Dell EMC PowerEdge C6420 User manual

Dell EMC PowerEdge C6420
The PowerEdge C6420 optimizes compute, processors, memory
and large volume local storage for an IT services platform that can
be eciently and predictably scaled, while drastically reducing
complexity. With up to 4 independent hot-swappable 2-socket
servers in a very dense 2U chassis, servers can be easily
repurposed as workloads change. Numerous options for compute,
storage, connectivity and chassis oerings provide exibility to
congure servers for your specic workloads.
Technical Guide

Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the
problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2018 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other
trademarks may be trademarks of their respective owners.
2019 - 01
Rev. A00

Contents
1 System overview............................................................................................................. 5
Introduction........................................................................................................................................................................ 5
2 System features.............................................................................................................. 6
Product comparison........................................................................................................................................................... 6
Specications..................................................................................................................................................................... 7
3 Chassis views and features............................................................................................. 9
Chassis views..................................................................................................................................................................... 9
Front panel view and features...................................................................................................................................... 9
System sled enumeration..............................................................................................................................................9
Back view................................................................................................................................................................... 10
Internal view of the system................................................................................................................................................ 11
Locating the information tag of your system..................................................................................................................... 13
4 Processor...................................................................................................................... 14
Processor Features........................................................................................................................................................... 14
Supported processors.......................................................................................................................................................15
Chipset..............................................................................................................................................................................17
5 Memory......................................................................................................................... 18
Supported memory........................................................................................................................................................... 18
Memory speed.................................................................................................................................................................. 18
6 Storage..........................................................................................................................19
Supported drives...............................................................................................................................................................19
Storage controller specications.......................................................................................................................................22
Optical Drives................................................................................................................................................................... 22
Tape drive.........................................................................................................................................................................23
Internal storage.................................................................................................................................................................23
M.2 boot storage........................................................................................................................................................23
7 Networking and PCIe.................................................................................................... 24
PCIe slots......................................................................................................................................................................... 25
8 Direct contact liquid cooling (DCLC).............................................................................26
Liquid cooled sled............................................................................................................................................................. 27
9 Power, thermal and acoustics........................................................................................28
Power...............................................................................................................................................................................28
Acoustics......................................................................................................................................................................... 30
10 Supported operating systems...................................................................................... 32
3

11 Dell EMC OpenManage systems management..............................................................33
iDRAC with Lifecycle controller........................................................................................................................................ 33
iDRAC features and comparison................................................................................................................................. 34
Agent-free management.................................................................................................................................................. 38
Agent-based management............................................................................................................................................... 38
Dell EMC consoles............................................................................................................................................................38
Dell EMC OpenManage systems management tools, utilities and protocols..................................................................... 40
Integration with third-party consoles.................................................................................................................................41
OpenManage connections with third-party consoles....................................................................................................... 42
12 Appendix A. Additional specications...........................................................................43
Chassis dimensions...........................................................................................................................................................43
Chassis weight................................................................................................................................................................. 43
Video................................................................................................................................................................................44
USB..................................................................................................................................................................................45
Environmental specications............................................................................................................................................ 45
Acoustics................................................................................................................................................................... 45
Temperature specications.........................................................................................................................................45
13 Appendix B. Standards compliance.............................................................................. 46
14 Appendix C Additional resources.................................................................................. 47
15 Appendix D. Support and deployment services............................................................ 48
ProDeploy Enterprise Suite and Residency Services.........................................................................................................48
ProDeploy Plus........................................................................................................................................................... 48
ProDeploy...................................................................................................................................................................48
Basic Deployment.......................................................................................................................................................48
Residency Services.................................................................................................................................................... 49
Deployment services........................................................................................................................................................ 49
Remote Consulting Services.............................................................................................................................................49
Data Migration Service.....................................................................................................................................................49
ProSupport Enterprise Suite.............................................................................................................................................49
ProSupport Plus...............................................................................................................................................................50
ProSupport...................................................................................................................................................................... 50
ProSupport One for Data Center..................................................................................................................................... 50
ProSupport One for Data Center...................................................................................................................................... 51
Support Technologies........................................................................................................................................................51
SupportAssist.............................................................................................................................................................52
TechDirect..................................................................................................................................................................52
Additional professional services........................................................................................................................................ 52
Dell Education Services.................................................................................................................................................... 52
Dell EMC Global Infrastructure Consulting Services......................................................................................................... 53
Dell EMC Managed Services............................................................................................................................................ 53
4

