Data Modul eDM-COMB-CR6 User manual

www.data-modul.com
USER MANUAL
eDM-COMB-CR6

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DATA MODUL AG | www.data-modul.com
Revision History
Revision
Revision History
Date
00
First release
10.10.2019
Reference to this Document
The purpose of all the figures and illustrations in this document is merely to provide a better explanation and can differ to the
actual appearance of the board. They are to be understood as schematic representations.
© 2019 DATA MODUL AG. All rights reserved.
Trademarks:
Microsoft and Windows are registered trademarks of Microsoft Corporation.
HDMI, the HDMI logo and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC.
Other trademarks are the property of their respective owners.
Technical and optical changes as well as misprints reserved.

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Contents
Preface .....................................................................................................................................................................................3
Using this Docum ent.............................................................................................................................................................3
Purpose ofthis Docum ent......................................................................................................................................................3
DangerSym bols & Levels ......................................................................................................................................................3
DangerSym bols.................................................................................................................................................................3
DangerLevels....................................................................................................................................................................3
GeneralSym bols................................................................................................................................................................3
TechnicalSupport.................................................................................................................................................................4
ListofAbbreviations..............................................................................................................................................................4
TechnicalData ..........................................................................................................................................................................5
Supported O perating System s ...............................................................................................................................................5
EFI/ BIO S..............................................................................................................................................................................5
API........................................................................................................................................................................................5
Tools.....................................................................................................................................................................................5
Standards & Certifications.....................................................................................................................................................5
Environm entalism ..............................................................................................................................................................5
EM C Standards..................................................................................................................................................................5
ElectricalSafety.................................................................................................................................................................5
Shock & Vibration..............................................................................................................................................................5
Block Diagram .......................................................................................................................................................................6
O rdering Inform ation .............................................................................................................................................................7
Hardw are Features.................................................................................................................................................................7
Platform ............................................................................................................................................................................7
CPU ...................................................................................................................................................................................7
M em ory.............................................................................................................................................................................7
Chipset..............................................................................................................................................................................7
Graphic & M edia................................................................................................................................................................7
IO ......................................................................................................................................................................................8
LAN ...................................................................................................................................................................................8
AdditionalInterfaces & Functions...........................................................................................................................................8
LVDS .................................................................................................................................................................................8
CRF M odule W iFi/BT/W iGig ................................................................................................................................................8
TPM ...................................................................................................................................................................................8
Hardw are M onitor..............................................................................................................................................................8
Em bedded Controller.........................................................................................................................................................9
Data M odulBoard Controller..............................................................................................................................................9

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O nM odule M em ory ..........................................................................................................................................................10
Environm entalConditions................................................................................................................................................10
Pow erSupply ......................................................................................................................................................................10
InputVoltage Requirem ents.............................................................................................................................................10
Pow erFeatures ................................................................................................................................................................10
Interfaces / Connectors .......................................................................................................................................................10
CO M Express connector,type 6 pin-out.............................................................................................................................10
O nboard Fan....................................................................................................................................................................10
CPLD JTAG & debug connector..........................................................................................................................................11
BIO S Setup .............................................................................................................................................................................12
Term s & Abbreviations.........................................................................................................................................................12
BIO S Update D escription .....................................................................................................................................................13
BIO S Setup Description .......................................................................................................................................................13
M ain................................................................................................................................................................................14
Advanced ........................................................................................................................................................................14
CPU Configuration............................................................................................................................................................14
Pow er& Perform ance.......................................................................................................................................................15
Trusted Com puting ..........................................................................................................................................................16
SerialPortConsole Redirection ........................................................................................................................................16
Connectivity Configuration ...............................................................................................................................................18
Therm alConfiguration......................................................................................................................................................19
SIO Configuration ............................................................................................................................................................19
USB Configuration ...........................................................................................................................................................21
Netw ork Stack Configuration ............................................................................................................................................21
CSM Configuration ...........................................................................................................................................................22
M odule Peripherals Configuration ....................................................................................................................................22
M odule HW M onitor.........................................................................................................................................................25
M odule W atchdog Configuration ......................................................................................................................................25
M odule Display Configuration ..........................................................................................................................................27
Chipset............................................................................................................................................................................28
Security...........................................................................................................................................................................32
Boot................................................................................................................................................................................34
Save & Exit......................................................................................................................................................................36

