in an enclosed space is not recommended.

Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor

endorsement, sponsorship or association. 9

XLamp®XR FamiLy LED SoLDERing & HanDLing

ASSEMBLY STORAGE & HANDLING

Do not stack PCBs or assemblies containing XLamp XR family LEDs so that anything rests on the XLamp LED lens. Force applied to the

XLamp LED lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XR family LEDs should be stacked in a

way to allow at least 1cm clearance above the LED lens.

Do not use bubble wrap directly on top of XLamp XR family LEDs. Force from the bubble wrap can potentially damage the LED.

X

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X

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P

CORRECT

P

CORRECT

Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor

endorsement, sponsorship or association. 10

XLamp®XR FamiLy LED SoLDERing & HanDLing

TAPE AND REEL

All Cree carrier tapes conform to EIA‑481D, Automated Component Handling Systems Standard.

330.2 mm

+

12.0±.1

5.5±.1

13.5

(MIN)

16.0+.3

-.0

1.75±.10

4.0±.1

50

EMPTY POCKETS

WITH TAPE

60 (MIN)

EMPTY POCKETS

WITH TAPE

5-10

EMPTY

POCKTES WITH

UNSEALED

COVER TAPE

1.5 ± .1

ANODE SIDE

CATHODE SIDE

LOADED POCKETS

USER FEED DIRECTION

START

12.0±.1

5.5±.1

13.5

(MIN)

16.0+.3

-.0

1.75±.10

4.0±.1

50

EMPTY POCKETS

WITH TAPE

60 (MIN)

EMPTY POCKETS

WITH TAPE

5-10

EMPTY

POCKTES WITH

UNSEALED

COVER TAPE

1.5 ± .1

ANODE SIDE

CATHODE SIDE

LOADED POCKETS

USER FEED DIRECTION

START

Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor

endorsement, sponsorship or association. 11

XLamp®XR FamiLy LED SoLDERing & HanDLing

PACKAGING AND LABELS

The diagrams below show the packaging and labels Cree uses to ship XLamp XR family LEDs. XLamp XR family LEDs are shipped in tape

loaded on a reel. Each box contains only one reel in a moisture barrier bag.

Label with Cree Bin

Code, Qty, Lot # Label with Cree Bin

Code, Qty, Lot #

Vacuum-Sealed

Moisture Barrier Bag

Dessicant

(inside bag)

Humidity Indicator

Card (inside bag)

Patent Label

Label with Customer Order

Code, Qty, Reel ID, PO #

Patent Label

Label with Cree Bin Code,

Quantity, Reel ID

Humidity Indicator Card

(inside bag)

Dessicant

(inside bag)

Label with Cree Bin Code,

Quantity, Reel ID

Label with Cree Order Code,

Quantity, Reel ID, PO #

Label with Cree Order Code,

Quantity, Reel ID, PO #

Label with Cree Bin Code,

Quantity, Reel ID

Unpackaged Reel

Packaged Reel

Boxed Reel

Cree XLamp XR Series User manual

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