1
System overview
Introduction
The PowerEdge C6420 optimizes compute, processors, memory and large volume local storage for an IT services platform that can
be eciently and predictably scaled, while drastically reducing complexity. With up to 4 independent hot-swappable 2-socket servers
in a very dense 2U chassis, servers can be easily repurposed as workloads change. Numerous options for compute, storage,
connectivity and chassis oerings provide exibility to congure servers for your specic workloads.
• High Performance Computing (HPC)
• High Performance Data Analytics (HPDA)
• Web Scale Applications / Software as a Service (SaaS) / Infrastructure as a Service (IaaS)
• Financial Modeling and High Frequency Trading (HFT)
• Render nodes for Visual Eects Rendering (VFX)
• Private Cloud Infrastructure
• Hyper-converged Infrastructure (HCI)
The PowerEdge C6420, with its exible congurations, hyper-scale capabilities and overall eciency, is ideal for modern hyper-
converged infrastructures including validated, pre-bundled Dell EMC HPC solutions, VxRail and VxRack, the Dell EMC XC Series.
• Features latest generation Intel® Xeon® SP family processors and up to 56 cores per node
• With an M SKU CPU, each socket can support up to 1.5TB of memory (3TB per node). With non-M SKU CPU, 1.5TB per node
•Oers exible I/O options including, low-latency InniBand™ and next-generation Intel Omni-Path
• Provides new Direct Liquid Cooling options for improved power eciency
Dell EMC automation and intelligent management means you spend less time on routine maintenance and more focusing on bigger
priorities.
• Maximize uptime with proactive diagnostics and automated remediation that is 90% faster.
• Leverage existing consoles with easy integrations for VMware® vSphere®, Microsoft® System Center, and Nagios®.
• Improve productivity with agent-free Dell EMC iDRAC9 improved usability making automated, ecient management part of your
routine IT practice.
• Simplify deployment with Dell EMC OpenManage next-generation console and server proles to fully congure and prep servers
in rapid, scalable fashion
Dell EMC provides a comprehensive, cyber-resilient architecture guarding PowerEdge servers from malicious attacks. Security is
embedded into every server to prevent unauthorized changes and protect your data.
• Prevent unauthorized conguration changes or malicious rmware attacks with new Conguration Lock-down
• Eliminate unauthorized rmware updates with embedded authentication so only properly signed rmware updates can run.
• Securely repurpose or retire servers with system erase of local storage to ensure data privacy
• Automate updates that check le dependencies and proper update sequence, before deploying them independently from OS/
hypervisor
5

2
System features
Product comparison
The following table shows the comparison between the PowerEdge C6320 and PowerEdge C6420 per sled:
Table 1. Product comparison with predecessor
Feature PowerEdge C6320 Dell EMC PowerEdge C6420
Processor Intel® Xeon® E5-2600v3 and v4 Series Intel® Xeon® Scalable Family Processor
Series
Front Side Bus Intel® QuickPath Interconnect (QPI) 2x Intel® Ultra Path Interconnect (UPI)
Sockets 2 2
Cores 4, 6, 8, 10, 12, 14, 16, 18, 20, 22 core 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 28 core
L2/L3 Cache 10MB, 15MB, 20MB, 25MB, 30MB, 35MB,
40MB, or 45MB
8, 11, 16, 16.5, 19, 19.25, 22, 27 20, 22,
24.75. 25, 2730, 33, 36, or 38MB
Chipset Intel® C612 chipset Intel® C621 Chipset (Lewisburg)
DIMMs 16 x DDR4 1600MHz/1866/2133MHz/
2400MHz
• 2933MT/s memory available in
16/32/64GB DIMMs
• 2666MT/s in 8/128GB for Cascade
Lake
• 16x DDR4
Min/Max RAM 4GB / 512GB • up to 3TB per node when using an M
SKU CPU
• 1.5TB for all others
• 8GB / 2048GB
Hard Drive Bays 4-node: Up to 6 x 2.5-in or 3 x 3.5-in Hot-
swap HDDs
4-node: Up to 6 x 2.5-in or 3 x 3.5-in Hot-
swap HDDs
Hard Drive Types SAS/SATA SAS/SATA/NVMe
External Drive Bay None None
Internal Boot Drive SATA DOM (64GB) or 1.8" SSD options • 1 x 120/240GB M.2 RI SSD Drive
• 2 x 120/240GB M.2 RI SSD Drives in
RAID 1
Embedded Hard Drive Controller Chipset-based SATA Chipset-based SATA
Optional Storage Controller • Non HW RAID: Intel C612
• RAID: All at 6Gbs - LSI 2008
Mezzanine, PERC H330, PERC H730
• Non HW RAID: Intel C621, HBA330
Mezz, 12Gb SAS PCIe LP HBA
• RAID: PERC H330 Mezz, PERC
H730p Mezz
Availability Hot-plug HDD and PSU; Redundant PSU Hot-plug HDD and PSU; Redundant PSU
Server Management iDRAC8 (Express, Enterprise) editions BMC (including virtual media and
console), iDRAC9 Enterprise
6

