Cree Xlamp mx series User manual

soldering & handling

XLamp®

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endorsement, sponsorship or association.

Cree, Inc.

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CLD-AP32 REV 9B

Cree®XLamp®MX Family LEDs

INTRODUCTION

This application note applies to the XLamp®MX Family of LEDs,

which have order codes in the following format:

MX6xxx-xx-xxxx-xxxxxx

MX3xxx-xx-xxxx-xxxxxx

This application note explains how XLamp MX Family of LEDs

and assemblies containing these LEDs should be handled during

manufacturing. Please read the entire document to understand

how to properly handle XLamp MX LEDs.

TABLE OF CONTENTS

Handling XLamp®MX Family LEDs.............................................2

Circuit Board Preparation & Layouts...........................................3

Case Temperature (Ts) Measurement Point............................... 4

Notes on Soldering XLamp®MX Family LEDs ...........................4

Low Temperature Operation........................................................7

XLamp® MX Family LED Reow Soldering Characteristics....... 8

Chemicals & Conformal Coatings...............................................9

Assembly Storage & Handling...................................................10

Tape and Reel.............................................................................11

Packaging & Labels ...................................................................12

document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 2

XLamp®mX FamiLy LED SoLDEring & HanDLing

22

HANDLING XLAMP®MX FAMILY LEDS

Manual Handling

Use tweezers to grasp the XLamp MX LEDs at the base. Do not touch the top surface of the LED with tweezers.

Cree recommends the following at all times when handling XLamp MX Family LEDs or assemblies containing these LEDs:

• Never touch the optical surface with ngers or sharp objects. The LED lens surface could be soiled or damaged, which would affect

the optical performance of the LED.

• Cree recommends always handling MX family LEDs with appropriate ESD grounding.

• Cree recommends handling MX family LEDs wearing clean, lint-free gloves.

Pick & Place Nozzle

For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be constructed of non-

metallic materials. Cree and several of Cree’s customers have had good success using nozzles fabricated from 90d urethane.

Whenever possible, Cree recommends the use of a pick & place tool to remove the XLamp MX LEDs from the factory tape & reel packaging.

Cree recommends the pickup tool shown below for XLamp MX Family of LEDs.

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•Recommended MX6 Pickup Collet

All dimensions in mm..

document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 3

XLamp®mX FamiLy LED SoLDEring & HanDLing

33

CIRCUIT BOARD PREPARATION & LAYOUTS

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specications before placing or

soldering XLamp MX LEDs onto the PCB.

The diagram below shows the recommended PCB solder pad layout for XLamp MX Family of LEDs.

For additional information about FR4 thermal vias, illustrated above, consult Cree’s Optimizing PCB Thermal Performance for Cree XLamp

LEDs application note.

Recommended FR4 Solder Pad Recommended MCPCB Solder Pad

All dimensions in mm.

Alternative Solder Pad

Recommended Stencil Pattern

(Hatched Area Is Opening)

document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 4

XLamp®mX FamiLy LED SoLDEring & HanDLing

CASE TEMPERATURE (TS) MEASUREMENT POINT

XLamp MX LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This

measurement point is shown in the picture below.

It is not required to use a solder footprint for the thermal pad that is larger than the XLamp MX LED itself. In testing, Cree has found such

a solder pad to have insignicant impact on the resulting Ts measurement.

NOTES ON SOLDERING XLAMP®MX FAMILY LEDS

The XLamp MX Family of LEDs are designed to be reow soldered to a PCB. Reow soldering may be done by a reow oven or by placing

the PCB on a hotplate and following the reow soldering prole listed in the XLamp MX Family LED Reow Soldering Characteristics

section (page 7).

Do not wave-solder XLamp MX LEDs. Do not hand-solder XLamp MX LEDs. N2 reow is recommended.

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Notes on Soldering XLamp XP Family LEDs

XLamp XP Family LEDs are designed to be reow soldered to a PCB. Reow soldering may be done by a reow oven or

by placing the PCB on a hotplate and following the reow soldering prole listed on the previous page.

