Davicom DM9163 User manual

DM9163
Layout Guide
Version: DM9163-LG-V10 1
May 5, 2014
DM9163
Layout Guide
Version: 1.0
Technical Reference Manual
Davicom Semiconductor, Inc
May 5, 2014

DM9163
Layout Guide
2 Version: DM9163-LG-V10
May 5, 2014
1. Placement, Signal and Trace Routing
•Place the 10/100M magnetic as close as possible to the DM9163 (no more than 20mm) and to the RJ-45
connector.
•Place the termination resistors 50Ωas close as possible to the 10/100M magnetic and the DM9163 RX±
pins and TX±pins. The 50Ωresistors and grounding capacitors of TX±and RX±should be placed near
DM9163 (no more than 10mm).
•The 25MHz crystal should not be placed near important signal traces, such as RX±receive pair and TX±
transmit pair, band gap resistor, magnetic and board edge.
•Traces routed from the DM9163 RX±pair to the 10/100M magnetic and the RJ45 connector should run
symmetrically, directly, identically, and closely (no more than 2mm). The same rule is applied to traces routed
from the DM9163 TX±pair.
Magnetic
RJ-45
RX+
RX-
TX+
TX-
d1
d2
d1
d1 < 2mm
d2 > 3mm; having AGND as a shield is better
d3 > 5mm; having AGND as a shield is better
d1
d1
d2
Do not turn at right angle (90°),
turn 45°instead Crystal
d3
better
Magnetic
RJ-45
RX+
RX-
TX+
TX-
d1
d2
It’s worse to turn at right angle (90°)
Crystal
d3
Worse
d1
Worse

DM9163
Layout Guide
Version: DM9163-LG-V10 3
May 5, 2014
•It is recommended that RX±receive and TX±transmit traces turn at 45°angle. Do not turn at right angle.
Better Worse
•Avoid using vias in routing the traces of RX±pair and TX±pair.
•The RX±pair, TX±pair, clock, should be routed to have characteristic impedance of 50 Ohm.
•Do not place the DM9163 RX±receive pair across the TX±transmit pair. Keep the receive pair away from
the transmit pair (no less than 3mm). It’s better to place ground plane between these two pairs of traces.
•Do not route any digital signal between the DM9163 RX±and TX±pairs to the RJ-45. Keep the two pairs
away from all the other active signals and the chassis ground.
•There should be no power or ground plane in the area under the network side of the 10/100M magnetic and
the area under the RJ-45 connector.
•Any terminated pins of the RJ-45 connector (pins 4,5,7 and 8, see Figure 1-1, 1-2) and the magnetic (see
Figure 1-1, 1-2) should be tied as closely as possible to the chassis ground through a resistor divider network
75Ωresistors (no more than 2mm to the magnetic) and a 0.1μF/2KV bypass capacitor.
•The Band Gap resistor should be placed as close as possible to pins 47 and 48 (BGRES, BGRESG) (no
more than 3mm). Avoid running any high-speed signal near the Band Gap resistor placement (no less than
3mm from 25MHz XT1 and XT2).

DM9163
Layout Guide
4 Version: DM9163-LG-V10
May 5, 2014
10Base-T/100Base-TX Application
Figure 1-1 and 1-2 illustrate the two types of the specific transformer interconnects and how to connect with
Davicom DM9163. These two transformers are not pin-to-pin compatible and must be considered when using the
DM9163 in auto-MDIX mode.
Figure 1-1
Figure 1-2
DM9163
DM9163
3
.
3
V
3.3V

DM9163
Layout Guide
Version: DM9163-LG-V10 5
May 5, 2014
2. Power Supply Decoupling Capacitors
•Place all the decoupling capacitors for all power supply pins as close as possible to the power pads of the
DM9163 (no more than 2.5mm from the above mentioned pins). The recommended decoupling capacitor is
0.1μF or 0.01μF.
•The PCB layout and power supply decoupling should provide sufficient decoupling to achieve the following
when measured at the device:
(1) All DVDDs and AVDDs should be within 50mV peak to peak of each other,
(2) All DGNDs and AGNDs should be within 50mV peak to peak of each other.
(3) The resultant AC noise voltage measured across each DVDD/DGND set and AVDD/AGND set should be
less than 100mV peak to peak.
•The 0.1-0.01μF decoupling capacitor should be connected between each DVDD/DGND set and
AVDD/AGND set and be placed as close as possible to the power pins of DM9163. The conservative
approach is to use two decoupling capacitors on each DVDD/DGND set and AVDD/AGND set. One 0.1μF is
for low frequency noise, and the other 0.01μF is for high frequency noise on the power supply.
•The 3.3V connection to the transmit center tap of the magnetic has to be well decoupled to minimize
common mode noise injection from the power supply into the twisted pair cable. It is recommended that a
0.01μF decoupling capacitor should be placed between the center tap 3.3V to AGND ground plane. This
decoupling capacitor should be placed as close as possible to the center tap of the magnetic.10 uF or 47 uF
Capacitor should be connected between each 3.3V and AGND.
Figure 2
DM9163