Feature PowerEdge C6320 Dell EMC PowerEdge C6420
I/O Slots 1U sled: 1 x PCIe x16 Gen3 (half height,
half length)+ 1 x PCIe x8 Gen3
(mezzanine)
1U sled: 1 x PCIe x16 Gen3 (half height,
half length)+ 1 x PCIe x16 Gen3 OCP 2.0
Mezzanine + 1 PCIe x8 Mezz (for storage
controller)
NIC/LOM 2x Intel® 82599ES 10GbE (SFP+) 1 x 1Gb Intel® i350 Ethernet RJ45
USB 1 rear per server 2 x USB 3.0 ports per C6420
Power Supplies Hot-Swap Redundant, 1400W (80+
Platinum) Redundant, 1600W (80+
Platinum)
Hot-Swap Fault Tolerant Redundant and
Non Redundant, 1600W (80+ Platinum),
Fault Tolerant Redundant 2000W/2400W
Fans 4 x 60mm, Non-redundant, non-hot
Swappable
4x6056 dual-rotor redundant, non-hot
swappable fans
Form Factor 2U Rack 2U Rack
Dimension (HxWxD) (D) 790mm x (H) 86.8mm x (W)448mm (D) 790mm x (H) 86.8mm x (W)448mm
Maximum Weight Max: 41 Kg • 3.5" Chassis:43.62kg
• 2.5" Chassis:41.46kg
• No BP Chassis :34.56kg
Specications
Table 2. Technical Specications
Feature Specication
Servers per chassis One to four 2-socket C6420 servers per C6400 chassis
Processor Intel® Xeon® Scalable Processor Family series
Front side bus 2 x Intel® Ultra Path Interconnect (UPI)
Number of processors 1 or 2
Number of cores Up to 28 cores
Chipset Intel C621 chipset
Memory • 16 x DDR4
• 2933MT/s memory available in 16/32/64GB DIMMs
• 2666MT/s in 8/128GB for Cascade Lake
Min/max RAM • up to 3TB per node when using an M SKU CPU
• 1.5TB for all others
• 8GB / 2048GB
Chassis Congurations • 24 x 2.5” Direct Backplane with up to 6 SAS/SATA drives per C6420 sled
• 24 x 2.5” Expander Backplane with up to 12 SAS/SATA drives per C6420 sled and 2 C6420 sleds
per C6400 chassis
• 24 x 2.5" NVMe Backplane with up to 2 SAS/SATA/NVMe drives and 4 SAS/SATA drives per
C6420 sled
• 12 x 3.5” Direct Backplane with up to 3 SAS/SATA drives per C6420 sled
• No Backplane option with no external drives per C6420 sled
Drive types SAS, SATA, SSD, NVMe SSDs
7