Do not wave solder XLamp XP Family LEDs. Do not hand solder XLamp XP Family LEDs.

Solder Paste Type

Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after

reow soldering is not required. Cree uses the following solder paste internally:

Indium Corporation of America® Part number 82676

• Sn62/Pb36/Ag2 composition

• Flux: NC-SMQ92J

Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg.

Solder Paste Thickness

The choice of solder and the application method will dictate the specic amount of solder. For the most consistent results,

an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder

thickness that results in a 3-mil (75-μm) bond line.

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This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the

data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected].

and XLamp are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners

and do not imply specic product and/or vendor endorsement, sponsorship or association.

4CLD-AP25 Rev 3

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

www.cree.com/xlamp

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WRONG

document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 5

XLamp®mX FamiLy LED SoLDEring & HanDLing

55

Solder-Paste Type

Cree strongly recommends using “no clean” solder paste with XLamp MX Family LEDs so that cleaning the PCB after reow soldering is

not required. Cree uses Kester®R276 solder paste internally.

Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).

Solder Paste Thickness

The choice of solder and the application method will dictate the specic amount of solder. For the most consistent results, an automated

dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil

(102-μm) bond line, i.e., the solder joint thickness after reow soldering.

After Soldering

After soldering, allow XLamp MX LEDs to return to room temperature before subsequent handling. Premature handling of the device could

result in damage to the LED.

Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reow. After

shearing selected devices from the circuit board the solder should appear completely re-owed (no solder grains evident). The solder

areas should show minimum evidence of voids on the backside of the package and the PCB.

Cleaning PCBs After Soldering

Cree recommends using “no clean” solder paste so that ux cleaning is not necessary after reow soldering. If PCB cleaning is necessary,

Cree recommends the use of isopropyl alcohol (IPA).

Do not use ultrasonic cleaning.

Moisture Sensitivity

XLamp MX Family LEDs are shipped in sealed, moisture-barrier bags

(MBB) designed for long shelf life. If XLamp MX Family LEDs are

exposed to moist environments after opening the MBB packaging but

before soldering, damage to the LED may occur during the soldering

operation. The derating table at right denes the maximum exposure

time (in days) for an XLamp MX Family LED in the listed humidity and

temperature conditions. LEDs with exposure time longer than the time specied below must be baked according to the baking conditions

listed below.

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Temp. Maximum Percent Relative Humidity

30% 40% 50% 60% 70% 80% 90%

35 ºC - - - 17 1 .5 .5

30 ºC - - - 28 1 1 1

25 ºC - - - - 2 1 1

20 ºC - - - - 2 1 1

document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 6

XLamp®mX FamiLy LED SoLDEring & HanDLing

Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends

returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use.

Humidity inside the moisture-barrier packaging can be checked immediately after opening the packaging by inspecting the humidity

indicator card.The pictures below provide a guide on how to read the humidity indicator card immediately after opening the moisture-barrier

packaging.

The humidity indicator card shows that the humidity has not

reached 10%.

The humidity indicator card shows that the humidity level has

exceeded 30%.

Baking Conditions

It is not necessary to bake all XLamp MX Family LEDs. Only the LEDs that meet all of the following criteria must be baked:

1. LEDs that have been removed from the original MBB packaging.

2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.

3. LEDs that have not been soldered.

LEDs should be baked at 70ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging before baking.

Do not bake parts at temperatures higher than 70ºC. This baking operation resets the exposure time as dened in the Moisture Sensitivity

section above.

Storage Conditions

XLamp MX Family LEDs that have been removed from the original MBB packaging but not soldered should be stored in one of the

following ways:

• Store the parts in a rigid metal container with a tight-tting lid. Verify that the storage temperature is <30°C, and place fresh desiccant

and an RH indicator in the container to verify that the RH is no greater than 60%.