DM9163
Layout Guide
6 Version: DM9163-LG-V10
May 5, 2014
3. Ground Plane Layout
•Place a single ground plane approach to minimize EMI. Ground plane partitioning can cause increased EMI
emissions that could make the network interface card (NIC) not comply with specific regulations.
•All AGND pins may not directly short each other (see Figure 3-3). It must be directly connected to analog
ground domain (see Figure 3-2).
Figure 3-1
Analog ground domain
Digital ground domain
AGND
AGND
AGND
Good
Analog ground domain
Digital ground domain
AGND
AGND
AGND
Worse! AGND direct short
Figure3-2 Figure3-3
DM9163

DM9163
Layout Guide
Version: DM9163-LG-V10 7
May 5, 2014
4. Power Plane Partitioning
•The power planes should be approximately illustrated in Figure 4. The ferrite bead used should have an
impedance 100Ωat 100MHz and direct current rating of 400mA and above. A suitable bead is the
Panasonic surface mound bead, part number EXCCL4532U or an equivalent. A 10μF, 0.1μF and 0.01μF
electrolytic bypass capacitors should be connected between VDD and GND at the device side of each of the
ferrite bead.
•Should separate analog power planes from noisy logic power planes.
Figure 4
DM9163

DM9163
Layout Guide
8 Version: DM9163-LG-V10
May 5, 2014
5. Magnetics Selection Guide
•Refer to the following tables 5-1 and 5-2 for 10/100M magnetic sources and specification requirements. The
magnetics which meet these requirements are available from a variety of magnetic manufacturers.
Designers should test and qualify all magnetic specifications before using them in an application. The
magnetics listed in the following table are electrical equivalents, but may not be pin-to-pin equivalents.
Manufacturer Part Number
MAGCOM` HS9016, HS9024
Delta LFE8563-DC, LFE8563T-DC
Table 5-1: 10/100M Magnetics Sources
Parameter Values Units Test Condition
Tx / RX turns ratio 1:1 CT / 1:1 - -
Inductance 350
μH (Min) -
Insertion loss 1.1 dB ( Max ) 1 – 100 MHz
-18 dB ( Min ) 1 –30 MHz
-14 dB ( Min ) 30 – 60 MHz
Return loss
-12 dB ( Min ) 60 – 80 MHz
-40 dB ( Min ) 1 – 60 MHzDifferential to common
mode rejection -30 dB ( Min ) 60 – 100 MHz
Transformer isolation 1500 V -
Table 5-2: Magnetic Specification Requirements

DM9163
Layout Guide
Version: DM9163-LG-V10 9
May 5, 2014
6. Crystal Selection Guide
•A crystal can be used to generate the 25MHz reference clock instead of an oscillator. The crystal must be a
fundamental type, series-resonant, connect to XT1 and XT2, and shunt each crystal lead to ground with a
22pF capacitor as shown in Figure 6.
PARAMETER SPEC
Type Fundamental, series-resonant
Frequency 25 MHz +/- 0.01%
Equivalent Series Resistance 25 ohms max
Load Capacitance 22 pF typ.
Case Capacitance 7 pF max.
Power Dissipation 1mW max.
Table 6-1: Crystal Specifications
42 43
XT1XT2
A
GND
A
GND
C18
22pf
Y1 25M
C19
22pf
Figure 6
Crystal Circuit Diagram

DM9163
Layout Guide
10 Version: DM9163-LG-V10
May 5, 2014
7. MII Signals to Mac Controller
•The length of the trace routing for the Media Independent Interface (MII) signals should be as short and direct
as possible between the DM9163 and MAC controller (Maximum length to be shorter than 20cm). These MII
signals are as follows,
CRS, COL, TXD3, TXD2, TXD1, TXD0, TXEN, TXCLK, TXER
RXER, RXCLK, RXDV, RXD0, RXD1, RXD2, RXD3, MDC, MDIO
•TXD [0-3] and TXCLK length mismatch does not exceed 2cm.
•RXD [0-3] and RXCLK length mismatch does not exceed 2cm.
•All signal trace should be considered to have characteristic impedance of 50 Ohm.