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Preface
Using this Document
In this Docum ent,the eDM -CO M B-CR6 is also referred to as „board“.
Please read this D ocum entbefore using this board.
This Docum entcontains inform ation aboutthe hardw are,softw are and configuration ofthe board.
Aw areness of the safety instructions and instructions for use in this Docum entw illensure the safe and correctuse ofthe
board.
In addition to the inform ation given here,you should com ply w ith the localregulations forthe prevention ofaccidents and
generally applicable safety regulations.
Purpose of this Document
The purpose of this docum ent is the definition of the technical param eters, the electrical connections and the m echanical
dim ensions ofthe eD M -CO M B-CR6.
Danger Symbols & Levels
In this Docum ent, sym bols are used to highlight im portant safety instructions and any advice relating to the board. The
instructions should be follow ed very carefully to avoid any risk ofaccident,personalinjury orproperty dam age.
Danger Symbols
Dangerous Voltage,dangerofelectric shock
Hazard point
All DATA M O DU L AG products are electrostatic sensitive
devices and are packaged accordingly. Do not open or
handle a DATA M O D U L AG product except at an
electrostatic-free w orkstation.Additionally,do notship or
store DATA M O DUL AG products nearstrong electrostatic,
electrom agnetic,m agnetic,orradioactive fields unless the
device is contained w ithin its original m anufacturer's
packaging. Be aw are that failure to com ply w ith these
guidelines w illvoid the DATA M O DUL AG Lim ited W arranty.
Danger Levels
DAN GER Indicates a hazardous situation,w hich w illresultin death
orserious injury.
W ARN IN G Indicates a hazardous situation, w hich could result in
death orserious injury.
CAUTIO N Indicates a hazardous situation,w hich m ay resultin m inor
orm oderate injury.
N O TICE Indicates a property dam age.
General Symbols
Additionalsupportorusefulinform ation.
The crossed-out refuse bin indicates that the products
have to be properly recycled ordisposed ofin accordance
w ith nationallegislation in the respective EU countries.
If you w ish to dispose of used electrical and electronic
products outside the European Union,please contactyour
localauthority so as to com ply w ith the localregulations.

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Technical Support
DATA M O DUL's technicians and engineers are com m itted to provide the best possible technicalsupport for our custom ers to
enable an easy use and im plem entation ofourproducts.W e recom m end to visitourw ebsite atw w w .data-m odul.com firstforthe
latestdocum entation,utilities and drivers,w hich have been m ade available to assistyou.Ifyou need further assistance after
visiting ourw ebsite please contactourtechnicalsupportdepartm entby em ailatsupport@ data-m odul.com .
List of Abbreviations
Abbreviation D escription
CO M Com puterO n M odule
DDC Display Data Channel
EM I
EN
Electro M agnetic Interference
European Norm
FFC FlatFoilCable
HDM I High Definition M ultim edia Interface
I2C Inter-Integrated CircuitBus
LCD Liquid CrystalD isplay
LVDS
NA
Low Voltage DifferentialSignal
NotAvailable
NC N otConnected
PCB Printed CircuitBoard
PVM Pulse W idth M odulation
SB Standby
SSP Synchronous SerialProtocol
TBD To Be Defined
TCO N Tim ing Controller
TM D S
TTL
Transition M inim ized D ifferentialSignaling
TransistorTransistorLogic
UL Underw riterLab
USB U niversalSerialBus

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Technical Data
Supported Operating Systems
M icrosoft® W indow s® 10 (64 bit)
Linux
EFI / BIOS
UEFIbased Firm w are using AM IAptio V core
Darkboot/ Bootlogo support
Legacy Free O peration
Bootfrom externalSPIas defined by CO M Express specification
M em ory-initialization according to SPD ,X.M .P.profiles supported
LID and Sleep signals supported
ACPIW ake Events (W O L S3-S5,USB S3-S4,LID S3,Pw rBtn S3-S5)
AC Pow erLoss configurable by setup
Spread Spectrum configurable by setup,defaultO N
ACPI6.1
DATA M O D U L fam ily feature:Em bedded Controllerspecification
API
eAPIas defined by CO M Express
Data M odulspecific extension to eAPI
Tools
BIO S update tool
FPGA update tool
APItesttool
Standards & Certifications
Environmentalism
2011/65/EU (of8.June 2011 directive ofthe European parliam entand ofthe councilon the restriction ofthe use ofcertain
hazardous substances in electricaland electronic equipm ent(RoHS))
2006/1907/EU (of 18. Decem ber 2006 of the European parliam ent and of the council concerning the Registration,
Evaluation,Authorisation and Restriction ofChem icals (REACH))
2012/19/EC (of 04. July 2012 directive of the European parliam ent and of the council on w aste electricaland electronic
equipm ent(W EEE))
The board is designed and m anufactured to m eetISO 14001.
The packing com plies w ith directive 1994/62/EU.
EMC Standards
EM I/EM C:according to EN55022
Electrical Safety
Designed to m eetEN60950 and UL60950.
Shock & Vibration
Shock and Vibration according to IEC/EN60068-2-6 and IEC/EN 60068-2-27.