Feature Specication
Onboard drive controllers Intel C621: SATA HDD / SATA SSD Drives Only
Boot Drive options • 1x M.2 120GB/240GB RI SSD drive
• 2x M.2 120/240GB RI SSD drives in RAID 1
Storage Controllers • S140 Software RAID
• PERC H330 x8 Mezz Card
• PERC H730p x8 Mezz Card
• SAS HBA330
• 12Gb SAS HBA x16 PCIe Adapter
Availability • Hot-plug hard drives
• Hot-plug redundant power
• ECC memory
• Single device data correction (SDDC)
Server management • BMC or iDRAC9 Enterprise with 1 x 1Gbps RJ45 connector
• Intel Node Manager 3.0 compliant
I/O slots • 1 x16 PCIe Gen 3 LP HH riser slot
• 1 x16 OCP 2.0 Mezz slot (for network controller)
• 1 x8 Mezz slot (for storage controller)
• 1 x16 PCIe Gen 3 buried slot (for M.2 Boot device)
I/O adapter options • 1 Gb Ethernet
• 10/25/40/100Gb Ethernet
• FDR/EDR InniBand
• Omni-Path
Embedded NIC One 1Gb Ethernet for Systems Management and Host Trac or dedicated for Systems
Management
Security PowerEdge Secure Boot, System Erase, System Lockdown, Drift Detection, BIOS and OS Recovery,
Active Directory/LDAP, two-factor authentication (TFA), SSH with Public Key Authentication (PKA),
TLS 1.2, SNMP v3, Self-Encrypting and Instant Secure Erase (ISE) Drives, FIPS /TCG; TPM 1.2/2.0,
TPM 2.0 China
Video 1 x Mini Display Port
USB 2 x USB 3.0 ports, 1x micro USB CONN type-AB for iDRAC direct
Power supplies • Dual hot-plug non-redundant high-eciency 1600W PSU
• Dual hot-plug fault tolerant redundant high-eciency 1600W/2000W/2400W PSUs
Cooling • Shared cooling with quick-disconnect 4 x 6056 dual rotor redundant fan modules with
detectable with PWM control
• Direct Contact Liquid Cooling (DCLC)
Chassis C6400 2U rack-mounted
Rails Static rails for C6000 family
Chassis Dimensions (D) 790mm x (H) 86.8mm x (W)482.6mm
Weight • 3.5" Chassis:43.62kg
• 2.5" Chassis:41.46kg
• No BP Chassis:34.56kg
8

3
Chassis views and features
The C6400 chassis is an ultra-dense 2U enclosure that supports up to four independent two-socket (2S) sleds connected to a direct
backplane.
Chassis views
Front panel view and features
The C6400 chassis oers four sled options.
Figure 1. Front panel features and indicators of the 24 x 2.5 inch hard drive enclosure
1. left control panel 2. drive bay
3. right control panel 4. information tag
Figure 2. Front panel features and indicators of the 12 x 3.5 inch hard drive enclosure
1. left control panel 2. drive bay
3. right control panel 4. information tag
System sled enumeration
The enumeration for the motherboards is:
9

Figure 3. System sled enumeration
1U sled are shipped from the factory in:
• 1- node, 2- node, 3- node, and 4- node congurations only with 2.5 inch backplanes, 2.5 inch with NVMe backplanes and 3.5 inch
backplanes.
– Only 1- node, and 3-node applies to the 2.5 inch expander backplane.
• The empty slots in 1- node, 2- node, and 3- node congurations are lled with the dummy or blank sleds.
Back view
Figure 4. Back view of the PowerEdge C6420 sled
Table 3. Back panel features
Item Indicator, button, or
connector
Icon Description
1 mezzanine card slot N/A Enables you to connect
mezzanine expansion cards.
For more information, see the
Technical specications
section.
2 sled release handle N/A Enables you to remove the sled
from the enclosure.
3 Low Prole PCIe card slot N/A Enables you to connect PCI
Express expansion cards. For
more information, see the
Technical specications
section.
10