• Store the parts in a dry, nitrogen-purged cabinet or container that actively maintains the temperature at <30° and the RH at no greater

than 60%.

• For short-term store only: LEDs can be resealed in the original MBB bag soon after opening. Fresh desiccant may be needed. Use the

included humidity indicator card to verify <60% RH.

document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 7

XLamp®mX FamiLy LED SoLDEring & HanDLing

If an environment of <60% RH is not available for storage, XLamp MX Family LEDs should be baked (described above) before reow

soldering.

LOW TEMPERATURE OPERATION

The minimum operating temperature of these XLamp LED components is -40 °C. To maximize lifetime, Cree recommends avoiding

applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0°C.

document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 8

XLamp®mX FamiLy LED SoLDEring & HanDLing

XLAMP®MX FAMILY LED REFLOW SOLDERING CHARACTERISTICS

In testing, Cree has found XLamp MX Family of LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As

a general guideline, Cree recommends that users follow the recommended soldering prole provided by the manufacturer of the solder

paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.

Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.

Profile Feature Lead-Free Solder

Average Ramp-Up Rate (Tsmax to Tp) 1.2°C/second

Preheat: Temperature Min (Tsmin) 120 °C

Preheat: Temperature Max (Tsmax)170 °C

Preheat: Time (tsmin to tsmax) 65-150 seconds

Time Maintained Above: Temperature (TL)217 °C

Time Maintained Above: Time (tL) 45-90 seconds

Peak/Classication Temperature (Tp) 235 - 245 °C

Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds

Ramp-Down Rate 1 - 6 °C/second

Time 25°C to Peak Temperature 4 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

IPC/JEDEC J-STD-020C

TP

TL

Temperature

Time

t 25˚C to Peak

Preheat

ts

tS

tP

25

Ramp-down

Ramp-up

Critical Zone

TL to TP

Tsmax

Tsmin

document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 9

XLamp®mX FamiLy LED SoLDEring & HanDLing

CHEMICALS & CONFORMAL COATINGS

Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and

current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application

Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of

chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.

Recommended Cleaning Solutions

Cree has found the following chemicals to be safe to use with XLamp MX Family LEDs.

• Water

• Isopropyl alcohol (IPA)

Chemicals Tested as Harmful

In general, subject to the specics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to

XLamp MX Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp MX Family LEDs.

The fumes from even small amounts of the chemicals may damage the LEDs.

• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)

• Methyl acetate or ethyl acetate (i.e., nail polish remover)

• Cyanoacrylates (i.e., “Superglue”)

• Glycol ethers (including Radio Shack®Precision Electronics Cleaner - dipropylene glycol monomethyl ether)

• Formaldehyde or butadiene (including Ashland®PLIOBOND®adhesive)

Hermetically Sealing Luminaires

For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment

that contains oxygen. Simply allowing the LEDs to ventilate to air is sufcient; no extraordinary measures are required. Hermetically

sealing LEDs in an enclosed space is not recommended.

Potential of Silver Tarnishing

XLamp MX LEDs contain silver plated parts that may tarnish (turn black) over time when exposed to oxidizing substances such as sulfur,

chlorine, or other halides. Oxidation of the leads can reduce the ability to make a good solder connection and affect the light output of

the LED. Exposure to oxidizing substances can come from materials used near the LED during manufacturing or from the air around the

LEDs during storage.

To reduce the potential of tarnishing for XLamp MX LEDs, Cree recommends that customers minimize exposure of the LEDs to oxidizing

substances at all times, including storage, manufacturing and product testing. Potential sources of oxidizing substances include paper,

air lters, some cleaning chemicals, cardboard boxes and rubber anti-static mats.

document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 10

XLamp®mX FamiLy LED SoLDEring & HanDLing

ASSEMBLY STORAGE & HANDLING

Do not stack PCBs or assemblies containing XLamp MX Family of LEDs. PCBs or assemblies containing XLamp MX Family of LEDs

should be stacked in a way to allow at least 1-cm clearance.