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Block Diagram

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Ordering Information
M odelN am e PartN o. Description
eDM -CO M B-CR6-E-2276M E 12040447 CO M Express Type 6 Basic w ith Intel® Xeon® ,CM 246 chipset,ECC
eDM -CO M B-CR6-i7-9850HE 12040448 CO M Express Type 6 Basic w ith Intel® Core® i7,Q M 370chipset
eDM -CO M B-CR6-i3-9100HL 12040449 CO M Express Type 6 Basic w ith Intel® Core® i5,Q M 370chipset
eDM -CO M B-CF6-CF 12029280 Active cooling solution,w ith fan
eDM -CO M B-CF6-CP 12029281 Passive cooling solution,w ithoutfan
eDM -CO M B-CF6-CH 12029282 Heatspreader,3 m m plate w ith 8 m m standoffs,flatsurface
Hardware Features
Platform
The 9th Generation Intel® Core™processor fam ily are a 64-bit, m ulti-core processor (up to 6 cores) built on 14-nanom eter
process technology (Coffee Lake Refresh-H ).
CPU
The eDM -CO M B-CR6 supports allavailable Coffee Lake Refresh CPUs in FCBG A1440 package,14nm ,up to 45W TDP.
Package:42 m m x 28 m m x 1.395 m m ,FCBG A1440 c-states
Supported Features:
C-States:CO -C10
Intel® Virtualization Technology (Intel® VT)
Intel® Stream ing SIM D Extensions 4.2 (Intel® SSE4.2)
Intel® Hyper-Threading Technology (Intel® H T Technology)
Intel® 64 Architecture
Execute Disable Bit
Intel® Turbo BoostTechnology 2.0
Intel® Advanced VectorExtensions 2 (Intel® AVX2)
PCLM U LQ DQ (Perform Carry-Less M ultiplication Q uad w ord)Instruction
Intel® TransactionalSynchronization Extensions (Intel® TSX-N I)
PAIR –Pow erAw are InterruptRouting
GM M Scoring Accelerator
Intel® ProcessorTrace
High D efinition Contend Protection (HDCP)2.2
Security Features:
Intel® Active M anagem entTechnology 12.0 (Intel® AM T 12.0)
Intel® Trusted Encryption Technology (Intel® TXT)
Intel® Advanced Encryption Standard N ew Instructions (Intel® AES-N I)
Intel® Security Key
SM EP –SupervisorM ode Execution Protection
Intel® BootGuard
Intel® Softw are Guard Extensions (Intel® SGX)
Intel® M em ory Protection Extensions (Intel® M PX)
Memory
Tw o SO -D IM M sockets
M em ory type:DDR4,ECC/N on-ECC (Variants w ith Intel® CM 246 chipsetsupportECC m em ory)
Speed:up to 2666 M T/s
Size:up to 32 GB (2 x 16 G B)
Chipset
M obile Intel® 300 Series ChipsetQ M 370,H M 370 and CM 246 PCH
Graphic & Media
GFX type: Intel® Gen 9.5 Graphics Processing U nit(GT2)