Item Indicator, button, or
connector
Icon Description
4 sled release lock N/A Enables you to remove the sled
from the enclosure.
5 rear power button N/A Enables you to power on the
sled while accessing it from the
rear.
6 iDRAC or NIC port Enables you to remotely access
iDRAC. For more information,
see the iDRAC User’s Guide at
Dell.com/poweredgemanuals.
7 mini display port Enables you to connect a
display device to the system.
For more information, see the
Technical specications
section.
8 iDRAC Direct micro USB port Enables you to connect a
portable device to the sled.
9 OCP or OPA card slot N/A Enables you to connect Open
Compute Project (OCP) or
Omni-Path Architecture (OPA)
expansion cards. For more
information, see the Technical
specications section.
10 EST pull out tab N/A This tab has the unique
Express Service Code, Service
Tag, and MAC address labels.
11 system id indicator and button The System Identication (ID)
button is available on the front
and back of the systems. Press
the button to identify a system
in a rack by turning on the
system ID button. You can also
use the system ID button to
reset iDRAC and to access
BIOS using the step through
mode.
12 USB 3.0 port (2) The USB ports are 9-pin and
3.0-compliant. These ports
enable you to connect USB
devices to the system.
Internal view of the system
CAUTION: This system must be operated with the system cover installed to ensure proper cooling.
11

Figure 5. Inside the PowerEdge C6400 enclosure
1. sled 2. right midplane
3. fan cage (2) 4. fan (4)
5. right linking board 6. backplane
7. drive cage 8. expander board
9. left midplane 10. left linking board
11. chassis management board 12. power interposer board
Figure 6. Inside the PowerEdge C6420 sled
1. sled pull handle 2. mezzanine card
3. SATA connector 4. memory slot (4)
5. CPU1 processor heat sink module 6. CPU2 processor heat sink module socket
7. supporting bracket 8. M.2 SATA riser
9. memory slot (4) 10. PCIe expansion card riser assembly
12

Locating the information tag of your system
You can identify your system using the unique Express Service Code and Service Tag. Pull out the information tag in front of the
system to view the Express Service Code and Service Tag. Alternatively, the information may be on a sticker on the back of the
system chassis. The mini Enterprise Service Tag (EST) is found on the back of the system chassis. This information is used by Dell to
route support calls to the appropriate personnel.
Figure 7. Locating the information tag of your system
1. Information tag (Top view)
2. Information tag (Bottom view)
3. OpenManage Mobile (OMM) label
4. iDRAC MAC address and iDRAC secure password label
NOTE: If you have opted for secure default access to iDRAC, the iDRAC secure default password is available on the
back of the system Information tag. This label will be blank, if you have not opted for secure default access to
iDRAC, then the default user name and password are root and calvin.
5. Service Tag
13

4
Processor
Processor Features
Based on the Intel® 14nm fabrication technology, the Intel® Xeon® processor family introduced a new micro-architecture that
provides signicant performance advantages and new features targeted for a range of workloads such as: High Performance
Computing (HPC), Enterprise applications, Cloud service providers, storage, network applications, Internet of Things (IoT), and many
more. The following table summarizes key features of the processor family.
Table 4. Processor Features
Category Feature Function
Compute More Cores Up to 28C
Intel® AVX-512 512-bit instructions
MLC Optimization Acceleration of enterprise-class and HPC
workloads
Heterogeneous support with converged
programming environment
Higher 'private-local' ratio in cache
Lower power
Intel® Ultra Path Interconnect (UPI)
(replaces QPI)
Increases bandwidth: up to 10.4 GT/s
Intel AVX-512 VNNI 512-bit instructions to improve Deep
Learning performance
Memory & Security Memory Capacity and Bandwidth increase Up to DDR4 2933 MT/s (11% increase)
Up to 6 channels (50% increase)
MPX (Memory Protection Extensions) Prevents buer overow
I/O Fabric Integration On package integration of next-generation
Intel® Omni-Path Fabric controller
PCIe Bandwidth Up to 48 PCIe lanes; 3.0 speed 79 GB/s
bi-directional pipeline (from 53 GB/s on
BDW)
Separate Reference with Independent
Spread Spectrum Clocking (SRIS)
Eliminates clock in PCIe cables
MCTP Scaling 256 PCIe buses, up to 8 segments
Storage Non-Transparent Bridge (NTB)
Enhancements
3 full-duplex NTBs and 32 MSI-X vectors
Crystal Beach DMA (CBDMA) Adds MMIO -> mem transfer support
2X performance increase vs. prior gen
platform
14