Do not use bubble wrap directly on top of XLamp MX Family of LEDs. Force from the bubble wrap can potentially damage the LED.

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document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 11

XLamp®mX FamiLy LED SoLDEring & HanDLing

TAPE AND REEL

All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.

Except as noted, all dimensions in mm.

Loaded Pockets

(1,000 Lamps)

Leader

400mm (min) of

empty pockets with

at least 100mm

sealed by tape

(50 empty pockets min.)

Trailer

160mm (min) of

empty pockets

sealed with tape

(20 pockets min.)

START

END

Cathode Side

Anode Side

(denoted by + and circle)

160.0

A

B

2.5

±.1

SECTION A-A

SCALE 2 : 1

1.5

±.1

8.0

±.1

4.0

±.1

1.75

±.10

12.0 .0

+

.3

DETAIL B

SCALE 2 : 1

13

mm

7"

Cover Tape

Pocket Tape

User Feed Direction

SIZE

TITLE

OF

REV.

SHEET

C

DRAWING NO.

DATE

CHECK

FINAL PROTECTIVE FINISH

MATERIAL

APPROVED

DRAWN BY

THIRD ANGLE PROJECTION

SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300

Fax (919) 313-5558

4600 Silicon Drive

Durham, N.C 27703

UNAUTHORIZED PERSON WITHOUT

THE WRITTEN CONSENT

MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY

CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT

CONTAINED WITHIN ARE THE PROPRIETARY AND

CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION

OF CREE INC.

NOTICE

X° ± .5 °

.XXX ± .25

.XX ± .75

.X ± 1.5

FOR SHEET METAL PARTS ONLY

.XX ± .25

.XXX ± .125

X° ± .5 °

UNLESS OTHERWISE SPECIFIED

DIMENSIONS ARE IN

MILLIMETERS AND AFTER FINISH.

TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH:

1.6

(8 )

(12 )

(1.75 )

(4 )

( )1.5

(1.55 )

Trailer Loaded Pockets Leader

2/14.000

B

2402-00005

Carrier Loading Specification-MX6

7/1/09D. Seibel

REVISONS

REV DESCRIPTION BY DATE APP'D

A Released J.L. 7/1/09

B ADDED CATHODE AND ANODE NOTES DC 2/26/12

160mm (min) of

empty pockets

sealed with tape

(20 pockets min.)

400mm (min) of

empty pockets with

at least 100mm

sealed by tape

(50 empty pockets min.)

(1,400 pcs /Reel

CATHODE SIDE

ANODE SIDE

Cathode Mark

document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty information,

please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specic product and/or vendor endorsement,

sponsorship or association. 12

XLamp®mX FamiLy LED SoLDEring & HanDLing

PACKAGING & LABELS

The diagrams below show the packaging and labels Cree uses to ship XLamp MX LEDs. XLamp MX LEDs are shipped in tape loaded on

a reel. Each box contains only one reel in a moisture barrier bag.

Patent Label

(on bottom of box)

Label with Cree Bin Code,

Quantity, Reel ID

Label with Cree Bin

Code, Quantity, Reel ID

Label with Cree Order Code,

Quantity, Reel ID, PO #

Label with Cree Order Code,

Quantity, Reel ID, PO #

Label with Cree Bin Code,

Quantity, Reel ID

Unpackaged Reel

Packaged Reel

Boxed Reel

CREE Bin Code

& Barcode Label

Vacuum-Sealed

Moisture Barrier Bag

Label with Customer

P/N, Qty, Lot #, PO #

Label with Cree Bin

Code, Qty, Lot #

Label with Cree Bin

Code, Qty, Lot #

Vacuum-Sealed

Moisture Barrier Bag

Patent Label

Label with Customer Order

Code, Qty, Reel ID, PO #

Humidity Indicator Card

(inside bag)

Dessicant

(inside bag)

Cree XLamp MX Series User manual

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