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DirectX 12,Direct3D 2015,O penGL 4.5,O penCL 2.1 APIs
Display Pipes (3 independent)
3 x DDIs (DigitalDisplay Interfaces):
DisplayPort1.2 w ith supportforM ulti-Stream Transport
HDM I1.4 (requires externallevelshifter)
DVIport(requires externallevelshifter)
HDM I2.0a (w ith converter)
eDP 1.4,Resolutions up to 4K (UHD@ 60Hz)
Video Decode:H.265/H EVC @ level5.1 (4k),H .264/AVC @ Level5.1(4k),VC-1,W M V9,JPEG,VP8/VP9,M PEG2
Video Encode:H .265/HEVC @ level5.1 (4k),H.264/AVC @ Level5.1(4k),W M V9,JPEG,VP8/VP9,M PEG 2
IO
4 x USB 3.0
8 x USB 2.0,1 x U SB O TG support
4 x SATA 3.0 (6Gb/s)w ith RAID support0/1/5/10
8 x PCIExpress® G en.3 lanes (x1/x2/x4 operation)
PEG G en 3 port(1 x16 link (default),2 x8 links or1 x8 + 2 x4 links)
SPIforonboard/externalBIO S flash
LPC bus / eSPI forEm bedded Controller/ TPM / externalSIO (m ultiplexed)
GPIO s,1M Hz SM B 2.0
IntelHD Audio
2 x UART
IEEE1588 support (Standard for a Precision Clock Synchronization Protocol for Netw orked M easurem ent and Control
System s)
LAN
Intel® GbE supportvia the onboard Intel® i219-LM GbE LAN controller(w ith AM T 11 support).
Additional Interfaces & Functions
LVDS
The eDM -CO M B-CR6 supports D ual channel LVDS 1/2x18/24bit up to 1920x1200 from an eD P2LVD S converter like NXP
PTN3460.O ptionally itbe possible to bypass LVDS converterto redirectthe eDP signals to the CO M Express connectorpins by 0R
resistors placed stubless on the PCB.
CRF Module WiFi/BT/WiGig
O ptionally the eDM -CO M B-CR6 supports a soldered CRF M odule (through CN Vi),support for IntelW ireless-AC (Gigabitw ireless
speed),e.g.:IntelW ireless-AC 9560.
TPM
O ptionally the eDM -CO M B-CR6 supports Trusted Platform M odule (Version 1.2 and 2.0).
Hardware Monitor
Hardw are M onitoring supports on the eDM -CO M B-CR6 design using the Nuvoton N CT7802Y.
Hardw are M onitorproviding follow ing inform ation:
CPU DIE tem perature m easured through PECIinterface
PCB tem perature m easured inside H W M onitor(place H W M atcoolspotofPCB)
LevelofVCC m odule inputvoltage
Levelof5V_SBY inputvoltage
LevelofVCCRTC voltage follow erO pAm p circuit.
The H ardw are M onitorprovides controlsignals to operate one a connected atthe CO M Express baseboard fan connectorand on
board connector.

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Embedded Controller
An Em bedded Controller providing the feature set defined in Data M odulEm bedded Controller specification Rev 1.0 using an
Altera M AX-10 FPGA supports by the eDM -CO M B-CR6 design.
Data Modul Board Controller
The DATA M O D U L Em bedded Controller(DM EC)im plem ents a setoftypicalem bedded peripheralfeatures in the Com puter-O n-
M odule (CoM ) including devices like G PIO , I2C, W atchdog tim ers, UARTs etc.Depending on the D ATA M O DUL board type,the
DM EC device is connected to the chipseteithervia LPC oreSPI.
The DM EC Controlleron the eD M -CO M B-CR6 m odule provides the follow ing functionality:
Connected to LPC on Intel300 Series PCH-H
Tw o U ARTs
Speed up to 115200Bd
I/O Address/IRQ configurable via BIO S setup.
UART1 optionally supports RTS/CTS/DSR/D TR signals through G PIO s,configurable via BIO S setup.
I2C controller
Controls up to three I2C busses via m ultiplexer.
Supports Autom atic Bus Clearto preventbus hangs.
Supports M ultiple m asters on the bus.This feature is only supported ifAutom atic Bus Clearis off.
Supports FastM ode+.
I2C speed configurable via BIO S setup.
Up to 400kH z in norm alm ode,up to 800kHz in FastM ode+.
IRQ configurable via BIO S setup.
W atchdog
Supports up to three stages.
Tim eoutperstage:1m s-65sec,w ith a granularity of1m s or128m s -~140m in,w ith a granularity of128m s.
Supports Standard and W indow M ode.W indow m ode is an advanced w atchdog feature forsafety criticalapplications.It
only allow s triggering the W atchdog w ithin a specific tim e w indow .This covers the case w here softw are hangs in a loop
w ithin the w atchdog triggerroutine.
Stage events include N M I,Resetand IRQ (ifenabled in BIO S setup).
Supports Auto Reload (allow s to use the W atchdog as an eventticker).
Supports registerlock to preventthe W atchdog from being disabled orits configuration being changed in safety critical
applications.
Fully configurable via BIO S setup.
CO M Express GPIO s:
Supports eightbi-directionalGPIO s.
Initialstate (In/O ut,H igh/Low ,setduring early PO ST)can be configured via BIO S setup.
Capable to generate IRQ events (ifIRQ enabled in BIO S setup).Fordetails on how to enable IRQ generation please refer
to the DM EC FunctionalSpecification.
AdditionalGPIO function configurable via BIO S setup:
oGPIO 2:GPIO orUART1 DSR
oGPIO 4:G PIO orU ART1 CTS orPW M 0
oGPIO 5:G PIO orW D Kick InputorUART1 RTS orPW M 1
oGPIO 6:G PIO orI2C2 CL orUART1 D TR
oGPIO 7:GPIO orI2C2 SDA.
PW M controller
Supports either tw o independent 8Bit channels or one 16Bit channel for higher resolution for exam ple in DAC
applications.
Leftorcenteraligned PW M output
Program m able period and double buffered duty cycle registers
Configurable outputpolarity
W ide range PW M period configurable perchannelvia program m able pre-scaler”.