Category Feature Function
Intel® Volume Management Device
(Intel® VMD)
Manages CPU attached PCIe NVMe
SSDs: Provides robust hot-plug capability
Enclosure Management and Error isolation
Supported processors
The following table lists the supported processors for the PowerEdge C6420:
Table 5. Cascade Lake processors
Class SKU Frequency (GHz) Number of cores TDP Watts
Platinum 8280 2.7 28 205
Platinum 8276M 2.2 28 165
Platinum 8276 2.2 28 165
Platinum 8270 2.7 26 205
Platinum 8268 2.9 24 205
Platinum 8260M 2.4 24 165
Platinum 8260 2.4 24 165
Platinum 8253 3.1 16 125
Gold 6252N (post RTS) 2.4 24 150
Gold 6252 2.1 24 150
Gold 6248 2.5 20 150
Gold 6246 3.3 12 165
Gold 6244 3.6 8 150
Gold 6242 2.8 16 150
Gold 6240M (post RTS) 2.6 18 150
Gold 6240 2.6 18 150
Gold 6238M (post RTS) 2.1 22 140
Gold 6238 (post RTS) 2.1 22 140
Gold 6234 (post RTS) 3.3 8 130
Gold 6230N 2.3 20 125
Gold 6230 2.3 20 125
Gold 6226 (post RTS) 2.7 12 125
Gold 5222 3.8 4 105
Gold 5220S (post RTS) 2.7 18 125
Gold 5220 2.2 18 125
Gold 5218N 2.3 16 125
Gold 5218 2.3 16 125
Gold 5217 3 8 115
15

Class SKU Frequency (GHz) Number of cores TDP Watts
Gold 5215M 2.5 10 85
Gold 5215 2.5 10 85
Silver 4216 2.1 16 100
Silver 4215 2.5 8 85
Silver 4214 2.2 12 85
Silver 4210 2.2 10 85
Silver 4208 2.1 8 85
Bronze 3204 1.7 6 85
Table 6. Skylake processors
Class SKU Frequency (GHz) Number of cores TDP Watts
Platinum 8180 2.5 28 205
Platinum 8180M 2.5 28 205
Platinum 8176M 2.1 28 165
Platinum 8168 2.7 24 205
Platinum 8158 3 12 150
Platinum 8156 3.6 4 105
Gold 6148 2.4 20 150
Gold 6154 3 18 200
Gold 6150 2.7 18 165
Gold 6142 2.6 16 150
Gold 6132 2.6 14 140
Gold 6146 3.2 12 165
Gold 6136 3 12 150
Gold 6126 2.6 12 125
Gold 6144 3.5 8 150
Gold 6134 3.2 8 130
Gold 6128 3.4 6 115
Gold 5122 3.6 4 105
Platinum 8176 2.1 28 165
Platinum 8176M 2.1 28 165
Platinum 8170M 2.1 26 165
Platinum 8170 2.1 26 165
Platinum 8164 2 26 150
Platinum 8160M 2.1 24 150
Platinum 8160 2.1 24 150
16

Class SKU Frequency (GHz) Number of cores TDP Watts
Platinum 8153 2 16 125
Gold 6152 2.1 22 140
Gold 6138 2 20 125
Gold 6140M 2.3 18 140
Gold 6140 2.3 18 140
Gold 6130 2.1 16 135
Gold 5120 2.2 14 105
Gold 5118 2.3 12 105
Gold 5117 2 14 105
Gold 5115 2.4 10 85
Silver 4116 2.1 12 85
Silver 4114 2.2 10 85
Silver 4112 2.6 4 85
Silver 4110 2.1 8 85
Silver 4108 1.8 8 85
Bronze 3106 1.7 8 85
Bronze 3104 1.7 6 85
Platinum 8176F 2.1 28 173
Platinum 8160F 2.1 24 160
Platinum 6138F 2 20 135
Platinum 6130F 2.1 16 135
Gold 6148F 20 2.4 160
Gold 6142F 16 2.6 160
Gold 6126F 12 2.6 135
Chipset
The PowerEdge C6420 server incorporates the Intel C621 chipset for processor interfacing and for I/O.
17