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M ostcom m on features are accessible through eApifunction calls.eApisupports and drivers forthe DM EC device are available for
W indow s and Linux.Fordetails on the D M EC registerlayoutplease referto the DM EC FunctionalSpecification w hich is available
from D ATA M O DU L on request.
OnModule Memory
An 16 M Byte SPIin SO -8 package flash to store EFIand setup configuration is used on the eDM -CO M B-CR6 design.
A 32kbitI2C EEPRO M configured to address AE/AF is connected to the fastI2C bus ofthe Em bedded Controllerand also to the
I2C interface ofthe CO M Express connector.
Environmental Conditions
The eDM -CO M B-CR6 is able to be operated and stored underthe follow ing environm entalconditions:
Tem perature (operating): 0°C …+60°C (com m ercialgrade)
Extended tem perature ranges on request.
Tem perature (storage): -40°C …+85°C
Relative hum idity: <80%
Tolerable airpressure: >708 hPa (approx.altitude 2000m )
Power Supply
Input Voltage Requirements
VCC: 12.0 V ± 5%
5V_SBY: 5.0 V ± 5%
M odes: ATX M ode orVCC only w ithout5V_SBY
Voltage Ripple: m ax.100m V peak to peak 0 …20 M Hz
Rise Tim e: 0.1 …20m s from inputvoltage <10% nom inalVCC
M ax.Inrush Current 5V_SBY: 2A
VCC: 10A
Power Features
ResetButton Behavior
M odule resets im m ediately w hen resetbutton is pressed in S0 state.
M odule stays in resetcondition w hen resetbutton is pressed and hold in any system state <S0.
Pow erButton Behavior
A push ofthe pow erbutton pow erup the system to S0 ifitis in S5/S3 state orshutdow n to S5 ifitis in S0 state.O perating
system handle the pow erbutton eventdepending on the driversettings.
Push and hold the pow erbutton >4s (pow erbutton override)shutdow n the system into S5 independentofthe othersettings.
Interfaces / Connectors
COM Express connector, type 6 pin-out
According CO M Express specification Rev.3.0
Onboard Fan
Supported by design butnotassem bled in series production.
Connectortype:JST partnum berSM 04B-SURS-TF.
M ating cable headertype:JST partnum ber04SU R-32S.
Pinout
Pin assignm ent Pin D escription
1 GND
2 VCC
3 SENSE
4 VCC

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CPLD JTAG & debug connector
Connectortype:JST partnum berSM 10B-SURS-TF.
M ating cable headertype:JST partnum ber10SU R-32S.
Pinout
Pin assignm ent Pin D escription
1 V_3V3_S5
2 JTAG _TCK
3 JTAG _TD I
4 JTAG _TM S
5 JTAG _TD O
6 Debug RS232 RX
7 Debug RS232 TX
8 JTAG EN / GPIO 1
9 Debug G PIO 2
10 GM D

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BIOS Setup
The purpose of this chapter is to describe the settings in the UEFI BIO S Setup program on this Com puter on M odule and to
explain the procedure forupdating the UEFIBIO S.
Terms & Abbreviations
Term /Abbreviation D escription
ACPI Advanced Configuration and Pow erInterface
AES Advanced Encryption Standard
AFU
ASPM
AM IFirm w are Update
Active State Pow erM anagem ent
BBS BIO S BootSpecification
CO M Com puterO n M odule
CRID Com patible Revision ID
CSM Com patibility SupportM odule
CTD P Configurable TDP
DM I DirectM em ory Interface
DTS DigitalTherm alSensor
DVM T Dynam ic Video M em ory Technology
ECP Enhanced Capabilities Port
EFP ExternalFlatPanel
EHCI Enhanced H ostControllerInterface
EIS Enhanced IntelSpeedstep
EPP
GPIO
Enhanced ParallelPort
GeneralPurpose Input/O utput
IGFX IntelGraphics
IPv4/IPv6 InternetProtocolVersion
KEK Key Exchange Key
LBAR LinearBase Address Register
LFP LocalFlatPanel
M RC M em ory Reference Code
NM I Non-M askable Interrupt
NVRAM Non-Volatile Random -Access M em ory
O PRO M O ption RO M
O S O perating System
PK Platform Key
PM E Pow erM anagem entEvent
PVM Pulse W idth M odulation
PXE PrebootExecution Environm ent
RAID RedundantArray ofIndependentDisk
SCI System ControlInterrupt
SM I System M anagem entInterrupt
SO -DIM M Sm allO utline D ualInline M em ory M odule
SPP Standard ParallelPort
TD P Therm alDesign Pow er
TO LUD Top O fLow erUsable M em ory
TXT Trusted Execution Technology
VT-d Virtualization Technology forDirected I/O
W DT W atchdog Tim eout
XHCI eXtensible H ostControllerInterface

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BIOS Update Description
This CO M is provided w ith an Am erican M egatrends,Inc.Aptio V UEFIFirm w are.For updating the firm w are,please use Intel®
Flash Program m ing Tool(FPT)utility suite.This is a scriptable com m and line tool,utilized forfactory orfield BIO S updates.Itis
available forM icrosoftW indow s® ,Linux,and the UEFIshell.
Please contactyourDATA M O D UL supportforaccessing the tools.
The com plete UEFIFirm w are im age forthis CO M consists ofseveralregions:
DescriptorRegion:Describes the size and location ofthe firm w are regions and contains severalconfiguration settings.
BIO S Region:Responsible form ain hardw are initialization and feature interfaces during runtim e.
M E Region:Intel® M anagem entEngine firm w are binary.
GBE Region:Contains G igabit-Ethernetconfiguration data.
Forupdating the com plete 16M B firm w are im age w ith the U EFIversion ofFPT use follow ing com m and:
fpt.efi–fnew biosfile.bin
Forcom plete com m and reference,please check -? com m and forthe help screen.
BIOS Setup Description
The UEFISetup program allow s users to m odify the basic system configuration and save these settings to N VRAM .
To enterUEFISetup,press D EL orESC during PO ST.
Figure PO ST Screen
To select a Boot Popup M enu, press F7 during PO ST.At End of Post a selection m enu w illshow allavailable boot devices to
choose from .UEFISetup program can be entered from BootPopup M enu as w ell.
Figure BootPopup M enu
Follow ing is a description ofthe UEFISetup pages.

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Main
Param eter Value Com m ent
System Date Day M M /DD/YYYY Setthe Date.
System Tim e HH:M M :SS Setthe Tim e.
M odule Inform ation Subm enu Displays M odule Inform ation.
Platform Inform ation Subm enu Displays Platform Inform ation.
Advanced
Param eter Value Com m ent
CPU Configuration Subm enu CPU Configuration Param eters
Pow er& Perform ance Subm enu Pow er& Perform ance Options
Trusted Com puting Subm enu Trusted Com puting (TPM )Settings
SerialPortConsole Redirection Subm enu SerialPortConsole Redirection
Connectivity Configuration Subm enu Connectivity Configuration Param eters
Therm alConfiguration Subm enu Therm alConfiguration Param eters
SIO Configuration Subm enu SuperIO Settings
USB Configuration Subm enu USB Configuration Param eters
Netw ork Stack Configuration Subm enu N etw ork Stack Settings
CSM Configuration Subm enu Com patibility SupportM odule Settings
NVM e Configuration Subm enu N VM e D evice Options Settings
M odule Peripherals Configuration Subm enu Configure M odule Peripherals
M odule H/W M onitor Subm enu M onitorhardw are status
M odule W atchdog Configuration Subm enu Configure W atchdog
M odule D isplay Configuration Subm enu Configure M odule D isplay options
CPU Configuration
Param eter Value Com m ent
Hardw are Prefetcher Disabled
Enabled
Enable/D isable the M id LevelCache (L2)stream er
prefetcher.
AdjacentCache Line Prefetch Disabled
Enabled
Enable/D isable the M id LevelCache (L2)prefetching
ofadjacentcache lines.
IntelVirtualization Technology D isabled
Enabled
W hen enabled,a VM M can utilize the additional
hardw are capabilities provided by Vanderpool
Technology.
Hyper-Threading Disabled
Enabled Enable/D isable H yper-Threading technology.
AES Disabled
Enabled
Enable/D isable CPU Advanced Encryption Standard
instructions.