5
Memory
The C6420 supports up to 16 DIMMs, with speeds of up to 2666MT/s. The system supports registered (RDIMMs) and load reduced
DIMMs (LRDIMMs) which use a buer to reduce memory loading and provide greater density, allowing for the maximum platform
memory capacity. Unbuered DIMMs (UDIMMs) are not supported.
The maximum system population is 2TB (16 DIMM slots x128 GB DDR4 LRDIMM), however for best performance the system should
be populated to achieve a balanced conguration by populating 1 DIMM per channel. In a balanced conguration with maximum
capacity, 12 DIMM slots are populated for a total of 1.5TB memory using 128GB DIMMs.
Supported memory
The following table list the supported memory for the PowerEdge C6420 when using Cascade Lake processor:
Availability Density DIMM Type Dell PN Conguration DRAM Package
type
DIMM max speed Rated
voltage
Yes 8GB RDIMM 1VRGY 1Rx8 8Gb SDP 2666MT/s in Cascade
Lake processor
1.2V
Yes 16GB RDIMM TFYHP 2Rx8 8Gb SDP 2933MT/s 1.2V
Yes 32GB RDIMM 8WKDY 2RX4 8Gb SDP 2933MT/s 1.2V
Yes 64GB RDIMM W403Y 4Rx4 8Gb DDP 2933MT/s 1.2V
Yes 128GB LRDIMM 917VK 8Rx4 8Gb TSV 2666MT/s in Cascade
Lake processor
1.2V
Memory speed
The PowerEdge C6420 system supports memory speeds of 2933MT/s, 2666MT/s, 2400MT/s, 2133MT/s, and 1866MT/s depending
on the DIMM types installed and the conguration. All memory on all processors and channels run at the same speed and voltage. By
default, this speed will be the highest speed supported by the CPU and the DIMMs. For example both DIMMs and CPUs must be
capable of running at 2666MT/s in order for memory to run at 2666MT/s (specic CPU / DIMM conguration required). CPU SKUs
in the Platinum category support up to 2666MT/s memory speed while CPU SKUs in Gold and Silver category support up to 2400
MT/s memory speed. The operating speed of the memory is also determined by the maximum speed supported by the processor,
the speed settings in the BIOS, and the operating voltage of the system.
The table below lists the memory conguration and performance details for the Mercury, based on the quantity and type of DIMMs
per memory channel.
DIMM type DIMM ranking Capacity DIMM rated voltage,
speed
1 DPC
RDIMM 1R / 2R 8GB, 16GB, 32GB DDR4 (1.2V), 2666 D: 2666
LRDIMM 4R 64GB DDR4 (1.2V), 2666 D: 2666
LRDIMM 8R 128GB DDR4 (1.2V), 2666 D: 2666
18