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Power & Performance
Param eter Value Com m ent
CPU –Pow erM anagem entControl Subm enu CPU –Pow erM anagem entControlO ptions
GT –Pow erM anagem entControl Subm enu G T –Pow erM anagem entControlO ptions
CPU –Power Management Control
Param eter Value Com m ent
Intel(R)SpeedStep(tm ) Disabled
Enabled Enable/D isable IntelSpeedStep Technology.
Turbo M ode Disabled
Enabled Enable/D isable IntelTurbo BoostTechnology.
Config TDP Configurations Subm enu Config TDP Configurations
C states Disabled
Enabled
Enable/D isable CPU Pow erM anagem ent.
Allow s CPU to go to C states w hen it’s not100%
utilized.
Package C State Lim it
Auto
Cpu D efault
C10
C9
C8
C7S
C7
C6
C3
C2
C0/C1
M axim um Package C State Lim itSetting.
Cpu D efault:Leaves to Factory defaultvalue.
Auto:Initializes to deepestavailable Package C
State Lim it.
Config TDP Configuration
Param eter Value Com m ent
Configurable TDP BootM ode
N om inal
Dow n
Up
Deactivated
Configurable TDP M ode as
Nom inal/U p/Dow n/D eactivate TDP selection.
Deactivate option w illsetM SR to N om inaland
M M IO to Zero.
Configurable TDP Lock Enabled
D isabled
Configurable TDP M ode Lock sets the Lock bits
on TURBO _ACTIVATIO N _RATIO and
CO N FIG _TD P_CO NTRO L.
Note:W hen CTD P Lock is enabled Custom
ConfigTDP Countw illbe forced to 1 and Custom
ConfigTDP BootIndex w illbe forced to 0.
ACPICTDP BIO S Enabled
D isabled
Enable/D isable ACPIConfigurable TDP support
(TableId CtdpB).
GT –Power Management Control
Param eter Value Com m ent
RC6 (RenderStandby) Enabled
Disabled Enable/D isable renderstandby support.
Disable Turbo GT frequency Enabled
D isabled
Enable:Disable Turbo GT frequency
Disabled:GT frequency is notlim ited.

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Trusted Computing
Param eter Value Com m ent
Security Device Support Disabled
Enabled
Enable/D isable BIO S supportforsecurity device.If
disabled,O S w illnotshow Security Device.TCG EFI
protocoland IN T1A interface w illnotbe available.
SH A-1 PCR Bank Disabled
Enabled Enable orDisable SHA-1 PCR Bank.
SH A256 PCR Bank Disabled
Enabled Enable orDisable SHA256 PCR Bank.
Pending operation N one
TPM Clear
Schedule an O peration forthe Security Device.N O TE:
YourCom puterw illrebootduring restartin orderto
change State ofSecurity Device.
Platform H ierarchy Disabled
Enabled Enable orDisable Platform H ierarchy
Storage Hierarchy Disabled
Enabled Enable orDisable Storage Hierarchy
Endorsem entHierarchy Disabled
Enabled Enable orDisable Endorsem entHierarchy
TPM 2.0 UEFISpec Version TCG_1_2
TCG _2
Selectthe TCG2 Spec Version Support.
TCG _1_2:the Com patible m ode forW in8/W in10.
TCG _2:Supportnew TCG2 protocoland eventform at
forW in10 orlater.
Serial Port Console Redirection
Param eter Value Com m ent
Console Redirection D isabled
Enabled Enables/Disables Console Redirection.
Console Redirection Settings Subm enu
The settings specify how the host com puter and the
rem ote com puter (w hich the user is using) w ill
exchange data. Both com puters should have the
sam e orcom patible settings.
Legacy Console Redirection Settings Subm enu Configure PortforLegacy Console Redirection.

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Console Redirection Settings
Param eter Value Com m ent
Term inalType
VT100
VT100+
VT-UTF8
AN SI
Em ulation:
AN SI:Extended ASCIIcharset.VT100:ASCIIcharset.
VT100+:Extends VT100 to supportcolor,function
keys,etc.
VT-UTF8:Uses U TF8 encoding to m ap Unicode chars
onto 1 orm ore bytes.
Bits perseconds
9600
19200
38400
57600
115200
Selects serial port transm ission speed. The speed
m ust be m atched on the other side. Long or noisy
lines m ay require low erspeeds.
Data Bits 7
8
Configures the num berofdata bis.
8 is recom m ended to easily use the link for file
transferand non-English texttransfer.
Parity
N one
Even
O dd
M ark
Space
A parity bitcan be sentw ith the data bits to detect
som e transm ission errors.
Even:parity bitis 0 ifthe num of1's in the data bits
is even.
O dd:parity bitis 0 ifnum of1's in the data bits is
odd.
M ark:parity bitis alw ays 1.
Space:Parity bitis alw ays 0.
M ark and Space Parity do notallow forerror
detection.They can be used as an additionaldata
bit.
Stop Bits 1
2
Stop bits indicate the end ofa serialdata packet.(A
startbitindicates the beginning).The standard
setting is 1 stop bit.Com m unication w ith slow
devices m ay require m ore than 1 stop bit.
Flow Control N one
Hardw are RTS/CTS
Flow controlcan preventdata loss from buffer
overflow .W hen sending data,ifthe receiving buffers
are full,a 'stop'signalcan be sentto stop the data
flow .O nce the buffers are em pty,a 'start'signalcan
be sentto re-startthe flow .Hardw are flow control
uses tw o w ires to send start/stop signals.
VT-UTF8 Com bo Key Support Disabled
Enabled
Enable VT-UTF8 Com bination Key Supportfor
AN SI/VT100 term inals.
RecorderM ode D isabled
Enabled
W ith this m ode enabled,only textw illbe sent.This is
to capture Term inaldata.
Resolution 100x31 Disabled
Enabled Enables/Disables extended term inalresolution.
Putty KeyPad
VT100
LINUX
XTERM R6
SCO
ESCN
VT400
SelectFunctionKey and KeyPad on Putty.

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Legacy Console Redirection Settings
Param eter Value Com m ent
Redirection CO M Port
CO M 0
CO M 1
CO M 2
CO M 3
Selecta CO M Portto use forLegacy O S and Legacy
O PRO M Console Redirection.
Resolution 80x24
80x25
O n Legacy O S,the N um berofRow s and Colum ns
supported by redirection.
Redirection AfterPO ST Enabled
Disabled
Enabled:Console Redirection is available forLegacy
O S.
Disabled:Legacy console redirection is disabled
before booting to Legacy O S.
Serial Port for Out-of-Band Management/Windows Emergency Management Services (EMS)
Param eter Value Com m ent
O ut-of-Band M gm tPort
CO M 0
CO M 1
CO M 2
CO M 3
Select a CO M Port to use for M icrosoft W indow s Em ergency
M anagem entServices (EM S).
EM S allow s for rem ote m anagem ent of a W indow s Server O S
through a serialport.
Term inalType
VT100
VT100+
VT-U TF8
AN SI
VT-UTF8 is the preferred term inal type for out-of-band
m anagem ent.The nextbestchoice is VT100+ and then VT100.
See above,in Console Redirection Settings page,form ore H elp
w ith Term inalType/Em ulation.
Bits perseconds
9600
19200
57600
115200
Selects serial port transm ission speed. The speed m ust be
m atched on the other side. Long or noisy lines m ay require
low erspeeds.
Flow Control
N one
Hardw are RTS/CTS
Softw are Xon/Xoff
Flow controlcan preventdata loss from bufferoverflow .W hen
sending data, if the receiving buffers are full, a 'stop' signal
can be sentto stop the data flow .O nce the buffers are em pty,
a 'start'signalcan be sent to re-start the flow .Hardw are flow
controluses tw o w ires to send start/stop signals.
Connectivity Configuration
Param eter Value Com m ent
CN ViM odule Disable
Enable Enable/Disable integrated CN Vim odule.
Advanced settings D isable
Enable Configure ACPIobjects forw ireless devices.