6
Storage
The system enables multiple storage congurations to tune the system conguration for a wide variety of workloads. The C6400
chassis is available in the following conguration types:
• No hard drives in a No-Backplane Conguration
• 24 x 2.5" Direct Backplane conguration with up to 6 SAS/SATA drives per node
• 24 x 2.5" Expander Backplane conguration with up to 12 SAS/SATA drives per node and two nodes per chassis
• 24 x 2.5" NVMe Backplane conguration with up to 6 drives per node out of which two drives can be NVMe drives
• 12 x 3.5" Direct Backplane conguration with up to 3 SAS/SATA drives per node
Supported drives
The PowerEdge C6420 system supports up to 24 x 2.5” hard disk drives per server node and up to 12 x 3.5” hard disk drives per
server node depending on the number of installed nodes and backplane type (max 6 x 2.5” HDDs using 2.5”direct backplane; max 3 x
3.5” HDDs using 3.5" direct backplane).
• Support for 7.2K, 10K and 15K RPM 2.5-inch and 3.5-inch SAS drives
• Support for 7.2K RPM Enterprise 2.5-inch and 3.5-inch SATA
NOTE: For the latest list of drives available on C6420, please always refer to the options available in quoting and ordering
tools. This list may not accurately reect the comprehensive list of all drives available on the C6420 platform.
The following table list the supported NVMe drives:
Table 7. Supported NVMe drives
Description Interface Capacity DPN Type
SSDR,800G,NVMEPCIE,
2.5,PM1725A
PCIe 800GB KWH83 MU
SSDR,1.6T,NVMEPCIE,
2.5,PM1725A
PCIe 1.6TB JD6CH MU
SSDR,3.2,NVMEPCIE,
2.5,PM1725A
PCIe 3.2TB JDMHM MU
SSDR,3.2,NVME,PCIE,
2.5,PM1725
PCIe 3.2TB 99JNC MU
SSDR,6.4,NVMEPCIE,
2.5,PM1725A
PCIe 6.4TB Y3XT2 MU
The following table shows the supported SSD drives:
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Table 8. Supported SSD drives
Description Interface Class Capacity
120GB SSD SATA Boot 6Gbps 512n 2.5in Hot-plug Drive, 1
DWPD, 219 TBW
SATA RI 120GB
240GB SSD SATA Mix Use 6Gbps 512n 2.5in Hot-plug Drive,
SM863a,3 DWPD,1314 TBW
SATA MU 240GB
400GB SSD SAS Mix Use 12Gbps 512e 2.5in Hot-plug Drive,
PM1635a,3 DWPD,2190 TBW
SAS MU 400GB
400GB SSD SAS Write Intensive 12Gbps 512n 2.5in Hot-plug
Drive, PX05SM,10 DWPD,7300 TBW
SAS WIG 400GB
480GB SSD SAS Mix Use 12Gbps 512n 2.5in Hot-plug Drive,
PX05SV,3 DWPD,2628 TBW
SAS MU 480GB
480GB SSD SATA Read Intensive 6Gbps 512n 2.5in Hot-plug
Drive, S3520, 1 DWPD, 945 TBW
SATA RI 480GB
480GB SSD SATA Mix Use 6Gbps 512n 2.5in Hot-plug Drive,
SM863a,3 DWPD,2628 TBW
SATA MU 480GB
800GB SSD SAS Write Intensive 12Gb 512n 2.5in Hot-plug
Drive, PX05SM,10 DWPD,14600 TBW
SAS WIG 800GB
960GB SSD SAS Read Intensive 12Gbps 512n 2.5in Hot-plug
Drive, PX05SR,1 DWPD,1752 TBW
SAS RI 960GB
960GB SSD SAS Read Intensive 12Gbps 512e 2.5in Hot-plug
Drive, PM1633a,1 DWPD,1752 TBW
SAS RI 960GB
960GB SSD SAS Mix Use 12Gbps 512n 2.5in Hot-plug Drive,
PX05SV,3 DWPD,5256 TBW
SAS MU 960GB
960GB SSD SATA Read Intensive 6Gbps 512n 2.5in Hot-plug
Drive, S3520, 1 DWPD, 1750 TBW
SATA RI 960GB
960GB SSD SATA Mix Use 6Gbps 512n 2.5in Hot-plug Drive,
SM863a,3 DWPD,5256 TBW
SATA MU 960GB
1.6TB SSD SAS Mix Use 12Gbps 512e 2.5in Hot-plug Drive,
PM1635a,3 DWPD,8760 TBW
SAS MU 1.6TB
1.6TB SSD SAS Write Intensive 12Gbps 512n 2.5in Hot-plug
Drive, PX05SM,10 DWPD,29200 TBW
SAS WIG 1.6TB
1.92TB SSD SAS Read Intensive 12Gbps 512n 2.5in Hot-plug
Drive, PX05SR,1 DWPD,3504 TBW
SAS RI 1.92TB
1.92TB SSD SAS Read Intensive 12Gb 512e 2.5in Hot-plug
Drive, PM1633a,1 DWPD,3504 TBW
SAS RI 1.92TB
1.92TB SSD SAS Mix Use 12Gbps 512n 2.5in Hot-plug Drive,
PX05SV,3 DWPD,10512 TBW
SAS MU 1.92TB
1.92TB SSD SATA Mix Use 6Gbps 512n 2.5in Hot-plug Drive,
SM863a,3 DWPD,10512 TBW
SATA MU 1.92TB
1.92TB SSD SATA Read Intensive 6Gpbs 512n 2.5in Hot-plug
Drive, PM863a,1 DWPD,3504 TBW
SATA RI 1.92TB
3.84TB SSD SAS Mix Use 12Gbps 512n 2.5in Hot-plug Drive,
PX05SV,3 DWPD,10512 TBW
SAS MU 3.84TB
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